High-Speed(10+Gbps) BGA Mezzanine Connectors
IT3 Series
Hirose’s IT3 mezzanine connector system is as
comfortable in today’s data rates of PCIe and
XAUI as it is in tomorrow’s 10+Gbps systems.
With the ability to transmit differential, singleended, and power through one package and
being stackable from 14 – 40mm, IT3 can solve
your interface needs for both current and future
generations.
■Mechanical features
● Unique 3-piece structure for flexibility
● Stacking heights from 14 to 40mm
● Staggered 1.5mm ∞ 1.75mm ball grid array
● Number of Contacts: 100, 200, &300 signals
+ 90% additional grounds
● Differential, single-ended, and power
● Low mating/extracting forces
● Wide misalignment tolerances for multiple
connector use
● Both of SnPb and Pb-free are available
● Excellent reflow solderability
● IT3 is inter-mateable with IT5 Series
Interposer
Signal
Ground
Signal / Ground Configuration
■Signal integrity features
● Insertion loss to Crosstalk Ratio (ICR)
60
0
ICR
IEEE spec
50
-10
40
RL (dB)
The ICR performance meets the
extrapolated IEEE 802.3ap
specification for 6.25Gbps with
fully-populated pin assignment,
and 10 + Gbps with skipped pin
assignment.
ICR (dB)
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
■Flexibility
30
-20
-30
20
● Return Loss
-40
10
The differential return loss meets
the extrapolated IEEE 802.3ap
specification up to 12GHz.
0
0
5
10
15
20
-50
RL
IEEE Spec
0
5
Frequency (GHz)
10
15
20
Frequency (GHz)
■Stacking height variations
2piece
Stacking Height
Contact Position
100
14
mm
15
mm
3piece
17
mm
18
mm
20
mm
22
mm
25
mm
26
mm
28
mm
30
mm
32
mm
35
mm
38
mm
40
mm
*
200
*
300
* : Under planning
In cases where the application will demand a high level of reliability, such as automotive,
please contact a company representative for further information.
2017.10⑤
1
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Product Specifications
Current Rating : 1.0A / pin (note 1)
Voltage Rating : 50Vrms
Storage Temperature Range : -10˚C to +60˚C
Rating
Item
1. Insulation Resistance
2. Withstanding Voltage
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
3. Contact Resistance
Operating Temperature Range: -55˚C to +85˚C
Operating Humidity Range: For relative humidity,
90% max (no condensation is permitted)
Specification
Conditions
1000Mø min.
No flashover or insulation breakdown
40mø max. (height 14-15mm)
50mø max. (height 17-24mm) (note 2)
55mø max. (height 25-32mm) (note 2)
60mø max. (height 33-40mm) (note 2)
100V DC
150V duty for 60 seconds (2mA max leak)
100mA
4. Vibration
1) No electrical discontinuity of 1μs or more
2) No damage, crack, or loose part
Frequency : 50 to 2000Hz; power spectrum density :
2
0.1G /Hz for 90 minutes in three directions
5. Cyclic Temperature
and Humidity
1) Contact resistance change: 20mø or less
2) No damage, crack or loose part
25˚C, 80% RH : 60 min dwell time, 30 min ramp time
65˚C, 50% RH : 60 min dwell time under 24 cycles
6. Durability
(Mating/Un-mating)
1) Contact resistance change: 20mø or less
2) No damage, crack or loose part
100 cycles
Note1 : Refer to IT3 derating curves on test report TR636E-20041 for power application.
Note2 : The value of contact resistance includes 2 contact points and the bulk resistance.
■Materials / Finish
●Receptacle
Component
Housing(Mounting Side)
Housing(Detachable / Mating Side)
Locator
Contact
Solder Ball
Tray
Pick Up Cap
Pick Up Tape
Material
LCP
LCP
LCP
Copper Alloy
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Paper (Nomex)
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Black
300pos
100pos and 200pos
●Interposer
Component
Guide (Mounting Side)
Guide (Detachable/Mating Side)
Blade
Contact
Ground Shield
Tray
Material
PBT
LCP
PBT
LCP
Copper Alloy
Copper Alloy
Polypropylene
Finish & Remarks
Black , UL 94V-0
Gray , UL 94V-0
Gray , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
----------
●Plug
Component
Housing
Locator
Contact
Solder Ball
Tray
Pick Up Cap
2
Material
LCP
LCP
Copper Alloy
Tin-Lead (SnPb)
Tin (Pb-Free)
Polystyrene
Stainless steel
Finish & Remarks
Black , UL 94V-0
Black , UL 94V-0
Contact Area : Gold (0.76 μm) over Nickel (1.5 μm)
Mounting Area : Gold (0.05 μm) over Nickel (1.5 μm)
Other
: Nickel (1.5 μm)
Sn(63)-Pb(37)
Sn(96.5)-Ag(3)-Cu(0.5)
Blue
100pos, 200pos and 300pos
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Product Number Structure
Refer to the chart below when determining the product specifications from the product number.
Please select from the product numbers listed in this catalog when placing orders.
●Receptacle
IT 3 ** - *** S - BGA ** (**)
❶
❷
❸
❹
❺
❻
❼
●Interposer
IT 3 ** - *** P - ** H ** (**)
❶
❷
❸
❹
❽
❻
❾
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
●Plug
IT 3 ** - *** P - ** BGA ** (**)
❶
❷
❶ Series name : IT3
❷ Receptacle Type
D
: Mating Receptacle
D* : Mating Receptacle ( Customized )
M
: Mounting Receptacle
M* : Mounting Receptacle ( Customized )
Interposer Type
Blank : Standard
** : Customized
Plug Type
M
: Plug
M* : Plug ( Customized )
❸ Contact Positions : 100, 200, 300
❹ Connector type
S : Receptacle
P : Interposer , Plug
❺ BGA : Ball Grid Array
❻ Package Specification
Blank : Standard
** : Customized
❸
❹
❽
❻
❼
❼ Material and Plating Specification of Mounting Receptacle, plug
Housing : Black
(37) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76μm)+Ni(1.5μm)
(57) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76μm)+Ni(1.5μm)
Material and Plating Specification of Mating Receptacle
Housing : Glay
(39) : Pb-free Solder Sn(96.5)-Ag(3.0)-Cu(0.5)
Contact Area : Au(0.76μm)+Ni(1.5μm)
(59) : Eutectic Solder Sn(63)-Pb(37)
Contact Area : Au(0.76μm)+Ni(1.5μm)
❽ Stacking Height (mm)
14, 15, 17, 18, 20, 22, 25, 26, 28, 30, 32, 35, 38, 40
Plug : 14, 15
Interposer : 17, 40
❾ Plating Specification of Interposer
(03), (04) : Contact Area : Au(0.76μm)+Ni(1.5μm)
■Signal Integrity
●Pin assignment
For the fully-populated pin assignment, adjacent pins are grouped into differential pairs as shown in the
figures below. In the following data, one victim pair and eight aggressor pairs are included.
7
8
9
16
17
18
4
5
6
13
14
15
1
2
3
10
11
12
Mating receptacle side
Signal
Ground
Mounting receptacle side
Victim pair
Aggressor pair
3
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
●Impedance profile at 60ps rise time (20-80%)
115
115
110
110
110
105
100
Z (Ohm)
115
Z (Ohm)
Z (Ohm)
The impedance profiles (of connector only) for the center pair are shown below. The IT3 receptacles
are designed with higher impedance to offset the via’s low impedance.
105
100
100
S11
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
95
0
200
400
600
Time (ps)
800
105
S11
95
1000
0
17mm Height
200
400
600
Time (ps)
800
S11
95
1000
0
25mm Height
200
400
600
Time (ps)
800
1000
32mm Height
●Differential propagation delay
Stacking Height (mm)
Delay (ps)
17
101.05
25
146.69
32
188.48
●Differential Insertion Loss
0
0
-1
-1
-2
-2
-2
-3
-3
-3
-4
-4
-4
-5
S (dB)
0
-1
S (dB)
S (dB)
The differential insertion loss is less than -2dB up to 12GHz.
-5
-5
-6
-6
-6
-7
-7
-7
-8
-8
-8
-9
-9
-9
S514
-10
0
5
10
15
S514
-10
20
0
5
17mm Height
10
15
S514
-10
20
0
5
25mm Height
10
15
20
32mm Height
●Differential Return Loss
The connector-only differential return loss for the center pair meets the extrapolated IEEE 802.3ap
spec up to 12GHz. (The attenuation of PCB traces in the channel will give an even larger margin.)
0
-10
-20
-20
-20
-30
-50
5
10
Frequency (GHz)
17mm Height
15
-30
-40
RL
IEEE Spec
0
RL (dB)
-10
-40
4
0
-10
RL (dB)
RL (dB)
0
20
-50
-40
RL
IEEE Spec
0
5
10
Frequency (GHz)
25mm Height
15
-30
20
-50
RL
IEEE Spec
0
5
10
Frequency (GHz)
32mm Height
15
20
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
●Differential Near-End Crosstalk (NEXT)
The near-end crosstalk at the center pair from surrounding 8 aggressors is shown below. The NEXT
is not as critical because TX and RX can be grouped into separate wafers.
0
0
-10
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-30
-40
-50
0
5
10
15
-30
-40
-50
-60
20
0
5
Frequency (GHz)
10
15
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-20
-30
-40
-50
-60
20
0
5
Frequency (GHz)
17mm Height
10
15
20
Frequency (GHz)
25mm Height
32mm Height
●Differential Far-End Crosstalk (FEXT)
Low far-end crosstalk at the center pair from surrounding 8 aggressors is observed. Even lower
crosstalk can be achieved by skipping pins.
0
0
-10
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-30
-40
-50
0
5
10
15
-10
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-20
S (dB)
S (dB)
-20
-60
0
-30
-40
-50
-60
20
0
5
Frequency (GHz)
10
15
S141
S142
S143
S144
S146
S147
S148
S149
Sum
-20
S (dB)
-10
-30
-40
-50
-60
20
0
5
Frequency (GHz)
17mm Height
10
15
20
Frequency (GHz)
25mm Height
32mm Height
●Insertion-Loss-to-Crosstalk-Ratio (ICR) for FEXT
The insertion-loss-to-crosstalk-ratio (ICR) for 8-aggressor FEXT meets the extrapolated IEEE
802.3ap specification up to 12GHz.
60
60
ICR
IEEE spec
50
60
ICR
IEEE spec
50
40
ICR (dB)
30
30
30
20
20
20
10
10
10
0
0
5
10
15
20
0
ICR
IEEE spec
50
40
ICR (dB)
40
ICR (dB)
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
-60
S51
S52
S53
S54
S56
S57
S58
S59
Sum
-20
S (dB)
S (dB)
-20
-10
S (dB)
-10
0
0
5
10
15
20
0
0
5
10
15
Frequency (GHz)
Frequency (GHz)
Frequency (GHz)
17mm Height
25mm Height
32mm Height
20
5
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Receptacle
6.0±0.3
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
19.2±0.5
A±0.5
Shown: 200 position mounting receptacle, IT3M-200S-BGA
Unit : mm
*
Contact Positions
100
(100 signals/90 grounds)
200
(200 signals/180 grounds)
300
(300 signals/270 grounds)
6
Type
Mating
Receptacle
Mounting
Receptacle
Mating
Receptacle
Mounting
Receptacle
Mating
Receptacle
Mounting
Receptacle
Solder Ball Material
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Pb-free (SAC305) solder
SnPb solder
Part No.
IT3D-100S-BGA(39)
IT3D-100S-BGA(59)
IT3M-100S-BGA(37)
IT3M-100S-BGA(57)
IT3D-200S-BGA(39)
IT3D-200S-BGA(59)
IT3M-200S-BGA(37)
IT3M-200S-BGA(57)
IT3D-300S-BGA(39)
IT3D-300S-BGA(59)
IT3M-300S-BGA(37)
IT3M-300S-BGA(57)
HRS No.
A
636-0013-1 39
636-0013-1 59
21.0
636-0014-4 37
636-0014-4 57
636-0003-8 39
636-0003-8 59
38.5
636-0004-0 37
636-0004-0 57
636-0007-9 39
636-0007-9 59
56.0
636-0008-1 37
636-0008-1 57
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Interposer
21±0.5
A±0.5
Spacer
Spacer
IT3-***P-**H(**)
IT3M-***S-BGA(**)
Mother board
B±0.5
Mating Side
(1.0 with spacers)
1.4±0.3 (Contact wipe)
IT3D-***S-BGA(**) Daughter card
0.9±0.3
Contact wipe
Mated connector height : C±0.25
Mounting Side
Spacer height : D±0.127
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Mating Side
Mounting Side
Mating Cross Section
Mating condition with spacers
Mating condition without spacers
Unit : mm
*
Height
(mm)
17
18
20
22
25
26
Part No.
HRS No.
A
IT3-100P-17H(04)
IT3-200P-17H(04)
IT3-300P-17H(04)
IT3-100P-18H(03)
IT3-200P-18H(03)
IT3-300P-18H(03)
IT3-100P-20H(03)
IT3-200P-20H(03)
IT3-300P-20H(03)
IT3-100P-22H(03)
IT3-200P-22H(03)
IT3-300P-22H(03)
IT3-100P-25H(04)
IT3-200P-25H(04)
IT3-300P-25H(04)
IT3-100P-26H(04)
IT3-200P-26H(04)
IT3-300P-26H(04)
636-0265-4 04
636-0100-4 04
636-0130-5 04
636-0250-7 03
636-0252-2 03
636-0254-8 03
636-0223-4 03
636-0224-7 03
636-0225-0 03
636-0264-1 03
636-0209-3 03
636-0210-2 03
636-0150-2 04
636-0155-6 04
636-0160-6 04
636-0165-0 04
636-0110-8 04
636-0135-9 04
24.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
B
C
Height
D
(mm)
15.8 16.6 17.0
16.8 17.6 18.0
28
30
32
18.8 19.6 20.0
35
20.8 21.6 22.0
38
23.8 24.6 25.0
40
Part No.
HRS No.
A
IT3-100P-28H(04)
IT3-200P-28H(04)
IT3-300P-28H(04)
IT3-200P-30H(04)
IT3-300P-30H(04)
IT3-100P-32H(04)
IT3-200P-32H(04)
IT3-300P-32H(04)
IT3-100P-35H(03)
IT3-200P-35H(03)
IT3-300P-35H(03)
IT3-100P-38H(03)
IT3-200P-38H(03)
IT3-300P-38H(03)
IT3-100P-40H(03)
IT3-300P-40H(03)
636-0170-0 04
636-0105-8 04
636-0140-9 04
636-0180-3 04
636-0185-7 04
636-0266-7 04
636-0115-1 04
636-0145-2 04
636-0239-4 03
636-0240-3 03
636-0241-6 03
636-0200-9 03
636-0195-0 03
636-0190-7 03
636-0230-0 03
636-0175-3 03
24.0
41.5
59.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
24.0
41.5
59.0
24.0
59.0
B
C
D
26.8 27.6 28.0
28.8 29.6 30.0
30.8 31.6 32.0
33.8 34.6 35.0
36.8 37.6 38.0
38.8 39.6 40.0
24.8 25.6 26.0
7
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
■Plug
24±0.5
B±0.5
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
21±0.5
A±0.5
Shown : 200 position mounting plug, IT3M-200P-15BGA
*
Height
(mm)
8
Solder Ball Material
14
Pb-Free(SAC305) solder
15
Pb-Free(SAC305) solder
Sn-Pb solder
Pb-Free(SAC305) solder
Sn-Pb solder
Pb-Free(SAC305) solder
Sn-Pb solder
Part No.
IT3M-100P-14BGA(37)
IT3M-200P-14BGA(37)
IT3M-300P-14BGA(37)
IT3M-100P-15BGA(37)
IT3M-100P-15BGA(57)
IT3M-200P-15BGA(37)
IT3M-200P-15BGA(57)
IT3M-300P-15BGA(37)
IT3M-300P-15BGA(57)
Unit : mm
HRS No.
A
B
636-0511-9 37
636-0508-4 37
636-0507-1 37
636-0504-3 37
636-0504-3 57
636-0505-6 37
636-0505-6 57
636-0506-9 37
636-0506-9 57
24.0
41.5
59.0
13.15
24.0
41.5
59.0
14.15
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BPCB footprint (mounting foot pattern)
1
2
(27.2)
(29.2)
1
2
(27.2)
(29.2)
1
1.5
0.75
X
0.875
1.75
A
1
(5.73)
1
(B)
2
(6.73)
2
(C)
0.875
Mounting Receptacle - IT3M
Plug
Ø0.6±0.03
Ø0.1 X Y
Signal
Ground
Column
No.1
No.n
13.5
(7.85)
0.875
Y
(6.85)
X
1
W
U
R
N
L
J
G
E
C
A
2
V
T
P
M
K
H
F
D
B
1.5
Row
0.75
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
B
D
F
H
K
M
P
T
V
Y
A
C
E
G
J
L
N
R
U
W
(7.85)
Row
(6.85)
Column
No.1
No.n
13.5
Ground
2
Ø0.6±0.03
Ø0.1 X Y
Signal
1.75
A
1
(5.73)
1
(B)
2
(6.73)
2
(C)
0.875
Mating Receptacle - IT3D
1
Minimum clearance for all devices
2
Minimum clearance for sensitive devices
Unit : mm
*
Dimension
A
B
C
100
15.75
28.10
30.10
200
33.25
45.60
47.60
300
50.75
63.10
65.10
9
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BSpacers
Spacers are required to support the PWB’s and protect the BGA solder joints.
Stacking
Height
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Spacers
Suggested spacer style is shown below :
Spacer, male-male, M3 thread
The recommended spacer height corresponds to the interposer stacking height as shown in the
chart below :
Stacking Height
14 mm
15 mm
17 mm
18 mm
20 mm
22 mm
25 mm
26 mm
28 mm
30 mm
32 mm
35 mm
38 mm
40 mm
Recommended Spacer Height
14 +/-0.127 mm
15 +/-0.127 mm
17 +/-0.127 mm
18 +/-0.127 mm
20 +/-0.127 mm
22 +/-0.127 mm
25 +/-0.127 mm
26 +/-0.127 mm
28 +/-0.127 mm
30 +/-0.127 mm
32 +/-0.127 mm
35 +/-0.127 mm
38 +/-0.127 mm
40 +/-0.127 mm
1050mm
1050mm
Two spacers located diagonally are minimally
required. Some applications may require 4 spacers.
Spacers should be located 10 – 50 mm from the
corners of the receptacles to prevent excessive
mechanical loading on the interconnections.
If assembly will be subjected to vibration, spacers
should be located to prevent resonance, and
additional spacers may be required.
Recommended Spacer Location
10
¢(#*
CdceaViZYi]gdj\]]daZ
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BInterposer installation
Position interposer directly over mounting receptacle, aligning the polarity chamfers.
If positioned properly, the interposer should slide easily onto the mounting receptacle.
Place installation cap onto interposer and push straight down to engage the locking latches.
Manual Installation
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
*Installation caps are available upon
request for manual operation
Press firmly on installation cap only,
not on wafers or interposer body
Locking
Latch
Always support PWB from
underside to prevent flexing
BDaughter card installation
After the interposer is mounted, install spacers onto motherboard. To install mating receptacle, align
the spacer holes in the daughter card with the threads on the spacers.
The spacers help align the mating receptacle with
the interposer. If positioned correctly, the mating
receptacle will slip down into the interposer.
Push directly down on the assembly to lock the
mating receptacle in place. Install nuts onto the
spacer threads. Tighten nuts to specified torque.
BDaughter card removal
To remove a daughter card, first remove
the nuts from the reinforcing spacers,
then lift the daughter card straight off
the interposers, as shown right.
11
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BInterposer removal
Interposer Removal by Hand
1) Hold the Interposer Assembly on the walls
without locking latches
Locking
Latch
2) Gently rotate one side of the Interposer
Assembly laterally 10° maximum
10dMAX
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
Caution: do not rotate more than 10 degrees
3) While gently rotating, pull up on other side of the
Interposer Assembly
4) The Interposer Assembly is removed, and the
Mounting Receptacle is ready to accept another
Interposer Assembly.
An interposer removal tool is also available. This tool is not an interposer installation cap, so please do not
use it to install an interposer. Doing so may damage an interposer.
Interposer Removal with Tool
1) Cover the interposer Assembly with the
interposer removal tool
2) Gently rotate one side of the Interposer
Assembly laterally 10° maximum using the tool
Locking
Latch
10°MAX
Caution: do not rotate more than 10 degrees
3) While gently rotating, pull up on other side of the
tool
4) The Interposer Assembly is removed, as it is
inside the tool
Precaution
Visually inspect the interposer before reinstalling it. Discard if it shows any sign of damage or wear.
Do not subject the interposer assembly to more than five removal-reinstallation cycles, even if it
appears unaffected.
12
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
BAssembly reflow soldering profile
Parameters
Eutectic (SnPb)
Pb-Free
Comment
Preheat Ramp Rate
2 - 3ç/sec
2 - 3ç/sec
Other components may limit ramp rate to 2ç/sec
Soak Time
0 - 120 sec
0 - 120 sec
Soak Temperature
140 - 180ç
160 - 215ç
Peak Reflow Temperature
205 - 225ç
230 - 250ç
Time Above Liquidus (TAL)
30 - 90 sec
45 - 120 sec
Cooling Rate
>6ç/sec
>6ç/sec
Maximum Package Body Temperature (T)
240ç
260ç
10ç
10ç
5 sec
5 sec
Maximum Delta T between Body and
PWB at Liquidus
Package Body Exposure Limit
at Maximum Temperature
Soak requirements determined by board design,
oven capability, and paste activation requirements
Caution - "oversoaking" may exhaust flux and
affect soldering
Cooler peak temperatures may require longer
TAL's
Shorter TAL's may require higher peak
temperatures
Faster cooling rates produce finer grain
structures and smoother joint appearances
Open body design allows for low delta T between
package and solder joint
Standard practice is easy to achieve with open
body design
Adjust profile if maximum exposure limit is
approached or exceeded
Reflow Profile
Different solder pastes have
different thermal performance
characteristics. Consult with
paste manufacturer for optimum
profile settings.
Check thermal exposure limits of
PWB laminate if processing with
Pb-free solder.
BMating self alignment
BMating tolerance
Unit : mm
*
+/-0.8
Due to its 3-piece design, the IT3 connector
system can accept mating tolerances of up to
±0.3mm tolerance in the X-axis and up to
±0.2mm in the Y-axis.
+/-0.6
+/-0.3
X-direction
+/-0.2
Y-direction
X-direction
Y-direction
13
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BPackaging information
Please order per box with its Minimum Order Quantity (MOQ) of connectors contained.
The number for each configuration is shown below.
●Receptacles
Unit : pcs
IT 3* - ***S - BGA(**)
(1)
(2)
(1)
(2)
M
D
●Plug
100
200
300
120
120
72
72
48
48
IT 3* - ***P - BGA(**)
(1)
(2)
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
This is also a packaging quantity,
therefore please multiply integrally
based on this MOQ quantity when
you place more.
Dry package and deoxidizer
Box
Ex.) 240pcs of IT3M-300S-BGA(57)
(= 5 of vacuum packed boxes)
Cushion
materials
Three trays
+ One empty tray as lid
Bundle
BPackaging information
●Interposers
IT 3 - ***P - **H(**)
(3)
Unit : pcs
(4)
(3)
(4)
17
18
20
22
25
26
28
30
32
35
38
40
100
200
300
100
100
100
100
100
100
50
80
80
80
80
80
80
40
40
40
40
40
60
60
60
60
60
60
30
30
30
30
30
30
----------
50
50
50
50
----------
This is also a packaging quantity,
therefore please multiply integrally
based on this MOQ quantity when
you place more.
Box
Cushion
materials
One or two trays (depending on height)
+One empty tray as lid
14
Bundle
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
BTray information
BTray information (con’t)
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Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
(&
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15
Jan.1.2020 Copyright 2020 HIROSE ELECTRIC CO., LTD. All Rights Reserved.
IT3 Series●High-Speed(10+Gbps) BGA Mezzanine Connectors
USA:
HIROSE ELECTRIC (U.S.A.), INC. HEADQUARTERS CHICAGO OFFICE
2300 Warrenville Road, Suite 150,
Downers Grove, IL 60515
Phone : +1-630-282-6700
http://www.hirose.com/us/
USA:
HIROSE ELECTRIC (U.S.A.), INC. SAN JOSE OFFICE
2841 Junction Ave, Suite 200
San Jose, CA. 95134
Phone : +1-408-253-9640
Fax : +1-408-253-9641
http://www.hirose.com/us/
USA:
HIROSE ELECTRIC (U.S.A.), INC. DETROIT OFFICE (AUTOMOTIVE)
17197 N. Laurel Park Drive, Suite 253,
Livonia, MI 48152
Phone : +1-734-542-9963
Fax : +1-734-542-9964
http://www.hirose.com/us/
USA:
HIROSE ELECTRIC (U.S.A.), INC. BOSTON OFFICE
300 Brickstone Square Suite 201,
Andover, MA 01810
Phone : +1-978-662-5255
THE NETHERLANDS:
HIROSE ELECTRIC EUROPE B.V.
Hogehillweg #8 1101 CC Amsterdam Z-O
Phone : +31-20-6557460
Fax : +31-20-6557469
http://www.hirose.com/eu/
GERMANY:
HIROSE ELECTRIC EUROPE B.V. GERMAN BRANCH
Schoenbergstr. 20, 73760 ostfildern
Phone : +49-711-456002-1
Fax : +49-711-456002-299
http://www.hirose.com/eu/
GERMANY:
HIROSE ELECTRIC EUROPE B.V. NUREMBERG OFFICE
Neumeyerstrasse 22-26, 90411 Nurnberg
Phone : +49-911 32 68 89 63
Fax : +49-911 32 68 89 69
http://www.hirose.com/eu/
GERMANY:
HIROSE ELECTRIC EUROPE B.V. HANOVER OFFICE
Bayernstr. 3, Haus C 30855 Langenhagen, Germany
Phone : +49-511 97 82 61 30
Fax : +49-511 97 82 61 35
http://www.hirose.com/eu/
FRANCE:
HIROSE ELECTRIC EUROPE B.V. PARIS OFFICE
130 Avenue Joseph Kessel, Bat E, 78960
Voisins le Bretonneux, France
Phone : +33-1-85764886
Fax : +33-1-85764823
http://www.hirose.com/eu/
UNITED KINGDOM:
HIROSE ELECTRIC EUROPE BV (UK BRANCH)
4 Newton Court, Kelvin Drive, Knowlhill,
Milton Keynes, MK5 8NH
Phone : +44-1908 202050
Fax : +44-1908 202058
http://www.hirose.com/eu/
CHINA:
HIROSE ELECTRIC (SHANGHAI) CO., LTD.
18, Enterprise Center Tower 2, 209# Gong He
Road, Jing’an District, Shanghai, CHINA 200070
Phone : +86-21-6391-3355
Fax : +86-21-6391-3335
http://www.hirose.com/cn/
CHINA:
HIROSE ELECTRIC (SHANGHAI) CO.,LTD. BEIJING BRANCH
A1001, Ocean International Center, Building 56# East 4th
Ring Middle Road, ChaoYang District, Beijing, 100025
Phone : +86-10-5165-9332
Fax : +86-10-5908-1381
http://www.hirose.com/cn/
CHINA:
HIROSE ELECTRIC TECHNOLOGIES (SHENZHEN) CO., LTD.
Room 09-13, 19/F, Office Tower Shun Hing Square, Di Wang Commercial Centre,
5002 Shen Nan Dong Road, Shenzhen City, Guangdong Province, 518008
Phone : +86-755-8207-0851
Fax : +86-755-8207-0873
http://www.hirose.com/cn/
HONG KONG:
HIROSE ELECTRIC HONGKONG TRADING CO., LTD.
Room 1001, West Wing, Tsim Sha Tsui Centre, 66
Mody Road, Tsim Sha Tsui East, Kowloon, Hong Kong
Phone : +852-2803-5338
Fax : +852-2591-6560
http://www.hirose.com/hk/
TAIWAN:
HIROSE ELECTRIC TAIWAN CO., LTD.
103 8F, No.87, Zhengzhou Rd., Taipei
Phone : +886-2-2555-7377
Fax : +886-2-2555-7355
http://www.hirose.com/tw/
KOREA:
HIROSE KOREA CO.,LTD.
143, Gongdan 1-daero, Siheung-si,
Gyeonggi-do, 15084, Korea
Phone : +82-31-496-7000
Fax : +82-31-496-7100
http://www.hirose.co.kr/
SINGAPORE:
INDIA:
HIROSE ELECTRIC SINGAPORE PTE. LTD. DELHI LIAISON OFFICE
HIROSE ELECTRIC SINGAPORE PTE. LTD.
03, Anson Road, #20-01, Springleaf Tower, Office NO.552, Regus-Green Boulevard, Level5, Tower C,
Sec62, Plot B-9A, Block B, Noida, 201301, Uttar Pradesh, India
Singapore 079909
Phone : +91-12-660-8018
Phone : +65-6324-6113
Fax : +91-120-4804949
Fax : +65-6324-6123
http://www.hirose.com/sg/
http://www.hirose.com/sg/
INDIA:
HIROSE ELECTRIC SINGAPORE PTE. LTD. BANGALORE LIAISON OFFICE
Unit No-403, 4th Floor, No-84, Barton Centre, Mahatma
Gandhi (MG) Road, Bangalore 560 001, Karnataka, India
Phone : +91-80-4120 1907
Fax : +91-80-4120 9908
http://www.hirose.com/sg/
MALAYSIA:
THAILAND:
PENANG REPRESENTATIVE OFFICE
BANGKOK OFFICE (REPRESENTATIVE OFFICE)
73-3-1, Ideal@The One, Jalan Mahsuri, Bayan Unit 4703, 47th FL., 1 Empire Tower, South Sathorn
Road, Yannawa, Sathorn, Bangkok 10120 Thailand
Lepas Penang, 11950, Malaysia
Phone : +66-2-686-1255
Phone : +604-648-5536
Fax : +66-2-686-3433
http://www.hirose.com/sg/
http://www.hirose.com/sg/
®
16
2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN
TEL: +81-45-620-3526 Fax: +81-45-591-3726
http://www.hirose.com
http://www.hirose-connectors.com
The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use.
The contents of this catalog are current as of date of 10/2017. Contents are subject to change without notice for the purpose of improvements.
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