DF30FB-50DP-0.4V(82)

0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors DF30 Series Space-saving design Connector footprint is minimized. 0) (0.4 (0.90) (3 . 76 ) 56 ( 4. 22) (10. ) Features High contact reliability 1. High-density mounting This connector offers a space-saving design that reduces the connector footprint. The low stacking height of 0.9mm is highly suited for applications that require a low mounted height. (Fig.1) 2. High contact reliability DF30*-*DP-0.4V Projections on the header terminals increase the wiping ability and provide superior mating reliability. During mating, the projections of the header terminals produce a tactile click, which helps to confirm proper insertion. (Fig.2) 3. Self-alignment feature A self-alignment range of 0.3mm is provided on the receptacle and allows for easier mating in tight spaces. (Fig.3) DF30*-*DS-0.4V Projections on the header strengthen mating retention. 4. Wide selection of pin counts Standard pin counts are 20, 22, 24, 30, 34, 40, 50, 60, 70, and 80 positions. Smaller pin counts are also available that are applicable to LCD and camera modules in cell phones. Mated height: 0.9 mm Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Fig.1 Fig.2 Wide self-alignment range: 0.3 mm 5. Suitable for automatic mounting Although this connector is extremely small, it still has a sufficient vacuum area for pick-and-place machines to hold the part. Receptacle area : 1.12mm Header area : 1.11mm 0.3mm Fig.3 In cases where the application will demand a high level of reliability, such as automotive, please contact a company representative for further information. 2021.12r 1 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Product Specifications Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Rating Operating temperature range : -35ç to 85ç (Note 1) Rated current 0.3A Rated voltage 30V AC Operating humidity range : Relative humidity 20% to 80% Item 1. Insulation resistance 2. Withstanding voltage 3. Contact resistance Specification 50Mø min. No flashover or insulation breakdown. 100mø max. 4. Vibration No electrical discontinuity of 1µs or more 5. Humidity Contact resistance : 100mø max. Insulation resistance : 25Mø min. 6. Temperature cycle Contact resistance : 100mø max. Insulation resistance : 50Mø min. Storage temperature range -10ç to 60ç (Note 2) Storage humidity range Relative humidity 40% to 70% (Note 2) Conditions 100V DC 100V AC / 1 minute 100 mA Frequency : 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis 96 hours at temperature of 40ç±2ç and RH of 90% to 95% Temperature : -55ç➝+5ç to +35ç➝+85ç➝+5ç to +35ç Duration : 30➝10➝30➝10(Minutes) 5 cycles 7. Durability Contact resistance : 100 mø max. (insertions/withdrawals) 50 cycles 8. Resistance to soldering heat Reflow : At the recommended temperature profile Manual soldering: 350ç for 3 seconds No deformation of components affecting performance. Note 1 : Includes temperature rise caused by current flow. Note 2 : The term "storage" refers to products stored for long period of time prior to mounting and use. Operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Materials Connectors Receptacles and Headers Component Insulator Contacts Material LCP Phosphor bronze Finish Color : Black Gold plated Product Number Structure Receptacles and Headers DF30 FC * DS - 0.4 q w e r t V (**) y u qSeries name: DF30 tContact pitch : 0.4mm wConfiguration yTermination section FC/RC : Without metal fittings, without bosses V : Straight SMT eNumber of contacts : 20, 22, 24, 30, 34, 40, 50, 60, 70, 80 uPackaging (81) : Embossed tape packaging (5,000 pcs/reel) rConnector type DS : Double row receptacle (82) : Embossed tape packaging (1,000 pcs/reel) DP : Double row header 2 Remarks UL94V-0 ------------- DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Receptacles A B Note 2 3.76 P=0.4 C 0.15 Flat surface HRS logo 0.08 0.9 CAV. NO. HRS No. DF30FC-20DS-0.4V(**) DF30FC-22DS-0.4V(**) DF30FC-24DS-0.4V(**) DF30FC-30DS-0.4V(**) DF30FC-34DS-0.4V(**) DF30FC-40DS-0.4V(**) DF30FC-50DS-0.4V(**) DF30FC-60DS-0.4V(**) DF30FC-70DS-0.4V(**) DF30FC-80DS-0.4V(**) 684-1109-8 ** 684-1110-7 ** 684-1111-0 ** 684-1112-2 ** 684-1113-5 ** 684-1078-6 ** 684-1114-8 ** 684-1082-3 ** 684-1115-0 ** 684-1116-3 ** A B C 6.22 3.6 6.62 4.0 7.02 4.4 8.22 5.6 9.02 6.4 10.22 7.6 12.22 9.6 14.22 11.6 16.22 13.6 18.22 15.6 RoHS BRecommended PCB mounting pattern B ±0.02 P=0.4±0.02 1.2 1.36 1.6 2.0 2.4 2.8 3.2 4.86 +0.05 0 Part No. Yes 0.23±0.02 Recommended solder paste thickness: 120 μm Note 1 : Order by number of reels. Note 2 : Receptacles with 24 or fewer contacts positions will not have recessed areas. Header A B 2.32 3.12 P=0.4 Note 2 [Specification number] -**, (**) (81) : Embossed tape packaging (5,000 pcs/reel) (82) : Embossed tape packaging (1,000 pcs/reel) Note 2 A CAV. NO. C 0.15 Flat surface HRS logo 0.08 0.8 Unit : mm HRS No. DF30RC-20DP-0.4V(**) DF30RC-22DP-0.4V(**) DF30RC-24DP-0.4V(**) DF30RC-30DP-0.4V(**) DF30RC-34DP-0.4V(**) DF30RC-40DP-0.4V(**) DF30RC-50DP-0.4V(**) DF30RC-60DP-0.4V(**) DF30FC-70DP-0.4V(**) DF30FC-80DP-0.4V(**) 684-1268-1 ** 684-1269-4 ** 684-1270-3 ** 684-1271-6 ** 684-1272-9 ** 684-1273-1 ** 684-1275-7 ** 684-1276-0 ** 684-1077-3 ** 684-1144-9 ** A B 5.14 3.6 5.54 4.0 5.94 4.4 7.14 5.6 7.94 6.4 9.14 7.6 11.14 9.6 13.14 11.6 15.14 13.6 17.14 15.6 C RoHS BRecommended PCB mounting pattern 1.2 B ±0.02 P=0.4±0.02 1.36 1.6 2.0 2.4 2.8 3.2 Yes 0 2-0.05 Part No. No. of contacts 20 22 24 30 34 40 50 60 70 80 3.42 +0.05 0 Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Unit : mm No. of contacts 20 22 24 30 34 40 50 60 70 80 0 3.46 -0.05 4.56 [Specification number] -**, (**) (81) : Embossed tape packaging (5,000 pcs/reel) (82) : Embossed tape packaging (1,000 pcs/reel) 0.23±0.02 Note 1 : Order by number of reels. Recommended solder paste thickness: 120 μm Note 2 : Receptacles with 24 or fewer contacts positions will not have recessed areas. 3 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Packaging Specification Embossed Carrier Tape Dimensions - Receptacle Reel Dimensions 0.2 3± Unreeling direction A Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Ø380±2 Ø80±1 PS A B±0.1 A±0.3 A .1 +00 F Part number label Ø1 4±0.1 8±0.1 2±0.1 C±0.1 5 Ø1. 1.75±0.1 F-F (1.7) 1.4±0.15 0.3±0.1 D±0.5 E±1 G-G H F 0.2±0.05 G G Unreeling direction Unit : mm .1 +0 0 H 75 . R0 R0 .7 5 Part No. DF30#-20DS-0.4V(**) DF30#-22DS-0.4V(**) DF30#-24DS-0.4V(**) DF30#-30DS-0.4V(**) DF30#-34DS-0.4V(**) DF30#-40DS-0.4V(**) DF30#-50DS-0.4V(**) DF30#-60DS-0.4V(**) DF30#-70DS-0.4V(**) DF30#-80DS-0.4V(**) + 0 0 .1 A B 16.0 C D E 7.5 17.5 21.5 11.5 25.5 29.5 14.2 33.5 37.5 — 24.0 32.0 28.4 Embossed tape 32mm or wider will have perforated feed holes on two sides. Embossed Carrier Tape Dimensions - Header Reel Dimensions E-E 0.2 Part number label 3± Unreeling direction Ø380±2 A A A±0.3 PS Ø80±1 E Ø1 1.75±0.1 (1.6) 1.3±0.15 0.3±0.1 B±0.1 .1 +00 5 8±0.1 2±0.1 A Ø1. 4±0.1 C±0.5 D±1 E Unreeling direction F F F-F Unit : mm Part No. DF30#-20DP-0.4V(**) DF30#-22DP-0.4V(**) DF30#-24DP-0.4V(**) DF30#-30DP-0.4V(**) DF30#-34DP-0.4V(**) DF30#-40DP-0.4V(**) DF30#-50DP-0.4V(**) DF30#-60DP-0.4V(**) DF30#-70DP-0.4V(**) DF30#-80DP-0.4V(**) 4 A B C D 16.0 7.5 17.5 21.5 24.0 11.5 25.5 29.5 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Usage Recommendations 1. Recommended temperature ● Ordinary solder cream Temperature(ç) profile 250 240 220 200 150 10 to 20 sec. Soldering 60 to 90 sec. Preheating 100 ● Lead-free solder cream Temperature(ç) Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Time (seconds) 10 seconds or less 250 230 200 150 60 seconds or less Soldering 150 60 to 120 sec. Preheating 100 Time (seconds) Note 1 : Up to 2 cycles of Reflow soldering are possible under the same conditions, provided that there is a return to normal temperature between the first and second cycle. Note 2 : The temperature profile indicates the board surface temperature at the point of contacts with the connector terminals. 2. Recommended manual soldering Manual soldering : 340±10ç for 3 seconds 3. Recommended screen thickness Thickness : 0.12mm and open area ratio (Pattern area ratio) 4. Board warpage Opening are ratio : DS side 100%, DP side 84% Maximum of 0.02mm at the connector center, with both ends of the connector as reference points. 5. Cleaning conditions 6. Precautions Please refer to the “Handbook on the Use of Wire-to-Board Connectors”. ■ Terminals are exposed on the header side. Please note that touching them with bare hands causes contact failure or static electricity, resulting in damage to the components. ■ Note that mating/unmating when the product is not mounted on the PCB could cause damage or deformation of the terminal. ■ Avoid supporting the PCB using only the connectors. Other means of support are needed. ■ Care should be taken that excessive prying during mating/unmating could cause damage. ■ In the case of hand soldering, please do not apply any flux, which could cause flux wicking. ■ The product may differ slightly in color due to different production lots of the resin. This color variation has no influence on the performance. ■ Please refer to the next page for the precautions for mating/unmating. ■ Care should be taken to secure the mated connector and FPC within the device with housings and cushioning materials. This will help prevent disconnections or unmating in the event of dropping, other external forces or stressed routing of the FPC. 5 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Handling Precautions when mating the connectors DF30*-*DS-0.4V(**) Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. DF30*-*DP-0.4V(**) 0.3mm 0.3mm Receptacle Keep the connectors parallel to each other when positioning. Header Do not attempt to mate the connectors starting at one end or side. Press-down evenly until slight resistance is felt. Overcoming this slight resistance will complete the mating of receptacle with the header. A definite "click" sensation will confirm the fully mated condition. 6 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Handling Precautions when un-mating the connectors DF30*-*DS-0.4V(**) Fully mated DF30*-*DP-0.4V(**) Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Receptacle Lift even one side, keeping both boards parallel to each other. Header Fig. A Fig. B When handling circumstances prevent the connector from being kept level during un-mating, one end may be lifted separate as shown on Fig. A. However, to utilize this procedure the connector must be mounted on a sufficiently rigid circuit board. Any deflection of the board during this operation may result in damage to the connector or solder joints. Do not attempt the start of the un-mating of the connectors from one side (Fig. B). When removal is from the width orientation as illustrated in the diagram to the left, damage could be caused to the connector. Do not perform removal from the width orientation. 7 DF30 Series●0.4mm Pitch, 0.9mm Height, Board-to-Board / Board-to-FPC Connectors Nov.1.2022 Copyright 2022 HIROSE ELECTRIC CO., LTD. All Rights Reserved. MEMO : 2-6-3,Nakagawa Chuoh,Tsuzuki-Ku,Yokohama-Shi 224-8540,JAPAN https://www.hirose.com/ 8 The characteristics and the specifications contained herein are for reference purpose. Please refer to the latest customer drawings prior to use. The contents of this catalog are current as of date of 12/2021. Contents are subject to change without notice for the purpose of improvements.