TMPC1004HV-R30MG-D

Form No: XXXXXX-7-0000-PBM02-170500032 Specification for Approval Date: 2017/05/03 Customer : 深圳台慶 TMPC1004H-series(G)-D TAI-TECH P/N: CUSTOMER P/N: DESCRIPTION: QUANTITY: pcs REMARK: Customer Approval Feedback □西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw □Office: 深圳辦公室 11BC,Building B Fortune Plaza,NO.7002, Shennan Avenue, Futian District Shenzhen TEL: +86- 755-23972371 Sales Dep. APPROVED CHECKED 曾詩涵 Angela Tseng 曾詩涵 Angela Tseng FAX: +86-755-23972340 □臺慶精密電子(昆山)有限公司 TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: sales@tai-tech.cn ■慶邦電子元器件(泗洪)有限公司 TAIPAQ ELECTRONICS (SIHONG) CO., LTD JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANGSU , CHINA. TEL: +86-527-88601191 FAX: +86-527-88601190 E-mail: sales@taipaq.cn R&D Center APPROVED CHECKED DRAWN 羅宜春 梁周虎 張光 TAIPAQ P1 SMD Power Inductor TMPC1004HV-Series(G)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 2017/05/03 新發行 羅宜春 梁周虎 張光 備 注 TAIPAQ P2 SMD Power Inductor TMPC1004HV-Series(G)-D 1. Features 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. Halogen Pb Halogen-free Pb-free 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. High reliability -Reliability test complied to AEC-Q200. 2. Applications Note PC power system，incl. IMVP-6 DC/DC converter . 3. Dimensions C 　 100 1516 D E B A leadfram L R45 1516 E H B Recommend PC Board Pattern D C A non-leadfram Series TMPC1004HV Type G A(mm) leadframe non-leadframe 11.0±0.5 B(mm) C(mm) 10.0±0.3 3.8±0.2 D(mm) 2.3±0.3 E(mm) 3.0±0.3 L(mm) 4. Part Numbering TMPC 1004 HV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: 印 D/C - 100 MG D E - G(mm) H(mm) 13.6 5.4 3.5 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. D F BxC Carbonyl Powder,vehicle. 100=10.0uH M=±20% 印字:黑色.100 及 D/C 1516 (15 年,16 週期)(依實際生產日期而定) TAIPAQ P3 5. Specification Part Number Inductance L0 (uH)±20% @0A I rms (A) Typ. I sat (A) Typ. DCR (mΩ) Typ. @25℃ DCR (mΩ) Max. @25℃ Type TMPC1004HV-R15YG-D 0.15±30% 43 75 0.5 0.6 non-leadframe TMPC1004HV-R19YG-D 0.19±30% 36 70 0.6 0.9 non-leadframe TMPC1004H-R20YG-D 0.20±30% 35 70 0.66 0.95 non-leadframe TMPC1004HV-R22MG-D 0.22 35 60 0.8 1.0 non-leadframe TMPC1004HV-R24MG-D 0.24 34 60 0.8 1.0 non-leadframe TMPC1004HV-R27MG-D 0.27 33 60 0.82 1.0 non-leadframe TMPC1004HV-R30MG-D 0.30 32 60 0.94 1.1 non-leadframe TMPC1004HV-R36MG-D 0.36 31 60 1.05 1.2 non-leadframe TMPC1004HV-R39MG-D 0.39 30 60 1.1 1.3 non-leadframe TMPC1004HV-R45MG-D 0.45 29 45 1.3 1.5 non-leadframe TMPC1004HV-R47MG-D 0.47 28 43 1.3 1.5 non-leadframe TMPC1004HV-R56MG-D 0.56 25 40 1.6 1.8 non-leadframe TMPC1004HV-R68MG-D 0.68 22 39 2.4 2.7 non-leadframe TMPC1004HV-R75MG-D 0.75 22 39 2.4 2.7 non-leadframe TMPC1004HV-R88MG-D 0.88 20 38 2.5 2.9 non-leadframe TMPC1004HV-R90MG-D 0.90 20 38 2.6 3.0 non-leadframe TMPC1004HV-1R0MG-D 1.00 18 36 3.0 3.3 non-leadframe TMPC1004HV-1R2MG-D 1.20 17 33 3.3 3.8 non-leadframe TMPC1004HV-1R5MG-D 1.50 16 33 4.0 4.6 non-leadframe TMPC1004HV-1R8MG-D 1.80 14 30 5.3 6.4 leadframe TMPC1004HV-2R2MG-D 2.20 12 27 6.5 7.0 leadframe TMPC1004HV-2R5MG-D 2.50 11.5 23 7.9 8.7 leadframe TMPC1004HV-3R0MG-D 3.00 11.5 21 10 11.5 leadframe TMPC1004HV-3R3MG-D 3.30 11 20 10.8 11.8 leadframe TMPC1004HV-3R9MG-D 3.90 10.5 19 12.6 14.5 leadframe TMPC1004HV-4R0MG-D 4.00 10.2 18 13 15 leadframe TMPC1004HV-4R7MG-D 4.70 10 17 15.0 15.5 leadframe TMPC1004HV-5R6MG-D 5.60 9.0 14 17 19.3 leadframe TMPC1004HV-6R2MG-D 6.20 8.7 13.7 17.2 21.3 leadframe TMPC1004HV-6R5MG-D 6.50 8.6 13.6 17.3 22.3 leadframe TMPC1004HV-6R8MG-D 6.80 8.5 13.5 17.5 23.3 leadframe TMPC1004HV-7R3MG-D 7.30 8.3 13.0 19.0 21.8 leadframe TMPC1004HV-8R2MG-D 8.20 8.0 12.5 20 22.5 leadframe TMPC1004HV-100MG-D 10.0 7.5 12.0 27.0 30 leadframe TMPC1004HV-150MG-D 15.0 6.25 10 40 45 leadframe TMPC1004HV-180MG-D 18.0 5.5 9.0 56 62 leadframe TMPC1004HV-220MG-D 22.0 5.0 7.0 64 74 leadframe TMPC1004HV-270MG-D 27.0 4.0 6.0 86 100 leadframe TMPC1004HV-330MG-D 33.0 3.5 5.0 92 112 leadframe TMPC1004HV-470MG-D 47.0 3.0 4.5 145 167 leadframe TMPC1004HV-680MG-D 68.0 2.0 3.0 205 240 leadframe TMPC1004HV-820MG-D 82.0 1.5 2.5 265 320 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 20%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAIPAQ P4 6. Material List 5 5 4 3 2 1 NO Items 1 Core 2 3 Materials NO Items Carbonyl Powder. 1 Core Carbonyl Powder. Wire Polyester Wire or equivalent. 2 Wire Polyester Wire or equivalent. Clip 100% Pb free solder(Ni+Sn---Plating) 3 Halogen-free ketone 4 Ink Epoxy resin 5 paint 4 Ink 5 paint Materials Solder 100% Pb free solder Halogen-free ketone Epoxy resin 7. Reliability and Test Condition Item Performance Operating temperature -55~+125℃(Including self - temperature rise) Storage temperature and Humidity range 1.-10~+40℃,50~60%RH (Product without taping) 2.-55~+125℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L20% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △T(℃) without core loss. 1.Applied the allowed DC current. 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Step2：125±2℃ transition time 1min MAX. Step3：125±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs High Temperature Exposure(Storage) Temperature Cycling Moisture Resistance Biased Humidity (AEC-Q200) High Temperature Operational Life (AEC-Q200) Vibration Appearance：No damage. Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity ：85±3﹪R.H, Temperature：85℃±2℃ Duration : 1000hrs Min with 100% rated current. Measured at room temperature after placing for24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：125±2℃(Inductor) Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minute Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 TAIPAQ P5 Item Performance Test Condition Type Mechanical Shock Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 100 6 Half-sine 12.3 Lead 100 6 Half-sine 12.3 shocks in each direction along 3 perpendicular axes. Number of heat cycles: 1 Appearance：No damage. Resistance to Soldering Heat Temperature(℃) Time(s) 260±5(solder temp) 10±1 Impedance：within±15% of initial value Inductance：within±10% of initial value Temperature ramp/immersion and emersion rate 25mm/s ±6 mm/s Q：Shall not exceed the specification value. Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：125±2℃ within 20Sec. Step3：125±2℃ 15±1min Number of cycles： 300 Measured at room temperature after placing fo24±2hrs Resistance to Solvents Add aqueous wash chemical - OKEM clean or equivalent. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. ESD Solderability More than 95% of the terminal electrode should be covered with solder。 Steam Aging: 8 hours ± 15 min Preheat: 150℃,60sec.。 Solder: Sn96.5% Ag3% Cu0.5% Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec. Depth: completely cover the termination Electrical Test not required V-0 or V-1 are acceptable epoxy V-0 or V-1 are acceptable Flammability TAIPAQ P6 Item Performance Test Condition Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to thecomponent being tested. Terminal Strength ( SMD ) Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. TAIPAQ P7 8. Soldering and Mounting (1) Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (3) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. R eflow Soldering PR E-H EATING SO LD ER IN G Iron Soldering N ATU R AL C O O LIN G PRE-HEATING 217 60~150s 200 150 60~180s TEMPERATURE(　C) TEMPERATURE(　 C) tp(245 　C / 20~40s.) SOLDERING within 4~5s TP(260 ℃ / 10s m ax.) 350 150 Gradual cooling Over 60s 480s m ax. NATURAL COOLING 25 TIM E( sec.) Reflow times: 3 times max. Fig.1 TIME(sec.) Iron Soldering times: 1 times max. Fig.2 TAIPAQ P8 9. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x24mm 24.4+2/-0 100±2 13+0.5/-0.2 330 C B D 2.0∮0.5 A EMBOSSED CARRIER (2) Tape Dimension Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) TMPC 11.6±0.1 1004 10.4±0.1 4.5±0.1 16.0±0.1 24±0.3 11.5±0.1 t(mm) D(mm) 0.35±0.05 1.5±0.1 (3) Packaging Quantity TMPC 1004 Chip / Reel 500 Inner box 1000 Carton 4000 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 stadnard). 165　to180　 Base tape Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions To maintain the solderability of terminal electrodes: 1. TAIPAQ products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. TAIPAQ P9 10. Typical Performance Curves 0.28 80 0.18 60 0.21 60 0.12 40 0.14 40 0.06 20 0.07 20 0.18 72 0.12 48 0.06 24 0 12 24 36 48 0 60 14 28 42 56 0 0 70 16 32 TMPC1004H-R24 0.4 100 48 64 80 DC CURRENT(A) DC CURRENT(A) TMPC1004H-R22 0.4 0 0 0 DC CURRENT(A) 100 TEMP. RISE(oC) 80 96 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 0.24 0.24 0 TMPC1004H-R20 0.35 0.3 0 TMPC1004H-R19 100 120 TEMP. RISE(oC) INDUCTANCE (uH) TMPC1004H-R15 0.3 100 0.4 0.32 80 0.32 0.24 60 0.16 40 0.08 20 TMPC1004H-R27 80 60 0.2 50 40 30 60 TEMP. RISE(oC) 70 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 80 0.3 TEMP. RISE(oC) INDUCTANCE (uH) 90 0.24 40 0.16 20 0.1 20 0.08 10 0 30 45 0 0 60 12 24 DC CURRENT(A) TMPC1004H-R30 0.5 36 48 0 60 0 0 12 24 DC CURRENT(A) 100 TMPC1004H-R36 0.8 36 48 TMPC1004H-R39 0.8 100 100 90 80 60 0.2 40 80 0.6 TEMP. RISE(oC) INDUCTANCE (uH) 0.3 90 80 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 0.4 70 60 0.4 50 40 30 0.2 0.1 0.6 70 60 0.4 50 40 30 0.2 20 20 20 10 0 0 12 24 36 48 0 60 15 30 45 TMPC1004H-R45 TMPC1004H-R47 0.8 100 100 15 70 60 0.4 50 40 30 45 60 TMPC1004H-R56 1 80 70 80 TEMP. RISE(oC) INDUCTANCE (uH) 0.6 30 90 80 0.2 0.6 70 60 0.4 50 40 30 0.8 60 50 0.6 40 0.4 30 0.2 0 20 10 10 0 0 9 18 27 36 20 20 0 45 10 0 0 9 18 DC CURRENT(A) 27 36 0 45 0 0 8 DC CURRENT(A) TMPC1004H-R68 1.2 80 0.9 60 0.6 40 0.3 20 16 24 32 40 DC CURRENT(A) TMPC1004H-R75 1 100 TEMP. RISE(oC) INDUCTANCE (uH) 1.5 0.2 100 1.5 0.8 80 1.2 0.6 60 0.4 40 0.2 20 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 0 0 DC CURRENT(A) 90 INDUCTANCE (uH) 0 60 DC CURRENT(A) DC CURRENT(A) 0.8 10 0 0 TEMP. RISE(oC) INDUCTANCE (uH) 0 60 DC CURRENT(A) TEMP. RISE(oC) 15 TEMP. RISE(oC) 0 0 TMPC1004H-R88 120 90 0.9 60 0.6 TEMP. RISE(oC) 0 30 0 0 0 0 7.8 15.6 23.4 31.2 39 0 0 8 16 24 32 0 40 0 0 7.6 DC CURRENT(A) DC CURRENT(A) TMPC1004H-R90 1.5 0.3 100 TMPC1004H-1R0 2 15.2 22.8 30.4 38 DC CURRENT(A) TMPC1004H-1R2 2 100 150 90 60 0.6 40 70 60 1 50 40 30 1.5 90 1 60 0.5 0.5 0.3 TEMP. RISE(oC) INDUCTANCE (uH) 0.9 120 80 1.5 20 20 30 10 0 0 0 8 16 24 DC CURRENT(A) 32 40 0 0 0 9 18 DC CURRENT(A) 27 36 0 0 0 6.6 13.2 19.8 DC CURRENT(A) 26.4 33 TEMP. RISE(oC) 80 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 1.2 TAIPAQ P1 TMPC1004H-1R5 3 150 2.7 120 2.16 TMPC1004H-1R8 150 TMPC1004H-2R2 4 80 1.2 60 1.62 90 1.08 60 3 60 50 2 40 30 1 0.6 30 0.54 TEMP. RISE(oC) 90 120 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 1.8 TEMP. RISE(oC) INDUCTANCE (uH) 70 2.4 20 30 10 0 0 0 6.6 13.2 19.8 26.4 0 33 0 6 DC CURRENT(A) 12 18 24 30 0 0 6.75 70 5 56 4 13.5 20.25 27 DC CURRENT(A) DC CURRENT(A) TMPC1004H-2R5 5 0 0 TMPC1004H-3R0 70 TMPC1004H-3R3 6 80 2 28 3 42 2 28 4.5 60 50 3 40 30 1.5 1 14 1 14 0 0 0 0 TEMP. RISE(oC) 42 56 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 3 TEMP. RISE(oC) INDUCTANCE (uH) 70 4 20 10 0 5 10 15 20 25 0 4.2 12.6 16.8 21 0 0 5 TMPC1004H-3R9 150 TMPC1004H-4R0 6 10 15 20 DC CURRENT(A) DC CURRENT(A) DC CURRENT(A) 6 8.4 0 150 TMPC1004H-4R7 8 80 70 120 2.4 60 1.2 30 90 3 60 1.5 6 60 TEMP. RISE(oC) 90 4.5 TEMP. RISE(oC) INDUCTANCE (uH) 3.6 120 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 4.8 50 4 40 30 2 20 30 10 0 0 0 3.8 7.6 11.4 15.2 0 19 0 3.6 DC CURRENT(A) 7.2 10.8 14.4 18 0 0 4.25 TMPC1004H-6R2 12.75 17 TMPC1004H-6R5 100 11 8 80 8.8 80 6 60 6.6 60 4 40 4.4 40 2 20 2.2 20 10 80 8.5 DC CURRENT(A) DC CURRENT(A) TMPC1004H-5R6 10 0 0 100 50 6 40 4 30 TEMP. RISE(oC) 60 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 8 TEMP. RISE(oC) INDUCTANCE (uH) 70 20 2 10 0 3.5 7 10.5 0 14 0 0 2.74 DC CURRENT(A) TMPC1004H-6R8 12 5.48 8.22 10.96 0 13.7 0 0 3 DC CURRENT(A) TMPC1004H-7R3 10 80 6 9 12 15 DC CURRENT(A) 100 TMPC1004H-8R2 16 80 70 70 50 6 40 30 3 80 6 60 4 40 TEMP. RISE(oC) INDUCTANCE (uH) 60 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 8 9 20 12 60 50 8 40 30 4 2 20 0 0 20 10 0 10 0 3.375 6.75 10.125 0 13.5 2.8 DC CURRENT(A) 8.4 11.2 0 0 3.125 80 TMPC1004H-150 30 100 50 10 40 30 5 TEMP. RISE(oC) INDUCTANCE (uH) 60 9.375 12.5 TMPC1004H-180 30 100 90 24 15 6.25 DC CURRENT(A) 70 INDUCTANCE (uH) 14 DC CURRENT(A) TMPC1004H-100 20 5.6 0 90 80 70 18 60 50 12 40 30 24 TEMP. RISE(oC) INDUCTANCE (uH) 0 80 70 18 60 50 12 40 30 20 6 20 10 0 0 0 3 6 DC CURRENT(A) 9 12 TEMP. RISE(oC) 0 6 20 10 0 0 0 2 4 6 DC CURRENT(A) 8 10 10 0 0 0 2.25 4.5 DC CURRENT(A) 6.75 9 TEMP. RISE(oC) 0 TAIPAQ P1 TMPC1004H-270 50 80 100 50 40 80 40 30 60 20 40 10 20 10 0 0 0 TMPC1004H-330 80 70 60 50 20 40 30 10 TEMP. RISE(oC) INDUCTANCE (uH) 30 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 70 60 50 30 40 20 30 20 20 10 10 0 0 0 1.75 3.5 5.25 7 0 1.2 DC CURRENT(A) 2.4 3.6 4.8 6 0 0 1 DC CURRENT(A) TMPC1004H-470 60 TEMP. RISE(oC) TMPC1004H-220 40 70 TMPC1004H-680 100 2 3 4 5 DC CURRENT(A) TMPC1004H-820 100 80 120 36 42 24 28 80 60 50 60 40 40 30 TEMP. RISE(oC) INDUCTANCE (uH) 56 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 48 80 96 60 72 40 48 20 24 20 12 14 20 10 0 0 0 1 2 3 DC CURRENT(A) 4 5 0 0 0 0.6 1.2 1.8 DC CURRENT(A) 2.4 3 0 0 0 0.7 1.4 2.1 DC CURRENT(A) 2.8 3.5 TEMP. RISE(oC) 70