ZA1-30-2-1.00-Z-10

® HIGH-SPEED COMPRESSION INTERPOSER (0.80 mm) .0315" AND (1.00 mm) .0394" PITCH FEATURES & BENEFITS • Dual compression contacts or single compression with solder balls • BeCu Micro-formed contacts • Performance up to 14 Gbps (ZAX Series) • Low-profile body height for a short signal path • Highly customizable solutions • Visit samtec.com?ZRDP for ultra-low profile Z-Ray® cable assembly Solder Ball Option BeCu Compression Contacts Design & Construction Adhesive-Bonded Cover Film • One-piece design assembled into rugged low profile FR4 substrate under high pressure and temperature BeCu Compression Contacts • Built standard with a 1 mm board-to-board thickness Core PCB • Contacts are designed using BeCu foils that have been formed into the“beam” structure BeCu Compression Contacts Adhesive Adhesive Adhesive-Bonded Cover Film PERFORMANCE SPECIFICATIONS Single Compression w/ Solder Balls Dual Compression Series ZA8 ZA1 ZA8 ZA1 Pitch 0.80 mm 1.00 mm 0.80 mm 1.00 mm 25 20 50 58 Max Row Max Column 25 20 50 58 Thickness FR4 Core 1.00 to 3 mm 1.00 to 3 mm 0.5 to 3 mm 0.5 to 3 mm Thickness Tolerance FR4 Core ±10% ±10% ±10% ±10% Deflection / Normal Force per Pin Operating Temperature F-221 (Rev 17JUN21) 0.20 mm / 30g - 55˚C to +105˚C (Single Cycle only above 85˚C) samtec.com/ZRAY Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. ® 14 (1.00 mm) .0394" PITCH • HIGH-SPEED COMPRESSION INTERPOSER ZA1 - POSITIONS PER ROW - TERMINATION –10, –20, –30, –40 –1 =Single Compression with Solder Balls (-10 & -20 positions only) - HEIGHT - –1.00 PLATING OPTION - –Z = (1.00 mm) .040" Height - NO. OF ROWS –10 = 6 µ" (0.15 µm) Gold in contact area (Termination -1 only) = Ten Rows –1 = Lead –2 –2 = Dual Compression (-10, -20, -30 & -40 positions only) = Lead-Free A POSITIONS PER ROW A B -10 (14.30) .563 (11.40) .449 A 40 X 10 DUAL COMPRESSION (1.00) B .039 A APPLICATION (11.00) A .433 SOLDER TYPE (1.00) .039 -20 (24.30) .957 (21.40) .843 -30 (38.30) 1.508 N/A -40 (48.30) 1.902 N/A (1.09) .043 B (11.00) B .433 (1.09) .043 B (11.00) .433 (11.00) .433 20 X 10 DUAL COMPRESSION 20 X 10 COMPRESSION WITH SOLDER BALLS 10 X 10 COMPRESSION WITH SOLDER BALLS Dual compression or single compression with solder balls View complete specifications at: samtec.com?ZA1 Ultimate Design Flexibility • Configurations for any application, complete with detailed footprints • Customer-specific stack heights, pin counts, insulator shapes and plating thicknesses • Customizable in X-Y-Z axes • Quick-turn customization with minimal NRE and tooling charges Z-Ray® interposers are highly customizable and are available in a wide variety of custom geometries and pin counts. • Various compression and alignment configurations samtec.com/ZRAY Unless otherwise approved in writing by Samtec, all parts and components are designed and built according to Samtec’s specifications which are subject to change without notice. F-221 (Rev 17JUN21)