DF24B-40DS-0.9C

The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. 0.9 mm Pitch Vertical Mating Board-to-Wire Connectors DF24 Series Space-saving Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Double row socket Double row header (SMT) Low-profile Double row socket ■Features 11. Space saving Small contact pitch (0.9 mm) together with vertical mating direction allows high density mounting of the board components. 3.8 12. Low profile Two-level contact location and horizontal wire exits allow a low profile of 3.8 mm, when fully. 8.2 13. Reliable mating/un-mating Double row header (SMT) Complete vertical mating, with both sides self-aligned, is confirmed with tactile “click” sensation. 14. High contact reliability Long contact wipe Two-point socket contact 2-point socket contact, with a long wipe (0.55 mm) assures highly reliable electrical and mechanical connection. 15. Prevention of solder wicking 0.55mm Despite its low-profile, solder wicking is prevented by the nickel barrier and solder collection areas. 16. Self-alignment and side-pull protection The walls of the double row socket assembly will self-align during the mating and protect header and socket assemblies from a accidental side-pull on the wires. Contact - header 17. Simplified un-mating A pull strap for double row socket version may be selected for easier un-mating. Self-alignment and side-pull protection 18. Contact deformation protection Flat contact blades on the headers are supported by the insulator’s walls, protecting them from deformation during handling. 19. Board placement with automatic equipment Socket contacts Wall Supplied on reels containing 1,000 assemblies. 10. RoHS compliant Contact blades All components and materials comply with the requirements of the EU Directive 2002/95/EC. ■Applications Notebook computers, miniature office automation devices, miniature consumer devices, cameras, recording devices and other devices requiring vertical mating reliable connectors. Contact deformation protection B297 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon.Board-to-Wire Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Connectors ■Product Specifications Current rating (Note 1) Rating AWG28 :1A AWG30 :0.5A AWG32~36 :0.3A Wire size Voltage rating 80V AC Item –35ç to +85ç (Note 2) Relative humidity 20% to 80% Storage temperature range Storage humidity range –10ç to +60ç (Note 3) Relative humidity 40% to 70% (Note 3) Specification Conditions 1.Insulation resistance 500 M ohms min. 100V DC 2.Withstanding voltage No flashover or insulation breakdown. 250V AC/one minute 3.Contact resistance 30 mø max. 1 mA, 20 mV max. 4.Insertion-Extraction force (per contact) 0.12N min., 2N max. Measured with a steel pin of 0.15mm thickness 5.Vibration Frequency: 10 to 55 Hz, single amplitude of 0.75mm, 2 hours, 3 axis No electrical discontinuity of 1μs or more. Contact resistance: 30 mø max. 6.Humidity Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Operating temperature range Operating humidity range 96 hours at temperature of 40±2ç and humidity of 90% to 95%. Insulation resistance: 250 Mø min. 7.Temperature cycle Contact resistance: 30 mø max. Temperature: –55ç ➝ +5ç to +35ç ➝ +85ç ➝ +5ç to +35ç Insulation resistance: 500 Mø min. Time: 30 ➝ 2 to 3 ➝ 30 ➝ 2 to 3 (Minutes) 8.Durability (mating / un-mating) Contact resistance: 30 mø max. 9.Resistance to soldering heat Reflow: At the recommended temperature profile No deformation of components affecting performance. Manual soldering: 350ç for 3 seconds Note 1: Current rating for header is 1A. Note 2: Includes temperature rise caused by current flow. Note 3: The term “storage” refers to products stored for long period of time prior to mounting and use. Operating temperature range and humidity range covers non-conducting condition of installed connectors in storage, shipment or during transportation. Note 4: Information contained in this catalog represents general requirements for this Series. Contact us for the drawings and specifications for a specific part number shown. ■Materials and Finishes Finish Remarks Socket Product Insulators Component Polyamide Color : Black UL94V-0 Crimp contact Contact-socket Phosphor bronze Gold plated –––––––––– Insulator Polyamide Color : Black UL94V-0 Contact-blade Phosphor bronze Gold plated –––––––––– Pull strap PET –––––––––––– –––––––––– Header Pull strap Material ■Ordering information ●Connectors DF24 # - * DS - 0.9 C 1 2 3 4 1 Series Name : DF24 5 6 4 Connector type 2 Form type DS : Double-row socket DP : Double-row header Pin headers A : Standard type 5 Contact pitch : 0.9 mm Sockets Blank : Standard type 6 Housing type A : Pull strap version 3 Number of contacts : 40, 50 C : Crimp housing V : Straight SMT header PTB : Pull strap (Note) Note: The pull strap is an optional. ●Contacts DF24 - 2830 SCF A 1 1 Applicable conductor 2830 : AWG 28 to 30 3234 : AWG 32 to 34 0036 : AWG 36 B298 5 cycles 30 cycles 2 3 2 Packaging SCF : Socket contact / reel 3 Plating A : Gold plated The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the HiroseSeries●0.9 website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 mm Pitch Vertical Mating Board-to-Wire Connectors ■Double-row header (SMT) A 0.15 P=0.9 3.8 4.8 Contact Contact P=0.9 A P=0.9±0.03 A±0.05 0.5±0.03 5.4±0.05 Contact No.1 3.4 2.3±0.05 ■PCB mounting pattern Specification number (51): Embossed tape packaging (1,000 pieces per reel). Contact No.2 Unit: mm Part number CL No. Number of contacts A B Packaging DF24A-40DP-0.9V(**) 687-3208-0-** 40 17.1 19.6 1,000 pcs. / reel DF24A-50DP-0.9V(**) 687-3209-2-** 50 21.6 24.1 1,000 pcs. / reel RoHS YES .05 +0 0 4±0.1 2±0.1 12±0.1 A 1.75±0.1 ■Packaging specifications .5 Ø1 Section A-A 2±0.5 Part number label C±0.1 Ø21± 0.8 ( Ø80 ) ( Ø380 ) 0.2 Ø13± B±0.1 A±0.3 Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 3.3 B D +20 (D+6) MAX 0.4±0.1 4.55±0.15 A Unreeling direction Unit: mm Part number DF24A-40DP-0.9V(**) Number of contacts A B C D 40 32 28.4 14.2 32.4 50 44 40.4 20.2 44.4 B299 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon.Board-to-Wire Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Connectors ■Double-row socket A A No. of contacts indicator 1 B 8.2 6.5 C 3.45 3.05 4.8 D Unit: mm Part number CL No. Number of contacts A B C D Packaging DF24B-40DS-0.9C 687-3301-5 40 22.1 18.75 17.1 21.1 100 pcs. / bag DF24B-50DS-0.9C 687-3302-8 50 26.2 23.25 21.6 25.2 100 pcs. / bag RoHS YES ■Double-row socket (Pull strap) A 0.3 4.5 A 1 No. of contacts indicator B C 8.2 6.5 2.85 Contact 3.45 P=0.9 1.2 Contact 3.05 Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Contact B300 2.85 P=0.9 Contact 4.8 D Unit: mm Part number CL No. Number of contacts A B C D Packaging RoHS DF24BA-50DS-0.9C 687-3304-3 50 27.4 23.25 21.6 25.2 100 pcs. / bag YES Note: Refer to page 5 for pull strap tab. The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the HiroseSeries●0.9 website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 mm Pitch Vertical Mating Board-to-Wire Connectors ■Crimp contact 1.03 0.85 Part number Applicable wire size Packaging Quantity DF24-2830SCFA 687-3001-1 28 – 30 DF24-3234SCFA 687-3004-0 32 – 34 DF24-36SCFA 687-3003-7 Reel 20,000 Finish RoHS Gold plated YES 36 4.6 ● Applicable wire (Tin plated annealed copper wire) 0.8 Wire size (Stranded wire conductor) Jacket diameter 1.95 AWG28 (7 / 0.127mm) AWG30 (7 / 0.107mm) 0.6mm max AWG32 (7 / 0.087mm) 0.55 AWG36 (7 / 0.057mm) 0.4mm max Note: When using other than the recommended wire, contact your nearest Hirose representative. ● Tools 3 Type Ø1 Autmatic t=0.12 Description Applicator Press unit Contact extraction tool Part number CL No. AP105-DF24-2830S 901-4602-5 DF24-2830SCFA AP105-DF24-3234S 901-4592-3 DF24-3234SCFA AP105-DF24-36S 901-4606-6 DF24-36SCFA CM-105 901-0005-4 –––––––––––––––––––––––– DF-C-PO(B) 550-0179-2 DF24-****SCFA Applicable contacts t=0.1 ■Pull strap A Applicable socket π [DF24BA-50DS-0.9C] 4 Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. CL No. Seal B Unit: mm Part number CL No. Number of contacts A B Packaging RoHS DF24-50DS-PTB 687-3300-2 50 25 75 500 pcs. / bag YES Before attachment of the pull strap Pull strap attached B301 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon.Board-to-Wire Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Connectors ■Pull Strap Attachment Procedure 1 With the adhesive side of the pull strap facing upward, pass both ends of the strap through the elongated openings at both ends of the socket. Adhesive side Elongated opening Elongated opening Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Socket B302 2 Peel-off the protective paper on one side and place one end of the strap over exposed adhesive (as illustrated below), using the remaining paper side as the alignment guide. Protective paper 3 Peel-off the remaining protective paper and place the other end of the strap over the adhesive, using the already attached end as the alignment guide. Completed The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon. Please check the products status on the HiroseSeries●0.9 website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 mm Pitch Vertical Mating Board-to-Wire Connectors ■Usage recommendations and Precautions 1. Recommended temperature profile (Including Lead-free solder) Temperature(ç) 250 200 240 220 Reflow conditions Preheating: 190 170 180±10ç 60~20sec. Soldering: 150 Preheating 250ç max. Soldering 240çmin. 20sec. max. 100 Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. 220çmin. 60sec. max. 50 0 50 100 150 200 250 Time(S) Note 1: Up to 2 cycles of Reflow soldering are possible under the same conditions, providing that there is a return to normal temperature between the first and second cycle. Note 2: The temperature profile indicates the board surface at the point of contacts with the connector terminals. 2.Recommended manual soldering Manual soldering: 300±10ç for 3 seconds 3.Recommended screen thickness and opening area ratio (Pattern area ratio) Thickness: 0.12mm Opening area ratio: 80% 4. Board warpage Maximum of 0.03mm at the connector center, with both ends of the connector as reference points. 5. Cleaning conditions Refer to “Nylon Connector Use Handbook”. 6. Wire preparation and Refer to “Nylon Connector Use Handbook”. contact crimping The crimp contacts are of a very small form and because of this, crimping should be performed carefully based on the content of the Crimping Conditions Table and the Crimping Quality Standards Manual. 7. Precautions ■Removal of the inserted socket contacts * Using the socket contact extraction tool (DF-C-PO(B) ) carefully lift the contact retention tab on the insulator housing, as shown on the Fig.1 and pull-out the wire. * Lift the tab ONLY enough to remove the contact. Exercise caution NOT to deflect too much. * The tab should return to its original position after the contact is removed. * The tab must be in its original position before inserting the new socket contact. Contact extraction tool DF-C-PO(B) Contact retention tab Fig. 1. Contact Removal B303 The product information in this catalog is for reference only. Please request the Engineering Drawing for the most current and accurate design information. All non-RoHS products have been discontinued, or will be discontinued soon.Board-to-Wire Please check the products status on the Hirose website RoHS search at www.hirose-connectors.com, or contact your Hirose sales representative. DF24 Series●0.9 mm Pitch Vertical Mating Connectors 7. Precautions ■Connector Mating/Un-mating * Hold the socket at both ends (as illustrated on Fig.2) when mating or un-mating. The mating/unmating of the connectors must be within the indicated angle of 20° on both axis. 20° 20° DO NOT MATE / UN-MATE HOLDING BY THE WIRES. Apr.1.2019 Copyright 2019 HIROSE ELECTRIC CO., LTD. All Rights Reserved. Hold here B304 Powered by TCPDF (www.tcpdf.org) Fig. 2. Mating / Un-mating ■Bundling of the Wires * To avoid wire damage or termination faults bundling of the wires should be at the distance of 20 mm min. from the socket (Fig. 3-1) * When bundling at the distance less than the recommended 20 mm, it is critical to avoid sharp bend radius (Fig. 3-2) or apply stretching or twisting forces (Fig. 3-3) Bundling close to socket Do not stretch or twist Sharp bend Fig. 3-1 Fig. 3-2 Fig. 3-3 Fig. 3. Bundling requirements * Do not mate/un-mate connectors when not mounted on the board. * Do not use connector as the only support for the board. * Do not use flux compounds when hand soldering. * Slight color shade difference of the insulator bodies will not affect the form, fit or function of the connectors.