IT1-168S-SV(26)

High Speed, Matched-Impedance, Parallel Board-to-board Connector Receptacle (2 required) IT1 Series Outline High-speed matched-impedance parallel board-to-board connector designed for applications requiring board-toboard spacing with transmission speeds exceeding 1GHz. The connection system has matched impedance of 50 ohm or can be customized. Contacts are on 0.5mm pitch. ■Features Transmission Module ●Connection Cross-Sectional Diagram 1. Impedance Matching using a 4-Layer Board The innovative transmission module uses PC boards with a strip line design of transmission lines, providing matched impedance of 50 ohms, for standard product. 2. Supports Multiple Connectors per board Designed with a tolerance of +/- 0.2mm for both the X and Y-axis. The three-piece structure and the +/- 0.2mm tolerance allows 3 or more IT1’s to be mounted on a single board. (0.65) : Wipe Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT1 Series Receptacle 2-Point contact 4-Layer board (Impedance matching) 3. Customized Board-to-Board Distance Board-to-board distance can be customized, from 16mm to 40mm. Ground lines or additional traces can be added to support high level, high speed transmission or mixed power/signal applications. Transmission Module 2-Point contact 4. Signal to Ground Ratio The standard signal-to-ground ratio is 10:2, which makes reliable matching of the characteristic impedance of each transmission line. This ratio also can be customized. Receptacle 5. Contact Reliability Use of double contact points on each of the contacts assures highly reliable performance. ■Applications Routers, servers, base stations and other telecommunication equipment. A294 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Product Specifications Rating Current rating 0.4 A (Note 1) Voltage rating 50V AC Item Operation Temperature Range -55ç to +85ç Operation Humidity Relative humidity 95% max. Range (No condensation) Storage Humidity Range Specification 40% to 70% (Note 2) Conditions Measured at 100V DC 150 V AC/one minute Measured at 100 mA 1. Insulation resistance 100 M ohms min. 2. Withstanding voltage No flashover or insulation breakdown 3. Contact resistance 100 m ohms max. Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Storage Temperature -10ç to +60ç (Note 2) Range 4. Vibration No electrical discontinuity of 1 μs or more. No damage, cracks, or parts dislocation. Frequency of 10 to 55 Hz, 0.75mm single amplitude, for 10 cycles in each of 3 directions 5. Shock No electrical discontinuity of 1 μs. min. No damage, cracks, or parts dislocation Acceleration of 490 m/s2, 11 ms duration, sine half-wave waveform, 3 cycles in each of the 3 axis. 6. Humidity Contact resistance: 110 m ohms max. Insulation resistance: 100 M ohms min. No damage, cracks, or parts dislocation 96 hours/40ç/ humidity of 90% to 95% 7. Temperature cycle Contact resistance: 110 m ohms max. Insulation resistance: 100 M ohms min. No damage, cracks, or parts dislocation Temperature: -55ç/ +15ç to +35ç/ +85ç/ +15ç to +35ç Duration: 30 / 2 to 3 / 30 / 2 to 3 (Minutes) 5 cycles Contact resistance: 110 m ohms max. 8. Durability (insertion/ withdrawal) No damage, cracks, or parts dislocation. 20 cycles 9. Resistance to 9. Soldering Heat Reflow: At the recommended temperature profile Manual soldering: 350ç for 3 seconds No deformation of components affecting performance. Note1: If the connector is going to be used at a current in excess of the 0.4 A, please contact your Sales Representative. Note2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. Note3: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. ■Material Receptacles Part Insulator Contacts Metal fittings Material LCP Phosphor bronze Phosphor bronze Finish Color : Beige Gold plating Tin plating Remarks UL94V-0 Material PBT FR-4 Finish Color : Black Contact portion : Gold plating Remarks UL94V-0 ------------------- Transmission Module Part Insulator Board ---------- ■Ordering information Receptacles IT 1 # - * S - SV (* *) 1 2 3 4 5 6 Transmission Module IT 1 - * P / * - *H 1 1 Series name 2 Locating Post type Blank 3 4 : IT1 : With Locating Post A : Without Locating Post : 168, 252 3 Number of contacts 4 Connector S : Receptacle Socket P : Transmission Plug Module 7 8 5 Lead SV : Straight SMT 6 Packaging Blank : Tray (25) : Tray(connectors with attached tape for a vacuum board placement) 7 Number of ground contacts : 28, 44 8 Board-to-board Distance: 19mm,23mm,30mm A295 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Receptacles - 168 Contacts 20.5 (=0.5∞41) ∞168 0.2 A 0.2 ±0.05 b84 1.5 1.5 0.5 20.5 (=0.5∞41) 0.5 b2 b1 8.8 ±0.5 b1 A 1 a2 2 ±0.2 a1 a84 a1 A 6 ±0.5 ( 0.6) (52) 2-(Ø1.5 mm): Locating Post Part Number CL No. Locating Post Type IT1-168S-SV 641-0002-0 With Locating Post IT1A-168S-SV 641-0012-4 Without Locating Post RoHS YES BRecommended PCB mounting pattern 61.7 +0.1 0 0 56.9 -0.1 52 ±0.05 1.5 ∞168 20.5 ( =0.5∞41) 0.5 0.06 A b2 b1 0 3 +0.1 0 6.6 -0.1 b 84 A a 84 a2 a1 1 Not required for products without Locating Post. 1 2-Ø1.7±0.05 +0.1 0 1.5 0.5 9.4 20.5 ( =0.5∞41) 0.3 ±0.02 A296 (3.55) 60.7 ±0.5 3.55 ±0.05 Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 60.7 ±0.5 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Receptacles - 252 Contacts 20.5 (=0.5∞41) 3 20.5 (=0.5∞41) 1.5 0.2 ±0.05 ∞252 0.2 A 20.5 (=0.5∞41) 0.5 b2 b1 1. 5 0.5 C b126 1.5 A 8.8 ±0.5 b1 a1 2 ±0.2 A a126 a1 a2 6 ±0.5 ( 0.6 ) ( 75.5 ) ( 3.55 ) 84.2 ±0.5 2-(Ø1.5 mm): Locating Post Part Number CL No. Locating Post Type IT1-252S-SV 641-0003-3 With Locating Post IT1A-252S-SV 641-0013-7 Without Locating Post RoHS YES BRecommended PCB mounting pattern 85.2 +0.1 0 80.4 0 -0.1 49.5 1.5 . 0.5 0.5 a 126 A a2 1 +0.1 0 9.4 b1 6.6 b2 b 126 B 20.5 (=0.5∞41) 3.55 3 0.3 ±0.02 ∞252 0.06 A 26 20.5 (=0.5∞41) 1.5 0 -0.1 20.5 ( =0.5∞41) 3 +0.1 0 Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 84.2 ±0.5 2- Ø1.7 ±0.05 0.1 A.B a1 1 Not required for products without locating Post. A297 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Transmission Module - 168 Contacts 7.8 ±0.5 b row a row (4.2) 5.8 ±0.3 57±0.5 168 A 19 Board Mounting side Locking Protrusion (2 Sides) 56±0.3 Part Number CL No. Board-to-board Distance A B C IT1-168P/28-19H 641-0192-8 19mm 18.4 18.4 16.6 IT1-168P/28-30H 641-0303-7 30mm 13.9 13.9 17.6 ■Connection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. Signal Ground Fig. 1 Signal Ground Signal Ground Signal Ground A298 5.8 ±0.3 Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 1 1 6.6 ±0.5 Mating side 8.4 ±0.3 8.4 ±0.3 55±0.3 a row α-β a01 - a84 a02 - a83 a03 - a82 Signal a04 - a81 a05 - a80 a06 - a79 Ground a07 - a78 a08 - a77 ı ı ı ı ı ı Signal ı ı ı ı a17 - a68 a18 - a67 Ground a19 - a66 a20 - a65 ı ı ı ı ı ı Signal ı ı ı ı a29 - a56 a30 - a55 Ground a31 - a54 a32 - a53 ı ı ı ı ı ı Signal ı ı ı ı a41 - a44 a42 - a43 a43 - a42 α-β a44 - a41 ı ı ı ı ı ı ı ı ı ı a53 - a32 a54 - a31 a55 - a30 a56 - a29 ı ı ı ı ı ı ı ı ı ı a65 - a20 a66 - a19 a67 - a18 a68 - a17 ı ı ı ı ı ı ı ı ı ı a77 - a08 a78 - a07 a79 - a06 a80 - a05 a81 - a04 a82 - a03 a83 - a02 a84 - a01 Signal Ground Signal Ground Signal Ground Signal Ground b row α-β b01 - b84 b02 - b83 b03 - b82 Signal b04 - b81 b05 - b80 b06 - b79 Ground b07 - b78 b08 - b77 ı ı ı ı ı ı Signal ı ı ı ı b17 - b68 b18 - b67 Ground b19 - b66 b20 - b65 ı ı ı ı ı ı Signal ı ı ı ı b29 - b56 b30 - b55 Ground b31 - b54 b32 - b53 ı ı ı ı ı ı Signal ı ı ı ı b41 - b44 b42 - b43 b43 - b42 α-β b44 - b41 ı ı ı ı ı ı ı ı ı ı b53 - b32 b54 - b31 b55 - b30 b56 - b29 ı ı ı ı ı ı ı ı ı ı b65 - b20 b66 - b19 b67 - b18 b68 - b17 ı ı ı ı ı ı ı ı ı ı b77 - b08 b78 - b07 b79 - b06 b80 - b05 b81 - b04 b82 - b03 b83 - b02 b84 - b01 RoHS YES IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System ■Transmission Module - 252 Contacts ●2-row type 7.8±0.5 b row a row (4.2) 5.8±0.3 80.5 ±0.5 252 2 1 23 Locking Protrusion (2 Sides) 5.8±0.3 Board Mounting side 10.4 ±0.3 Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. A 10.6 ±0.5 Mating side 10.4 ±0.3 78.5 ±0.3 79.5 ±0.3 Part Number CL No. Board-to-board Distance A B C IT1-252P/44-23H 641-0231-8 23mm 10.4 10.4 10.6 IT1-252P/44-30H 641-0304-0 30mm 13.9 13.9 17.6 RoHS YES ■Connection Table The connection table indicates contact numbers in the mated condition,as illustrated in Fig. 1. Signal Ground Signal Fig.1 Ground Signal Ground Signal Ground α-β a01 - a126 ı ı ı ı ı ı ı ı ı ı a05 - a122 a06 - a121 a07 - a120 a08 - a119 ı ı ı ı ı ı ı ı ı ı a17 - a110 a18 - a109 a19 - a108 a20 - a107 ı ı ı ı ı ı ı ı ı ı a29 - a98 a30 - a97 a31 - a96 a32 - a95 ı ı ı ı ı ı ı ı ı ı a41 - a86 a42 - a85 a43 - a84 Signal Ground Signal Ground Signal Ground Signal Ground a row α-β a44 - a83 ı ı ı ı ı ı ı ı ı ı a53 - a74 a54 - a73 a55 - a72 a56 - a71 ı ı ı ı ı ı ı ı ı ı a62 - a65 a63 - a64 a64 - a63 a65 - a62 ı ı ı ı ı ı ı ı ı ı a71 - a56 a72 - a55 a73 - a54 a74 - a53 ı ı ı ı ı ı ı ı ı ı a83 - a44 a84 - a43 a85 - a42 Signal Ground Signal Ground Signal Ground Signal α-β a86 - a41 ı ı ı ı ı ı ı ı ı ı a95 - a32 a96 - a31 a97 - a30 a98 - a29 ı ı ı ı ı ı ı ı ı ı a107 - a20 a108 - a19 a109 - a18 a110 - a17 ı ı ı ı ı ı ı ı ı ı a119 - a08 a120 - a07 a121 - a06 a122 - a05 ı ı ı ı ı ı ı ı ı ı a126 - a01 Signal Ground Signal Ground Signal Ground Signal Ground α-β b01 - b126 ı ı ı ı ı ı ı ı ı ı b05 - b122 b06 - b121 b07 - b120 b08 - b119 ı ı ı ı ı ı ı ı ı ı b17 - b110 b18 - b109 b19 - b108 b20 - b107 ı ı ı ı ı ı ı ı ı ı b29 - b98 b30 - b97 b31 - b96 b32 - b95 ı ı ı ı ı ı ı ı ı ı b41 - b86 b42 - b85 b43 - b84 Signal Ground Signal Ground Signal Ground Signal Ground b row α-β b44 - b83 ı ı ı ı ı ı ı ı ı ı b53 - b74 b54 - b73 b55 - b72 b56 - b71 ı ı ı ı ı ı ı ı ı ı b62 - b65 b63 - b64 b64 - b63 b65 - b62 ı ı ı ı ı ı ı ı ı ı b71 - b56 b72 - b55 b73 - b54 b74 - b53 ı ı ı ı ı ı ı ı ı ı b83 - b44 b84 - b43 b85 - b42 Signal Ground Signal Ground Signal Ground Signal α-β b86 - b41 ı ı ı ı ı ı ı ı ı ı b95 - b32 b96 - b31 b97 - b30 b98 - b29 ı ı ı ı ı ı ı ı ı ı b107 - b20 b108 - b19 b109 - b18 b110 - b17 ı ı ı ı ı ı ı ı ı ı b119 - b08 b120 - b07 b121 - b06 b122 - b05 ı ı ı ı ı ı ı ı ı ı b126 - b01 A299 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System BIT1 Series Extraction Tool CL No. Remarks RoHS IT1-PICKER(1) 641-1001-3 2-piece Package YES A300 (3) Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. (42) Part Number (1.25) (6) (6) (Ø2.5) IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System Installation and Use Instruction Manual Table of Contents Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 1. System Components .......................................................... A302 ¡Receptacles ¡Transmission Module Assembly ¡Extraction Tool 2. Recommended Design Guidelines ................................ A303 2-1 Recommended Solder Land Pattern 2-2 Board-to-Board Spacer Heights 3. Connector Placement ......................................................... A304 3-1 Receptacle Packaging Types 3-2 Receptacle Vacuum Pick-and-Place Areas 3-3 Receptacle Board Placement 3-4 Recommended Reflow Conditions 3-5 Solder Repairs 4. Mating Procedure ................................................................ A307 5. Un-mating of Connectors .................................................. A308 6. Removal of the Transmission Module from the stationary side. ..A309 7. Precautions When Mounting Multiple Connectors .. A310 ¡Allowable Amount of Misalignment ¡Recommended Positional Location A301 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System BConnector Handling Precautions 1. System components ■Receptacles ¡Contacts ¡Row A and row B contacts are arranged alternately starting with No.1 in row B. Placement on board is polarized. ¡Metal Fittings ¡Permanently inserted to provide lock with the Transmission Module and additional solder areas with the PCB. ¡Insulator body. ¡Injection molded single unit provides protection and correct self-alignment of all components. Insulator body Even numbered row: A contacts Odd numbered row: B contacts Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Metal fittings ■Transmission Module Assembly ¡Each Module has stationary side and a mating/un-mating side. ¡When mounting multiple connectors, please keep uniform orientation of the stationary side. ¡Transmission printed circuit boards used in the module are based on JIS standards and quality standards applicable to memory modules. Guide frame Mating/ un-mating side (Short) Transmission boards. Stationary side (Longer) ■Extraction Tool ¡Used to release the transmission module from the stationary receptacle. Extraction Tool (2 required) Fully Connected Condition The interconnection package consists of 3 main sub-assemblies: Two receptacles and the Transmission Module. The transmission module, held securely by the guide frame has a mating/un-mating side and a stationary side. Once the stationary side is inserted in the receptacle, it can not be removed without the use of extraction tool. The mating/un-mating side allows repeated re-insertion of the receptacle on this side only. Receptacles Transmission module assembly Mating/ unmating side Stationary side A302 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 2. Recommended Design Guidelines 2-1 Solder Land Pattern When placing the receptacles on the Printed Circuit Boards using automatic mounting equipment or manually, assure that the correct diameters of the holes (Fig. 1) are through the entire thickness of the board. SLocating post hole diameterS The contacts of receptacle assembly are exposed on the bottom surfaces. The exposed areas of the contacts are a distance of 0.25 mm minimum from the surface of the Printed Circuit Board, on which the receptacle assembly is placed (Fig.2). Consideration should be taken not to place or assure insulation of conductive traces under the receptacle assemblies. Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Refer to the separate drawings for recommended solder land pattern dimensions of the receptacle, and signals and ground connection diagram of the transmission module. (mm) Automatic placement / (Locating post hole diameter) C dimension: 1.7 mm Manual placement / (Locating post hole diameter) C dimension: 1.6 mm / A position accuracy of + - 0.03 should be exercised from the center of the hole to contact Number 84. Fig. 1 IT1-168S-SV Recommended Solder Land Pattern Contact_A Contact_B Fig. 2 Cross section of IT1 receptacle 2-2 Board-to-Board Spacer heights The two parallel boards connected by the IT1 connectors should be fastened to additional spacers between them. Fig. 3 indicates the connector height tolerance and the spacer’s height. When designing the spacer’s height, consideration should be given to the solder paste thickness and any other features, which may affect the full mating of the connector. Fig. 3 indicates design dimensions for the 19 mm board-to-board distance. (mm) Fig. 3 A303 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3. Connector Placement 3-1 Packaging Types ¡Two types of packaging are available: semi-hard tray and hard tray. Customers may specify a packaging type suitable for their automatic placement machines. * Refer to the separate drawings for the detailed dimensions of the trays. ¡Semi-hard tray packaging 168 contacts receptacle: 40 pieces per tray 252 contacts receptacle: 30 pieces per tray ¡Hard tray packaging 168 contacts receptacle: 24 pieces per tray 252 contacts receptacle: 16 pieces per tray Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. (mm) A304 3-2 Automatic placement - Vacuum Pick-and-Place Areas ¡Specify "Vacuum Pick-up Tape Specification". ¡The area and position of the pick-and-place surface are indicated in the diagrams below. (mm) IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3-3 Receptacle Board Placement Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ¡When using automatic placement equipment, verify the packaging type and the Pick-and-place areas. ¡When placing manually, pay attention to the possibility of positional shift. Ref. Fig. 4. * When placing multiple connectors, to assure positional accuracy, it is advised to use automatic placement equipment. SPrecautions for Manual PlacementS The orientation posts serve as a prevention measure to avoid incorrect placement of the receptacle assemblies on the board. The contact terminals must be placed correctly over the corresponding solder pad as shown on Fig. 4-1. Fig. 4-1 = Correct Fig. 4-2 = Incorrect Fig. 4-3 = Incorrect 3-4 Recommended Reflow Conditions A305 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 3-5 Solder Repairs Assure that flux is not reaching the contact areas of the connector. Wash the assembly as recommended below. SCleaning ConditionsS Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. When using water based cleaning agents (e.g., terpene, and alkali saponifiers), select the cleaning agent based on the documentation issued by the various manufacturers, which describes its effects on metals and resins. Care should be taken not to leave moisture on the connectors. A306 Residual flux or cleaning agent remaining on the connectors when cleaning with organic solvents or water based cleaners may cause deterioration of the electrical performance. It is important to check that a thorough washing has been performed. IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 4. Mating Procedure Follow the procedure described below. Note:¡The transmission module must be fully inserted into receptacle assembly already placed and soldered to a board. ¡The Transmission Module cannot be exposed to heat temperatures of the soldering process. Step 1 Receptacle Placement on the board – stationary side Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Assure that the orientation posts are aligned with the holes on the board. When specifying receptacle assemblies without the orientation posts exercise extra caution to assure correct orientation and connection with the solder pads. Step 2 Insertion of the Transmission Module Fully insert the Transmission Module in the board-installed receptacle assembly. It is critical that the insertion is done straight and uniformly. Step 3 Mating/un-mating Assure that the receptacle assembly is correctly aligned with the Transmission Module. Fully insert the receptacle assembly on the Transmission Module. It is critical that the insertion is done straight and uniformly. Step 4 Connection completed A307 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 5. Un-mating of Connectors Recommended Method Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ¡Pull uniformly straight up. A308 Prohibited un-mating Methods IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 6. Removal of the Transmission Module - stationary side ¡Requires use of dedicated extraction tool. Two are required. Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Step 1 ¡Fully insert the tools into each end of the receptacle assembly (Fig. 1) assuring that they will be over the hold areas of the Transmission Module frame. Ref. Fig. 2 Fig. 1 Step 2 Pull out the transmission module holding the tools straight. Fig. 2 extraction tool Insertion Area Insertion area Inappropriate area A309 IT1 Series●High Speed, Matched-Impedance, Parallel Board-to-board Connector System 7. Precautions When Mounting Multiple Connectors Note: Observe the requirements as listed in paragraph 7-1 and 7-2. The mating/un-mating forces will increase with use of multiple assemblies. It is recommended that a dedicated tooling is used for mating / un-mating of multiple connector assemblies in a single operation. 7-1 Allowable Amount of Misalignment Maximum allowable misalignment in X and Y directions is ±0.2 mm total. Refer to the drawings below. Dec.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Length Orientation A310 X1-X2= +- 0.2 Width Orientation 7-2 Recommended Connector Placement It is recommended to leave min. of 30 mm space between the adjacent connector assemblies. 7-3 Examples of Prohibited Placement Positions To assure reliability of solder joints and mating/ un-mating without damage, DO NOT PLACE MULTIPLE CONNECTORS as illustrated below. Y1-Y2= + - 0.2