GHDR-32V-S

Page No. ER07-A055 This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. PRODUCT SPECIFICATION Customer: Title Subject: Revised: RESPIRONICS 1/14 Date Issued: March 26, 2007 Date Revised: Issued by: GHD CONNECTOR Osaka Engineering Center This product specification contains the results of performance tests for GHD connector. -Index1. 2. 3. 4. 5. 6. 7. 8. PART NAME, PART NUMBER & DRAWING NUMBER CONSTRUCTION, DIMENSIONS, MATERIAL & SURFACE FINISH CHARACTERISTICS (CONNECTOR PART) ABOUT WHISKER PACKAGING SPECIFICATION (Embossed-taping) SPECIMEN TEST CONDITIONS REQUIREMENTS, TEST METHODS & TEST RESULTS 8.1 Taping Part 8.1.1 Appearance 8.1.2 Tensile Strength of Tape 8.1.3 Peel Strength of Cover Tape 8.2 Connector Part 8.2.1 Appearance 8.2.2 Mechanical Performance Test 8.2.2.1 Insertion Force (I.F.) & Withdrawal Force (W.F.) 8.2.2.2 Base Contact Retention Force 8.2.2.3 Crimp Tensile Strength 8.2.2.4 Socket Contact Retention Force 8.2.2.5 Locking Strength 8.2.3 Electrical Performance Test 8.2.3.1 Contact Resistance 8.2.3.2 Current Continuity 8.2.3.3 Insulation Resistance 8.2.3.4 Dielectric Withstanding Voltage 8.2.4 Environmental Test 8.2.4.1 Durability 8.2.4.2 Humidity 8.2.4.3 Heat Aging 8.2.4.4 Thermal Shock 8.2.4.5 Sulfur Dioxide Gas 8.2.4.6 Salt Spray 8.2.4.7 Vibration 8.2.4.8 Ammonia Gas 8.2.5 Solder Test 8.2.5.1 Solderability 8.2.5.2 Resistance to Soldering Heat 9. NOTICE Prepared by: Checked by: Reviewed by: Approved by: BER-4108-3-0 This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 1. No. ER07-A055 GHD CONNECTOR Page Revised: 2/14 PART NAME, PART NUMBER & DRAWING NUMBER Part Name Part Number Drawing Number Top entry type Loose piece product KRD-39931 BM∗B-GHDS-G (LF)(SN) header Taping product BM∗B-GHDS-G-TF (LF)(SN) KRD-39932 Applicable Housing KRD-39933 GHDR-∗V-S socket Contact 002 type SGHD-002GA-P0.2 KRD-39934 Note1: The number of circuits in two-digit figures is indicated in ∗. Note2: (LF) and (SN) as identification part number indicating lead-free product and tin-plated specification of lead-free product shall be displayed on a label until all products are shifted to the lead-free. 2. CONSTRUCTION, DIMENSIONS, MATERIAL & SURFACE FINISH Construction and dimensions shall be in accordance with the referenced drawings. Material and surface finish shall be as specified below. Part Name Base contact Header Reinforcement Socket Tape Reel 3. Material Phosphor bronze Brass Wafer 9T Nylon Housing PBT Contact Carrier tape Cover tape Flange Phosphor bronze Polyester Polyester Polystyrene Polystyrene Polypropylene Core Surface finish etc. Nickel-underplated Gold-plated Copper-underplated Tin-plated Color: Natural Flammability: UL94V-0 Color: Natural Flammability: UL94V-0 Nickel-underplated Selective gold-plated CHARACTERISTICS (CONNECTOR PART) Items Current rating Voltage rating Temperature range Rated values 1.0A (AC, DC) (Note3) 50V (AC, DC) (Note4) -25 to +85 °C Tin-plated annealed copper wire (stranded wire) AWG#30 to AWG#26 φ0.8 mm to φ1.0 mm Conductor spec. Conductor size Insulation O.D. Note3: When AWG#26 applied. Note4: Including temperature rise in applying an electrical current. Applicable wire 4. ABOUT WHISKER Although the lead-free plating of this product has performed re-flow tin plating which ensures maximum effectiveness for retarding whisker growth, it is not possible to completely eliminate the whisker problem. This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: GHD CONNECTOR No. ER07-A055 Page Revised: 3/14 5. PACKAGING SPECIFICATION (Embossed-taping) 5.1 Packaging quantity Quantity to be wound shall be 1,250 pieces per reel for top and side entry type as the standard quantity. 5.2 Packaging method (1) Each product shall be put into the fixed position*1 of the embossed carrier tape individually. The tape shall be sealed with cover tape by heat treatment. (2) After sealed, carrier tape shall be wound*2 to reel to be specified quantity and the end of cover tape*3 shall be fixed to flange of reel by adhesive tape. (3) The wound reel shall be packaged in a corrugated cardboard box for shipment. *1: See the attached drawings. *2: The direction to be wound; See the attached drawings. *3: Corresponding to leader part in taking out the tape. The treatment of the end of tape; See the attached drawings. 5.3 Marking The label marked the following items shall be attached to the flange part of a reel. (1) (2) (3) (4) (5) Part number Quantity Manufacturing lot No. Company name or its abbreviation Other necessary items 5.4 Storage Store the products in a clean room under the JST packaging conditions. Storage temperature: 5 to 35 °C Storage humidity: 60% max. 6. SPECIMEN Part Name Part Number Header Top entry type BM∗B-GHDS-G (LF)(SN) Housing GHDR-∗V-S Applicable socket Contact 002 type SGHD-002GA-P0.2 Note5: The number of circuits in two-digit figures is indicated in ∗. This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 7. No. ER07-A055 GHD CONNECTOR Page Revised: 4/14 TEST CONDITIONS 7.1 When tested in accordance with the test conditions and methods specified in each item, each requirement shall be met. Unless otherwise specified, the tests shall be conducted under the following ambient conditions specified in JIS C 60068-1 (IEC 60068-1) [Basic Environmental Testing Procedures General and Guidance]. Temperature: Relative humidity: 15 to 35 °C 25 to 75 % 7.2 For environmental tests, as a rule, the specimen assembled for actual use and the wire of AWG#26 shall be used. 8. REQUIREMENTS, TEST METHODS & TEST RESULTS 8.1 Taping Part 8.1.1 Appearance Requirement: (1) (2) (3) (4) Sprocket hole shall not be covered with cover tape. Cover tape shall not run out of carrier tape. Cover tape shall not be peeled. There shall be no other defects. Test method: Test result: 8.1.2 Visual inspection. Good. Tensile Strength of Tape Requirement: There shall be no defects such as breakage. Test method: Pulling load of 10N shall be applied to each of carrier and cover tapes. Pulling direction shall be its pulling-out direction. Test result: There was no defect. 8.1.3 Peel Strength of Cover Tape Requirement: Peeling angle: 165 to 180 degrees 0.1 to 1N Test method: Cover tape shall be pulled as shown in the figure on the right side. (Peeling speed: 300mm/min.) Test result: 0.19 to 0.38 N n=20 Pulling out direction This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: No. ER07-A055 GHD CONNECTOR Page Revised: 5/14 8.2 Connector Part 8.2.1 Appearance Requirement: There shall not be crack, deformation or discoloration which may affect the performance specified in this specification. Test method: Visual inspection. Test result: Good. 8.2.2 Mechanical Performance Test 8.2.2.1 Insertion Force (I.F.) & Withdrawal Force (W.F.) Requirement: No. of circuits At initial I.F. (N max.) W.F. (N min.) 20 50 5 At 30th W.F. (N min.) 5 Test method: A socket and a header shall be mated and unmated on the mating axis. Initial insertion and withdrawal force and withdrawal force at 30th shall be measured. A housing lock shall be removed for the measurement. (Testing speed: 1 to 5mm/sec.) Test result: UNIT: N No. of circuits 20 8.2.2.2 Items Initial I.F. Initial W.F. W.F. at 30th Ave. 10.8 9.8 9.6 Max. Min. 11.5 10.3 10.6 9.4 10.6 8.9 n=10 (No. of connectors) Base Contact Retention Force Requirement: 3N min. Test method: A base contact shall be pushed in the axial direction. The load to make the base contact start moving from the wafer shall be measured. (Testing speed: 1 to 5mm/sec.) Test method: Unit: N Base contact retention force Ave. Measured values Max. 5.3 6.8 Min. 4.7 n=20 (No. of pins) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.2.3 No. ER07-A055 GHD CONNECTOR Page Revised: 6/14 Crimp Tensile Strength Requirement: Wire to be used AWG #26 AWG #28 AWG #30 Requirement (N min.) 20 10 5 Wire Contact Pulling force Test method: Pulling load shall be applied to a correctly crimped socket contact and a wire. The load to pull the wire out of the socket contact or break the wire shall be measured. (Testing speed: 1 to 5mm/sec.) Test result: Wire size AWG #26 AWG #28 AWG #30 8.2.2.4 Ave. 38.5 26.9 14.0 Max. 40.4 27.8 15.4 UNIT: N Min. 36.4 25.6 12.6 n=20 (No. of pins) Socket Contact Retention Force Requirement: 5N min. (When AWG#26 applied.) Test method: A correctly crimped socket contact shall be mounted in a housing, and pulling load shall be applied between a housing and a socket contact. The load to pull the socket contact or wire out of the housing shall be measured. (Testing speed: 1 to 5mm/sec.) Socket Wire Pulling force Test method: Unit: N Socket contact retention force Ave. Measured values Max. 14.4 15.3 Min. 13.8 n=20 (No. of pins) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: No. ER07-A055 GHD CONNECTOR 8.2.2.5 Page Revised: 7/14 Locking Strength Requirement: 20N min. Test method: A socket housing and a header shall be mated. And then, the load shall be applied between them. The load to come them off each other or to break the housing shall be measured. (Testing speed: 1 5 mm/sec.) Test method: Unit: N 20-circuit 8.2.3 Ave. Measured values Max. 72.8 74.5 Min. 70.8 n=10 (No. of pins) Electrical Performance Test 8.2.3.1 Contact Resistance Requirement: Initial: 30 mΩ After tests: 50 mΩ max. max. A’ Test method: Contact resistance between points A and A’ and B and B’ of a specimen assembled for actual use as shown in the figure on the right side shall be measured under the following conditions. Test current: 1mA (DC) Open voltage: 20mV max. Wire to be used: AWG#26 Test result: 8.2.3.2 Wire Wire B’ Socket Top entry type header A B PCB (Printed circuit board) See each environmental test item. Current Continuity Requirement: There shall be no current discontinuity longer than 1 microsecond during a vibration test. Test method: Each circuit of a specimen assembled for actual use shall be connected in series and test current of 10mA (DC) shall be applied. Current discontinuity longer than 1 microsecond during the test shall be detected by a continuity meter. Test result: See Vibration test item. This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.3.3 No. ER07-A055 GHD CONNECTOR Page Revised: 8/14 Insulation Resistance Requirement: Initial: 100MΩ min. After tests: 100MΩ min. (Humidity & thermal shock tests.) Test method: 250V DC shall be applied between adjacent contacts of a mated specimen to measure insulation resistance. (A header shall not be soldered onto a PCB.) Test result: Items Initial After humidity test After thermal shock test 8.2.3.4 Measured values 500MΩ min. 500MΩ min. 500MΩ min. n=20 (No. of connectors) Dielectric Withstanding Voltage Requirement: There shall be no breakdown or flashover. Test method: Testing voltage specified below shall be applied between adjacent contacts of a mated specimen for one minute. (A header shall not be soldered onto a PCB.) Initial: 500V AC After tests: 250V AC (Humidity & thermal shock tests.) Test result: Initial After humidity test After heat aging test Good Good Good n=20 (No. of connectors) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.4 No. ER07-A055 GHD CONNECTOR Page Revised: 9/14 Environmental Test 8.2.4.1 Durability Requirement: Contact resistance shall be 50 mΩ max. after the test. Test method: A socket and a header shall be mated and unmated by the normal operation way. After repeated 30 cycles, contact resistance shall be measured. Test result: Test item Contact resistance 8.2.4.2 Ave. 12.1 Initial Max. 16.1 Min. 10.7 UNIT: mΩ After the test Ave. Max. Min. 11.8 16.4 10.6 n=40 (No. of pins) Humidity Requirement: Contact resistance shall be 50 mΩ max. after the test. Insulation resistance shall be 100 MΩ min. after the test. There shall be no breakdown or flashover on the dielectric withstanding voltage test. Test method: The specimen shall be placed in a humidity chamber of the following conditions. After the test, contact resistance, insulation resistance and dielectric withstanding voltage shall be measured. Temperature: Relative humidity: Period: 40 ± 2 °C 90 to 95 % 240 hours Test result: Test item Contact resistance Ave. 13.0 Initial Max. 17.6 Min. 11.7 UNIT: mΩ After the test Ave. Max. Min. 13.8 16.6 11.9 n=40 (No. of pins) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.4.3 No. ER07-A055 GHD CONNECTOR Page Revised: 10/14 Heat Aging Requirement: Contact resistance shall be 50 mΩ max. after the test. Test method: The specimen shall be placed in a heat oven of the following conditions. After the test, contact resistance shall be measured. Temperature: 85 ± 2 °C Period: 250 hours Test result: Test item Contact resistance 8.2.4.4 Ave. 13.0 Initial Max. 17.3 Min. 11.6 UNIT: mΩ After the test Ave. Max. Min. 12.7 17.4 11.6 n=40 (No. of pins) Thermal Shock Requirement: Contact resistance shall be 50 mΩ max. after the test. Insulation resistance shall be 100 MΩ min. after the test. There shall be no breakdown or flashover on the dielectric withstanding voltage test. Test method: The specimen shall be subjected to a thermal shock test of the following conditions. After the test, contact resistance, insulation resistance and dielectric withstanding voltage shall be measured. 1 cycle consists of: - 55 ± 3 °C for 30 minutes +85 ± 2 °C for 30 minutes Total cycles: 25 cycles Test result: Test item Contact resistance Ave. 13.1 Initial Max. 17.3 Min. 11.9 UNIT: mΩ After the test Ave. Max. Min. 12.5 18.7 11.3 n=40 (No. of pins) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.4.5 No. ER07-A055 GHD CONNECTOR Page Revised: 11/14 Sulfur Dioxide Gas Requirement: Contact resistance shall be 50mΩ max. after the test. Test method: The specimen shall be subjected to sulfur dioixde gas of the following conditions. After the test, contact resistance shall be measured. Concentration: Temperature: Relative humidity: Period: 10 ± 3 ppm 40 ± 2 °C 80 ± 5 % 96 hours Test result: Test item Contact resistance 8.2.4.6 Ave. 13.0 Initial Max. 15.9 Min. 12.1 UNIT: mΩ After the test Ave. Max. Min. 13.8 16.6 11.0 n=40 (No. of pins) Salt Spray Requirement: Contact resistance shall be 50 mΩ max. after the test. Test method: The specimen shall be subjected to a salt spray test of the following conditions. After the test, it shall be washed with running water and dried naturally before the measurement of contact resistance. Temperature: 35 ± 2 °C Concentration: 5 % in weight Period: 48 hours Test result: Test item Contact resistance Ave. 12.8 Initial Max. 16.6 Min. 11.4 UNIT: mΩ After the test Ave. Max. Min. 13.6 17.7 11.4 n=40 (No. of pins) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.4.7 No. ER07-A055 GHD CONNECTOR Page Revised: 12/14 Vibration Requirement: Contact resistance shall be 50 mΩ max. after the test. There shall be no current discontinuity longer than 1 microsecond during the test. Test method: The specimen shall be subjected to a vibration test of the following conditions. During the test, current continuity shall be checked. After the test, contact resistance shall be measured. Frequency: Amplitude: Direction: 10-55-10 Hz/minute 1.52 mm Each of X,Y,Z-axis directions Period: 2 hours for each direction ∗Each axis shall be at right angles to others. Test result: Test item Contact resistance Current continuity Ave. 13.8 Initial Max. 18.3 Min. 12.2 UNIT: mΩ After the test Ave. Max. Min. 12.9 18.1 11.9 There was no current discontinuity longer than 1 microsecond. n=40 (No. of pins) 8.2.4.8 Ammonia Gas Requirement: There shall be no stress corrosion cracking. Test method: A mated specimen shall be subjected to an ammonia gas test of the following conditions. After the test, stress corrosion cracking shall be checked. (A header shall not be soldered.) Ammonia solution: 3 % in weight Solution volume: 25 ml per liter of volume Period: 7 hours Test result: There was no stress corrosion cracking. n=10 (No. of connectors) This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: 8.2.5 Page Revised: No. ER07-A055 GHD CONNECTOR 13/14 Solder Test 8.2.5.1 Solderability Requirement: Plating surface of solder-dipping section of a specimen shall be covered with smooth solder. Test method: Fluxed soldering section of the specimen shall be dipped in solder of the following conditions. Solder: Sn-3.0Ag-0.5Cu Flux: Activation flux (CF-110VH-2A) Solder temperature: 245 ± 3 °C Immersion period: 3 ± 0.5 seconds Test result: Good. n=10 (No. of pins) 8.2.5.2 Resistance to Soldering Heat Requirement: There shall be no deformation or damage which may affect the performance. Test method: [By soldering iron] A specimen shall be soldered by soldering iron of the following conditions. After the test, the appearance shall be observed. No abnormal load such as lateral load shall be applied to the specimen during the test. Temperature of the tip: 350 °C Soldering period: 3 seconds Test result: There was no deformation or damage which may affect the performance. n=10 (No. of connectors) GHD CONNECTOR No. ER07-A055 14/14 [By reflow soldering] A specimen shall be subjected to reflow soldering of the condition shown in the graph below. After the test, the appearance shall be observed. Material of testing PCB shall be glass base epoxy resin and its thickness shall be 1.6 mm. Temperature of wafer’s surface This is our exclusive property. It is not to be copied, reprinted or disclosed to a third party, not used for manufacturing, without our written consent, and has to be returned to us. Title Subject: Page Revised: (°C) 250 +5/0 °C 250 230 180 150 0 60 to 120 sec. 30±10 sec. [Temperature profile for reflow soldering] Test result: There was no deformation or damage which may affect the performance. n=10 (No. of connectors) 9. NOTICE 9.1 For blister Considering handling of GHD connector in mating operation, tenacious heat-resistant nylon is used for the material of a wafer. But 'blister' may generate on the outer surface of the wafer during the process of reflow soldering, depending on the condition of water absorption of a wafer and the condition of reflow soldering. In regard to this “blister”, the 'blister' is not caused by decomposition of resin, and it does not affect the performances of the connector.