BTE-120-06-H-D

BASIC BLADE & BEAM HEADER & SOCKET (0.80 mm) .0315" PITCH • BTE/BSE SERIES BTE BTE Mates: BSE BSE - NO. OF POSITIONS PER ROW - –020, –040,–060, –080, –100, –120 Mates: BTE SPECIFICATIONS Insulator Material: Liquid Crystal Polymer Contact Material: Phosphor Bronze Plating: Au or Sn over 50 µ" (1.27 µm) Ni Current Rating: 2 A per pin (2 pins powered) Operating Temp Range: -55 °C to +125 °C Voltage Rating: 225 VAC with 5 mm Stack Height Max Cycles: 100 LEAD STYLE Specify LEAD STYLE from chart -D-A- –F (5.97) .235 A BSE - NO. OF POSITIONS PER ROW - 01 - –020, –040, –060, –080, –100, –120 MOQ Required 30 µ" (0.76 µm) Gold Edge Mount Capability Friction Lock option 11 mm, 14 mm, 16.10 mm, 19.10 mm, 22 mm, 25 mm and 30 mm Stack Height (Caution: Some automatic placement/ inspection machines may have component height restrictions. Please consult machinery specifications.) = (7.00 mm) .275" DIA Polyimide Film Pick & Place Pad –L = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –TR = Tape & Reel (80 positions maximum) A MATED HEIGHT –01 (4.27) .168 LEAD STYLE MATED HEIGHT* –02 (7.21) .284 PLATING OPTION –L = 10 µ" (0.25 µm) Gold on contact, Matte Tin on tail –C* EXTENDED LIFE PRODUCT –01 (5.00 mm) .1971" –02 (8.00 mm) .315" *Processing conditions will affect mated height. –F = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails (*–C Plating passes 10 year MFG testing) (7.24) .285 –FR = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) (80 positions maximum) LEAD STYLE = Gold Flash on contact, Matte Tin on tail No. of positions x (0.80) .0315 + (5.27) .2075 OTHER OPTION –K = Gold Flash on contact, Matte Tin on tail = Electro-Polished Selective 50 µ" (1.27 µm) min Au over 150 µ" (3.81 µm) Ni on Signal Pins in contact area, Matte Tin over 50 µ" (1.27 µm) min Ni on all solder tails (*–C Plating passes 10 year MFG testing) No. of positions x (0.80) .0315 + (4.00) .1575 ALSO AVAILABLE 10 YEAR MFG WITH 50 µ" GOLD PLATING OPTION –C* PROCESSING Lead-Free Solderable: Yes SMT Lead Coplanarity: (0.10 mm) .004" max (020-080) (0.15 mm) .006" max (100-120)* *(.004" stencil solution may be available; contact IPG@samtec.com) Board Stacking: For applications requiring more than two connectors per board or 80 positions or higher, contact ipg@samtec.com - -D-A- OTHER OPTION –TR = Tape & Reel (80 positions maximum) –FR = Full Reel Tape & Reel (must order maximum quantity per reel; contact Samtec for quantity breaks) (80 positions maximum) (3.25) .128 HIGH MATING CYCLES Note: Some lengths, styles and options are non-standard, non-returnable. (3.05) .120 samtec.com?BTE or samtec.com?BSE Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-221