FX11LB-60P/6-SV(92)

0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections FX11 Series Stacking height : 2.5mm, 3mm ■Features 10 Signal : 1 Ground Arrangement 1. Low Profile Design The board-to-board mating height of 2mm, 2.5mm and 3mm suits smaller, thinner case designs. (Fig.2) 2. Improved Transmission Efficiency Between Boards Transmission characteristics have been improved through a design that fixes ground plates to both sides of the header and receptacle. Ground Plate Signal contact m 5m 0.7 Housing 3. 10 Signal:1 Ground Arrangement mm 0.5 Metal fitting Signal and ground are arranged in a ratio of 10 : 1 with the ground plate connected to the board Via SMT. The ground stability achieved serves to reduce noise. (Fig.1) m 5m 0.7 Fig.1 Ground plate and metal fitting make contact 4. Metal Fittings for Added Strength Stacking Height Variation Metal fittings provide for greater adhesion to the board, which protects the connector against sheaning forces. The unique connector design provides a connection between the fitting and the ground plate for a stronger ground. '#* !( bb 'bb 5. Suited to High-Density Applications The signal contact pitch of 0.5mm affords a compact connector, and reduces mounting space on the board. Note: 2.0mm type product cannot be used or interchanged with the 2.5mm or 3.0mm type product. Fig.2 6. Structure Prevents Solder Wicking Structure Prevent Solder Wicking A solder gap has been designed into the contact SMT portion to prevent solder wicking. (Fig.3) 7. High Contact Reliability HdaYZg\Veedgi^dc Effective wipe length is 0.55mm (2mm height) and 1mm(2.5mm, 3mm height) for signal contacts. 7dVgYbdjci^c\edgi^dc AVcY 8dciVXi hjg[VXZ 8. Optional Ground Plate Fig.3 An alternate style is also available without the ground plate. The space provided by the absence of the ground plate is filled with additional signal contacts. ■Signal Integrity Features 120 ICR 3mm(Without GND) 60 115 50 110 30 ●Differential Impedance The differential impedance is 100 + /- 10ø for FX11 at 50 ps rise time(20% to 80%). Impedance 3mm(Without GND) 105 40 Z(ø) ●Insertion-Loss-to-Crosstalk Ratio (ICR) The insertion-loss-to-crosstalk ratio (ICR) with five differential FEXT aggressors meets the extrapolated IEEE802.3ap specification to 10+ Gbps. ICR(dB) Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Stacking height : 2mm 100 95 20 90 10 0 85 ICR IEEEspec 0 1 2 3 4 5 6 7 8 9 10 80 0.8 Frequency(GHz) In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information. FX11- 3mm DifferentialTDR 0.9 1 1.1 1.2 Time(ns) 2017.11e 1.3 1.4 1.5 1 FX11 Series●0.5mm Pitch Connectors with Ground Plate for 2mm to 3mm High-Speed Board-to-Board Connections BStacking height variation ● With ground plate Header Receptacle FX11L#-*P / *-SV FX11L#-*S / *-SV 2mm Header Receptacle FX11#-*P / *-SV FX11#-*P / *-SV0.5 2.5mm 3mm FX11#-*S / *-SV ● Without ground plate Header Receptacle FX11L#-*P-SV FX11L#-*S-SV 2mm Header Receptacle FX11#-*P-SV FX11#-*P-SV0.5 2.5mm 3mm Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. FX11#-*S-SV Note 1: The thickness of the solder paste is not included in the stacking height. Note 2: 2mm type and 2.5mm, 3mm type, with ground plate type and without ground type are not mated with each other. BCross section of mating H^\cVaedgi^dc %#** :[[ZXi^kZbVi^c\aZc\i] %#** :[[ZXi^kZl^eZaZc\i] ● Stacking height : 2mm