IT3-100P-26H(04)

High-Speed(10+Gbps) BGA Mezzanine Connectors IT3 Series Hirose’s IT3 mezzanine connector system is as comfortable in today’s data rates of PCIe and XAUI as it is in tomorrow’s 10+Gbps systems. With the ability to transmit differential, singleended, and power through one package and being stackable from 14 – 40mm, IT3 can solve your interface needs for both current and future generations. ■Mechanical features ● Unique 3-piece structure for flexibility ● Stacking heights from 14 to 40mm ● Staggered 1.5mm ∞ 1.75mm ball grid array ● Number of Contacts: 100, 200, &300 signals + 90% additional grounds ● Differential, single-ended, and power ● Low mating/extracting forces ● Wide misalignment tolerances for multiple connector use ● Both of SnPb and Pb-free are available ● Excellent reflow solderability ● IT3 is inter-mateable with IT5 Series Interposer Signal Ground Signal / Ground Configuration ■Signal integrity features ● Insertion loss to Crosstalk Ratio (ICR) 60 0 ICR IEEE spec 50 -10 40 RL (dB) The ICR performance meets the extrapolated IEEE 802.3ap specification for 6.25Gbps with fully-populated pin assignment, and 10 + Gbps with skipped pin assignment. ICR (dB) Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ■Flexibility 30 -20 -30 20 ● Return Loss -40 10 The differential return loss meets the extrapolated IEEE 802.3ap specification up to 12GHz. 0 0 5 10 15 20 -50 RL IEEE Spec 0 5 Frequency (GHz) 10 15 20 Frequency (GHz) ■Stacking height variations 2piece Stacking Height Contact Position 100 14 mm 15 mm 3piece 17 mm 18 mm 20 mm 22 mm 25 mm 26 mm 28 mm 30 mm 32 mm 35 mm 38 mm 40 mm * 200 * 300 * : Under planning In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information. 2017.10⑤ 1 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Product Specifications Current Rating : 1.0A / pin (note 1) Voltage Rating : 50Vrms Storage Temperature Range : -10˚C to +60˚C Rating Item 1. Insulation Resistance 2. Withstanding Voltage Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 3. Contact Resistance Operating Temperature Range: -55˚C to +85˚C Operating Humidity Range: For relative humidity, 90% max (no condensation is permitted) Specification Conditions 1000Mø min. No flashover or insulation breakdown 40mø max. (height 14-15mm) 50mø max. (height 17-24mm) (note 2) 55mø max. (height 25-32mm) (note 2) 60mø max. (height 33-40mm) (note 2) 100V DC 150V duty for 60 seconds (2mA max leak) 100mA 4. Vibration 1) No electrical discontinuity of 1μs or more 2) No damage, crack, or loose part Frequency : 50 to 2000Hz; power spectrum density : 2 0.1G /Hz for 90 minutes in three directions 5. Cyclic Temperature and Humidity 1) Contact resistance change: 20mø or less 2) No damage, crack or loose part 25˚C, 80% RH : 60 min dwell time, 30 min ramp time 65˚C, 50% RH : 60 min dwell time under 24 cycles 6. Durability (Mating/Un-mating) 1) Contact resistance change: 20mø or less 2) No damage, crack or loose part 100 cycles Note1 : Refer to IT3 derating curves on test report TR636E-20041 for power application. Note2 : The value of contact resistance includes 2 contact points and the bulk resistance. ■Materials / Finish ●Receptacle Component Housing(Mounting Side) Housing(Detachable / Mating Side) Locator Contact Solder Ball Tray Pick Up Cap Pick Up Tape Material LCP LCP LCP Copper Alloy Tin-Lead (SnPb) Tin (Pb-Free) Polystyrene Stainless steel Paper (Nomex) Finish & Remarks Black , UL 94V-0 Gray , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm) Other : Nickel (1.5 μm) Sn(63)-Pb(37) Sn(96.5)-Ag(3)-Cu(0.5) Black 300pos 100pos and 200pos ●Interposer Component Guide (Mounting Side) Guide (Detachable/Mating Side) Blade Contact Ground Shield Tray Material PBT LCP PBT LCP Copper Alloy Copper Alloy Polypropylene Finish & Remarks Black , UL 94V-0 Gray , UL 94V-0 Gray , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) Other : Nickel (1.5 μm) ---------- ●Plug Component Housing Locator Contact Solder Ball Tray Pick Up Cap 2 Material LCP LCP Copper Alloy Tin-Lead (SnPb) Tin (Pb-Free) Polystyrene Stainless steel Finish & Remarks Black , UL 94V-0 Black , UL 94V-0 Contact Area : Gold (0.76 μm) over Nickel (1.5 μm) Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm) Other : Nickel (1.5 μm) Sn(63)-Pb(37) Sn(96.5)-Ag(3)-Cu(0.5) Blue 100pos, 200pos and 300pos IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Product Number Structure Refer to the chart below when determining the product specifications from the product number. Please select from the product numbers listed in this catalog when placing orders. ●Receptacle IT 3 ** - *** S - BGA ** (**) ❶ ❷ ❸ ❹ ❺ ❻ ❼ ●Interposer IT 3 ** - *** P - ** H ** (**) ❶ ❷ ❸ ❹ ❽ ❻ ❾ Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. ●Plug IT 3 ** - *** P - ** BGA ** (**) ❶ ❷ ❶ Series name : IT3 ❷ Receptacle Type D : Mating Receptacle D* : Mating Receptacle ( Customized ) M : Mounting Receptacle M* : Mounting Receptacle ( Customized ) Interposer Type Blank : Standard ** : Customized Plug Type M : Plug M* : Plug ( Customized ) ❸ Contact Positions : 100, 200, 300 ❹ Connector type S : Receptacle P : Interposer , Plug ❺ BGA : Ball Grid Array ❻ Package Specification Blank : Standard ** : Customized ❸ ❹ ❽ ❻ ❼ ❼ Material and Plating Specification of Mounting Receptacle, plug Housing : Black (37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) Contact Area : Au(0.76μm)+Ni(1.5μm) (57) : Eutectic Solder Sn(63)-Pb(37) Contact Area : Au(0.76μm)+Ni(1.5μm) Material and Plating Specification of Mating Receptacle Housing : Glay (39) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5) Contact Area : Au(0.76μm)+Ni(1.5μm) (59) : Eutectic Solder Sn(63)-Pb(37) Contact Area : Au(0.76μm)+Ni(1.5μm) ❽ Stacking Height (mm) 14, 15, 17, 18, 20, 22, 25, 26, 28, 30, 32, 35, 38, 40 Plug : 14, 15 Interposer : 17, 40 ❾ Plating Specification of Interposer (03), (04) : Contact Area : Au(0.76μm)+Ni(1.5μm) ■Signal Integrity ●Pin assignment For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the figures below. In the following data, one victim pair and eight aggressor pairs are included. 7 8 9 16 17 18 4 5 6 13 14 15 1 2 3 10 11 12 Mating receptacle side Signal Ground Mounting receptacle side Victim pair Aggressor pair 3 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Impedance profile at 60ps rise time (20-80%) 115 115 110 110 110 105 100 Z (Ohm) 115 Z (Ohm) Z (Ohm) The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles are designed with higher impedance to offset the via’s low impedance. 105 100 100 S11 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 95 0 200 400 600 Time (ps) 800 105 S11 95 1000 0 17mm Height 200 400 600 Time (ps) 800 S11 95 1000 0 25mm Height 200 400 600 Time (ps) 800 1000 32mm Height ●Differential propagation delay Stacking Height (mm) Delay (ps) 17 101.05 25 146.69 32 188.48 ●Differential Insertion Loss 0 0 -1 -1 -2 -2 -2 -3 -3 -3 -4 -4 -4 -5 S (dB) 0 -1 S (dB) S (dB) The differential insertion loss is less than -2dB up to 12GHz. -5 -5 -6 -6 -6 -7 -7 -7 -8 -8 -8 -9 -9 -9 S514 -10 0 5 10 15 S514 -10 20 0 5 17mm Height 10 15 S514 -10 20 0 5 25mm Height 10 15 20 32mm Height ●Differential Return Loss The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.) 0 -10 -20 -20 -20 -30 -50 5 10 Frequency (GHz) 17mm Height 15 -30 -40 RL IEEE Spec 0 RL (dB) -10 -40 4 0 -10 RL (dB) RL (dB) 0 20 -50 -40 RL IEEE Spec 0 5 10 Frequency (GHz) 25mm Height 15 -30 20 -50 RL IEEE Spec 0 5 10 Frequency (GHz) 32mm Height 15 20 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ●Differential Near-End Crosstalk (NEXT) The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT is not as critical because TX and RX can be grouped into separate wafers. 0 0 -10 S51 S52 S53 S54 S56 S57 S58 S59 Sum -30 -40 -50 0 5 10 15 -30 -40 -50 -60 20 0 5 Frequency (GHz) 10 15 S51 S52 S53 S54 S56 S57 S58 S59 Sum -20 -30 -40 -50 -60 20 0 5 Frequency (GHz) 17mm Height 10 15 20 Frequency (GHz) 25mm Height 32mm Height ●Differential Far-End Crosstalk (FEXT) Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower crosstalk can be achieved by skipping pins. 0 0 -10 S141 S142 S143 S144 S146 S147 S148 S149 Sum -30 -40 -50 0 5 10 15 -10 S141 S142 S143 S144 S146 S147 S148 S149 Sum -20 S (dB) S (dB) -20 -60 0 -30 -40 -50 -60 20 0 5 Frequency (GHz) 10 15 S141 S142 S143 S144 S146 S147 S148 S149 Sum -20 S (dB) -10 -30 -40 -50 -60 20 0 5 Frequency (GHz) 17mm Height 10 15 20 Frequency (GHz) 25mm Height 32mm Height ●Insertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE 802.3ap specification up to 12GHz. 60 60 ICR IEEE spec 50 60 ICR IEEE spec 50 40 ICR (dB) 30 30 30 20 20 20 10 10 10 0 0 5 10 15 20 0 ICR IEEE spec 50 40 ICR (dB) 40 ICR (dB) Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. -60 S51 S52 S53 S54 S56 S57 S58 S59 Sum -20 S (dB) S (dB) -20 -10 S (dB) -10 0 0 5 10 15 20 0 0 5 10 15 Frequency (GHz) Frequency (GHz) Frequency (GHz) 17mm Height 25mm Height 32mm Height 20 5 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Receptacle 6.0±0.3 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 19.2±0.5 A±0.5 Shown: 200 position mounting receptacle, IT3M-200S-BGA Unit : mm * Contact Positions 100 (100 signals/90 grounds) 200 (200 signals/180 grounds) 300 (300 signals/270 grounds) 6 Type Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Mating Receptacle Mounting Receptacle Solder Ball Material Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Pb-free (SAC305) solder SnPb solder Part No. IT3D-100S-BGA(39) IT3D-100S-BGA(59) IT3M-100S-BGA(37) IT3M-100S-BGA(57) IT3D-200S-BGA(39) IT3D-200S-BGA(59) IT3M-200S-BGA(37) IT3M-200S-BGA(57) IT3D-300S-BGA(39) IT3D-300S-BGA(59) IT3M-300S-BGA(37) IT3M-300S-BGA(57) HRS No. A 636-0013-1 39 636-0013-1 59 21.0 636-0014-4 37 636-0014-4 57 636-0003-8 39 636-0003-8 59 38.5 636-0004-0 37 636-0004-0 57 636-0007-9 39 636-0007-9 59 56.0 636-0008-1 37 636-0008-1 57 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Interposer 21±0.5 A±0.5 Spacer Spacer IT3-***P-**H(**) IT3M-***S-BGA(**) Mother board B±0.5 Mating Side (1.0 with spacers) 1.4±0.3 (Contact wipe) IT3D-***S-BGA(**) Daughter card 0.9±0.3 Contact wipe Mated connector height : C±0.25 Mounting Side Spacer height : D±0.127 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Mating Side Mounting Side Mating Cross Section Mating condition with spacers Mating condition without spacers Unit : mm * Height (mm) 17 18 20 22 25 26 Part No. HRS No. A IT3-100P-17H(04) IT3-200P-17H(04) IT3-300P-17H(04) IT3-100P-18H(03) IT3-200P-18H(03) IT3-300P-18H(03) IT3-100P-20H(03) IT3-200P-20H(03) IT3-300P-20H(03) IT3-100P-22H(03) IT3-200P-22H(03) IT3-300P-22H(03) IT3-100P-25H(04) IT3-200P-25H(04) IT3-300P-25H(04) IT3-100P-26H(04) IT3-200P-26H(04) IT3-300P-26H(04) 636-0265-4 04 636-0100-4 04 636-0130-5 04 636-0250-7 03 636-0252-2 03 636-0254-8 03 636-0223-4 03 636-0224-7 03 636-0225-0 03 636-0264-1 03 636-0209-3 03 636-0210-2 03 636-0150-2 04 636-0155-6 04 636-0160-6 04 636-0165-0 04 636-0110-8 04 636-0135-9 04 24.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 B C Height D (mm) 15.8 16.6 17.0 16.8 17.6 18.0 28 30 32 18.8 19.6 20.0 35 20.8 21.6 22.0 38 23.8 24.6 25.0 40 Part No. HRS No. A IT3-100P-28H(04) IT3-200P-28H(04) IT3-300P-28H(04) IT3-200P-30H(04) IT3-300P-30H(04) IT3-100P-32H(04) IT3-200P-32H(04) IT3-300P-32H(04) IT3-100P-35H(03) IT3-200P-35H(03) IT3-300P-35H(03) IT3-100P-38H(03) IT3-200P-38H(03) IT3-300P-38H(03) IT3-100P-40H(03) IT3-300P-40H(03) 636-0170-0 04 636-0105-8 04 636-0140-9 04 636-0180-3 04 636-0185-7 04 636-0266-7 04 636-0115-1 04 636-0145-2 04 636-0239-4 03 636-0240-3 03 636-0241-6 03 636-0200-9 03 636-0195-0 03 636-0190-7 03 636-0230-0 03 636-0175-3 03 24.0 41.5 59.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 24.0 41.5 59.0 24.0 59.0 B C D 26.8 27.6 28.0 28.8 29.6 30.0 30.8 31.6 32.0 33.8 34.6 35.0 36.8 37.6 38.0 38.8 39.6 40.0 24.8 25.6 26.0 7 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors ■Plug 24±0.5 B±0.5 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 21±0.5 A±0.5 Shown : 200 position mounting plug, IT3M-200P-15BGA * Height (mm) 8 Solder Ball Material 14 Pb-Free(SAC305) solder 15 Pb-Free(SAC305) solder Sn-Pb solder Pb-Free(SAC305) solder Sn-Pb solder Pb-Free(SAC305) solder Sn-Pb solder Part No. IT3M-100P-14BGA(37) IT3M-200P-14BGA(37) IT3M-300P-14BGA(37) IT3M-100P-15BGA(37) IT3M-100P-15BGA(57) IT3M-200P-15BGA(37) IT3M-200P-15BGA(57) IT3M-300P-15BGA(37) IT3M-300P-15BGA(57) Unit : mm HRS No. A B 636-0511-9 37 636-0508-4 37 636-0507-1 37 636-0504-3 37 636-0504-3 57 636-0505-6 37 636-0505-6 57 636-0506-9 37 636-0506-9 57 24.0 41.5 59.0 13.15 24.0 41.5 59.0 14.15 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BPCB footprint (mounting foot pattern) 1 2 (27.2) (29.2) 1 2 (27.2) (29.2) 1 1.5 0.75 X 0.875 1.75 A 1 (5.73) 1 (B) 2 (6.73) 2 (C) 0.875 Mounting Receptacle - IT3M Plug Ø0.6±0.03 Ø0.1 X Y Signal Ground Column No.1 No.n 13.5 (7.85) 0.875 Y (6.85) X 1 W U R N L J G E C A 2 V T P M K H F D B 1.5 Row 0.75 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. B D F H K M P T V Y A C E G J L N R U W (7.85) Row (6.85) Column No.1 No.n 13.5 Ground 2 Ø0.6±0.03 Ø0.1 X Y Signal 1.75 A 1 (5.73) 1 (B) 2 (6.73) 2 (C) 0.875 Mating Receptacle - IT3D 1 Minimum clearance for all devices 2 Minimum clearance for sensitive devices Unit : mm * Dimension A B C 100 15.75 28.10 30.10 200 33.25 45.60 47.60 300 50.75 63.10 65.10 9 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BSpacers Spacers are required to support the PWB’s and protect the BGA solder joints. Stacking Height Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Spacers Suggested spacer style is shown below : Spacer, male-male, M3 thread The recommended spacer height corresponds to the interposer stacking height as shown in the chart below : Stacking Height 14 mm 15 mm 17 mm 18 mm 20 mm 22 mm 25 mm 26 mm 28 mm 30 mm 32 mm 35 mm 38 mm 40 mm Recommended Spacer Height 14 +/-0.127 mm 15 +/-0.127 mm 17 +/-0.127 mm 18 +/-0.127 mm 20 +/-0.127 mm 22 +/-0.127 mm 25 +/-0.127 mm 26 +/-0.127 mm 28 +/-0.127 mm 30 +/-0.127 mm 32 +/-0.127 mm 35 +/-0.127 mm 38 +/-0.127 mm 40 +/-0.127 mm 1050mm 1050mm Two spacers located diagonally are minimally required. Some applications may require 4 spacers. Spacers should be located 10 – 50 mm from the corners of the receptacles to prevent excessive mechanical loading on the interconnections. If assembly will be subjected to vibration, spacers should be located to prevent resonance, and additional spacers may be required. Recommended Spacer Location 10 ¢(#* CdceaViZYi]gdj\]]daZ IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BInterposer installation Position interposer directly over mounting receptacle, aligning the polarity chamfers. If positioned properly, the interposer should slide easily onto the mounting receptacle. Place installation cap onto interposer and push straight down to engage the locking latches. Manual Installation Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. *Installation caps are available upon request for manual operation Press firmly on installation cap only, not on wafers or interposer body Locking Latch Always support PWB from underside to prevent flexing BDaughter card installation After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align the spacer holes in the daughter card with the threads on the spacers. The spacers help align the mating receptacle with the interposer. If positioned correctly, the mating receptacle will slip down into the interposer. Push directly down on the assembly to lock the mating receptacle in place. Install nuts onto the spacer threads. Tighten nuts to specified torque. BDaughter card removal To remove a daughter card, first remove the nuts from the reinforcing spacers, then lift the daughter card straight off the interposers, as shown right. 11 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BInterposer removal Interposer Removal by Hand 1) Hold the Interposer Assembly on the walls without locking latches Locking Latch 2) Gently rotate one side of the Interposer Assembly laterally 10° maximum 10dMAX Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Caution: do not rotate more than 10 degrees 3) While gently rotating, pull up on other side of the Interposer Assembly 4) The Interposer Assembly is removed, and the Mounting Receptacle is ready to accept another Interposer Assembly. An interposer removal tool is also available. This tool is not an interposer installation cap, so please do not use it to install an interposer. Doing so may damage an interposer. Interposer Removal with Tool 1) Cover the interposer Assembly with the interposer removal tool 2) Gently rotate one side of the Interposer Assembly laterally 10° maximum using the tool Locking Latch 10°MAX Caution: do not rotate more than 10 degrees 3) While gently rotating, pull up on other side of the tool 4) The Interposer Assembly is removed, as it is inside the tool Precaution Visually inspect the interposer before reinstalling it. Discard if it shows any sign of damage or wear. Do not subject the interposer assembly to more than five removal-reinstallation cycles, even if it appears unaffected. 12 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. BAssembly reflow soldering profile Parameters Eutectic (SnPb) Pb-Free Comment Preheat Ramp Rate 2 - 3ç/sec 2 - 3ç/sec Other components may limit ramp rate to 2ç/sec Soak Time 0 - 120 sec 0 - 120 sec Soak Temperature 140 - 180ç 160 - 215ç Peak Reflow Temperature 205 - 225ç 230 - 250ç Time Above Liquidus (TAL) 30 - 90 sec 45 - 120 sec Cooling Rate >6ç/sec >6ç/sec Maximum Package Body Temperature (T) 240ç 260ç 10ç 10ç 5 sec 5 sec Maximum Delta T between Body and PWB at Liquidus Package Body Exposure Limit at Maximum Temperature Soak requirements determined by board design, oven capability, and paste activation requirements Caution - "oversoaking" may exhaust flux and affect soldering Cooler peak temperatures may require longer TAL's Shorter TAL's may require higher peak temperatures Faster cooling rates produce finer grain structures and smoother joint appearances Open body design allows for low delta T between package and solder joint Standard practice is easy to achieve with open body design Adjust profile if maximum exposure limit is approached or exceeded Reflow Profile Different solder pastes have different thermal performance characteristics. Consult with paste manufacturer for optimum profile settings. Check thermal exposure limits of PWB laminate if processing with Pb-free solder. BMating self alignment BMating tolerance Unit : mm * +/-0.8 Due to its 3-piece design, the IT3 connector system can accept mating tolerances of up to ±0.3mm tolerance in the X-axis and up to ±0.2mm in the Y-axis. +/-0.6 +/-0.3 X-direction +/-0.2 Y-direction X-direction Y-direction 13 IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BPackaging information Please order per box with its Minimum Order Quantity (MOQ) of connectors contained. The number for each configuration is shown below. ●Receptacles Unit : pcs IT 3* - ***S - BGA(**) (1) (2) (1) (2) M D ●Plug 100 200 300 120 120 72 72 48 48 IT 3* - ***P - BGA(**) (1) (2) Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Dry package and deoxidizer Box Ex.) 240pcs of IT3M-300S-BGA(57) (= 5 of vacuum packed boxes) Cushion materials Three trays + One empty tray as lid Bundle BPackaging information ●Interposers IT 3 - ***P - **H(**) (3) Unit : pcs (4) (3) (4) 17 18 20 22 25 26 28 30 32 35 38 40 100 200 300 100 100 100 100 100 100 50 80 80 80 80 80 80 40 40 40 40 40 60 60 60 60 60 60 30 30 30 30 30 30 ---------- 50 50 50 50 ---------- This is also a packaging quantity, therefore please multiply integrally based on this MOQ quantity when you place more. Box Cushion materials One or two trays (depending on height) +One empty tray as lid 14 Bundle IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors BTray information BTray information (con’t) 8]Vb[Zg8dccZXidg8dajbc& (& (& (& (& (& (& (& (#- (&*¤%#* JEDEC Tray for IT3M 100 Position Receptacles and plug (& (& (& (& (& M( *&#, '-#'* *&#, *&#, *&#, N( &-#,* ('#- ('#- IVeZ (#- (&*¤%#* (#- JEDEC Tray for IT3M 200 Position Receptacles and plug M( ,,#+ ,,#+ JEDEC Tray for IT3D 200 Position Receptacles M( 8]Vb[Zg8dccZXidg8dajbc& )&#& N( ,,#+ ,,#+ (&*¤%#* 8Ve JEDEC Tray for IT3M 300 Position Receptacles and plug (#- 8]Vb[Zg8dccZXidg8dajbc& )&#& N( ('#- &-#,* ,,#+ ('#- ('#- &(*#.¤%#* ('#('#- (#- IVeZ (&*¤%#* ('#- &-#,* ,,#+ 8]Vb[Zg8dccZXidg8dajbc& '-#'* N  ( ('#- &(*#.¤%#* *&#, ('#- *&#, ('#- *&#, N( IVeZ &(*#.¤%#* *&#, ('#- &-#,* *&#, 8]Vb[Zg8dccZXidg8dajbc& &- (&*¤%#* 8]Vb[Zg8dccZXidg8dajbc& *&#, (& JEDEC Tray for IT3D 100 Position Receptacles M( &(*#.¤%#* Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. (& &(*#.¤%#* ('#- ('#- &(*#.¤%#* IVeZ (#- M( (& N( &- ('#- &-#,* (& ('#- (& ('#- &-#,* (& ('#- M( (&*¤%#* 8Ve JEDEC Tray for IT3D 300 Position Receptacles 15 Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved. IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors USA: HIROSE ELECTRIC (U.S.A.), INC. HEADQUARTERS CHICAGO OFFICE 2300 Warrenville Road, Suite 150, Downers Grove, IL 60515 Phone : +1-630-282-6700 http://www.hirose.com/us/ USA: HIROSE ELECTRIC (U.S.A.), INC. SAN JOSE OFFICE 2841 Junction Ave, Suite 200 San Jose, CA. 95134 Phone : +1-408-253-9640 Fax : +1-408-253-9641 http://www.hirose.com/us/ USA: HIROSE ELECTRIC (U.S.A.), INC. DETROIT OFFICE (AUTOMOTIVE) 17197 N. Laurel Park Drive, Suite 253, Livonia, MI 48152 Phone : +1-734-542-9963 Fax : +1-734-542-9964 http://www.hirose.com/us/ USA: HIROSE ELECTRIC (U.S.A.), INC. BOSTON OFFICE 300 Brickstone Square Suite 201, Andover, MA 01810 Phone : +1-978-662-5255 THE NETHERLANDS: HIROSE ELECTRIC EUROPE B.V. Hogehillweg #8 1101 CC Amsterdam Z-O Phone : +31-20-6557460 Fax : +31-20-6557469 http://www.hirose.com/eu/ GERMANY: HIROSE ELECTRIC EUROPE B.V. GERMAN BRANCH Schoenbergstr. 20, 73760 ostfildern Phone : +49-711-456002-1 Fax : +49-711-456002-299 http://www.hirose.com/eu/ GERMANY: HIROSE ELECTRIC EUROPE B.V. NUREMBERG OFFICE Neumeyerstrasse 22-26, 90411 Nurnberg Phone : +49-911 32 68 89 63 Fax : +49-911 32 68 89 69 http://www.hirose.com/eu/ GERMANY: HIROSE ELECTRIC EUROPE B.V. HANOVER OFFICE Bayernstr. 3, Haus C 30855 Langenhagen, Germany Phone : +49-511 97 82 61 30 Fax : +49-511 97 82 61 35 http://www.hirose.com/eu/ FRANCE: HIROSE ELECTRIC EUROPE B.V. PARIS OFFICE 130 Avenue Joseph Kessel, Bat E, 78960 Voisins le Bretonneux, France Phone : +33-1-85764886 Fax : +33-1-85764823 http://www.hirose.com/eu/ UNITED KINGDOM: HIROSE ELECTRIC EUROPE BV (UK BRANCH) 4 Newton Court, Kelvin Drive, Knowlhill, Milton Keynes, MK5 8NH Phone : +44-1908 202050 Fax : +44-1908 202058 http://www.hirose.com/eu/ CHINA: HIROSE ELECTRIC (SHANGHAI) CO., LTD. 18, Enterprise Center Tower 2, 209# Gong He Road, Jing’an District, Shanghai, CHINA 200070 Phone : +86-21-6391-3355 Fax : +86-21-6391-3335 http://www.hirose.com/cn/ CHINA: HIROSE ELECTRIC (SHANGHAI) CO.,LTD. BEIJING BRANCH A1001, Ocean International Center, Building 56# East 4th Ring Middle Road, ChaoYang District, Beijing, 100025 Phone : +86-10-5165-9332 Fax : +86-10-5908-1381 http://www.hirose.com/cn/ CHINA: HIROSE ELECTRIC TECHNOLOGIES (SHENZHEN) CO., LTD. Room 09-13, 19/F, Office Tower Shun Hing Square, Di Wang Commercial Centre, 5002 Shen Nan Dong Road, Shenzhen City, Guangdong Province, 518008 Phone : +86-755-8207-0851 Fax : +86-755-8207-0873 http://www.hirose.com/cn/ HONG KONG: HIROSE ELECTRIC HONGKONG TRADING CO., LTD. Room 1001, West Wing, Tsim Sha Tsui Centre, 66 Mody Road, Tsim Sha Tsui East, Kowloon, Hong Kong Phone : +852-2803-5338 Fax : +852-2591-6560 http://www.hirose.com/hk/ TAIWAN: HIROSE ELECTRIC TAIWAN CO., LTD. 103 8F, No.87, Zhengzhou Rd., Taipei Phone : +886-2-2555-7377 Fax : +886-2-2555-7355 http://www.hirose.com/tw/ KOREA: HIROSE KOREA CO.,LTD. 143, Gongdan 1-daero, Siheung-si, Gyeonggi-do, 15084, Korea Phone : +82-31-496-7000 Fax : +82-31-496-7100 http://www.hirose.co.kr/ SINGAPORE: INDIA: HIROSE ELECTRIC SINGAPORE PTE. LTD. DELHI LIAISON OFFICE HIROSE ELECTRIC SINGAPORE PTE. LTD. 03, Anson Road, #20-01, Springleaf Tower, Office NO.552, Regus-Green Boulevard, Level5, Tower C, Sec62, Plot B-9A, Block B, Noida, 201301, Uttar Pradesh, India Singapore 079909 Phone : +91-12-660-8018 Phone : +65-6324-6113 Fax : +91-120-4804949 Fax : +65-6324-6123 http://www.hirose.com/sg/ http://www.hirose.com/sg/ INDIA: HIROSE ELECTRIC SINGAPORE PTE. LTD. BANGALORE LIAISON OFFICE Unit No-403, 4th Floor, No-84, Barton Centre, Mahatma Gandhi (MG) Road, Bangalore 560 001, Karnataka, India Phone : +91-80-4120 1907 Fax : +91-80-4120 9908 http://www.hirose.com/sg/ MALAYSIA: THAILAND: PENANG REPRESENTATIVE OFFICE BANGKOK OFFICE (REPRESENTATIVE OFFICE) 73-3-1, Ideal@The One, Jalan Mahsuri, Bayan Unit 4703, 47th FL., 1 Empire Tower, South Sathorn Road, Yannawa, Sathorn, Bangkok 10120 Thailand Lepas Penang, 11950, Malaysia Phone : +66-2-686-1255 Phone : +604-648-5536 Fax : +66-2-686-3433 http://www.hirose.com/sg/ http://www.hirose.com/sg/ ® 16 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN TEL: +81-45-620-3526 Fax: +81-45-591-3726 http://www.hirose.com http://www.hirose-connectors.com The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 10/2017. Contents are subject to change without notice for the purpose of improvements.