QS Series
USB Module
Data Guide
! Warning: Some customers may want Linx radio frequency (“RF”)
products to control machinery or devices remotely, including machinery
or devices that can cause death, bodily injuries, and/or property
damage if improperly or inadvertently triggered, particularly in industrial
settings or other applications implicating life-safety concerns (“Life and
Property Safety Situations”).
Table of Contents
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NO OEM LINX REMOTE CONTROL OR FUNCTION MODULE
SHOULD EVER BE USED IN LIFE AND PROPERTY SAFETY
SITUATIONS. No OEM Linx Remote Control or Function Module
should be modified for Life and Property Safety Situations. Such
modification cannot provide sufficient safety and will void the product’s
regulatory certification and warranty.
2^
Customers may use our (non-Function) Modules, Antenna and
Connectors as part of other systems in Life Safety Situations, but
only with necessary and industry appropriate redundancies and
in compliance with applicable safety standards, including without
limitation, ANSI and NFPA standards. It is solely the responsibility
of any Linx customer who uses one or more of these products to
incorporate appropriate redundancies and safety standards for the Life
and Property Safety Situation application.
5^
Do not use this or any Linx product to trigger an action directly
from the data line or RSSI lines without a protocol or encoder/
decoder to validate the data. Without validation, any signal from
another unrelated transmitter in the environment received by the
module could inadvertently trigger the action.
All RF products are susceptible to RF interference that can prevent
communication. RF products without frequency agility or hopping
implemented are more subject to interference. This module does not
have a frequency hopping protocol built in.
Do not use any Linx product over the limits in this data guide.
Excessive voltage or extended operation at the maximum voltage could
cause product failure. Exceeding the reflow temperature profile could
cause product failure which is not immediately evident.
Do not make any physical or electrical modifications to any Linx
product. This will void the warranty and regulatory and UL certifications
and may cause product failure which is not immediately evident.
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Description
Features
Applications
Ordering Information
Absolute Maximum Ratings
Electrical Specifications
Pin Assignments
Pin Descriptions
Module Description
Theory of Operation
Installing the Drivers
Changing the Device Descriptions
Software Considerations
Serial Number Considerations
Power Supply Guidelines
Pad Layout
Helpful Application Notes from Linx
Typical Applications
Production Guidelines
Hand Assembly
Automated Assembly
QS Series USB Module
Data Guide
Description
0.812"
The Linx QS Series USB module allows the
rapid addition of USB to virtually any device.
Housed in a compact SMD package, the
0.630"
QS module provides a complete solution for
SDM-USB-QS1-S
LOT QUxxxx
converting between USB and CMOS / TTL logic
level serial sources. The module can be directly
connected to virtually any serial device including
0.125"
microprocessors, RS-232 / RS-485 level
converters or Linx wireless RF modules. The QS
Figure 1: Package Dimensions
module is completely self contained so it requires
no external components except a USB jack and includes all necessary
firmware and drivers, freeing the designer from complicated programming.
Power can be supplied externally or from the USB bus. Both USB 1.1 and
USB 2.0 are supported at data rates up to 3Mbps.
Features
• Single chip USB-toasynchronous serial data
conversion
• Low cost
• 3Mbps baud rate
• Supports low-speed USB
• Full handshaking support for
RS-232 and RS-485
• Bus or self-powered
• Compact surface-mount package
• VID, PID, serial number and
descriptors programmed via USB
• No external components needed
except a USB jack
• Drivers and firmware included
• Supports Windows 98 / 2000 /
XP / Vista / Windows 7 and 10
• USB 1.1 and 2.0 compatible
Applications
•
•
•
•
Interface / upgrade legacy
peripherals
Interface microcontrollers & USB
USB to RS-232 / RS-485
converters
Interfacing RF modules to USB
•
•
•
•
•
•
– 1 –
USB smart card readers
USB modems
Robotics
USB instrumentation
USB game controllers
USB-to-serial converter cables
Revised 2/3/2020
Ordering Information
Electrical Specifications
Ordering Information
QS Series USB Module Specifications
Part Number
Description
Parameter
SDM-USB-QS-S
QS Series USB Module
Power Supply
MDEV-USB-QS
QS Series Master Development Kit
Figure 2: Ordering Information
Symbol
Min.
Typ.
Max.
Units
Operating Voltage
VCC
4.35
5.0
5.25
VDC
Supply Current
lCC
26.0
28.0
mA
3.0
Mbps
0.6
VDC
Notes
UART SECTION
Data Rate
Absolute Maximum Ratings
0.0003
Data Output:
Absolute Maximum Ratings
Supply Voltage Vcc
−0.5
to
+6.0
VDC
Any Input or Output Pin
−0.5
to
VCC + 0.5
VDC
Max. Current Sourced by Output Pins
24
Operating Temperature
Storage Temperature
mA
0
to
+70
ºC
−65
to
+150
ºC
Exceeding any of the limits of this section may lead to permanent damage to the device.
Furthermore, extended operation at these maximum ratings may reduce the life of this
device.
Figure 3: Absolute Maximum Ratings
Logic Low
VOL
0.3
0.4
Logic High
VOH
3.2
4.1
EEPROM Size
4.9
VDC
1,024
Bits
USB Section
Data Output:
Logic Low
UVOL
0.0
0.3
VDC
Logic High
UVOH
2.8
3.6
VDC
Single-Ended RX Threshold
UVSE
0.8
2.0
VDC
Differential Common Mode
UCOM
0.8
2.5
VDC
Differential Input Sensitivity
UVDIF
0.2
Driver Output Impedance
UDRVZ
29
44
Ω
0.0
+70
°C
VDC
Environmental
Operating Temperature Range
Figure 4: Electrical Specifications
Warning: This product incorporates numerous static-sensitive
components. Always wear an ESD wrist strap and observe proper ESD
handling procedures when working with this device. Failure to observe
this precaution may result in module damage or failure.
– 2 –
– 3 –
Pin Assignments
1
2
3
4
5
6
7
8
Module Description
USBDP
RI
USBDM
DCD
GND
DSR
VCC
DATA_IN
SUSP_IND DATA_OUT
RX_IND
RTS
TX_IND
CTS
485_TX
DTR
16
15
14
13
12
11
10
9
Figure 5: SDM-USB-QS-S Pinout (Top View)
Pin Descriptions
Pin Descriptions
Pin Number
Name
Description
1
USBDP
USB data signal plus
2
USBDM
USB data signal minus
3
GND
4
VCC
5
SUSP_IND
6
RX_IND
The host application software can access the USB device by simple,
custom functions or by standard Windows Win32 API calls. In addition,
Virtual COM Port drivers are available that make the USB module appear to
the PC as a COM port, without the need for additional system resources,
such as an IRQ or address. This allows the designer to program the
application software to use standard serial or parallel ports and then simply
select the port that represents the USB module. The drivers automatically
direct the data to the USB bus and the device.
Theory of Operation
Figure 7 shows a block diagram of the QS module.
Ground supply
SUSP_IND
Positive power supply
VCC
GND
Goes low during USB Suspend Mode. This pin can be
used to power down external logic when the host puts
the USB bus into suspend mode.
This line will pulse low when receiving data from the USB
bus. This allows for the connection of a LED indicator.
7
TX_IND
This line will pulse low when transmitting data on the USB
bus. This allows for the connection of a LED indicator.
8
485_TX
Transmit enable line for RS-485 applications.
9
DTR
10
The Linx SDM-USB-QS module converts USB signals from a host, such
as a PC or hub, into TTL logic level signals. This enables the module to
be connected directly to microcontrollers (or Linx RF modules for wireless
applications) or to RS-232 or RS-485 level converters for communication
with legacy devices. The module handles all complicated enumeration and
bus communication processes, freeing the designer to focus on handling
the data. All necessary firmware is included in the module and the device
descriptors can easily be changed to customize the module.
TX Buffer
128 Bytes
DATA_IN
RTS
CTS
USBDP
USBDM
USB
Transceiver
Serial Interface
Engine (SIE)
Clear to Send control / handshake input
11
RTS
Request To Send / handshake output
12
DATA_OUT
13
DATA_IN
14
DSR
Data Set Ready control / handshake input
15
DCD
Data Carrier Detect control / input
16
RI
USB Protocol
Engine
UART FIFO
Controller
DTR
UART
DSR
DCD
RI
485_TX
TX_IND
Data Terminal Ready control / handshake output
CTS
DATA_OUT
RX_IND
USB DPLL
RX Buffer
384 Bytes
Transmit asynchronous data output
Receive asynchronous data input
Ring Indicator control input
Clock
Figure 7: SDM-USB-QS-S Block Diagram
The USB transceiver block provides the physical interface for the USB
signalling.
Figure 6: Pin Descriptions
– 4 –
– 5 –
The USB DPLL locks onto the NRZ data and provides separate recovered
clock and data signals to the Serial Interface Engine (SIE).
The SIE performs the parallel-to-serial and serial-to-parallel conversion,
bitstuffing / un-stuffing, and CRC calculations on the USB data.
The USB Protocol Engine manages the data from the USB control
endpoint, the USB protocol requests from the USB host controller, and the
commands for controlling the functional parameters of the UART.
Installing the Drivers
The drivers for the USB module are included with the module’s
development system or may be downloaded from the Linx website at
www.linxtechnologies.com. These drivers should be downloaded onto the
hard drive of a PC or onto a disk. When the module is attached to the PC
for the first time, Windows automatically detects the device and searches
for the best driver. Windows prompts for the location of the drivers, so
browse to the folder or the disk, click Next, and Windows does the rest.
Windows XP may return an error window as shown in Figure 8.
Data from the USB data out endpoint is stored in the TX buffer and
removed from the buffer to the UART transmit register under control of the
UART FIFO controller.
Data from the UART receive register is stored in the RX buffer prior to being
removed by the SIE on a USB request for data from the device data in
endpoint.
The UART FIFO controller handles the transfer of data between the RX and
TX buffers and the UART transmit and receive registers.
The UART performs asynchronous 7 / 8 bit parallel-to-serial and serial-toparallel conversion of the data on the RS-232 interface. Control signals
supported by the UART include RTS, CTS, DSR, DTR, DCD, and RI. The
UART provides a transmitter-enable control signal (485_TX) to assist with
interfacing to RS-485 transceivers. The UART supports RTS / CTS, DSR /
DTR and X-On / X-Off handshaking options. Handshaking, where required,
is handled in hardware to ensure fast response times. The UART also
supports the RS-232 BREAK setting and detection conditions.
– 6 –
Figure 8: Windows XP Driver Error Window
This window is simply a warning that the driver has not gone through
Microsoft’s certification process and could potentially pose a problem for
the system. The drivers provided for the QS module are Microsoft Certified
and should not pose any problems unless modified by the user. Click the
Continue Anyway button to finish the installation process.
– 7 –
Changing the Device Descriptions
Serial Number Considerations
The QS can be customized to display the product’s name, manufacturer
name, and to use different Product Identifiers (PID) and Vendor Identifiers
(VID). This allows an end user to see the final product’s name in their
Windows Device Manager and when the hardware is first loaded. The
PID and VID are set by the USB Implementers Forum and should not be
changed unless the final product has gone through the certification process
and received its own unique IDs.
The VID and PID are used by Windows to determine what devices are
attached to the bus and which drivers to load in order to communicate
with each device. A unique serial number is used to distinguish between
different devices of the same type so that the operating system can be
sure that it is communicating with the correct one. Windows views every
different combination of VID, PID and serial number as a new device and
starts the “Found New Hardware” wizard for each one. This is an issue in
a mass production environment, so the QS modules are shipped with the
“Enable Serial Number” option disabled in the EEPROM. This prevents the
serial number from being used during ennumeration.
The Manufacturer, Description, and Serial Number strings can all be
modified using the QS EEPROM Programmer software, which can be
downloaded from the Linx web site. This easy-to-use software reprograms
the module via the USB bus and can be done during production testing.
Once the module is reprogrammed, some modifications to the driver files
may be necessary. If a VID and PID other than the default Linx numbers
are used, these numbers need to be added to the files. This requires
modifying several lines in the .inf files and is described in detail in the QS
Series Programmer’s Guide. Modifying the name displayed by the Windows
Device Manager requires changing only one line, also described in the
Programmer’s Guide.
Software Considerations
The PC needs a set of drivers that tell it how to communicate with the QS
module. The CDM drivers for the QS Series module install two different
drivers at the same time. The first driver makes the QS appear as a COM
port on the host PC. This allows the application to use standard writes and
reads to a serial port, and the drivers redirect data to the USB module.
The second driver supports a series of functions that allow direct control
of the QS module. These functions are described in Application Note
AN-00200: SDM-USB-QS Programmer's Guide, where examples are given
in both Visual Basic and C. The Programmer's Guide can be downloaded
from the Application Notes page in the Support section of the Linx website.
Sample software is available on the Software page in the Support section.
With the serial number disabled, Windows tracks each device by
connection and assign a USB port to a particular device. If the device is
moved to another port, it needs to be reinstalled. The problem that arises
is that the device is installed on the same PC multiple times, once for each
USB port into which it has been plugged.
It is recommended to set the “Enable Serial Number” option and to use
a unique serial number as a part of the product's final testing procedure.
The QS EEPROM Programmer can be downloaded from the Linx website
and the EEPROM programming functions can be found in Application Note
AN-00200. These can be used as a part of an automated test program at
the end of the production line to program custom descriptors and a unique
serial number into the product.
Note: Avoid using the same serial number for multiple devices, as
it can cause a conflict in the operating system. Windows XP has a
particular problem with this and may crash if it sees two of the same
type of device with the same serial number on the same bus.
In addition to the Programmer's Guide, the QS Series Master Development
System (MDEV-USB-QS) includes example software and sample system
source code. This source code provides the driver function declarations,
examples of how to use the functions in a program, and other code that
may be of use.
– 8 –
– 9 –
Helpful Application Notes from Linx
The USB module can be powered in two ways: from the USB bus or from
an external source. If necessary, a voltage regulator can be used to supply
a clean 5V as the external source, or the VCC pin can be connected to the
bus power pin of the USB connector. Using the bus to power the module
is an advantage because the module then uses power from the host
rather than from the peripheral. This is especially helpful if the peripheral is
battery-powered. Figure 9 shows the schematic powering from the bus.
USB Type B
Connector
4
SDM-USB-QS-S
GND
GND
It is not the intention of this manual to address in depth many of the issues
that should be considered to ensure that the modules function correctly
and deliver the maximum possible performance. We recommend reading
the application notes listed in Figure 11 which address in depth key areas
of RF design and application of Linx products. These applications notes are
available online at www.linxtechnologies.com or by contacting Linx.
DAT+
DAT 5V
3
2
1
1
2
GND
3
4
6
5
GSHD
GSHD
Power Supply Guidelines
5
GND GND
6
7
8
USBDP
RI
USBDM
DCD
GND
DSR
VCC
DATA_IN
SUSP_IND
DATA_OUT
RX_IND
RTS
TX_IND
CTS
485_TX
DTR
16
15
Helpful Application Note Titles
Note Number
Note Title
AN-00200
SDM-USB-QS-S Programmer's Guide
AN-00201
Installing the SDM-USB-QS-S Drivers
14
13
Figure 11: Helpful Application Note Titles
12
11
10
9
Figure 9: USB Bus-Powered Schematic
The USB specification has strict allowances for using power from the bus.
A device is allowed to use 100mA before enumeration, 500mA during
normal operation, and 500mA in suspend mode. A descriptor stored in the
EEPROM tells the host how much current the device will pull from the bus
so that the host can allocate the appropriate power. The modules come
programmed for 100mA, but if the final product draws more than this, then
the device descriptors need to be changed.
Pad Layout
The following pad layout diagram is designed to facilitate both hand
and automated assembly.
0.065"
0.610"
0.070"
0.100"
Figure 10: Recommended PCB Layout
– 10 –
– 11 –
Typical Applications
1
VCC 2
3
4
5
0.1uF +
16V
14
15
16
DTR
RTS
CTS
DCD
DSR
RX DATA
VCC
RI
7
6
20
21
8
5
26
22
19
24
SUSP_IND
25
C1+
C1C2+
+
V+
MAX213
V-
13
17
+
C2T1IN
T1OUT
T2IN
T2OUT
T3IN
T3OUT
T4IN
T4OUT
R1OUT
R1IN
R2OUT
R2IN
R3OUT
R3IN
R4OUT
R4IN
R5OUT
R5IN
2
3
1
28
0.1uF
16V
GND
DAT+
DAT 5V
GND GND
4
27
23
18
GND
SUSP_IND
3
4
5
6
8
DTR2
RI
USBDM
DCD
GND
DSR
VCC
DATA_IN
SUSP_IND
DATA_OUT
RX_IND
RTS
TX_IND
CTS
485_TX
DTR
16
15
14
13
12
11
10
9
RI
DCD
DSR
RX DATA
TX Side
TX DATA
RTS
CTS
DTR
16
Connector
+5V INPUT 4
15
3
DAT+
14
2
+
DAT 0.1uF
5V
GND
12
11
11
VCC
12
C1+
+
GND GND
10 0.1uF
V+
+5VVCC
TO 220
=10V
9 6.3V
C114
VOLTAGE DOUBLER
15
C2+
V0.1uF +
+10V TO -10V
16V
C2- VOLTAGE INVERTER
16
VCC
Figure 13: Wireless Modem Using ES Series RF Modules
400k
7 T1IN
220
DCD2
DSR2
CTS2
TX DATA2
DCD2
RTS2
DSR2
RX DATA2
RX DATA2
CTS2
RI2
DTR2
RI2
Figure 14 below shows the QS module connected
to a microprocessor.
400k
T2
3
This is the design used in the QS Master6 T2Development
Kit and the
VCC
400k
documentation for the kit describes the connections and software.
6
2
IN
7
3
8
20 T3IN
4
OUT
T2
T3OUT 1
T3
VCC
9
220
5
1
2
3
4
5
6
7
8
9
220
DB9M
Figure 12: RS-232 to USB Converter
VCC
400k
RA2/AN2 21 T4IN
RA3/AN3 8 R1OUT
RA4/AN4
MCLR/VPP
GND
RB0/INT 5 R2OUT
RB1
RB2/RX
RB3
18
RA1/AN1T4OUT 28
17
R1
IN
169
R1
RA7
15
RA6
5k
14
VCC
13
RB7 R2IN 4
R2
12
RB6
11
5k
RB5/TX
10
RB4
T4
26 R3OUT
22 R4OUT
10K
VCC
SW-PB
200K
R3IN 27
R3
PIC16F88
5k
R4IN 23
R4
5k
6
GSHD
GSHD
USB Type B
Connector
GND
DAT+
DAT 5V
19 R5OUT
4
3
2
1
1
2
3
4
5
The QS Series modules can be used with Linx RF modules to create a
wireless link between two PCs. Figure 13 shows a design using the ES
Series RF modules. An option not shown in the schematic below is that
one of the output lines of the QS module (RTS or DTR) could be connected
to the PDN lines of the RF modules, enabling the host to turn the RF
modules on and off.
5
220
VCC
220
6
7
8
SDM-USB-QS-S
24 EN
USBDP
RI
USBDM
DCD
GND
DSR
VCC
DATA_IN
SUSP_IND
RX_IND
DATA_OUT
RTS
TX_IND
CTS
485_TX
DTR
Figure 14: Interface with a Microprocessor
– 12 –
T1OUT 2
T1
VCC
1
220
GND
10
SDM-USB-QS-S
1
USBDP
RI
2
USBDM
DCD
3
GND
DSR
4 0.1uF
VCC
DATA_IN
+
6.3V
5
13
SUSP_IND DATA_OUT
6
RX_IND
RTS
7
TX_IND
CTS
8
17
485_TX
DTR
0.1uF
+
16V
RX Side
RTS2
220
NC
NC
16
15
14
13
12
11
10
9
GND
USB Type B
SDM-USB-QS-S
USBDP
RI
USBDM
GND
DSR
VCC
SUSP_IND DATA_OUT
RX_IND
RTS
TX_IND
CTS
485_TX
DTR
GSHD
GSHD
VCC 220
GND
SDM-USB-QS-S
USBDP
1
2
3
4
5
6
7
8
NC
NC
PDN
RSSI
DATA
AUDIO
AREF
NC
VCC
GSHD
6
1
2
TX DATA2
EN
SHDN
GND
7
VCC
9
4
3
2
1
10
9
8
7
6
5
0.1uF
6.3V
PDN
ANT
LVL ADJ
GND
LOW V DET
GND
/CLK SEL
DATA
/CLK
6
11
VCC
GSHD
12
GSHD
+
5
0.1uF
6.3V
TX DATA
USB Type B
Connector
+
6
0.1uF
GND
5
VCC
GND
DAT+
DAT 5V
RXM-XXX-ES
1
TXM-XXX-ES
8
USB Type B
Connector
GSHD
There are many potential uses for the QS Series modules, three of which
will be described here. Figure 12 shows the QS and a MAX213 RS-232
level converter IC from Maxim. This creates a USB-to-RS-232 converter
that supports all of the standard handshaking lines. Similarly, RS-485 or
RS-422 level converter chips could be used for designs requiring those
standards.
– 13 –
R5IN 18
R5
5k
16
25
GND
1510
14
13
12
11
VCC
220
10
9
220
SHDN
16
15
14
13
12
11
10
9
The module is housed in a hybrid SMD package that supports hand and
automated assembly techniques. Since the modules contain discrete
components internally, the assembly procedures are critical to ensuring
the reliable function of the modules. The following procedures should be
reviewed with and practiced by all assembly personnel.
Hand Assembly
Pads located on the bottom
Soldering Iron
of the module are the primary
Tip
mounting surface (Figure 15).
Since these pads are inaccessible
during mounting, castellations
that run up the side of the module Solder
have been provided to facilitate
PCB Pads
Castellations
solder wicking to the module’s
Figure 15: Soldering Technique
underside. This allows for very
quick hand soldering for prototyping and small volume production. If the
recommended pad guidelines have been followed, the pads will protrude
slightly past the edge of the module. Use a fine soldering tip to heat the
board pad and the castellation, then introduce solder to the pad at the
module’s edge. The solder will wick underneath the module, providing
reliable attachment. Tack one module corner first and then work around the
device, taking care not to exceed the times in Figure 16.
Warning: Pay attention to the absolute maximum solder times.
Absolute Maximum Solder Times
Hand Solder Temperature: +427ºC for 10 seconds for lead-free alloys
Reflow Oven: +255ºC max (see Figure 40)
Figure 16: Absolute Maximum Solder Times
Automated Assembly
For high-volume assembly, the modules are generally auto-placed.
The modules have been designed to maintain compatibility with reflow
processing techniques; however, due to their hybrid nature, certain aspects
of the assembly process are far more critical than for other component
types. Following are brief discussions of the three primary areas where
caution must be observed.
– 14 –
Reflow Temperature Profile
The single most critical stage in the automated assembly process is the
reflow stage. The reflow profile in Figure 17 should not be exceeded
because excessive temperatures or transport times during reflow will
irreparably damage the modules. Assembly personnel need to pay careful
attention to the oven’s profile to ensure that it meets the requirements
necessary to successfully reflow all components while still remaining
within the limits mandated by the modules. The figure below shows the
recommended reflow oven profile for the modules.
300
Recommended RoHS Profile
Max RoHS Profile
Recommended Non-RoHS Profile
255°C
250
235°C
217°C
Temperature (oC)
Production Guidelines
200
185°C
180°C
150
125°C
100
50
0
30
60
90
120
150
180
210
240
270
300
330
360
Time (Seconds)
Figure 17: Maximum Reflow Temperature Profile
Shock During Reflow Transport
Since some internal module components may reflow along with the
components placed on the board being assembled, it is imperative that
the modules not be subjected to shock or vibration during the time solder
is liquid. Should a shock be applied, some internal components could be
lifted from their pads, causing the module to not function properly.
Washability
The modules are wash-resistant, but are not hermetically sealed. Linx
recommends wash-free manufacturing; however, the modules can be
subjected to a wash cycle provided that a drying time is allowed prior
to applying electrical power to the modules. The drying time should be
sufficient to allow any moisture that may have migrated into the module
to evaporate, thus eliminating the potential for shorting damage during
power-up or testing. If the wash contains contaminants, the performance
may be adversely affected, even after drying.
– 15 –
Linx Technologies
159 Ort Lane
Merlin, OR, US 97532
Phone: +1 541 471 6256
Fax: +1 541 471 6251
www.linxtechnologies.com
Disclaimer
Linx Technologies is continually striving to improve the quality and function of its products. For this reason, we
reserve the right to make changes to our products without notice. The information contained in this Data Guide
is believed to be accurate as of the time of publication. Specifications are based on representative lot samples.
Values may vary from lot-to-lot and are not guaranteed. “Typical” parameters can and do vary over lots and
application. Linx Technologies makes no guarantee, warranty, or representation regarding the suitability of any
product for use in any specific application. It is the customer’s responsibility to verify the suitability of the part for
the intended application. NO LINX PRODUCT IS INTENDED FOR USE IN ANY APPLICATION WHERE THE SAFETY
OF LIFE OR PROPERTY IS AT RISK.
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OR FOR ANY OTHER BREACH OF CONTRACT BY LINX TECHNOLOGIES. The limitations on Linx Technologies’
liability are applicable to any and all claims or theories of recovery asserted by Customer, including, without
limitation, breach of contract, breach of warranty, strict liability, or negligence. Customer assumes all liability
(including, without limitation, liability for injury to person or property, economic loss, or business interruption) for
all claims, including claims from third parties, arising from the use of the Products. The Customer will indemnify,
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