ISD4003-04MSI

ISD4003 SERIES SINGLE-CHIP, MULTIPLE-MESSAGES VOICE RECORD/PLAYBACK DEVICES 4-, 5-, 6-, AND 8-MINUTE DURATION -1- Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 1. GENERAL DESCRIPTION The ISD4003 ChipCorder® series provides high-quality, 3-volt, single-chip record/playback solutions for 4- to 8-minute messaging applications ideally for cellular phones and other portable products. The CMOS-based devices include an on-chip oscillator, anti-aliasing filter, smoothing filter, AutoMute® feature, audio amplifier, and high density multilevel Flash memory array. The ISD4003 series is designed to be used in a microprocessor- or microcontroller-based system. Address and control are accomplished through a Serial Peripheral Interface (SPI) or Microwire Serial Interface to minimize pin count. Recordings are stored into the on-chip Flash memory cells, providing zero-power message storage. This unique single-chip solution utilizes Winbond’s patented multilevel storage technology. Voice and audio signals are directly stored onto memory array in their natural form, providing high-quality voice reproduction. -2- ISD4003 SERIES 2. FEATURES • Single-chip voice record/playback solution • Single 3 volt supply • Low-power consumption Operating current: - ICC_Play = 15 mA (typical) - ICC_Rec = 25 mA (typical) Standby current: - ICC_Standby = 1 µA (typical) • Duration: 4, 5, 6, and 8 minutes • High-quality, natural voice/audio reproduction • AutoMute feature provides background noise attenuation • No algorithm development required • Microcontroller SPI or Microwire™ Serial Interface • Fully addressable to handle multiple messages • Non-volatile message storage • 100K record cycles (typical) • 100-year message retention (typical) • On-chip oscillator • Power-down feature to reduce power consumption • Available in die form, PDIP, SOIC, and TSOP • Temperature: - Commercial (die): 0°C to +50°C - Commercial (packaged units): 0°C to +70°C - Extended: -20°C to +70°C - Industrial: -40°C to +85°C -3- Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 3. BLOCK DIAGRAM Internal Clock Timing XCLK Sampling Clock ANA IN- Amp 5-Pole Active Antialiasing Filter Analog Transceivers Decoders ANA IN+ 1920K Cell Nonvolatile Multilevel Storage Array 5-Pole Active Smoothing Filter AutoMuteTM Feature Amp Power Conditioning VCCA VSSA VSSA VSSA VSSD VCCD Device Control SCLK SS MOSI MISO -4- INT RAC AM CAP AUDOUT ISD4003 SERIES 4. TABLE OF CONTENTS 1. GENERAL DESCRIPTION.................................................................................................................. 2 2. FEATURES ......................................................................................................................................... 3 3. BLOCK DIAGRAM .............................................................................................................................. 4 4. TABLE OF CONTENTS ...................................................................................................................... 5 5. PIN CONFIGURATION ....................................................................................................................... 6 6. PIN DESCRIPTION ............................................................................................................................. 7 7. FUNCTIONAL DESCRIPTION.......................................................................................................... 12 7.1. Detailed Description.................................................................................................................... 12 7.2. Serial Peripheral Interface (SPI) Description.............................................................................. 13 7.2.1. OPCODES ........................................................................................................................... 14 7.2.2. SPI Diagrams ....................................................................................................................... 15 7.2.3. SPI Control and Output Registers........................................................................................ 16 8. TIMING DIAGRAMS.......................................................................................................................... 18 9. ABSOLUTE MAXIMUM RATINGS.................................................................................................... 20 9.1. Operating Conditions .................................................................................................................. 21 10. ELECTRICAL CHARACTERISTICS ............................................................................................... 22 10.1. Parameters For Packaged Parts ........................................................................................ 22 10.2. Parameters For Die .............................................................................................................. 25 10.3. SPI AC Parameters .............................................................................................................. 26 11. TYPICAL APPLICATION CIRCUIT ................................................................................................. 27 12. PACKAGING AND DIE INFORMATION ......................................................................................... 30 12.1. 28-Lead 300-Mil Plastic Small Outline IC (SOIC)..................................................................... 30 12.2. 28-Lead 600-Mil Plastic Dual Inline Package (PDIP) ............................................................... 31 12.3. 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 ................................ 32 12.4. Die Information ......................................................................................................................... 33 13. ORDERING INFORMATION........................................................................................................... 35 14. VERSION HISTORY ....................................................................................................................... 36 -5- Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 5. PIN CONFIGURATION SCLK SS 1 28 MOSI 2 27 VCCD MISO 3 26 XCLK VSSD 4 25 INT NC 5 24 RAC NC 6 23 VSSA NC 7 22 NC NC 8 21 NC NC 9 20 NC NC 10 19 NC ISD4003 VSSA 11 18 VCCA VSSA 12 17 ANA IN+ AUD OUT 13 16 ANA IN- AM CAP 14 15 NC SOIC / PDIP VSSA RAC NC NC INT XCLK VCCD SCLK SS MOSI MISO VSSD NC NC 1 28 2 27 3 26 4 25 5 24 6 23 7 8 ISD4003 22 21 9 20 10 19 11 18 12 17 13 16 14 15 TSOP -6- NC NC VCCA ANA IN+ ANA INNC AM CAP NC AUD OUT NC VSSA VSSA NC NC ISD4003 SERIES 6. PIN DESCRIPTION PIN NAME PIN NO. FUNCTION SOIC / PDIP TSOP SS 1 9 Slave Select: This input, when LOW, will select the ISD4003 device. MOSI 2 10 Master Out Slave IN: This is the serial input to the ISD4003 device when it is configured as slave. The master microcontroller places data on the MOSI line one half-cycle before the rising edge of SCLK for clocking into the device. MISO 3 11 Master In Slave Out: This is the serial output (open drain) of the ISD4003 device. This output goes into a highimpedance state if the device is not selected. VSSA / VSSD 11, 12, 23 / 4 1, 17, 18 / 12 Ground: The ISD4003 series utilizes separate analog and digital ground busses. The analog ground (VSSA) pins should be tied together as close as possible and connected through a low-impedance path to power supply ground. The digital ground (VSSD) pin should be connected through a separate low-impedance path to power supply ground. These ground paths should be large enough to ensure that the impedance between the VSSA pins and the VSSD pin is less than 3 Ω. The backside of the die is connected to VSS through the substrate. For chip-on-board design, the die attach area must be connected to VSS or left floating. NC 5-10, 15, 19-22 3, 4, 1316, 19, 21, 23, 27, 28 Not connected AUD OUT [1] 13 20 Audio Output: This pin provides an audio output of the stored data and is recommended be AC coupled. It is capable of driving a 5 KΩ impedance REXT. [1] The AUD OUT pin is always at 1.2 volts when the device is powered up. When in playback, the output buffer connected to this pin can drive a load as small as 5 KΩ. When in record, a built-in resistor connects AUD OUT to the internal 1.2-volt analog ground supply. This resistor is approximately 850 KΩ, but will vary somewhat according to the sample rate of the device. This relatively high impedance allows this pin to be connected to an audio bus without loading it down. -7- Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES PIN NAME AM CAP PIN NO. FUNCTION SOIC / PDIP TSOP 14 22 AutoMute™ Feature: The AutoMute feature only applies for playback operation and helps to minimize noise (with 6 dB of attenuation) when there is no signal (i.e. during periods of silence). A 1 µF capacitor to ground is recommended to connect to the AM CAP pin. This capacitor becomes a part of an internal peak detector which senses the signal amplitude. This peak level is compared to an internally set threshold to determine the AutoMute trip point. For large signals, the AutoMute attenuation is set to 0 dB automatically but 6 dB of attenuation occurs for silence. The 1 µF capacitor also affects the rate at which the AutoMute feature changes with the signal amplitude (or the attack time). The AutoMute feature can be disabled by connecting the AM CAP pin directly to VCCA.. ANA IN- 16 24 Inverting Analog Input: This pin transfers the signal into the device during recording via differential-input mode. In this differential-input mode, a 16 mVp-p maximum input signal should be capacitively coupled to ANA IN- for optimal signal quality, as shown in Figure 1: ANA IN Modes. This capacitor value should be equal to that used on ANA IN+ pin. The input impedance at ANA IN- is normally 56 KΩ. In the single-ended mode, ANA IN- should be capacitively coupled to VSSA through a capacitor equal to that used on the ANA IN+ pin. ANA IN+ 17 25 Non-Inverting Analog Input: This pin is the non-inverting analog input that transfers the signal to the device for recording. The analog input amplifier can be driven single ended or differentially. In the single-ended input mode, a 32 mVp-p (peak-to-peak) maximum signal should be capacitively connected to this pin for optimal signal quality. The external capacitor associated with ANA IN+ together with the 3 KΩ input impedance are selected to give cutoff at the low frequency end of the voice passband. In the differential-input mode, the maximum input signal at ANA IN+ should be 16 mVp-p capacitively coupled for optimal signal quality. The circuit connections for the two modes are shown in Figure 1. -8- ISD4003 SERIES PIN NAME PIN NO. FUNCTION SOIC / PDIP TSOP VCCA / VCCD 18 / 27 26 / 7 Supply Voltage: To minimize noises, the analog and digital circuits in the ISD4003 devices use separate power busses. These +3V busses are brought out to separate pins and should be tied together as close to the supply as possible. In addition, these supplies should be decoupled as close to the package as possible. RAC 24 2 Row Address Clock: This is an open drain output that provides the signal of a ROW with a 200 ms period for 8 KHz sampling frequency. (This represents a single row of memory.) This signal stays HIGH for 175 ms and stays LOW for 25 ms when it reaches the end of a row. The RAC pin stays HIGH for 109.37 µsec and stays LOW for 15.63 µsec in Message Cueing mode (see Message Cueing section for detailed description). Refer to the AC Parameters table for RAC timing information at other sample rates. When a record command is first initiated, the RAC pin remains HIGH for an extra TRACL period. This is due to the need of loading the internal sample and hold circuits in the device. This pin can be used for message management techniques. A pull-up resistor is required to connect this pin to other device. INT 25 5 Interrupt: This is an open drain output pin. This pin goes LOW and stays LOW when an Overflow (OVF) or End of Message (EOM) marker is detected. Each operation that ends with an EOM or OVF will generate an interrupt. The interrupt will be cleared the next time an SPI cycle is initiated. The interrupt status can also be read by an RINT instruction. A pull-up resistor is required to connect this pin to other device. Overflow Flag (OVF) – The Overflow flag indicates that the end of memory has been reached during a record or playback operation. End of Message (EOM) – The End of Message flag is set only during playback operation when an EOM is found. There are eight EOM flag position options per row. -9- Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES PIN NAME XCLK PIN NO. FUNCTION SOIC / PDIP TSOP 26 6 External Clock Input: The pin has an internal pull-down device. The ISD4003 series is configured at the factory with an internal sampling clock frequency centered to ±1 percent of specification. The frequency is then maintained to a variation of ±2.25 percent over the entire commercial temperature and operating voltage ranges. The internal clock has a –6/+4 percent tolerance over the extended temperature, industrial temperature and voltage ranges. A regulated power supply is recommended for industrial temperature range parts. If greater precision is required, the device can be clocked through the XCLK pin as follows: Sample Rate Required Clock ISD4003-04M Part Number 8.0 kHz 1024 kHz ISD4003-05M 6.4 kHz 819.2 kHz ISD4003-06M 5.3 kHz 682.7 kHz ISD4003-08M 4.0 kHz 512 kHz These recommended clock rates should not be varied because the anti-aliasing and smoothing filters are fixed. Otherwise, aliasing problems can occur if the sample rate differs from the one recommended. The duty cycle on the input clock is not critical, as the clock is immediately divided by two. If the XCLK is not used, this input must be connected to ground. SCLK 28 8 Serial Clock: This is the input clock to the ISD4003 device. It is generated by the master device (typically microcontoller) and is used to synchronize the data transfer in and out of the device through the MOSI and MISO lines, respectively. Data is latched into the ISD4003 on the rising edge of SCLK and shifted out of the device on the falling edge of SCLK. - 10 - ISD4003 SERIES Internal to the device 53KΩ 0.1 µ F Signal 3KΩ ANA IN+ 32m Vp-p To Filter + 0.1 µ F 3KΩ ANA IN- 53KΩ 1.2V Single-Ended Input Mode Internal to the device 53KΩ 0.1 µ F 3KΩ ANA IN+ Input Signal 16m Vp-p - Input Signal 16m Vp-p 180° + To Filter 0.1 µ F 3KΩ ANA IN- 53KΩ 1.2V Differential Input Mode FIGURE 1: ISD4003 SERIES ANA IN MODES TRAC (200 ms) RAC 25 ms TRACL FIGURE 2: RAC TIMING WAVEFORM DURING NORMAL OPERATION (example of 8KHz sampling rate) - 11 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 7. FUNCTIONAL DESCRIPTION 7.1. DETAILED DESCRIPTION Audio Quality The Winbond’s ISD4003 ChipCorder® series is offered at 8.0, 6.4, 5.3 and 4.0 kHz sampling frequencies, allowing the user a choice of speech quality options. Increasing the sampling frequency will produce better sound quality, but affects duration. Please refer to Table 1: Product Summary for details. Analog speech samples are stored directly into on-chip non-volatile memory without the digitization and compression associated with other solutions. Direct analog storage provides higher quality reproduction of voice, music, tones, and sound effects than other solid-state solutions. Duration The ISD4003 Series is a single-chip solution with 4-, 5-, 6-, and 8-minute duration. TABLE 1: PRODUCT SUMMARY OF ISD4003 SERIES Part Number Duration (Minutes) Sample Rate (kHz) Typical Filter Pass Band (kHz) * ISD4003-04M 4 8.0 3.4 ISD4003-05M 5 6.4 2.7 ISD4003-06M 6 5.3 2.3 ISD4003-08M 8 4.0 1.7 * This is the –3dB point. This parameter is not checked during production testing and may vary due to process variations and other factors. Therefore, the customer should not rely upon this value for testing purposes. Flash Storage The ISD4003 series utilizes on-chip Flash memory, providing zero-power message storage. The message is retained for up to 100 years typically without power. In addition, the device can be rerecorded typically over 100,000 times. Memory Architecture The ISD4003 series contains a total of 1,920K Flash memory cells, which is organized as 1,200 rows of 1,600 cells each. - 12 - ISD4003 SERIES Microcontroller Interface A four-wire (SCLK, MOSI, MISO & SS ) SPI interface is provided for controlling and addressing functions. The ISD4003 is configured to operate as a peripheral slave device, with a microcontrollerbased SPI bus interface. Read and write operations are controlled through this SPI interface. An interrupt signal ( INT ) and internal read only Status Register are provided for handshake purposes. Programming The ISD4003 series is also ideal for playback-only applications, where single- or multiple-messages playback is controlled through the SPI port. Once the desired message configuration is created, duplicates can easily be generated via a programmer. 7.2. SERIAL PERIPHERAL INTERFACE (SPI) DESCRIPTION The ISD4003 series operates via SPI serial interface with the following protocol. First, the data transfer protocol assumes that the microcontroller’s SPI shift registers are clocked on the falling edge of the SCLK. However, for the ISD4003, the protocols are as follows: 1. All serial data transfers begin with the falling edge of SS pin. 2. SS is held LOW during all serial communications and held HIGH between instructions. 3. Data is clocked in on the rising edge of the SCLK signal and clocked out on the falling edge of the SCLK signal, with LSB first. 4. Playback and record operations are initiated when the device is enabled by asserting the SS pin LOW, shifting in an opcode and an address data to the ISD4003 device (refer to the Opcode Summary in the following page). 5. The opcodes contain and . 6. Each operation that ends with an EOM or Overflow will generate an interrupt. The Interrupt will be cleared the next time a SPI cycle is initiated. 7. As Interrupt data is shifted out of the MISO pin, control and address data are simultaneously shifted into the MOSI pin. Care should be taken such that the data shifted in is compatible with current system operation. Because it is possible to read an interrupt data and start a new operation within the same SPI cycle. 8. An operation begins with the RUN bit set and ends with the RUN bit reset. 9. All operations begin after the rising edge of SS . - 13 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 7.2.1. OPCODES The available Opcodes are summarized as follows: TABLE 2: OPCODE SUMMARY Instructions OpCodes Address (11 bits) POWERUP Descriptions Control bits (5 bits) C0 C1 C2 C3 C4 0 0 1 0 0 Power-Up: Device will be ready for an operation after TPUD. 0 0 1 1 1 Initiates playback from address . 0 1 1 1 1 Playback from the current address (until EOM or OVF). 0 0 1 0 1 Initiates a record operation from address . 0 1 1 0 1 Records from current address until OVF is reached or Stop command is sent. 1 0 1 1 1 Initiates Message Cueing (MC) from address . MC [1] 1 1 1 1 1 Performs a Message Cueing from current location. Proceeds to the end of message (EOM) or enters OVF condition if no more messages are present. STOP 0 1 1 X 0 Stops the current operation. STOPPWRDN X 1 0 X 0 Stops the current operation and enters into standby (power-down) mode. RINT [2] 0 1 1 X 0 Read Interrupt status bits: Overflow and EOM. SETPLAY PLAY SETREC REC SETMC Notes: C0 = Message cueing C1 = Ignore address bit C2 = Master power control C3 = Record or playback operation C4 = Enable or disable an operation [1] Message Cueing can be selected only at the beginning of a playback operation. [2] As the Interrupt data is shifted out of the ISD4003, control and address data are being shifted in. Care should be taken such that the data shifted in is compatible with current system operation. It is possible to read interrupt data and start a new operation at the same time. See Figures 5 - 8 for references. - 14 - ISD4003 SERIES 7.2.2. SPI Diagrams MOSI Input Shift Register (Loaded to Row Counter A0-A10 only if IAB = 0) Select Logic Row Counter P0-P10 OVF EOM MISO Output Shift Register FIGURE 3: SPI INTERFACE SIMPLIFIED BLOCK DIAGRAM The following diagram describes the SPI port and the control bits associated with it. MISO OVF EOM P0 P1 P2 P3 P4 P5 P6 P7 P8 P9 P10 0 0 LSB MOSI A0 0 MSB A1 A2 A3 A4 A5 A6 A7 A8 A9 A10 C0 C1 C2 C3 C4 Message Cueing (MC) Ignore Address Bit (IAB) Power Up (PU) Play/Record (P/R) RUN FIGURE 4: SPI PORT - 15 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 7.2.3. SPI Control and Output Registers The SPI control register provides control of individual function such as play, record, message cueing, power-up, power-down, start, stop and ignore address pointer operations. TABLE 3: SPI CONTROL REGISTERS Control Bit Control Register C0 MC C1 C2 C3 C4 Address Bits IAB Bit Device Function Message Cueing function = 1 Enable Message Cueing = 0 Disable Message Cueing [1] Ignore Address bit = 1 Ignore input address register (A0-A10) = 0 Use the input address register (A0-A10) Power Up PU = 1 Power-Up = 0 Power-Down P/ R Playback or Record = 1 Play = 0 Record Enable or Disable an operation RUN = 1 Start = 0 Stop A0-A10 Input address register TABLE 4: SPI OUTPUT REGISTERS Output Bits Description OVF Overflow EOM End-of-Message P0-P10 Output of the row pointer register [1] When IAB (Ignore Address Bit) is set to 0, a playback or record operation starts from address (A0-A10). For consecutive playback or record, IAB should be changed to a 1 before the end of that row (see RAC timing). Otherwise the ISD4003 will repeat the operation from the same row address. For memory management, the Row Address Clock (RAC) signal and IAB can be used to move around the memory segments. - 16 - ISD4003 SERIES Message Cueing Message cueing (MC) allows the user to skip through messages, without knowing the actual physical location of the messages. It will stop when an EOM marker is reached. Then, the internal address counter will point to the next message. Also, it will enter into OVF condition when it reaches the end of memory. In this mode, the messages are skipped 1,600 times faster than the normal playback mode. Power-Up Sequence The ISD4003 will be ready for an operation after power-up command is sent and followed by the TPUD timing (25 ms for 8 KHz sampling rate). Refer to the AC timing table for other TPUD values with respect to different sampling rates. The following sequences are recommended for optimized Record and Playback operations. Record Mode 1. Send POWERUP command. 2. Wait TPUD (power-up delay). 3. Send POWERUP command. 4. Wait 2 x TPUD (power-up delay). 5. a). Send SETREC command with address xx, or b). Send REC command (recording from current location). 6. Send STOP command to stop recording. 7. Wait TSTOP/PAUSE. For 3 & 4), please refer to Apps Brief 39A: recorded pop elimination in the ISD4000 series. For 5.a), the device will start recording at address xx and will generate an interrupt when an overflow (end of memory array) is reached, if no STOP command is sent before that. Then, it will automatic stop recording operation. Playback Mode 1. Send POWERUP command 2. Wait TPUD (power-up delay) 3. a). Send SETPLAY command with address xx, or b). Send PLAY command (playback from current location). 4. a). Send STOP command to halt the playback operation, or b). Wait for playback operation to stop automatically, when an EOM or OVF is reached. 5. Wait TSTOP/PAUSE. For 3.a), the device will start playback at address xx and it will generate an interrupt when an EOM or OVF is reached. It will then stop playback operation. - 17 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 8. TIMING DIAGRAMS T SSH SS T SSm in T SCKhi T SSS SCLK T DIS T DIH T SCKlow M OSI T PD (TRISTATE) M ISO T PD T DF LSB FIGURE 5: TIMING DIAGRAM SS SCLK LSB A8 MOSI A9 A10 C0 C1 C2 C3 C4 LSB MISO OVF EOM P0 P1 P2 P3 P4 FIGURE 6: 8-BIT COMMAND FORMAT - 18 - P5 ISD4003 SERIES SS SCLK MOSI MISO LSB A0 A1 A2 LSB OVF EOM P0 A3 P1 P2 A4 A5 P3 A6 P4 A7 P5 A8 P6 A9 P7 P8 A10 C0 P9 C1 P10 X C2 C3 X C4 X ≈ ≈ ≈ ≈ Data Stop ≈ ≈ ≈ ≈ ≈ ≈ Play/Record ≈ MISO ≈ MOSI ≈ ≈ SCLK ≈ ≈ SS ≈ FIGURE 7: 16-BIT COMMAND FORMAT Data TSTOP/PAUSE ANA IN ≈ (Rec) TSTOP/PAUSE ANA OUT ≈ (Play) FIGURE 8: PLAYBACK/RECORD AND STOP CYCLE - 19 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 9. ABSOLUTE MAXIMUM RATINGS TABLE 5: ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) CONDITIONS VALUES Junction temperature 150°C Storage temperature range -65°C to +150°C Voltage applied to any pin (VSS –0.3V) to (VCC +0.3V) Voltage applied to any pin (Input current limited to ±20mA) (VSS –1.0V) to (VCC +1.0V) Voltage applied to MOSI, SCLK, and SS pins (VSS –1.0V) to 5.5V (Input current limited to ±20mA) Lead temperature (soldering – 10 seconds) 300°C VCC – VSS -0.3V to +7.0V TABLE 6: ABSOLUTE MAXIMUM RATINGS (DIE) CONDITIONS VALUES Junction temperature 150°C Storage temperature range -65°C to +150°C Voltage applied to any pad (VSS –0.3V) to (VCC +0.3V) Voltage applied to any pad (Input current limited to ±20 mA) (VSS –1.0V) to (VCC +1.0V) Voltage applied to MOSI, SCLK, and SS pins (VSS –1.0V) to 5.5V (Input current limited to ±20mA) VCC – VSS -0.3V to +7.0V Note: Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability and performance. Functional operation is not implied at these conditions. - 20 - ISD4003 SERIES 9.1. OPERATING CONDITIONS TABLE 7: OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS VALUES Commercial operating temperature range (Case temperature) 0°C to +70°C Extended operating temperature (Case temperature) -20°C to +70°C Industrial operating temperature (Case temperature) -40°C to +85°C Supply voltage (VCC) Ground voltage (VSS) [1] +2.7V to +3.3V [2] 0V TABLE 8: OPERATING CONDITIONS (DIE) CONDITIONS VALUES Commercial operating temperature range Supply voltage (VCC) Ground voltage (VSS) [1] VCC = VCCA = VCCD [2] VSS = VSSA = VSSD 0°C to +50°C [1] +2.7V to +3.3V [2] 0V - 21 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 10. ELECTRICAL CHARACTERISTICS 10.1. PARAMETERS FOR PACKAGED PARTS TABLE 9: DC PARAMETERS PARAMETERS SYMBOLS MIN[2] TYP[1] MAX[2] UNITS VCC x 0.2 V CONDITIONS Input Low Voltage VIL Input High Voltage VIH Output Low Voltage VOL 0.4 V IOL = 10 µA RAC, INT Output Low Voltage VOL1 0.4 V IOL = 1 mA Output High Voltage VOH V IOH = -10 µA VCC Current (Operating) ICC VCC x 0.8 V VCC - 0.4 - Playback 15 30 mA REXT = ∞ [3] - Record 25 40 mA REXT = ∞ [3] 1 10 µA [3] [4] ±1 µA 10 µA VCC Current (Standby) ISB Input Leakage Current IIL MISO Tristate Current IHZ Output Load Impedance REXT ANA IN+ Input Resistance RANA IN+ 2.2 3.0 3.8 KΩ ANA IN- Input Resistance RANA IN- 40 56 71 KΩ ANA IN+ or ANA IN- to AUD OUT Gain AARP 1 5 KΩ 23 dB 32 mVpp 1 KHz sinewave input [5] Notes: [1] Typical values @ TA = 25°C and VCC = 3.0V. [2] All Min/Max limits are guaranteed by Winbond via electronical testing or characterization. Not all specifications are 100 percent tested. [3] VCCA and VCCD connected together. [4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating. [5] Measured with AutoMute feature disabled. - 22 - ISD4003 SERIES TABLE 10: AC PARAMETERS (Packaged Parts) CHARACTERISTIC Sampling Frequency ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M Filter Pass Band ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M Record Duration ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M Playback Duration ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M Power-Up Delay ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M Stop or Pause in Record or Play ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M RAC Clock Period ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M RAC Clock Low Time ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M RAC Clock Period in Message Cueing Mode ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M RAC Clock Low Time in Message Cueing Mode ISD4003-04M ISD4003-05M ISD4003-06M ISD4003-08M SYMBOLS [2] MIN FS FCF TREC TPLAY TPUD TSTOP or TPAUSE TRAC TRACL TYP [1] MAX [2] UNITS CONDITIONS 8.0 6.4 5.3 4.0 KHz KHz KHz KHz [5] 3.4 2.7 2.3 1.7 KHz KHz KHz KHz 3 dB Roll-Off Point [3][7] 3 dB Roll-Off Point [3][7] 3 dB Roll-Off Point [3][7] 3 dB Roll-Off Point 4 5 6 8 min min min min [6] 4 5 6 8 min min min min [6] 25 31.25 37.5 50 msec msec msec msec 50 62.5 75 100 msec msec msec msec 200 250 300 400 msec msec msec msec 25 31.25 37.5 50 msec msec msec msec 125 156.3 187.5 250 µsec µsec µsec µsec 15.63 19.53 23.44 31.25 µsec µsec µsec µsec [5] [5] [5] [3][7] [6] [6] [6] [6] [6] [6] [10] [10] [10] [10] TRACM TRACML Total Harmonic Distortion THD ANA IN Input Voltage VIN 1 - 23 - 2 % 32 mV 32 mVpp 1 KHz [11] sinewave input Peak-to-Peak [4] [8] [9] Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES Notes: [1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%. [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] Low-frequency cutoff depends upon the value of external capacitors (see Pin Descriptions) [4] Single-ended input mode. In the differential input mode, VIN maximum for ANA IN+ and ANA IN- is 16 mVp-p. [5] Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage ranges. For greater stability, an external clock can be utilized (see Pin Descriptions) [6] Playback and Record Duration can vary as much as ±2.25 percent over the commercial temperature and voltage ranges, and –6/+4 percent over the extended temperature, industrial temperature and voltage ranges. For greater stability, an external clock can be utilized (see Pin Descriptions) [7] Filter specification applies to the antialiasing filter and the smoothing filter. Therefore, from input to output, expect a 6 dB drop by nature of passing through both filters. [8] The typical output voltage will be approximately 450 mVp-p with VIN at 32 mVp-p. [9] For optimal signal quality, this maximum limit is recommended. [10] When a record command is sent, TRAC = TRAC + TRACL on the first row address. [11] Measured with AutoMute feature disabled. - 24 - ISD4003 SERIES 10.2. PARAMETERS FOR DIE TABLE 11: DC PARAMETERS PARAMETERS [6] SYMBOLS MIN[2] TYP[1] MAX[2] UNITS VCC x 0.2 V CONDITIONS Input Low Voltage VIL Input High Voltage VIH Output Low Voltage VOL 0.4 V IOL = 10 µA RAC, INT Output Low Voltage VOL1 0.4 V IOL = 1 mA Output High Voltage VOH V IOH = -10 µA Operating Current ICC VCC x 0.8 V VCC - 0.4 -Playback 15 30 mA REXT = ∞ [3] -Record 25 40 mA REXT = ∞ [3] Standby Current ISB 1 10 µA [3] [4] Total Harmonic Distortion THD 1 2 % ANA IN+ or ANA IN- to AUD OUT Gain AARP 23 32 mVpp 1 KHz sinewave input [5] 32 mVpp 1 KHz sinewave input [5] dB Notes: [1] Typical values @ TA = 25°C and VCC = 3.0V. Sampling Frequency can vary as much as ±2.25 percent over the commercial temperature and voltage ranges [2] All Min/Max limits are guaranteed by Winbond via electrical testing or characterization. Not all specifications are 100 percent tested. [3] VCCA and VCCD connected together. [4] SS = VCCA = VCCD, XCLK = MOSI = VSSA = VSSA and all other pins floating. [5] Measured with AutoMute feature disabled. [6] The test coverage for die is limited to room temperature testing. The test conditions may differ from that of packaged parts. - 25 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 10.3. SPI AC PARAMETERS TABLE 12: AC PARAMETERS[1] PARAMETER SYMBOL MIN SS Setup Time TSSS 500 nsec SS Hold Time TSSH 500 nsec Data in Setup Time TDIS 200 nsec Data in Hold Time TDIH 200 nsec Output Delay Output Delay to HighZ [2] TYP MAX UNITS TPD 500 nsec TDF 500 nsec SS HIGH TSSmin 1 µsec SCLK High Time TSCKhi 400 nsec SCLK Low Time TSCKlow 400 nsec CLK Frequency F0 1,000 CONDITIONS KHz Notes: [1] Typical values @ TA = 25°C, VCC = 3.0V and timing measurement at 50%. [2] Tri-state test condition. VCC 6.32KΩ MISO 10.91KΩ 50pF (Includes scope and fixture capacitance) - 26 - ISD4003 SERIES 11. TYPICAL APPLICATION CIRCUIT These application examples are for illustration purposes only. Winbond makes no representation or warranty that such application will be suitable for production. Make sure all bypass capacitors are as close as possible to the package. C9 15-30 pF C8 15-25 pF 39 OCS1 38 OCS2 R5 47 KΩ 31 PD3/MOSI 32 PD4/SCK 33 PD5/SS 34 PC0 28 PC1 27 PC2 26 PC3 25 PC4 24 PC5 23 68HC705C8PPC6 22 PC7 21 24 RAC PB0 12 25 INT RESET TCAP TCMP R6 47 KΩ VCC 30 IRQ VCC PB1 13 11 PA0 PB2 14 10 PA1 PB3 15 9 PA2 PB4 16 8 PA3 PB5 17 7 PA4 PB6 18 6 PA5 PB7 19 5 PA6 4 PA7 3 MISO 2 MOSI PD1/TD0 2 35 29 PD2/MISO 1 37 PD0/RDI VCC U1 VCCD 27 VSSD 4 U2 R7 10 KΩ C2 0.22µ F 28 SCLK 1 SS C1 47 µ F VCCA 18 VSSA 23 C11 0.1 µ F C3 0.22µ F VSSA 12 VSSA 11 16 ANA IN- AUD OUT 13 C4 1 µF 3 ISD4003 C10 0.1 µ F J1 2 4 LINE OUT 5 R2 1M 17 ANA IN+ 1 R1 10K AM CAP 14 R3 100 R4 100K POT 1 C5 1µF 3 U3 26 XCLK 13 -IN 14 +IN 2 GAIN-OUT 11 V01 10 3 2 4 PDIP / SOIC C6 1µ F 5 BYPASS 6 7 HP-IN1 HP-IN2 3 HPSENSE 2 SHUTDOWN PD7 V02 15 VDD 12 GND GND GND GND GND 1 4 8 9 16 5 J4 EXT SPEAKER 1 C7 .1µ F LM4860M FIGURE 9: APPLICATION EXAMPLE USING SPI - 27 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES U2 23 24 GND RESET VCC MISO VCCD 27 21 2 MOSI VSSD 4 20 28 SCLK D0 19 1 G3 28 G2 27 VCCA G1 26 VSSA 23 VSSA 12 VSSA 11 ANA IN- AUD OUT 13 22 D2 D1 INT 25 SI 3 SK 2 G7 4 SO 1 L7 18 L6 17 C9 0.1 µ F 16 C2 0.22µ F C1 47 µ F SS 18 C3 0.22µ F C4 1 µF 3 J1 2 COP 820C 6 VCC R7 3.3 K Ω C10 82 pF VCC U1 3 D3 L5 16 5 CLI L4 15 7 10 L3 14 8 11 L2 13 9 12 L1 12 10 13 L0 11 ISD4003 C8 0.1 µ F 17 ANA IN+ 24 RAC 25 VCC R6 4.7 KΩ VCC 4 1 R1 10K AM CAP 1 C5 1µF INT R4 100K POT R3 100 14 3 U3 13 -IN 14 +IN 2 GAIN-OUT 11 V01 10 3 2 4 26 XCLK R5 4.7 KΩ LINE OUT 5 R2 1M C6 1µF PDIP / SOIC 5 BYPASS 6 7 HP-IN1 HP-IN2 3 HPSENSE 2 SHUTDOWN V02 15 VDD 12 GND GND GND GND GND 1 4 8 9 16 1 LM4860M FIGURE 10: APPLICATION EXAMPLE USING MICROWIRE - 28 - 5 C7 .1µ F J4 EXT SPEAKER ISD4003 SERIES U2 23 24 GND RESET VCC MISO VCCD 27 21 2 MOSI VSSD 4 20 28 SCLK D0 19 1 G3 28 G2 27 VCCA G1 26 VSSA 23 VSSA 12 VSSA 11 22 D2 D1 INT 25 SI 3 SK 2 G7 4 SO 1 L7 18 L6 17 C9 0.1 µ F 16 C2 0.22µ F C1 47 µ F SS ANA IN- AUD OUT 18 C3 0.22µ F C4 1 µF 13 3 J1 2 COP 820C 6 VCC R7 3.3 K Ω C10 82 pF VCC U1 3 D3 L5 16 5 CLI L4 15 7 10 L3 14 8 11 L2 13 9 12 L1 12 10 13 L0 11 ISD4003 C8 0.1 µ F 17 ANA IN+ 24 RAC 25 VCC R6 4.7 KΩ VCC 4 1 R1 10K AM CAP 1 C5 1µF INT R4 100K POT R3 100 14 3 U3 13 -IN 14 +IN 2 GAIN-OUT 11 V01 10 3 J4 2 4 26 XCLK R5 4.7 KΩ LINE OUT 5 R2 1M C6 1µF PDIP / SOIC 5 BYPASS 6 7 HP-IN1 HP-IN2 3 HPSENSE 2 SHUTDOWN V02 15 VDD 12 GND GND GND GND GND 1 4 8 9 16 5 EXT SPEAKER 1 C7 .1µ F LM4860M FIGURE 11: APPLICATION EXAMPLE USING SPI PORT ON MICROCONTROLLER - 29 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 12. PACKAGING AND DIE INFORMATION 12.1. 28-LEAD 300-MIL PLASTIC SMALL OUTLINE IC (SOIC) 28 27 26 25 24 23 22 21 20 19 18 17 16 15 1 2 3 4 5 6 7 8 9 10 11 12 13 14 A G C B D E H F INCHES MILLIMETERS Min Nom Max Min Nom Max A 0.701 0.706 0.711 17.81 17.93 18.06 B 0.097 0.101 0.104 2.46 2.56 2.64 C 0.292 0.296 0.299 7.42 7.52 7.59 D 0.005 0.009 0.0115 0.127 0.22 0.29 E 0.014 0.016 0.019 0.35 0.41 0.48 F 0.050 1.27 G 0.400 0.406 0.410 10.16 10.31 10.41 H 0.024 0.032 0.040 0.61 0.81 1.02 Note: Lead coplanarity to be within 0.004 inches. - 30 - ISD4003 SERIES 12.2. 28-LEAD 600-MIL PLASTIC DUAL INLINE PACKAGE (PDIP) INCHES A MILLIMETERS Min Nom Max Min Nom Max 1.445 1.450 1.455 36.70 36.83 36.96 B1 0.150 B2 0.065 C1 0.600 C2 0.530 0.070 0.540 D 3.81 0.075 1.65 0.625 15.24 0.550 13.46 1.78 15.88 13.72 0.19 D1 0.015 E 0.125 F 0.015 G 0.055 H 1.91 13.97 4.83 0.38 0.135 3.18 0.018 0.022 0.38 0.46 0.56 0.060 0.065 1.40 1.52 1.62 0.100 3.43 2.54 J 0.008 0.010 0.012 0.20 0.25 0.30 S 0.070 0.075 0.080 1.78 1.91 2.03 q 0° 15° 0° - 31 - 15° Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 12.3. 28-LEAD 8X13.4MM PLASTIC THIN SMALL OUTLINE PACKAGE (TSOP) TYPE 1 A A B B G G 1 22 33 44 55 66 77 88 99 10 10 11 11 12 12 13 13 14 14 28 28 27 27 26 26 25 25 24 24 23 23 22 22 21 21 20 20 19 19 18 18 17 17 16 16 15 15 F C E E D JJ H H I INCHES MILLIMETERS Min Nom Max Min Nom Max A 0.520 0.528 0.535 13.20 13.40 13.60 B 0.461 0.465 0.469 11.70 11.80 11.90 C 0.311 0.315 0.319 7.90 8.00 8.10 D 0.002 0.006 0.05 E 0.007 0.011 0.17 F 0.009 0.0217 0.15 0.22 0.27 0.55 G 0.037 0.039 0.041 0.95 1.00 1.05 H 0° 3° 6° 0° 3° 6° I 0.020 0.022 0.028 0.50 0.55 0.70 J 0.004 0.008 0.10 Note: Lead coplanarity to be within 0.004 inches. - 32 - 0.21 ISD4003 SERIES 12.4. DIE INFORMATION ISD4003 Series o Die Dimensions (with scribe line) [1] X: 166.6 ± 1 mils Y: 274.9 ± 1 mils o VSSD MOSI MISO SCLK VCCD INT VCCD XCLK SS RAC VSSA VSSD Die Thickness [2] 11.5 ± 0.5 mils o Pad Opening Single pad: 90 x 90 microns Double pad: 180 x 90 microns ≈ VSSA[3] VSSA VSSA[3] ISD4003 ≈ [3] AUD OUT ANA IN- VCCA [3] AM CAP ANA IN+ VCCA Notes: [1] The backside of die is internally connected to VSS. It MUST NOT be connected to any other potential or damage may occur. [2] Die thickness is subject to change, please contact Winbond as this thickness may change in the future. [3] Double bond is recommended if treated as one pad. - 33 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES ISD4003 SERIES PAD COORDINATIONS (with respect to die center) Pad Pad Description X Axis (µm) Y Axis (µm) VSSA Analog Ground 1885.2 3273.7 RAC Row Address Clock 1483.8 3273.7 INT Interrupt 794.8 3273.7 XCLK External Clock Input 564.8 3273.7 VCCD Digital Power Supply 384.9 3273.7 VCCD Digital Power Supply 169.5 3273.7 SCLK Slave Clock -14.7 3273.7 SS Slave Select -198.1 3273.7 MOSI Master Out Slave In -1063.7 3273.7 MISO Master In Slave Out -1325.6 3273.7 VSSD Digital Ground -1665.3 3273.7 VSSD Digital Ground -1836.9 3273.7 VSSA [1] Analog Ground -1943.1 -3272.4 VSSA [1] Analog Ground -1853.1 -3272.4 VSSA Analog Ground -1599.9 -3272.4 AUD OUT Audio Output 281.9 -3272.4 AM CAP AutoMute 577.3 -3272.4 ANA IN- Inverting Analog Input 1449.3 -3272.4 ANA IN+ Noninverting Analog Input 1603.5 -3272.4 VCCA [1] Analog Power Supply 1853.7 -3272.4 VCCA [1] Analog Power Supply 1943.7 -3272.4 Note: [1] Double bond recommended if treated as one pad. - 34 - ISD4003 SERIES 13. ORDERING INFORMATION ISD4003Product Family : Special Temperature Field : ISD4000 Family Product Series : 03 = Third Series (4-8 min) Duration : Blank = Commercial Package (0°C to + 70°C) or Commercial Die (0°C to + 50°C) D = Extended (-20°C to + 70°C) I = Industrial (-40°C to + 85°C) Packaged Units / Die : 04M = 4 minutes X = Die 05M = 5 minutes P = 06M = 6 minutes 28-Lead 600-mil Plastic Dual Inline Package (PDIP) 08M = 8 minutes S = 28-Lead 300-mil Plastic Small Outline Package (SOIC) E = 28-Lead 8x13.4mm Plastic Thin Small Outline Package (TSOP) Type 1 When ordering ISD4003 Series devices, please refer to the following valid part numbers. Die / Package Part Number Die ISD4003-04MX ISD4003-05MX ISD4003-06MX ISD4003-08MX PDIP ISD4003-04MP ISD4003-05MP ISD4003-06MP ISD4003-08MP SOIC ISD4003-04MS ISD4003-05MS ISD4003-06MS ISD4003-08MS ISD4003-04MSI ISD4003-05MSI ISD4003-06MSI ISD4003-08MSI ISD4003-04ME ISD4003-05ME ISD4003-06ME ISD4003-08ME ISD4003-04MED ISD4003-05MED ISD4003-06MED ISD4003-08MED ISD4003-04MEI ISD4003-05MEI ISD4003-06MEI ISD4003-08MEI TSOP For the latest product information, access Winbond worldwide website at http://www.winbond-usa.com - 35 - Publication Release Date: January 2004 Revision 1.0 ISD4003 SERIES 14. VERSION HISTORY VERSION DATE DESCRIPTION 0 June 2000 Initial version 1.0 Jan. 2004 Reformat the document. Add note for typical filter pass band. Add memory architecture description. Remove all CSP info. Revise RAC timing parameter for MC. Revise AutoMute: playback only. Revise SPI, opcodes sections, record & playback steps. Rename TRACLO to TRACL. Revise AARP parameter. Revise DC & AC parameters tables for die. Revise die: (x,y) coordinates. Figures 9-11: revise VCCA and VCCD pin #. Revise Ordering Information. - 36 - ISD4003 SERIES The contents of this document are provided only as a guide for the applications of Winbond products. Winbond makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Winbond or others is granted by this publication. Except as set forth in Winbond's Standard Terms and Conditions of Sale, Winbond assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. Winbond products are not designed, intended, authorized or warranted for use as components in systems or equipments intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Winbond products are not intended for applications wherein failure of Winbond products could result or lead to a situation wherein personal injury, death or severe property or environmental injury could occur. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Winbond makes no representation or warranty that such applications shall be suitable for the use specified. ISD® and ChipCorder® are trademarks of Winbond Electronics Corporation. The 100-year retention and 10K record cycle projections are based upon accelerated reliability tests, as published in the Winbond Reliability Report, and are neither warranted nor guaranteed by Winbond. This product incorporates SuperFlash® technology licensed from SST. ® ® Information contained in this ISD ChipCorder data sheet supersedes all data for the ISD ChipCorder products ® published by ISD prior to August, 1998. ® ® This data sheet and any future addendum to this data sheet is(are) the complete and controlling ISD ChipCorder product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. Copyright© 2003, Winbond Electronics Corporation. All rights reserved. ChipCorder® ISD® are registered trademark of Winbond. All other trademarks are properties of their respective owners. Headquarters Winbond Electronics Corporation America Winbond Electronics (Shanghai) Ltd. No. 4, Creation Rd. III Science-Based Industrial Park, Hsinchu, Taiwan TEL: 886-3-5770066 FAX: 886-3-5665577 http://www.winbond.com.tw/ 2727 North First Street, San Jose, CA 95134, U.S.A. TEL: 1-408-9436666 FAX: 1-408-5441797 http://www.winbond-usa.com/ 27F, 299 Yan An W. Rd. Shanghai, 200336 China TEL: 86-21-62365999 FAX: 86-21-62356998 Taipei Office Winbond Electronics Corporation Japan Winbond Electronics (H.K.) Ltd. 9F, No. 480, Pueiguang Rd. Neihu District Taipei, 114 Taiwan TEL: 886-2-81777168 FAX: 886-2-87153579 7F Daini-ueno BLDG. 3-7-18 Shinyokohama Kohokuku, Yokohama, 222-0033 TEL: 81-45-4781881 FAX: 81-45-4781800 Unit 9-15, 22F, Millennium City, No. 378 Kwun Tong Rd., Kowloon, Hong Kong TEL: 852-27513100 FAX: 852-27552064 Please note that all data and specifications are subject to change without notice. All the trademarks of products and companies mentioned in this datasheet belong to their respective owners. - 37 - Publication Release Date: January 2004 Revision 1.0