IT5M1-300P-25H(03)

PC Card Single Slot SMT Connectors for the AV Market (that Support 5 V Cards) IC15 Series Reliable card ejection ■Features Stroke: 11.7mm Card ejection distance 6mm min Ejection distance, molded-in guide Low friction 2-point card ejection Equipment outline Three-stage card ejection 1. Reliable card ejection Designed for the front mounted Audio/Visual equipment the connectors eject the inserted card by applying force equally at each edge of the card (distance of 6 mm minimum), allowing easy hold of the card for the final removal. IC15: When card is inserted. The button does not protrude without the card being inserted, preventing it’s damage when carrying the portable devices. 3. Secure board retention Built-in 4 points of board retention posts assure that the card insertion shock is not transferred to the solder joints. 4. Supports lead-free environments All components use lead-free materials. ■Applications DVD recorders, LCD TVs, PDP and other digital AV equipment IC15: When card is not inserted. Button does not protrude. Button does not protrude. In use Press ejection button. Ejection button pressed by mistake. Button is released, protrudes for card ejection. Button is inserted. Card is ready for ejection 2. New three-stage “Pop-Up” card ejection mechanism A60 IC15A Ejection button does not protrude. Press ejection button. Card is ready for ejection Damage prevention of ejection button. Card ejected ■Product Specifications Current rating Ratings Voltage rating 0.5A 125V AC Item Operating temperature range -55ç to +85ç (Note 1) Storage temperature range Relative humidity 95% max. Operating humidity range Storage humidity range (No condensation) Specifications -40ç to +70ç (Note 1) 40% to 70% (Note 1) Conditions 11. Insulation resistance 12. Withstanding voltage 13. Contact resistance 100 Mø min. No flashover or insulation breakdown. 60 mø max. (Initial value) 14. Vibration No electrical discontinuity of 100 ns or more. 15. Humidity Insulation resistance: 100 Mø min. 16. Temperature cycle Insulation resistance: 100 Mø min. 17. Durability (mating/unmating) Contact resistance: 20mø max. from initial value 18.Resistance to soldering heat No deformation of any component. No affect on contacts. 500 V DC 500 V AC / one minute 1mA DC Frequency: 10 to 2000 Hz, single amplitude of 1.52 mm or acceleration of 147m/s2 (peak), 4 hours / 3 axis 96 hours at temperature of 40ç±2ç and humidity of 90% to 95% Temperature: -55ç ➝ +5ç to +35ç ➝ +85ç ➝ +5ç to +35ç Duration: 30 ➝ 5 max. ➝ 30 ➝ 5 max. (Minutes) 5 cycles 10000 cycles at 400 to 600 cycles per hour Reflow: At the recommended temperature profile Manual soldering: 300 ç for 3 seconds Note 1: Includes temperature rise caused by current flow. Note 2: The term ”storage” refers to products stored for long period of time prior to mounting and use. Operating Temperature Range and Humidity range covers non- conducting condition of installed connectors in storage, shipment or during transportation. ■Materials/Finish SMT unit Material Finish Remarks Insulator Component Heat resistant thermoplastic compound UL94V-0 Contacts Brass Color: Black Contact area: Gold plated Termination area: Tin plated ------------Tin plated Ground/eject metal fittings Positioning pin Stainless steel Brass ------------------------------------- Guide unit Component Material Finish Remarks Frame Cover/Metal components Spring Ejection button PBT Stainless Stainless steel ABS Color: Black ------------------------Color: Gray UL94V-0 ------------------------UL94V-HB Note: Lead free products A61 ■Ordering information ● SMT unit IC15 A - PDR - SF M - EJL 1 2 3 4 5 6 1 Series name: IC15 4 SF: Right angle surface mount 2 Stand off height A: 2.2mm 5 M: With Vacuum pick-up plate 6 3 Terminal type PDR: Reverse type (5V type) Ejection button type EJL: Left button eject ● Guide unit IC15 A - G - P EJL 7 7 Series name:IC15 8 Stand off height A: 2.2mm 9 G: Guide unit 8 9 10 11 10 Eject mechanism codes P: Pop-up button 11 Ejection button type EJL: Left button eject Note: One SMT unit and one Guide unit constitute one assembly. They can not be ordered separate. A62 ■Reverse type Left Pop-up button type 3 Eject metal components movable range 2.6 59.5 No.35 No.2 No.36 35.75MAX No.34 SMT unit ( 1 ) No.1 10MAX 9.9(Card ejected) Eject metal components movable range 51.45 59.1(Mounting screw pitch) 8 3 1.8(Ejector pushed-in for card withdrawal) 56MAX 86.1(Card fully inserted) A 2.4 71.5 85.6(PC card length) PAL 39MIN 20.5 11MAX 6 8MAX No.68 15L 3 7 54(PC card width) Guide unit ( 2 ) 28.2 Outline of the PC card 37MAX 29MIN Eject metal components movable range No.68 C No.35 8.2 10MAX 5 4.9 No.36 No.34 Stand off height 2.2mm No.2 No.1 SMT unit (1) Part Number Guide unit (2) CL No. IC15A-PDR-SF-EJL CL640-1500-7 IC15A-PDR-SFM-EJL CL640-1502-2 Part Number CL No. IC15A-G-PEJL CL640-1503-5 Weight (g) 18.4 18.7 1: Above illustration shows the SMT unit and the Guide unit connected together. 2: Dimensions for card fitting are in accordance with “PC card standard”. 3 Indicated dimensions are symmetrical to the center of the card insertion slot. A63 BPCB mounting pattern ● Reverse type ● Stand off 2.2mm 2.65±0.05 55.05±0.05 1 Mounting area (12.35) 16.75±0.05 (4.4) 52.4±0.05 Ø2 55.85±0.05 Ø1.9 +0.1 0 (Plated +0.1 0 through hole) (Plated through hole) 55.75±0.05 3.35±0.05 2-Ø2 10MIN .8 Metal fitting mounting area C 1 52.9MAX 1 59.1±0.05 1 66.8MIN Note 1 Indicated dimensions are symmetrical to the center of the card insertion slot. BPCB mounting pattern (Enlarged detail) 47.4725±0.05 4.9275±0.05 No.68 No.34 2±0.1 2±0.1 ● Reverse type 68-0.37±0.03 P=0.635±0.03 Ø1.65±0.05 A64 No.1 No.2 No.35 Ø1.65±0.05 +0.1 0 .4 Ø1.9 Ø2 .4 Edge of the inserted PC card BMethod of Attachment to the Board and Precautions (1) Exercise caution when handling the Guide unit. (1) If needed, re-position the push rod or the stroke arm as indicated in Fig.1 Guide unit SMT unit 15L A A Stroke arm Push rod PAL PCB outline Fig. 1 (2 : 1) (2 : 1) A A Interference Interference Fig. 2 A65 (2) Align the left and right locking tabs (Fig. 4) of the Guide unit shield plate with the left and right openings on the SMT unit 15L insulator. (Fig. 3) Shield plate A Pushrod Stroke arm PAL Fig. 3 Opening A Locking tabs Protrusions SMT unit PCB Fig. 4 A66 Shield plate (3) Assuring the correct alignment firmly press-down the shield plate of the Guide unit (at the areas “A”) into the SMT unit until a loud “click” sound is heard. Both units should be now firmly locked together. 15L Area A Spring area – do not touch A Area A Note 1: When placing the Guide unit over the SMT unit, DO NOT press on any other area than “A”. (4) Attach the Guide unit in two places using recommended screws (Not supplied). PAL Screw description Recommended Fastening Torque M2∞0.4 0.12~0.16 (N • m) Note 2: When attaching the screws exercise caution not to deform the shield plate. Note 3: Do not insert/eject the PC card before the SMT unit and the Guide unit are fully mounted and locked. Note 4: Metal components of these connector assemblies have sharp edges. Use caution when handling and assembling. Note 5: Slight tool marks or cleaning fluid residue on the surfaces of the Guide unit will not affect form, fit or function of the assemblies. A67 BRecommended temperature profile 250ç(PEAK) 250 220ç Temperature(ç) 200 170ç 150 150ç 60s(MAX) 100 60~120s 50 25ç 0 START Time (Seconds) ● Recommended conditions • Reflow system: IR reflow • Solder composition: Paste, 96.5%Sn/3.0%Ag/0.5%Cu (Flux content 10.5wt%) • Test board: Glass epoxy 80mm∞125mm∞1.6mm thick • Metal mask: 0.15mm thick The temperature profiles are based on the above conditions. In individual applications the actual temperature may vary, depending on solder paste type, volume/thickness and board size/thickness. Consult your solder paste and equipment manufacturer for specific recommendations. A68