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ISD1750SYR

ISD1750SYR

  • 厂商:

    NUVOTON(新唐)

  • 封装:

    SOIC28

  • 描述:

    IC VOICE REC/PLAY 50SEC 28-SOIC

  • 详情介绍
  • 数据手册
  • 价格&库存
ISD1750SYR 数据手册
ISD1700 DESIGN GUIDE ISD1700 Series Design Guide -1- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE TABLE OF CONTENTS 1 GENERAL DESCRIPTION .............................................................................................................. 6 2 FEATURES ...................................................................................................................................... 7 3 BLOCK DIAGRAM ........................................................................................................................... 8 4 PINOUT CONFIGURATION ............................................................................................................ 9 5 PIN DESCRIPTION ....................................................................................................................... 10 6 FUNCTIONAL DESCRIPTION ...................................................................................................... 14 6.1 Detailed Description ............................................................................................................... 14 6.1.1 Audio Quality ................................................................................................................ 14 6.1.2 Message Duration ........................................................................................................ 14 6.1.3 Flash Storage ............................................................................................................... 14 6.2 Memory Array Architecture..................................................................................................... 14 6.3 Modes of Operations .............................................................................................................. 16 6.3.1 Standalone (Push-Button) Mode .................................................................................. 16 6.3.2 SPI Mode ..................................................................................................................... 16 7 ANALOG PATH CONFIGURATION (APC) ................................................................................... 17 7.1 APC Register.......................................................................................................................... 17 7.2 Device Analog Path Configurations........................................................................................ 18 8 STANDALONE (PUSH-BUTTON) OPERATIONS ........................................................................ 19 8.1 Sound Effect (SE) Mode ........................................................................................................ 19 8.1.1 Sound Effect (SE) Features ......................................................................................... 19 8.1.2 Entering SE Mode ........................................................................................................ 19 8.1.3 SE Editing .................................................................................................................... 19 8.1.4 Exiting SE Mode........................................................................................................... 20 8.1.5 Sound Effect Duration .................................................................................................. 20 8.2 Operation Overview................................................................................................................ 20 8.2.1 Record Operation ......................................................................................................... 21 8.2.2 Playback Operation ...................................................................................................... 21 8.2.3 Forward Operation ....................................................................................................... 22 8.2.4 Erase Operation ........................................................................................................... 23 8.2.5 Reset Operation ........................................................................................................... 25 8.2.6 VOL Operation ............................................................................................................. 25 8.2.7 FT (Feed-Through) Operation ..................................................................................... 26 8.3 vAlert Feature (Optional) ........................................................................................................ 26 8.4 Analog Inputs ......................................................................................................................... 26 -2- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 8.4.1 Microphone Input ......................................................................................................... 26 8.4.2 AnaIn Input ................................................................................................................... 27 8.5 System Management ............................................................................................................. 27 9 CIRCULAR MEMORY ARCHITECTURE (CMA) ........................................................................... 28 9.1 Restoring Circular Memory Architecture ................................................................................ 30 10 SERIAL PERIPHERAL INTERFACE (SPI) MODE ........................................................................ 31 10.1 Microcontroller Interface ......................................................................................................... 31 10.2 SPI Interface Overview........................................................................................................... 31 10.2.1 SPI Transaction Format ............................................................................................... 31 10.2.2 MOSI Data Format ....................................................................................................... 32 10.2.3 MISO Data Format ....................................................................................................... 33 10.3 SPI Command Overview ........................................................................................................ 34 10.4 Switching from SPI mode to Standalone Mode ...................................................................... 35 10.5 ISD1700 Device Registers ..................................................................................................... 35 10.5.1 Status Register 0 (SR0) ............................................................................................... 35 10.5.2 Status Register 1 (SR1) ............................................................................................... 37 10.5.3 APC Register ............................................................................................................... 37 10.5.4 Playback Pointer (PLAY_PTR) .................................................................................... 38 10.5.5 Record Pointer (REC_PTR) ......................................................................................... 38 10.5.6 DEVICEID Register ...................................................................................................... 38 11 SPI COMMAND REFERENCE ...................................................................................................... 39 11.1 SPI Priority Commands .......................................................................................................... 41 11.1.1 PU (0x01) Power Up .................................................................................................... 41 11.1.2 STOP (0x02) ................................................................................................................ 42 11.1.3 RESET (0x03) .............................................................................................................. 42 11.1.4 CLR_INT(0x04) ............................................................................................................ 43 11.1.5 RD_STATUS (0x05) .................................................................................................... 43 11.1.6 PD (0x07) Power Down................................................................................................ 44 11.1.7 DEVID (0x09) Read Device ID ..................................................................................... 45 11.2 Circular Memory Commands ................................................................................................. 45 11.2.1 PLAY (0x40) ................................................................................................................. 46 11.2.2 REC (0x41) .................................................................................................................. 46 11.2.3 ERASE (0x42) .............................................................................................................. 47 11.2.4 G_ERASE (0x43) Global Erase ................................................................................... 48 11.2.5 FWD (0x48) ................................................................................................................. 48 11.2.6 CHK_MEM (0x49) Check Circular Memory ................................................................. 49 -3- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.2.7 RD_PLAY_PTR (0x06) ................................................................................................ 50 11.2.8 RD_REC_PTR (0x08) .................................................................................................. 50 11.3 Analog Configuration Commands .......................................................................................... 51 11.3.1 RD_APC (0x44) Read APC Register ........................................................................... 51 11.3.2 WR_APC1 (0x45) Load APC Register ........................................................................ 51 11.3.3 WR_APC2 (0x65) Load APC Register ........................................................................ 52 11.3.4 WR_NVCFG (0x46) Write APC data into Non-Volatile Memory.................................. 53 11.3.5 LD_NVCFG (0x47) Load APC register from Non-Volatile Memory ............................. 53 11.4 Direct Memory Access Commands ........................................................................................ 53 11.4.1 SET PLAY (0x80) ......................................................................................................... 54 11.4.2 SET_REC (0x81) ......................................................................................................... 55 11.4.3 SET_ERASE (0x82) ..................................................................................................... 56 11.5 Additional Command .............................................................................................................. 56 11.5.1 EXTCLK (0x4A) ........................................................................................................... 57 11.6 General Guidelines for Writing Program Code ...................................................................... 58 11.7 Examples of Various Operating Sequences .......................................................................... 59 11.7.1 Record, Stop and Playback operations ........................................................................ 60 11.7.2 SetRec and SetPlay operations ................................................................................... 61 11.7.3 Wr_APC2, SetRec and SetPlay operations ................................................................. 62 11.7.4 Playback 3 Messages as 1 Message (using SetPlay) ................................................. 63 12 TIMING DIAGRAMS ...................................................................................................................... 64 12.1 Record Operation ................................................................................................................... 64 12.2 Playback Operation ................................................................................................................ 65 12.3 Erase Operation ..................................................................................................................... 66 12.4 Forward Operation ................................................................................................................. 67 12.5 Global Erase Operation .......................................................................................................... 68 12.6 Reset Operation ..................................................................................................................... 68 12.7 Looping Playback Operation .................................................................................................. 69 12.8 Global Erase Operation to Restore Circular Memory Architecture ........................................ 70 12.9 Playback Operation with AUD Output .................................................................................... 70 12.10 SPI Operation .................................................................................................................. 71 13 ABSOLUTE MAXIMUM RATINGS ................................................................................................ 72 13.1 Operating Conditions.............................................................................................................. 73 14 ELECTRICAL CHARACTERISTICS .............................................................................................. 74 14.1 DC Parameters ...................................................................................................................... 74 14.2 AC Parameters ....................................................................................................................... 75 -4- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 15 TYPICAL APPLICATION CIRCUITS ............................................................................................. 76 15.1 Good Audio Design Practices ................................................................................................ 79 16 ORDERING INFORMATION ......................................................................................................... 80 17 VERSION HISTORY ...................................................................................................................... 81 -5- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 1 GENERAL DESCRIPTION ® ® The Nuvoton ISD1700 ChipCorder Series is a high quality, fully integrated, single-chip multi-message voice record and playback device ideally suited to a variety of electronic systems. The message duration is user selectable in ranges from 26 seconds to 120 seconds, depending on the specific device. The sampling frequency of each device can also be adjusted from 4 kHz to 12 kHz with an external resistor, giving the user greater flexibility in duration versus recording quality for each application. Operating voltage spans a range from 2.4 V to 5.5 V to ensure that the ISD1700 devices are optimized for a wide range of battery or line-powered applications. The ISD1700 is designed for operation in either standalone or microcontroller (SPI) mode. The device incorporates a proprietary message management system that allows the chip to self-manage address locations for multiple messages. This unique feature provides sophisticated messaging flexibility in a simple push-button environment. The devices include an on-chip oscillator (with external resistor control), microphone preamplifier with Automatic Gain Control (AGC), an auxiliary analog input, antialiasing filter, Multi-Level Storage (MLS) array, smoothing filter, volume control, Pulse Width Modulation (PWM) Class D speaker driver, and current/voltage output. The ISD1700 devices also support an optional “vAlert” (voiceAlert) feature that can be used as a new message indicator. With vAlert, the device flashes an external LED to indicate that a new message is present. Besides, four special sound effects are reserved for audio confirmation of operations, such as “Start Record”, “Stop Record”, “Erase”, “Forward”, “Global Erase”, and etc. Recordings are stored into on-chip Flash memory, providing zero-power message storage. This unique single-chip solution is made possible through Nuvoton’s patented Multi-Level Storage (MLS) technology. Audio data are stored directly in solid-state memory without digital compression, providing superior quality voice and music reproduction. Voice signals can be fed into the chip through two independent paths: a differential microphone input and a single-ended analog input. For outputs, the ISD1700 provides a Pulse Width Modulation (PWM) Class D speaker driver and a separate analog output simultaneously. The PWM can directly drive a standard 8Ω speaker or typical buzzer, while the separate analog output can be configured as a singleended current or voltage output to drive an external amplifier. While in Standalone mode, the ISD1700 devices automatically enter into power down mode for power conservation after an operation is completed. In the SPI mode, the user has full control via the serial interface in operating the device. This includes random access to any location inside the memory array by specifying the start address and end address of operations. SPI mode also allows access to the Analog Path Configuration (APC) register. This register allows flexible configuration of audio paths, inputs, outputs and mixing. The APC default configuration for standalone mode can also be modified by storing the APC data into a non-volatile register (NVCFG) that is loaded at initialization. Utilizing the capabilities of ISD1700 Series, designers have the control and flexibility to implement voice functionality into the high-end products. Notice: The specifications are subject to change without notice. Please contact Nuvoton Sales Offices or Representatives to verify current or future specifications. Also, refer to the website for any related application notes. -6- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 2 FEATURES  Integrated message management systems for single-chip, push-button applications o o o o o o REC : level-trigger for recording PLAY : edge-trigger for individual message or level-trigger for looping playback sequentially ERASE : edge-triggered erase for first or last message or level-triggered erase for all messages FWD : edge-trigger to advance to the next message or fast message scan during the playback VOL : 8 levels output volume control RDY INT : ready or busy status indication o RESET : return to the default state o Automatic power-down after each operation cycle  Selectable sampling frequency controlled by an external oscillator resistor Sampling Frequency Rosc 12 kHz 53 kΩ 8 kHz 80 kΩ 6.4 kHz 100 kΩ 5.3 kHz 120 kΩ 4 kHz 160 kΩ  Selectable message duration o A wide range selection from 30 secs to 240 secs at 8 kHz sampling frequency  Message and operation indicators o Four customizable Sound Effects (SEs) for audible indication o Optional vAlert (voiceAlert) to indicate the presence of new messages o LED: stay on during recording, blink during playback, forward and erase operations  Dual operating modes o Standalone mode:  Integrated message management techniques  Automatic power-down after each operation cycle o SPI mode:  Fully user selectable and controllable options via APC register and various SPI commands  Two individual input channels o MIC+/MIC-: differential microphone inputs with AGC (Automatic Gain Control) o AnaIn: single-ended auxiliary analog input for recording or feed-through  Dual output channels o Differential PWM Class D speaker outputs directly drives an 8 Ω speaker or a typical buzzer o Configurable AUD (current) or AUX (voltage) single-ended output drives external audio amplifier  ChipCorder standard features o High-quality, natural voice and audio reproduction o 2.4V to 5.5V operating voltage o 100-year message retention (typical) o 100,000 record cycles (typical)  Temperature options: o Commercial: 0°C to +50°C (die); 0°C to +70°C (packaged units) o Industrial: -40°C to +85°C (packaged units)  Packaging types: available in die, PDIP, SOIC and TSOP  Package option: Lead-free packaged units -7- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 3 BLOCK DIAGRAM Internal Clock ROSC MIC+ MICAGC Sampling Clock AnaIn Amp Amp MUX AnaIn Timing AntiAliasing Filter Nonvolatile Multi-Level Storage Array Smoothing Filter Volume Control AUD / AUX SP+ Amp SP- AGC Amp Automatic Gain Control Power Conditioning Device Control SPI Interface VCCA VSSA VCCP VSSP1 VSSP2 VSSD VCCD REC PLAY ERASE FWD FT RESET VOL INT/RDY LED SS SCLK MOSI MISO -8- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 4 PINOUT CONFIGURATION VCCD 1 28 VSSD LED 2 27 INT / RDY RESET 3 26 FWD MISO 4 25 ERASE MOSI 5 24 REC SCLK 6 23 PLAY 22 FT 21 VCCA SS 7 VSSA 8 AnaIn 9 20 ROSC MIC+ 10 19 VOL MIC- 11 18 AGC VSSP2 12 17 AUD / AUX SP- 13 16 VSSP1 VCCP 14 15 Sp+ ISD1700 SOIC / PDIP VSSA AnaIn MIC+ MICVSSP2 SPVCCP Sp+ VSSP1 AUD/AUX AGC VOL ROSC VCCA 1 2 3 4 5 6 7 8 9 10 11 12 13 14 ISD1700 28 27 26 25 24 23 22 21 20 19 18 17 16 15 SS SCLK MOSI MISO RESET LED VCCD VSSD INT / RDY FWD ERASE REC PLAY FT TSOP -9- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 5 PIN DESCRIPTION PIN NAME PDIP / SOIC TSOP FUNCTIONS [3] VCCD 1 22 LED 2 23 RESET 3 24 Digital Power Supply: It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors should be as close to the device as possible. LED: With an LED connected, this output turns an LED on during recording and blinks LED during playback, forward and erase operations. RESET: When Low, the device enters into a known state and initializes all pointers to the default state. This pin has an internal pull-up resistor [1]. Due MISO 4 25 Master In Slave Out: Data is shifted out on the falling edge of SCLK. When the SPI is inactive ( SS = high), it’s tri-state. MOSI 5 26 SCLK 6 27 SS 7 28 Master Out Slave In: Data input of the SPI interface when the device is configured as slave. Data is latched into the device on the rising edge of SCLK. This pin has an internal pull-up resistor [1]. Serial Clock: Clock of the SPI interface. It is usually generated by the master device (typically microcontroller) and is used to synchronize the data transfer in and out of the device through the MOSI and MISO lines, respectively. This pin has an internal pull-up resistor [1]. Slave Select: This input, when low, selects the device as slave device and enables the SPI interface. This pin has an internal pull-up resistor [1]. VSSA 8 1 AnaIn 9 2 MIC+ 10 3 MIC- 11 4 VSSP2 12 5 to debounce is absent, this pin must be tied to Vcc if not used. Analog Ground: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. AnaIn: Auxiliary analog input to the device for recording or feed-through. An AC-coupling capacitor (typical 0.1uF) is necessary and the amplitude of the input signal must not exceed 1.0 Vpp. Depending upon the D3 of APC register, AnaIn signal can be directly recorded into the memory, mixed with the Mic signal then recorded into the memory or buffered to the speaker and AUD/AUX outputs via feed-through path. MIC+: Non-inverting input of the differential microphone signal. The input signal should be AC-coupled to this pin via a series capacitor. The capacitor value, together with an internal 10 KΩ resistance on this pin, determines the low-frequency cutoff for the pass band filter. The Mic analog path is also controlled by D4 of APC register. MIC-: Inverting input of the differential microphone signal. The input signal should be AC-coupled to the MIC+ pin. It provides input noise-cancellation, or common-mode rejection, when the microphone is connected differentially to the device. The Mic analog path is also controlled by D4 of APC register. Ground for Negative PWM Speaker Driver: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. - 10 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE PIN NAME PDIP / SOIC TSOP FUNCTIONS [3] SP- 13 6 VCCP 14 7 SP+ 15 8 VSSP1 16 9 AUD / AUX 17 10 SP-: The negative Class D PWM provides a differential output with SP+ pin to directly drive an 8 Ω speaker or typical buzzer. During power down or not used, this pin is tri-stated. This output can be controlled by D8 of APC register. The factory default is set at on state. Power Supply for PWM Speaker Driver: It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors to VSSP1 and VSSP2 should be as close to the device as possible. The VCCP supply and VSSP ground pins have large transient currents and need low impedance returns to the system supply and ground, respectively. SP+: The positive Class D PWM provides a differential output with the SPpin to directly drive an 8 Ω speaker or typical buzzer. During power down or not used, this pin is tri-stated. This output can be controlled by D8 of APC register. The factory default is set at on state. Ground for Positive PWM Speaker Driver: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. Auxiliary Output: Depending upon the D7 of APC register, this output is either an AUD or AUX output. AUD is a single-ended current output, whereas AUX is a single-ended voltage output. They can be used to drive an external amplifier. The factory default is set to AUD. This output can be powered down by D9 of APC register. The factory default is set to On state. For AUD output, there is a ramp up at beginning and ramp down at the end to reduce the pop. AGC 18 11 VOL 19 12 ROSC 20 13 Automatic Gain Control (AGC): The AGC adjusts the gain of the preamplifier dynamically to compensate for the wide range of microphone input levels. The AGC allows the full range of signals to be recorded with minimal distortion. The AGC is designed to operate with a nominal capacitor of 4.7 µF connected to this pin. Connecting this pin to ground (VSSA) provides maximum gain to the preamplifier circuitry. Conversely, connecting this pin to the power supply (VCCA) provides minimum gain to the preamplifier circuitry. Volume: This control has 8 levels of volume adjustment. Each Low going pulse decreases the volume by one level. Repeated pulses decrease volume level from current setting to minimum then increase back to maximum, and continue this pattern. During power-up or RESET , a default setting is loaded from non-volatile configuration. The factory default is set to maximum. This output can also be controlled by of APC [1] and an internal register. This pin has an internal pull-up device [2] for start and end allowing the use of a push button debounce (TDeb) switch. Oscillator Resistor: A resistor connected from ROSC pin to ground determines the sample frequency of the device, which sets the duration. Please refer to the Duration Section for details. - 11 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE PIN NAME PDIP / SOIC TSOP FUNCTIONS [3] VCCA 21 14 FT 22 15 PLAY 23 16 Analog Power Supply. It is important to have a separate path for each power signal including VCCD, VCCA and VCCP to minimize the noise coupling. Decoupling capacitors to VSSA should be as close to the device as possible. Feed-through: In Standalone mode, when FT is engaged low, the AnaIn feed-through path is activated. As a result, the AnaIn signal is transmitted directly from AnaIn to both Speaker and AUD/AUX outputs with Volume Control. However, SPI overrides this input, while in SPI mode, and feedthrough path is controlled by a D6 of APC register. This pin has an internal [1] [2] and an internal debounce (TDeb) for start and end pull-up device allowing the use of a push button switch. Playback: Pulsing PLAY to Low once initiates a playback operation. Playback stops automatically when it reaches the end of the message. Pulsing it to Low again during playback stops the operation. Holding PLAY Low constantly functions as a sequential playback operation loop. This looping continues until PLAY returns to High. This pin [1] [2] has an internal pull-up device and an internal debounce (TDeb) for start and end allowing the use of a push button switch. REC 24 17 ERASE 25 18 FWD 26 19 RDY INT 27 20 Record: The device starts recording whenever REC switches from High to Low and stays at Low. Recording stops when the signal returns to High. [1] This pin has an internal pull-up device and an internal debounce (TDeb) [2] for start allowing the use of a push button switch. Erase: When active, it starts an erase operation. Erase operation will take place only when the playback pointer is positioned at either the first or last message. Pulsing this pin to Low enables erase operation and deletes the current message. Holding this pin Low for more than 3 sec. initiates a global erase operation, and will delete all the messages. This pin has an [1] [2] for start and internal pull-up device and an internal debounce (TDeb) end allowing the use of a push button switch. Forward: When triggered, it advances to the next message from the current location, when the device is in power down status. During playback cycle, pulsing this pin Low stops the current playback operation and advances to the next message, and then re-starts the playback operation [1] and an of the new message. This pin has an internal pull-up device [2] for start and end allowing the use of a push internal debounce (TDeb) button switch. An open drain output. Ready (Standalone mode): This pin stays Low during record, play, erase and forward operations and stays High in power down state Interrupt (SPI mode): After completing the SPI command, an active low interrupt is generated. Once the interrupt is cleared, it returns to High. - 12 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE PIN NAME PDIP / SOIC TSOP FUNCTIONS [3] VSSD 28 21 Digital Ground: It is important to have a separate path for each ground signal including VSSA, VSSD, VSSP1 and VSSP2 to minimize the noise coupling. Note: [1] 600 kΩ TDeb = Refer to AC Timing [3] For any unused pins, left floated. [2] - 13 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 6 FUNCTIONAL DESCRIPTION 6.1 DETAILED DESCRIPTION 6.1.1 Audio Quality ® Nuvoton’s patented ChipCorder Multi-Level Storage (MLS) teczhnology provides a natural, high-quality record and playback solution on a single chip. The input voice signals are stored directly in the Flash memory and are reproduced in their natural form without any of the compression artifacts caused by digital speech solutions. 6.1.2 Message Duration The ISD1700 Series offer record and playback duration from 20 seconds to 480 seconds. Sampling frequency and message duration, TDur, are determined by an external resistor connected to the ROSC pin. Table 6.1 Duration vs. Sampling Frequency Sample Freq. 12 kHz ISD173 0 20 secs ISD174 0 26 secs ISD175 0 33 secs ISD176 0 40 secs ISD179 0 60 secs ISD171 20 80 secs 8 kHz 30 secs 40 secs 50 secs 60 secs 90 secs 6.4 kHz 37 secs 50 secs 62 secs 75 secs 5.3 kHz 45 secs 60 secs 75 secs 90 secs 4 kHz 60 secs 80 secs 100 secs 120 secs 112 secs 135 secs 180 secs 120 secs 150 secs 181 secs 240 secs 6.1.3 ISD171 50 100 secs 150 secs 187 secs 226 secs 300 secs ISD171 80 120 secs 180 secs 225 secs 271 secs 360 secs ISD172 10 140 secs 210 secs 262 secs 317 secs 420 secs ISD172 40 160 secs 240 secs 300 secs 362 secs 480 secs Flash Storage The ISD1700 devices utilize embedded Flash memory to provide non-volatile storage. A message can be retained for a minimum of 100 years without power. Additionally, each device can be re-recorded over 100,000 times (typical). 6.2 MEMORY ARRAY ARCHITECTURE The memory array provides storage of four special Sound Effects (SEs) as well as the voice data. The memory array is addressed by rows. A row is the minimum storage resolution by which the memory can be addressed. The memory assignment is automatically handled by the internal message management system in standalone mode. While in SPI mode, one has the full access to the entire memory via the eleven address bits. Table 6.2 shows the minimum storage resolution with respect to the sampling frequency. Table 6.2 Minimum Storage Resolution vs. Sampling Frequency Sampling Frequency Minimum Storage Resolution 12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz 83.3 msec 125 msec 156 msec 187 msec 250 msec - 14 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE For example, at 8 kHz sampling frequency, the minimum storage resolution is 125 msec, so each Sound Effect (SE) is approximately 0.5 second long. Table 6.3 shows the maximum row address of each device in the ISD1700 family. The four sound effects (SE) occupy the first sixteen rows in the memory array with four rows for each SE. That means from address 0x000 to address 0x00F. The remaining memory is dedicated to voice data storage. Hence, the address of voice message storage will start from 0x010 to the end of memory array. Table 6.3 Device Maximum Row Address Device Maximum Address ISD173 0 0x0FF ISD174 0 0x14F ISD175 0 0x19F ISD176 0 0x1EF ISD179 0 0x2DF ISD171 20 0x3CF ISD171 50 0x4BF ISD171 80 0x5AF ISD172 10 0x69F ISD172 40 0x78F Below figure shows the memory array architecture for ISD1700 series. 010 000 - 003 SE1 004 - 007 SE2 008 - 00B SE3 00C - 00F SE4 1st row of Voice Message 0FF Last row of ISD1730 14F 19F 1EF Last row of ISD1740 Last row of ISD1750 Last row of ISD1760 2DF Last row of ISD1790 Accessible by SPI Set Commands or SE mode Accessible by SPI Set Commands 3CF Last row of ISD17120 4BF Last row of ISD17150 5AF Last row of ISD17180 69F Last row of ISD17210 78F Last row of ISD17240 - 15 - or Standalone Alike SPI Commands Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 6.3 MODES OF OPERATIONS The ISD1700 Series can operate in either Standalone (Push-Button) or microcontroller (SPI) mode. 6.3.1 Standalone (Push-Button) Mode Standalone operation entails use of the REC , PLAY , FT , FWD , ERASE , VOL and RESET pins to trigger operations. The internal state machine automatically configures the audio path according to the desired operation. In this mode, the internal state machine takes full control on message management. This allows the user to record, playback, erase, and forward messages without the needs to know the exact addresses of the messages stored inside the memory. For additional information, refer to Standalone Mode sections. 6.3.2 SPI Mode In SPI mode, control of the device is achieved through the 4-wire serial interface. Commands similar to the push button controls, such as REC , PLAY , FT , FWD , ERASE , VOL and RESET , can be executed through the SPI interface. In addition, there are commands that allow the modification of the analog path configuration, as well as commands that direct access the memory address of the array, plus others. The SPI mode allows full control of the device and the ability to perform complex message management rather than conform to the circular memory architecture as push-button mode. Refer to SPI Mode sections for details. In addition, it is suggested that both the microcontroller and the ISD1700 device have the same power supply level for design simplicity. In either mode, it is strongly recommended that any unused pins, no matter input or output, must be left floated or unconnected. Otherwise, it will cause the device becoming malfunction. - 16 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 7 ANALOG PATH CONFIGURATION (APC) The analog path of the ISD1700 can be configured to accommodate a wide variety of signal path possibilities. This includes the source of recording signals, mixing of input signals, mixing the playback signal with an input signal to the outputs, feed-through signal to the outputs and which outputs being activated. The active analog path configuration is determined by a combination of the internal state of the device, i.e. desired operation (record or playback), the status of the FT and the contents of the APC register. The APC register is initialized by the internal non-volatile configuration (NVCFG) bits upon power-onreset or reset function. The APC register can be read and loaded using SPI commands. The factory default of NVCFG bits, , is 0100 0100 0000 = 0x440. This configures the device with recording through the MIC inputs, FT via AnaIn input, playback from MLS, SE editing feature enabled, maximum volume level, active PWM driver and AUD current outputs. One can use SPI commands to modify the APC register and store it permanently into the NVCFG bits. 7.1 APC REGISTER Details of the APC register are shown in Table 7.1. Table 7.1 APC Register Bit Name Description Default 000 (maximum) D0 VOL0 D1 VOL1 D2 VOL2 Volume control bits : These provide 8 steps of -4dB per step volume adjustment. Each bit changes the volume by one step, where 000 = maximum and 111 = minimum. D3 Monitor_Input Monitor input signal at outputs during recording. D4 Mix_Input D3 = 0 Disable input signal to outputs during record D3 = 1 Enable input signal to outputs during record Combined with FT in standalone mode or SPI_FT bit (D6) in SPI mode, D4 controls the input selection for recording. D4 = 0 D4 = 1 D5 SE_Editing FT / D6= 0 AnaIn REC FT / D6= 1 Mic REC FT / D6= 0 (Mic + AnaIn) REC FT / D6= 1 Mic REC Enable or disable editing of Sound Effect in Standalone mode: where 0 = Enable, 1 = Disable - 17 - 0 = Monitor_input is Disabled 0 = Mix_Input is Off 0 = Enable SE_Editing Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Bit Name D6 SPI_FT Description Default For SPI mode only. Once SPI_PU command is sent, the FT is disabled and replaced by this control bit (D6) with the same functionality. After exiting SPI mode through the PD command, the FT resumes control of feed-through (FT) function. 1 = SPI_FT is Off D6 = 0 FT function in SPI mode is On D6 = 1 FT function in SPI mode is Off D7 Analog Output: AUD/AUX Select AUD or AUX: 0 = AUD, 1 = AUX 0 = AUD D8 PWM SPK PWM Speaker +/- outputs: 0 = Enabled, 1 = Disabled D9 PU Analog Output PowerUp analog output: 0 = On, 1 = Off 0 = On D10 vAlert vAlert: 0 = On, 1 = Off. 1 = Off D11 EOM Enable EOM Enable for SetPlay operation: 0 = Off, 1 = On. When this bit is set to 1, SetPlay operation will stop at EOM location, rather than the End Address. 0 = Off 0 = PWM enabled 7.2 DEVICE ANALOG PATH CONFIGURATIONS Table 7.2 demonstrates the possible analog path configurations with ISD1700. The device can be in power-down, power-up, recording, playback and/or feed-through state depending upon the operation requested by the push-buttons or related SPI commands. The active path in each of these states is determined by D3 and D4 of the APC register, as well as either D6 of the APC register in SPI mode or the FT status in standalone mode. In addition,.D7~D9 of the APC register determine which output drivers are activated. Table 7.2 Operational Paths APC Register D4 D3 D6 / FT Mix Mon 0 0 0 0 0 1 0 1 0 0 1 1 1 1 1 0 0 1 1 1 0 1 0 1 Operational Paths Idle AnaIn FT AnaIn FT (Mic + AnaIn) FT (Mic + AnaIn) FT FT Disable FT disable FT disable FT disable Record AnaIn Rec AnaIn Rec + AnaIn FT (Mic + AnaIn) Rec (Mic + AnaIn) Rec + (Mic + AnaIn) FT Mic Rec Mic Rec + Mic FT Mic Rec Mic Rec + Mic FT - 18 - Playback (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p (AnaIn + MLS) --> o/p MLS --> o/p MLS --> o/p MLS --> o/p MLS --> o/p Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 8 STANDALONE (PUSH-BUTTON) OPERATIONS One can utilize the REC , PLAY , FT , FWD , ERASE , VOL or RESET control to initiate a desired operation. As completed, the device automatically enters into the power-down state. An unique message management system is executed under this mode, which links to an optional special Sound Effect (SE) feature to review certain operating status of the device. Hence, it is benefit to understand how SE functions first. 8.1 SOUND EFFECT (SE) MODE SE mode can be manipulated by several control pins as described below. There are four special sound effects (SE1, SE2, SE3, and SE4). Audio clips can be programmed into the SEs as various indications. Each SE occupies four designated memory rows and the first sixteen memory rows are reserved for these four SEs evenly and sequentially. 8.1.1 Sound Effect (SE) Features The functions of SEs are used to indicate the status of the following operations: o SE1: Beginning of recording, forward or global erase warning o SE2: End of recording, single erase or forward from last message o SE3: Invalid erase operation o SE4: Successful global erase In general, the LED flashes once for SE1, twice for SE2, and so forth. It is crucial to recognize that the LED flashes accordingly regardless the SEs are programmed or not. When none of them is programmed, the blinking periods of SE1, SE2, SE3 and SE4 are defined as TLS1, TLS2, TLS3 and TLS4, respectively. Once they are programmed, during operation, the device flashes LED and plays the related SE simultaneously. Nevertheless, the period of blinking LED, under this condition, is limited by the duration of the recorded SE. In addition, they are defined as TSE1, TSE2, TSE3 and TSE4, respectively. These timing parameters also apply to the conditions elaborated in the following related sections. (Refer to AC timing parameter for details.) 8.1.2 Entering SE Mode • First press and hold FWD Low for 3 seconds or more roughly. This action on FWD will usually blink LED once (and play SE1 simultaneously if SE1 is recorded). However, if playback pointer is at the last message or memory is empty, the chip will blink the LED twice (and play SE2 simultaneously if SE2 is recorded). • While holding FWD Low, press and hold the REC Low until the LED blinks once. • The LED flashing once again indicates that the device is now in SE mode. Once entering into SE mode, the SE1 is always the first one to be accessible. 8.1.3 • SE Editing After into SE editing mode, one can perform record, play, or erase operation on each SE by pressing the appropriate buttons. For example, to record SE, simply press and hold - 19 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE REC . Similarly for play or erase function, pulse PLAY or ERASE , respectively. Record source can be either Mic+/- or AnaIn. • A subsequent FWD operation moves the record and playback pointers to the next SE sequentially. The LED will also blink one to four times after such operation to indicate which SE is active. If FWD is pressed while in SE4, the LED will flash once to indicate that SE1 is again active. • While the LED is blinking, the device will ignore any input commands. One must wait patiently until the LED stops blinking completely before any record, play, erase or forward input should be sent. 8.1.4 • Exiting SE Mode The required steps are the same as Entering SE mode. First press and hold FWD until the LED stops blinking (and related SE is played if SEs are programmed). Then, simultaneously press and hold the REC Low until the LED blinks twice (and device will play SE2 if SE2 is programmed). The device now exits the SE editing mode. 8.1.5 Sound Effect Duration The duration of SEs is determined by the sampling frequency selected and illustrated in below table. Table 8.1 Sound Effect Duration vs. Sampling Frequency Sampling Frequency Duration of SE 8.2 12 kHz 8 kHz 6.4 kHz 5.3 kHz 4 kHz 0.33 sec 0.5 sec 0.625 sec 0.75 sec 1 sec OPERATION OVERVIEW After power is applied or power-on-reset (POR), the device is in the factory default state and two internal record and playback pointers are initialized. (These two pointers are discussed later.) Then the active analog path is determined by the state of the FT , the status of the APC register and the desired operation. Up to four optional sound effects (SE1~SE4) can be programmed into the device to provide audible feedback to alert the user about the operating status. Simultaneously, the LED output provides visual indication about the operating status. During the active state of LED output, no new command will be accepted. An unique message management technique is implemented. Under this mode, the recorded messages are stored sequentially into the embedded memory from the beginning to the end in a circular fashion automatically. Two internal pointers, the record pointer and playback pointer, determine the location where an operation starts. After POR, these pointers are initialized as follows: • If no messages are present, both point to the beginning of memory. - 20 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE • If messages are present, the record pointer points to the next available memory row following the last message and the playback pointer points to the beginning of the last recorded message. The playback pointer is affected either by the FWD or REC operation. The record pointer is updated to the next available memory row after each REC operation. 8.2.1 Record Operation The REC controls recording operation. Once setting this pin Low, the device starts recording from the next available row in memory and continues recording until either the REC returns to High or the memory is full. The source of recording is from either MIC+/- or AnaIn, whereas the active analog configuration path is determined by the desired operation and the state of the FT . The REC is debounced internally. After recording, the record pointer will move to the next available row from the last recorded message and the playback pointer will position at the beginning of the newly recorded message. However, it is important to perform an Erase operation on the desired location before any recording proceeds. In addition, the power supply must remain On during the entire recording process. If power is interrupted during recording process, the circular memory architecture will be destroyed. As a result, next time when a push button operation starts, the LED will blink seven times, which indicates that something unusual has occurred, and the device will fail to perform the requested operation. Under such scenario, the only way to recover the chip to a proper state is to perform a Global Erase operation. Message recording indicators: The built-in message management technique associates special Sound Effects, SE1 and SE2, within the recording process. a) When REC goes Low: • If SE1 is not programmed, then the LED turns On immediately to indicate that a recording is in progress. • If SE1 is programmed, device plays SE1 and blinks LED simultaneously. Then LED turns On to show recording is in process. The LED blinking period of SE1 is determined by the recorded duration of SE1 (TSE1). (Refer to AC timing parameter and timing diagrams for details.) b) When REC goes High or when the memory is full: • If SE2 is not programmed, then the LED turns Off immediately to indicate that the recording halts. • If SE2 is programmed, device plays SE2 and flashes LED simultaneously. Then LED turns Off to show recording stops. The LED blinking period of SE2 is determined by the recorded duration of SE2 (TSE2). Triggering of REC during a play, erase or forward operation is an illegal operation and will be ignored. 8.2.2 Playback Operation Two playback modes can be executed by PLAY , which is internally debounced. - 21 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE a) Edge-trigger mode: Pulsing PLAY Low once initiates a playback operation of the current message. Playback automatically stops at the end of the message. Pulsing PLAY again will re-play the message. During playback, the LED flashes and goes Off when the playback completes. Pulsing PLAY to Low again during playback stops the playback operation. Under these circumstances, the playback pointer remains at the start of the played message after the operation is completed. b) Looping Playback mode: As PLAY is held Low constantly, the device plays all messages sequentially from the current message to its previous message and loops the playback action. During the entire playback process, the LED flashes non-stop. Meanwhile, the looping playback mechanism is implemented in the following sequence: start playback from current message; as playback is over, perform a forward operation; start playback of new message; once playback completes, perform another forward action; start playback of new message, …..and so on. This looping pattern continues until PLAY is released. As PLAY is released, device will continue to playback the current message until completion. When playback stops, the playback pointer is set at the start of the halted message. If no SE1 and SE2 are programmed, after playing a message, except the last one, device flashes LED once with blinking period TLS1 due to forward action. As after the last message, device flashes LED twice with blinking period TLS2. If both SE1 and SE2 are programmed, after playing a message, except the last one, device plays SE1 and flashes LED simultaneously due to forward action. Then device keeps on the playback of new message. Alternatively, after playing the last message, device plays SE2 and flashes LED simultaneously due to forward action. Then device maintains the playback of the first message. The LED blinking period of SE1 and SE2 are determined by the recorded durations of SE1 and SE2, respectively. Triggering PLAY during a record, erase, or forward operation is an illegal operation and will be ignored. 8.2.3 Forward Operation The FWD allows the device to advance the playback pointer to the next message in a forward direction. When the pointer reaches the last message, it will jump back to the first message. Hence, the movement is alike a circular fashion among the messages. The FWD is debounced internally. The effect of a Low-going pulse on the FWD depends on the current state of the device: a) If the device is in power-down state and the playback pointer does not point to the last message, then: • The playback pointer will advance to the next message. • If SE1 is not recorded, device will flash LED once with blinking period TLS1. • However, if SE1 is recorded, device plays SE1 and blinks the LED once simultaneously. The LED blinking period is determined by the recorded duration, TSE1, of SE1. b) If the device is in power-down state and the playback pointer points to the last message, then: • The playback pointer will advance to the first message. - 22 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE • If SE2 is not recorded, device will flash LED twice with blinking period TLS2. • However, if SE2 is recorded, device plays SE2 and blinks the LED twice simultaneously. The LED blinking period is determined by the recorded duration, TSE2, of SE2. c) If the device is currently playing a message that is not the last one, then the device: • Halts the playback operation. • Advances the playback pointer to the next message. • If SE1 is not recorded, device will flash LED once with blinking period TLS1. • However, if SE1 is recorded, device plays SE1 and blinks the LED once simultaneously. The LED blinking period is determined by the recorded duration, TSE1, of SE1. • Playback the new message. • The LED flashes during this entire process. d) If the device is currently playing the last message, then the device: • Halts the playback operation. • Advances the playback pointer to the first message. • If SE2 is not recorded, device will flash LED twice with blinking period TLS2. • However, if SE2 is recorded, device simultaneously plays SE2 and blinks the LED twice. The LED blinking period is determined by the recorded duration, TSE2, of SE2. • Playback the first message. • The LED flashes during this entire process. Triggering of the FWD operation during an erase or record operation is an illegal operation and will be ignored. 8.2.4 Erase Operation Erasing individual message takes place only if the playback pointer is at either the first or the last message. Erasing individual messages other than the first or last message is not permitted in standalone mode. However, global erase can be executed at any message location and will erase all messages, once completed successfully. The ERASE is debounced internally. These two erase modes are described as follows: a) Individual Erase: Only the first or last messages can be individually erased. Pulsing ERASE Low enables device responses differently pending upon the status of the device and the current location of the playback pointer: • If the device is in power down mode and the playback pointer currently points to the first (or last) message, then the device will: o Erase first (or last) message and flash LED twice with blinking period TLS2, if SE2 is not programmed. o If SE2 is programmed, simultaneously play SE2 and flash the LED twice. The LED blinking period is determined by the recorded duration, TSE2, of SE2. - 23 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE o Update the playback pointer to the new first message - previously the second message (or new last message - originally the second to the last message). • If the device is in power down mode and the playback pointer is at any message other than the first or last message, then the device will: o Not erase any message and flash LED three times with blinking period TLS3, if SE3 is not programmed. o If SE3 is programmed, simultaneously play SE3 and flash the LED three times. The LED blinking period is determined by the recorded duration, TSE3, of SE3. o Not change to the playback pointer. • If the device is currently playing the first (or last) message, o Stops the playback operation. o Erases the message as scenario one of individual erase mentioned earlier. • If the device is currently playing any message other than the first or last message, then the device will: o Stops the playback operation. o Behave like scenario two of individual erase mentioned above. b) Global Erase: Level-triggering ERASE at Low for more than 2.5 seconds and holding it continuously will initiate the Global Erase operation and deletes all messages, except the Sound Effects (SEs). See the below figure for operation details. The device reacts differently according to the current condition of the device. • If SEs are not programmed o o The device will blink LED twice with blinking period TLS2 once ERASE is triggered to indicate the current message being erased if it is either the first or last one. Or if current message is neither the first nor last one, LED will blink three times with blinking period TLS3 to show that current message is not erased. If ERASE is kept Low constantly, the LED will be blinked seven times to indicate all messages being erased. However, if ERASE is released before the first three blinks of LED, then global erase operation will be abandoned. Otherwise, the global erase operation will be performed. The estimated total period of blinking seven times is defined as (3*TLS1 +TLS4). • If SEs are programmed, o o o o The device will play SE2 and flash the LED twice simultaneously once ERASE is triggered to indicate the current message being erased if it is either the first or last one. Or if current message is neither the first nor last one, the device will play SE3 and flash the LED three times simultaneously to indicate that current message is not erased. After ERASE continues to be held Low for 2.5 seconds or more, the device plays SE1 three times with LED flashing simultaneously. This serves as a warning signal that after playing SE1 three times, then global erase will be performed. However, if ERASE is released before the playback of the third SE1, then global erase operation will be abandoned. - 24 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE o o As ERASE is maintained Low continuously, the device will erase all messages and play SE4 with LED flashing simultaneously upon completion. During this process, the blinking periods of twice, three times and four times are limited by the recorded durations of SE2, SE3 and SE4 (TSE2,TSE3 and TSE4) respectively. However, it is vital to maintain the power supply On during the erase process. If power is interrupted during such process, the circular memory architecture will be destroyed. As a result, next time when a push button operation starts, the LED will blink seven times, which indicates that something abnormal has occurred, and the device will fail to perform the requested operation. Under such scenario, the only way to recover the chip to a proper state is to perform a Global Erase operation. Triggering ERASE for individual erase during a record or forward operation is an illegal operation and will be ignored. However, triggering ERASE for an individual erase operation during playback will delete the current played message, if it is the first or last one. Play SE1 &/or blink LED 3 times to Signalify for Global Erase to Global Erase Starts start. Release ERASE key to abort Global Erase operation ERASE key is Pressed and Held 2.5 seconds (min.) Case 1 : Current messge location : 1st or Last Play Erase 1st SE2 or last &/or blink message LED 2x Case 2 : Global Erase Wait Play Play Play SE1 SE1 SE1 &/or blink &/or blink &/or blink LED once LED once LED once Current messge location : Not at 1st or Last Play SE3 &/or blink LED 3x Wait Global Erase Play Play Play SE1 SE1 SE1 &/or blink &/or blink &/or blink LED once LED once LED once Play SE4 &/or blink LED 4x Play SE4 &/or blink LED 4x Figure 8.1: Global Erase Operation 8.2.5 Reset Operation In general, when a push button switch is used on this control, a 0.1 µF capacitor is typically recommended to connect the RESET to ground, which should satisfy the requirement for most applications. After RESET is triggered, the device will be in power down state and place both the record and the playback pointers at the last message. When a microcontroller is used for a power-on-Reset, RESET must stay active for at least 1 µsec after all supply rails reach their proper specifications. However, this pin must be connected to Vcc if not used. 8.2.6 VOL Operation Pulsing VOL Low changes the volume output. Each pulse on VOL will decrease the volume until the minimum setting is reached. Subsequent pulses will increase the volume until the - 25 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE maximum level is reached and the cycle will start again. There are 8 steps of volume control. Each step changes the volume by 4 dB. The VOL is debounced internally. A RESET operation will re-initialize the volume level to the factory default state, which is the maximum level. One can change this default setting using related SPI command. 8.2.7 FT (Feed-Through) Operation The FT controls the feed-through path from the input to the output of the chip. By factory default, when FT is held Low, FT mode is enabled. Active FT mode will pass AnaIn signal to both SPK and AUD outputs when the device is idle. During recording, device will record the AnaIn signal into the memory. However, the FT path is subject to the contents of NVCFG register during power-on-reset. Once power-up, one can configure the feed-through path by changing the setting of the APC register using the related SPI commands. 8.3 VALERT FEATURE (OPTIONAL) If this optional feature is enabled, after a recording operation, the LED output will blink once every few seconds to indicate the presence of a new message, while the device is in power-down state. After any subsequent operations, which power-up the device, the vAlert will stop flashing. 8.4 ANALOG INPUTS 8.4.1 Microphone Input INTERNAL TO THE DEVICE Ccoup 0.1uF Ra = 7K MIC + Ccoup 0.1uF AGC MIC IN Ra = 7K MIC Fcutoff=1/(2*pi*Ra*Ccoup) Figure 8.2: MIC input impedance (When this path is active) - 26 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 8.4.2 AnaIn Input INTERNAL TO THE DEVICE Ra = 42K Ccoup 0.1uF Ra = 42K ANAIN ANAIN INPUT AMPLIFIER Fcutoff=1/(2*pi*Ra*Ccoup) Figure 8.3: AnaIn input impedance (When the device is powered-up) 8.5 SYSTEM MANAGEMENT While in Standalone mode, it is recommended the designer to utilize the feedback from the RDY INT pin, visual and optional SE indications for effective system management with respect to its operations. - 27 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 9 CIRCULAR MEMORY ARCHITECTURE (CMA) The ISD1700 has a built-in circular memory management protocol to handle message management internally in Standalone mode. Before the device attempts to access memory via push-button controls or the SPI equivalent commands, it checks the memory structure for conformity to this circular memory protocol. If it fails, the LED will flash seven times and the device accepts no commands except reset and global erase in standalone mode. The only way to recover from this condition is to perform a global erase function successfully. The area of memory under circular memory management control is from address 0x010 to the end of memory, i.e. only for the voice message storage. This is because the first sixteen rows, up to address 0x00F are reserved for sound effects (SE). When the address pointer reaches the end of the memory, it will automatically roll over to address 0x010. To comply with the circular memory architecture, all messages must form a contiguous block with no empty space between them and there must be at least one blank row left between the last message and first message. This allows ISD1700 state machine to find the first and last message in memory after POR or Chk_Mem command in SPI mode. This CMA is automatically implemented by the ISD1700 in standalone mode and the similar pushbutton SPI commands. In SPI mode, however, the user has the option of direct addressing the array with the SET_PLAY, SET_REC and SET_ERASE commands, which are capable of going around this structure. This is an advantage if the user wishes to implement a fragmented memory management scheme onto the ISD1700. These SET commands also permit the recording, playback and erasing the sound effects in SPI mode. The SET_PLAY command can never corrupt the CMA, but the SET_REC and SET_ERASE commands have the ability to fragment the message memory area and invalidate the circular memory structure. Thus, if standalone operation or internal memory management is required, care must be taken in using these commands while in SPI mode. - 28 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Figure 9.1 Circular Memory Management An example of the Circular memory management is shown in Figure 9.1. Here the memory array starts with an empty memory, the ISD1700 detects this and sets the record pointer to point at row 0x010, the first row of normal memory. A subsequent REC command will record message 1. Now the playback pointer will point to the beginning of message 1 and the record pointer to the next row after message 1. Three more recordings will write message 2, 3 and 4. This results the record and playback pointers are at next row after message 4 and beginning of message 4, respectively. If two FWD commands are now sent, the playback pointer will jump from last message to message 1 then message 2. Note that the erase pointer is now invalid since erase is restricted to only the first or last message. If three FWD commands were executed, the playback pointer would end up back at message 1 after wrapping around the last message. Because the pointer is at the first message an erase command is valid. An ERASE will remove message 1 from the memory. Note that the record pointer has been unaffected by all these operations. A further two FWD and a subsequent ERASE commands will remove message 4. - 29 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Figure 9.2 Further Circular Message Management A Further example of circular memory management is shown in Figure 9.2. Here note how the three REC commands cause message 7 to be split across the end of memory boundary. Two FWD commands will wrap the playback pointer to message four – the second message in the circular queue. Now if we record until the memory is full, the record pointer becomes invalid and no further record commands will be accepted by the device. Either the first or last message must be erased first. The example above demonstrates erasing the last and then the first message as well. 9.1 RESTORING CIRCULAR MEMORY ARCHITECTURE In case the circular memory architecture is damaged, the LED will blink seven times of duration TLErr when either REC , PLAY , ERASE or FWD button or alike SPI commands are activated. During such occurrence, the only way to recover back to an operating status is to perform a successful global erase operation. In order to perform this effectively, one has to press-and-hold the ERASE for approximately twelve seconds (time for LED to blink seven times plus period for global erase) at 8 kHz sampling frequency. As a result, the device will resume back to the normal condition. Details are shown in the related timing diagram. - 30 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 10 SERIAL PERIPHERAL INTERFACE (SPI) MODE 10.1 MICROCONTROLLER INTERFACE A four-wire (SCLK, MOSI, MISO & SS ) SPI interface can be used for serial communication to the ISD1700 device. The ISD1700 Series is configured to operate as a peripheral slave device. All operations can be controlled through this SPI interface. To allow compatibility with Standalone mode, some SPI commands: PLAY, REC, ERASE, FWD, RESET and G_ERASE behave similarly as the corresponding features in Standalone mode. In addition, SET_PLAY, SET_REC and SET_ERASE commands allow the user to specify the start and the end addresses of the operation. Besides, there are commands accessing the APC register, which controls the configuration of the analog paths used by the device, and etc. 10.2 SPI INTERFACE OVERVIEW The ISD1700 series operates via the SPI serial interface with the following protocol. Data transfer protocol requires that the microcontroller’s SPI shift registers are clocked out on the falling edge of the SCLK. The SPI protocol of the ISD1700 device is as follows: 1. A SPI transaction is initiated on the falling edge of the SS pin. 2. SS must be held Low during the entire data transfer process. 3. Data is clocked into the device through the MOSI pin on the rising edge of the SCLK signal and clocked out of the MISO pin on the falling edge of the SCLK signal, with LSB first. 4. The opcodes contain command, data and address bytes, depending upon the command type. 5. While control and address data are shifted into the MOSI pin, the status register and current row address are simultaneously shifted out of the MISO pin. 6. The SPI transaction is completed by raising the SS to High. 7. After completing an operational SPI command, an active Low interrupt is generated. It will stay Low until it is reset by the CLR_INT command. 10.2.1 SPI Transaction Format Figure 10.1 describes the format of the SPI transaction. Data are shifted into the device on the MOSI data line. Concurrently, the device status and current row address and other data are returned to the host via the MISO data line. In order to perform functions normally, correct numbers of data bytes are required to shift into the MOSI. Meanwhile, the related numbers of bytes of information are shifted out from MISO. LSB MOSI MSB 1st Byte 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte CMD_Byte Data Byte 1 Data Byte 2 or Start Address (Low Byte) Data Byte 3 or Start Address (High Byte) End Address (Low Byte) End Address (Mid Byte) End Address (High Byte) 2nd Byte 3rd Byte 4th Byte 5th Byte 6th Byte 7th Byte Data Byte 1 or SR0 (Low Byte) Data Byte 2 or SR0 (High Byte) SR0 (Low Byte) SR0 (High Byte) SR0 (Low Byte) LSB MSB 1st Byte MISO Status Register 0 (SR0) (Low Byte & High Byte) Figure 10.1 SPI Transaction Format - 31 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 10.2.2 MOSI Data Format MOSI is the Master Out Slave In data line of the SPI interface. Data is clocked into the device on the rising edge of the SCLK signal, with the least significant bit (LSB) first. Depending upon the command type, the format may be two bytes or as long as seven bytes. The generalized sequence of MOSI data is shown in the table below. The first byte sent to the device is always the command opcode byte, which determines the operation to be performed. Bit 4 (C4) of the command byte determines whether the LED feature is activated for related operations. When C4=1, the LED is On. Subsequent bytes are data associated with the type of command, which may include start and end addresses for operation or other data bits. Table 10.1 MOSI Data Sequence st MSB 1 Byte: Command Byte Bit 7 C7 Bit 6 C6 Bit 5 C5 Bit 4 C4 nd MSB 2 Bit 15 X/D7 Bit 14 X/D6 Bit 13 X/D5 Bit 3 C3 Bit 2 C2 LSB Bit 1 C1 Byte: Data Byte1 Bit 12 X/D4 Bit 11 X/D3 LSB Bit 10 X/D2 Bit 9 X/D1 rd MSB 3 Byte: Data Byte2 / Start Address Byte1 Bit 23 X/S7 Bit 22 X/S6 Bit 21 X/S5 Bit 20 X/S4 Bit 19 D11/S3 Bit 18 D10/S2 Bit 17 D9/S1 4 Byte: Data Byte3 / Start Address Byte2 Bit 31 X Bit 30 X Bit 29 X Bit 28 X Bit 27 X Bit 26 S10 Bit 25 S9 5 Byte: End Address Byte1 Bit 39 E7 Bit 38 E6 Bit 37 E5 Bit 36 E4 Bit 35 E3 Bit 34 E2 Bit 33 E1 6 Byte: End Address Byte2 Bit 47 X Bit 46 X Bit 45 X Bit 44 X Bit 43 X Bit 42 E10 Bit 41 E9 7 Byte: End Address Byte3 Bit 55 X Note: Bit 54 X Bit 53 X Bit 52 X Bit 51 X Bit 50 X Bit 32 E0 LSB th MSB Bit 24 S8 LSB th MSB Bit 16 D8/S0 LSB th MSB Bit 8 X/D0 LSB th MSB Bit 0 C0 Bit 40 E8 LSB Bit 49 X Bit 48 X X = Don’t care (Recommend 0) Majority of commands are two-byte commands. The DEV_ID, RD_STATUS and WR_APC nd rd command are three-byte, in which the 2 and 3 bytes are data for WR_APC. The, RD_APC and Read pointer commands are four-byte. However, SET commands are seven-byte with Start address and End address and the rest address bits are reserved for future use (recommend 0). Address count starts at address 0x000, which is the start location of the first Sound Effect. Address locations 0x000-0x00F inclusively are reserved equally for 4 sound effects. Address 0x010 is the first address of non-reserved storage. For minimum storage resolution, please refer to Section 6.2. - 32 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 10.2.3 MISO Data Format Data is clocked out of the Master In Slave Out pin of ISD1700 device on the falling edge of the SCLK signal, with LSB first. MISO returns the status generated by the last command and current row address in the first two bytes for all operations. The commands RD_STATUS, DEVID, RD_PLAY_PNTR, RD_REC_PNTR and RD_APC provide additional information in the subsequent bytes (see below sections for more details). The sequence of MISO is shown in the table below. Table 10.2 MISO Data Sequence st LSB Bit 0 CMD_ Err 1 Byte : Status Register 0 (Low Byte) Bit 1 Memory Full Bit 2 Power Up nd LSB Bit 8 A3 2 Bit 9 A4 Bit 17 D1/ Memory Full Bit 18 D2 / Power Up Bit 12 A7 Bit 13 A8 Bit 14 A9 Bit 19 D3 / EOM Bit 20 D4 / Interrupt Bit 21 D5 / A0 Bit 25 D9 / A4 Bit 26 D10 / A5 Bit 27 D11 / A6 Bit 28 D12 / A7 Bit 22 D6 / A1 Bit 29 D13 / A8 Bit 30 D14 / A9 Bit 37 A0 Bit 39 A1 th Bit 34 Power Up Bit 35 EOM th Bit 42 A5 Bit 43 A6 Bit 44 A7 Bit 45 A8 Bit 46 A9 th Bit 50 Power Up Bit 51 EOM Bit 39 A2 MSB 7 Byte : SR0 (Low Byte) Bit 49 Memory Full Bit 31 D15 / A10 MSB Bit 36 Interrupt 6 Byte : SR0 (High Byte) Bit 41 A4 Bit 23 D7 / A2 MSB 5 Byte : SR0 (Low Byte) Bit 33 Memory Full Bit 15 A10 MSB th LSB Bit 48 CMD_ Err Bit 11 A6 Bit 7 A2 MSB 4 Byte : Data Byte 2 or SR0 (High Byte) LSB Bit 40 A3 MSB Bit 6 A1 rd LSB Bit 32 CMD_ Err Bit 5 A0 3 Byte : Data Byte 1 or SR0 (Low Byte) LSB Bit 24 D8 / A3 Bit 4 Interrupt Byte : Status Register 0 (High Byte) Bit 10 A5 LSB Bit 16 D0 / CMD_ Err Bit 3 EOM Bit 47 A10 MSB Bit 52 Interrupt Bit 53 A0 Bit 54 A1 Bit 55 A2 st The status bits of the 1 byte provide important information on the result of the previous command sent. In particular, bit 0 (command error bit) indicates whether the chip is able to process the previous command or not. The address bits represent the address location. The contents of the Data Bytes 1 & 2 are depended upon the previous command. th th th The 5 , 6 and 7 bytes are the repeat of SR0 status. - 33 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE SPI Format SS SCLK MOSI LSB C0 MISO LSB B0 C1 C2 C3 C4 C5 C6 C7 D0 B4 B5 B6 B7 B8 D1 D2 D3 Dv Dx Dy Bx By MSB Dz MSB B1 B2 B3 B9 B10 B11 X Bz where Cn & Dn represent input data bit of MOSI, while Bn are output data bit. The initial condition of the SPI inputs to the ISD1700 should be: o o o SS = High SCLK = High MOSI = Low 10.3 SPI COMMAND OVERVIEW The SPI commands offer greater control over the device than that in standalone mode. There are several types of commands:• • • • Priority commands: o Accepted at any time and do not require state machine intervention. o PU, STOP, PD, RD_STATUS, CLR_INT, DEVID, RESET Circular memory commands: o Execute operations similar to in Standalone mode. o PLAY, REC, FWD, ERASE, G_ERASE, RD_REC_PTR, RD_PLAY_PTR Analog configuration commands: o Enable/disable various configuration paths, load/write APC and NVCFG registers, etc. o RD_APC, WR_APC, WR_NVCFG, LD_NVCFG, CHK_MEM, Direct memory access commands: o Execute operations with start and end addresses. o SET_ERASE, SET_REC, SET_PLAY A SPI command always consists of a command byte. The command byte has one special purpose bit, bit 4 (LED). This bit controls the operation of the LED output. If the user wishes to enable the operation of the LED, all opcodes should have this bit set to 1. - 34 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE In SPI mode, the memory location is fully accessible via row address. The microcontroller (µC) can access any rows including the reserved Sound Effect rows (0x000-0x00F). The SET_PLAY, SET_REC, and SET_ERASE commands require a specified start address and end address. If start address and end address are the same, ISD1700 will perform the operation on that row only. The SET_ERASE operation erases all rows specified by start address and end address inclusively. The SET_REC operation begins recording from start address and ends recording at end address, also writes an EOM marker at the end address. The SET_PLAY operation plays back message from start address and stops at end address. Additionally, SET_PLAY, SET_REC, and SET_ERASE commands have a one deep FIFO buffer to offer seamless transitions from one block of memory to the next. This deep FIFO buffer is only valid for same type of SET commands, i.e. SET_PLAY followed by SET_ERASE will not utilize the buffer and a command error will be generated. The RDY bit in Status Register 1 will indicate when the chip is ready to accept the second command. Also, interrupt will be issued when the operation is completed. For example, if two consecutive SET-PLAY commands with two different pairs of addresses are sent correctly, then the buffer is full. After completing playback of the first message st and the 1 SET_PLAY operation encounters an EOM, it will ignore the normal action for EOM, i.e. nd stop playback. Instead the device continues to execute the 2 SET_PLAY command. As a result, the chip will playback the second message. This action will minimize any potential dead time between two recorded messages and allow the device to concatenate two individual messages smoothly. If circular memory architecture is satisfied, one can use PLAY, REC, FWD, RESET, ERASE and G_ERASE commands, which will function similarly as the REC , PLAY , FWD , RESET , ERASE and global-erase in standalone mode, respectively. These commands will ensure that memory organization remain compatible with standalone operations. However, sound effects will not be activated like in standalone mode. If one wishes to switch between SPI and standalone modes, care must be taken in using SET_REC and SET_ERASE to follow the circular memory architecture. 10.4 SWITCHING FROM SPI MODE TO STANDALONE MODE While doing so, the following precautions have to be taken into account due to the circular memory architecture. First, the arrangement of messages created in SPI mode must match the circular memory structure. Second, only one empty slot is allowed inside the memory array. Third, the device must be “Reset” either before or after exiting the SPI mode, prior to any standalone functions being performed. Failure to do so will cause malfunctioning in standalone mode. As a result, LED will flash seven times. When happened, restoring circular memory architecture must be required. 10.5 ISD1700 DEVICE REGISTERS There are several registers returning the internal state of the ISD1700 device. The following describes each and its access mode. 10.5.1 Status Register 0 (SR0) SR0 is a two bytes data returning from MISO, which includes 5 status bits (D4:D0) and 11 address bits (A10:A0). - 35 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE SR0 Byte #1 Byte #2 Table 10.3 Size: 16 bits Type: Read Bit # : D7 D6 D5 D4 D3 D2 D1 D0 Name : A2 A1 A0 INT EOM PU FULL CMD_ERR Bit # : D15 D14 D13 D12 D11 D10 D9 D8 Name : A10 A9 A8 A7 A6 A5 A4 A3 Description: Device status register Access Every SPI command returns SR0 as first two bytes in MISO Bit description of Status Register 0 Byte #2 Byte #1 SR0 Bit Name Description 7 6 A2 A1 Current row address bit 2 Current row address bit 1 5 4 A0 INT 3 EOM Current row address bit 0 This bit is set to 1 when current operation is done. It can be cleared by CLR_INT command. This bit is set to 1 when an EOM is detected. It can be cleared by CLR_INT command. 2 PU This bit is set to 1 when the device is powered up and operating in SPI mode. 1 FULL 0 CMD_ERR 15 A10 This bit, when set to 1, indicates memory array is full. That means the device cannot record any new messages unless old messages are deleted. This bit is only valid when user follows push button format to program and erase the array. This bit indicates the previous SPI command is invalid when is set to 1, if: µC sends less than 5 bytes of row address, SPI command is decoded but ignored. Current row address bit 10 14 A9 Current row address bit 9 13 A8 Current row address bit 8 12 A7 Current row address bit 7 11 A6 Current row address bit 6 10 A5 Current row address bit 5 9 A4 Current row address bit 4 8 A3 Current row address bit 3 where is the active row of memory - 36 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 10.5.2 Status Register 1 (SR1) SR1 Size: 8 bits Type: Read Bit Sequence: D7 D6 D5 D4 D3 D2 D1 D0 SE4 SE3 SE2 SE1 REC PLAY ERASE RDY Description: Device secondary status register Access RD_STATUS command. is the third byte of MISO Table 10.4 Bit description of Status Register 1 SR1 Bit Name Description 7 SE1 This bit is set to 1 when sound effect 1 is recorded and 0 when erased 6 SE2 This bit is set to 1 when sound effect 2 is recorded and 0 when erased 5 SE3 This bit is set to 1 when sound effect 3 is recorded and 0 when erased 4 SE4 This bit is set to 1 when sound effect 4 is recorded and 0 when erased 3 REC This bit (=1) indicates current operation is recording 2 PLAY This bit (=1) indicates current operation is playback 1 ERASE This bit (=1) indicates current operation is erase 0 RDY In standalone mode, RDY=1 indicates the device is ready to accept command. In SPI mode, SPI is ready to accept new command, if this bit equals to 1. For REC, PLAY or ERASE, if RDY=0 means the device is busy and will not accept a new command, except RESET, CLR_INT, RD_STATUS, PD. However, REC and PLAY will also accept STOP command. If other commands are sent, they will be ignored and CMD_ERR will be set to 1. For any SET commands, RDY=1 means the buffer is empty, SPI can accept similar SET command. If host sends other commands, SPI will ignore it and set CMD_ERR to 1 unless new commands are RESET, CLR_INT, RD_STATUS, and PD. Also, SET_REC and SET_PLAY will accept STOP command. 10.5.3 APC Register APC Size: 12 bits Type: R/W Bit Sequence: Description: Analog Path Configuration register. Access Read: RD_APC; (See Table 7.1) Write: LD_APC - 37 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 10.5.4 Playback Pointer (PLAY_PTR) PLAY_PTR Size: 11 bits Type: Read Bit Sequence: PLAY_PTR Description: Pointer at beginning of current message Access Read: RD_PLAY_PTR; Changed by FWD, RESET, REC 10.5.5 Record Pointer (REC_PTR) REC_PTR Size: 11 bits Type: Read Bit Sequence: REC_PTR Description: Pointer at first available row in the memory. Access Read: RD_REC_PTR; Changed by REC 10.5.6 DEVICEID Register DEVICEID Bit Sequence: Size 8 bits D7 D6 Type D5 Read D4 D3 CHIPID Description: Device identification register Access DEVID command as third byte of MISO Table 10.5 D2 D1 D0 Reserved Bit description of DEVICEID Register DEVICEID Bits Name Description CHIPID DDDDD Device 76543 Reserved 11100 ISD17240 11101 ISD17210 11110 ISD17180 11000 ISD17150 11001 ISD17120 11010 ISD1790 10100 ISD1760 10101 ISD1750 10110 ISD1740 10000 ISD1730 Reserved - 38 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11 SPI COMMAND REFERENCE This section describes the SPI command set. A summary of commands is given in Table 11.1 and commands are detailed in subsequent sub-sections. Table 11.1 SPI Command Reference Data Byte1 PU 0x01 0x00 STOP 0x02 0x00 Stop the current operation RESET 0x03 0x00 Reset the device CLR_INT 0x04 0x00 Clear interrupt and EOM bit RD_STATUS 0x05 0x00 0x00 RD_PLAY_PTR 0x06 0x00 0x00 PD 0x07 0x00 RD_REC_PTR 0x08 0x00 0x00 DEVID 0x09 0x00 0x00 PLAY 0x40 0x00 Play from current location without LED action until EOM or STOP command received REC 0x41 0x00 Record from current location without LED action until end of memory or STOP command received ERASE 0x42 0x00 Erase current message to EOM location G_ERASE 0x43 0x00 Erase all messages (not include Sound Effects) RD_APC 0x44 0x00 [1] Data Byte2 or Start Address [3] Byte1 Data Byte3 or Start Address [3] Byte2 End Address Bytes 1/2/3 Command [2] Byte Instructions Description [3] Returns status bits & current row st counter in first 1 2 bytes and rd operating status in 3 byte 0x00 Returns status bits & current row st counter in 1 2 bytes and playback rd th pointer in 3 & 4 bytes Power down the device 0x00 0x00 Returns status bits & current row st counter in 1 2 bytes and Record rd th pointer in 3 & 4 bytes Read the device ID register. 0x00 - 39 - Returns status bits & current row st counter in first 1 2 bytes and the rd th contents of APC register in 3 & 4 bytes. Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Instructions [1] WR_APC1 Command [2] Byte Data Byte1 0x45 Data Byte2 or Start Address [3] Byte1 Data Byte3 or Start Address [3] Byte2 End Address Bytes 1/2/3 Description [3] Write the data into the APC register with volume setting from VOL pin WR_APC2 0x65 WR_NVCFG 0x46 0x00 Write the contents of APC to NVCFG LD_NVCFG 0x47 0x00 Load contents of NVCFG to APC Register FWD 0x48 0x00 Forward playback pointer to start address of next message. Forward will be ignored during operating, except Play CHK_MEM 0x49 0x00 Check circular memory EXTCLK 0x4A 0x00 Enable/disable external clock mode SET_PLAY 0x80 0x00 end address or stop at EOM, depending on the D11 of APC SET_REC 0x81 0x00 to end address SET_ERASE 0x82 0x00 to end address Note: Write the data into the APC register with volume setting from bits [1] Set initial SPI condition as listed in Section 10.2 before any SPI command is sent. [2] Bit C4 (LED) must be set to 1 if LED indication is required. During the active state of LED output, no new command will be accepted. [3] For “xxx…”, recommend to use “000…” - 40 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Before starting to write the program code, one has to fully understand the definition of each command and how to implement each of them correctly. If not, you may end up to spend lots of time and efforts in debugging the program code. The following several sections illustrate exactly how the communication sequence of each SPI command should be. Bear in mind that the first bit of each input data byte shifting into the MOSI must be LSB, whereas the first bit of data byte coming out from the MISO is LSB. Also, care must be provided to fulfill the initial conditions on the SS , SCLK and MOSI inputs (as shown in Section 10.2). If wrong format is sent, then the device may not response at all or may respond strangely. Also, not every command will generate an interrupt feedback signal to the host in responding to the operation requested. Thus, precautions must be well considered to ensure that the device is ready to accept a new instruction. Otherwise, the instruction sent will be ignored. 11.1 SPI PRIORITY COMMANDS This class of SPI commands will always be accepted by the ISD1700. They control power up and down of the device, interrogating the status of the device and clearing interrupt requests. 11.1.1 PU (0x01) Power Up SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (01h) MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB MSB LSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 PU Opcode: Byte Sequence: 0x01 0x00 Interrupt: MOSI 0x01 0x00 MISO SR0 Description: Power up State before Execution Power Down State after Execution Idle/FT Registers Affected SR0: PU bit, SR1: RDY bit No This command wakes up the ISD1700 device and enables it into the idle state. Upon executing this command, PU bit of SR0 and RDY bit of SR1 are set to 1. This command does not generate an interrupt. Once in SPI mode, the input from FT pin is ignored and its function is replaced by Bit 6 of the APC register. SPI mode is exited via a PD (power down) command. - 41 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.1.2 STOP (0x02) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (02h) Data Byte 1 MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB LSB MSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 STOP Opcode: Byte Sequence: 0x02 0x00 Interrupt: MOSI 0x02 0x00 MISO SR0 Description: Stop the current operation State before Execution REC, PLAY, SET_PLAY, SET_REC State after Execution Idle/FT Registers Affected SR0: INT bit, SR1: RDY/PLAY/REC bits Yes This command stops the current operation and returns the device back to the state prior to the operation. This command is only valid for the PLAY, REC, SET_PLAY and SET_REC operations. Upon completion, an interrupt is generated. The CMD_ERR bit of SR0 is set when the STOP command is sent during ERASE, G_ERASE and SET_ERASE operations. As STOP is sent while the device is idle, no action is taken and no interrupt is generated. 11.1.3 RESET (0x03) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (03h) MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB MSB LSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 RESET Opcode: Byte Sequence: Description: 0x03 0x00 Interrupt: MOSI 0x03 0x00 MISO SR0 No Reset the Device - 42 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE State before Execution Any, except PD State after Execution PD Registers Affected SR0, SR1, APC This command stops the current operation, if any, puts the device back to power down state, and clears the status of interrupt & EOM bits. As a result, all interrupt & EOM bits are cleared and INT is released. 11.1.4 CLR_INT(0x04) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (04h) MOSI LSB B0 B1 MISO B2 B3 B4 B5 B6 MSB LSB MSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 CLR_INT Opcode: Byte Sequence: 0x04 0x00 Interrupt: MOSI 0x04 0x00 MISO SR0 No Description: Read Status and Clear INT and EOM State before Execution Any State after Execution Does not affect state, clears the INT bit and INT pin. Registers Affected SR0: INT bit, EOM bit The Clear Interrupt command reads the status of the device and clears the status of interrupt & EOM bits. As a result, all interrupt & EOM bits are cleared and INT is released. 11.1.5 RD_STATUS (0x05) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCLK Command (05h) Data Byte 2 Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB Status Register 1 Status Register 0 : Bytes #1 & #2 RD_STATUS Opcode: MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 0x05 - 43 - 0x00 0x00 Interrupt: No Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Byte Sequence: MOSI 0x05 MISO SR0 Description: Read Status State before Execution Any State after Execution Does not affect state. Registers Affected None 0x00 0x00 SR1 The Read Status command reads the status of the device. This command has three bytes. The current row address obtained represents the address location when this command is executed. See Table 10.3 and Table 10.4 for description of status register bits. 1st Byte 2nd Byte 3rd Byte Status Register 0 Status Bits 0 1 2 Status Register 1 Current Row Address Bits 3 4 5 6 7 0 1 2 3 4 Status Bits 5 6 7 0 RDY EOM Full PU CMD_ERR 1 2 3 PLAY ERASE 4 5 7 SE2 SE0 REC 6 SE1 SE3 INT Figure 11.1 Read Status Command 11.1.6 PD (0x07) Power Down SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (07h) Data Byte 1 MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB LSB MSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 PD Opcode: Byte Sequence: 0x07 0x00 Interrupt: MOSI 0x07 0x00 MISO SR0 No Description: Power down the device and enter into standby mode State before Execution Any. If sent during a REC, PLAY or ERASE operation, device will finish operation before powering down. State after Execution PD Registers Affected SR0: PU bit This command places the ISD1700 into power-down mode and also enable standalone mode. If command is sent during an active play/record/erase operation, the device will first finish the - 44 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE current operation then power down. Upon completion, the device generates an interrupt. While exiting SPI mode, the INT /RDY pin status switches from INT to RDY state. 11.1.7 DEVID (0x09) Read Device ID SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCLK Command (09h) Data Byte 2 Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 Device ID Status Register 0 : Bytes #1 & #2 DEVID Opcode: Byte Sequence: 0x00 Interrupt: No MOSI 0x09 0x00 0x00 MISO SR0 0x09 DEVICEID Description: Read the DEVICEID register to identify the device family State before Execution Any State after Execution Does not affect state. Registers Affected None The Read Device ID command reads the ID register and returns the device name in the third byte of MISO to identify which device is present. See Table 10.5 for a description of DEVICEID register bits. 11.2 CIRCULAR MEMORY COMMANDS A circular memory command performs a simple typical operation similar to the related function as in standalone mode except it does not automatically playback sound effects (SE) for audio feedback of the operation. So if sound effects are required to mimic the standalone operations, separate commands are needed to perform the features. These commands need to comply with the circular memory architecture. Before these commands are executed, the ISD1700 checks the memory structure first. If it does not match the circular memory architecture. then CMD_ERR bit in Status Register 0 (SR0) will be set to one and command will not execute. In addition to the push-button similar commands, commands to read the record and playback pointers as well as to check whether current memory structure matches the circular memory architecture are available, thus allow the SPI host to track the locations of the recorded messages for its own message management. - 45 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.2.1 PLAY (0x40) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (40h) Data Byte 1 MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB MSB LSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 PLAY Opcode: Byte Sequence: 0x40 0x00 Interrupt: MOSI 0x40 0x00 MISO SR0 Yes Description: Device starts to playback from current PLAY_PTR State before Execution Idle State after Execution Idle Registers Affected SR0, SR1: PLAY & RDY bits The PLAY command starts playback operation from current message and stops when it reaches EOM or receives STOP command. During playback, the device only responds to STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR of SR0 is set when other commands are sent. Both RDY and PLAY bits of SR1 are Low during PLAY. 11.2.2 REC (0x41) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (41h) MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB MSB LSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 REC Opcode: Byte Sequence: 0x41 0x00 Interrupt: MOSI 0x41 0x00 MISO SR0 Description: Device will record from current REC_PTR State before Execution Idle State after Execution Idle - 46 - Yes Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Registers Affected SR0, SR1: REC & RDY bits The REC command starts record operation from current REC_PTR and stops when it receives STOP command or memory array is full. In record mode, the device only responds to STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set while other commands are sent. Both RDY and REC bits of SR1 are Low during recording. Power supply must be remained during the entire operation. 11.2.3 ERASE (0x42) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (42h) Data Byte 1 MOSI MISO LSB B0 B1 B2 B3 B4 B5 B6 MSB LSB MSB B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 ERASE Opcode: Byte Sequence: 0x42 0x00 Interrupt: MOSI 0x42 0x00 MISO SR0 Yes Description: Device will delete the message from current message if at first or last message State before Execution Idle State after Execution Idle Registers Affected SR0, SR1: ERASE & RDY bits The ERASE command erases the current message row by row when it is either the first or the last one. It stops when it reaches EOM. In erase mode, the device only responds to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set while other commands are sent or the current message is neither the first nor the last message. Both RDY and ERASE bits of SR1 are Low during erase. Power supply must be remained during the entire operation. - 47 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.2.4 G_ERASE (0x43) Global Erase SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (43h) MOSI LSB MISO MSB MSB LSB B0 B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 G_ERASE Opcode Byte Sequence: 0x43 0x00 Interrupt MOSI 0x43 0x00 MISO SR0 Description: Device will ERASE all messages. State before Execution Idle State after Execution Idle Registers Affected SR0, SR1: ERASE & RDY Yes The G_ERASE command deletes all messages within the entire memory array, except the SE portion (rows 0x000-0x00F), regardless the location of the PLAY_PTR. In the G_ERASE mode, the device only responds to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR of SR0 is set when other commands are sent. Both the RDY and ERASE bits of SR1 are Low during erase process. 11.2.5 FWD (0x48) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (48h) Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 FWD Opcode Byte Sequence: 0x48 0x00 Interrupt MOSI 0x48 0x00 MISO SR0 Description: Advances the PLAY_PTR to next message State before Execution Idle - 48 - Yes Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE State after Execution Idle Registers Affected SR0, PLAY_PTR This command enables the PLAY_PTR to jump from current address to the start address of next message. Unlike the FWD in standalone mode, FWD doesn’t interrupt a current playback operation and can only be issued in the SPI idle state. To emulate a FWD during playback in standalone mode, the STOP command must first be issued, then followed by FWD and PLAY commands. To determine the location of the PLAY_PTR, the RD_PLAY_PTR command can be used. 11.2.6 CHK_MEM (0x49) Check Circular Memory SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (49h) Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 CHK_MEM Opcode Byte Sequence: 0x49 0x00 Interrupt MOSI 0x49 0x00 MISO SR0 Yes Description: Check the validity of circular memory architecture State before Execution Idle State after Execution Idle Registers Affected SR0, PLAY_PTR, REC_PTR The CHK_MEM command enables the device to check whether the arrangement of the messages conforms to circular memory architecture under standalone condition. The device must be powered up and in idle state for this command to operate. When existing memory structure fails circular memory check, the CMD_ERR of SR0 is set. Upon the successful completion, the record and playback pointers are initialized, i.e. the playback pointer points to the last message and the record pointer points to the first available memory row. The read pointer commands can now be used to determine the positions of both pointers. Also with the FWD command applied, the start address of the subsequent messages can be located. - 49 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.2.7 RD_PLAY_PTR (0x06) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 30 31 SCLK Command (06h) Data Byte 1 Data Byte 2 & Byte 3 MOSI LSB MISO B0 MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB MSB LSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 Status Register 0 : Bytes #1 & #2 RD_PLAY_PTR Opcode Byte Sequence: MOSI 0x06 MISO SR0 0x06 B30 B31 Playback Pointer 0x00 No Interrupt 0x00 0x00 0x00 PP xxxxx PP Description: Read the current position of the PLAY_PTR PP. State before Execution After CHK_MEM or idle State after Execution Idle Registers Affected None This command reads out the playback pointer address, where a push-button compatible playback or PLAY starts from. Prior sending this command, ensure circular memory architecture is satisfied by performing CHK_MEM. Otherwise, invalid data is obtained. 11.2.8 RD_REC_PTR (0x08) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 30 31 SCLK Data Byte 1 Command (08h) Data Byte 2 & Byte 3 MOSI LSB MISO B0 MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 MSB MSB LSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 Status Register 0 : Bytes #1 & #2 RD_REC_PTR Opcode Byte Sequence: MOSI 0x08 MISO SR0 0x08 0x00 Record Pointer Interrupt 0x00 No 0x00 RP 0x00 xxxxx RP Description: Read the current position of the REC_PTR RP. State before Execution After CHK_MEM or idle State after Execution Idle Registers Affected None - 50 - B30 B31 Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE This command reads out the record pointer address, where a push-button compatible record or REC starts from. Prior sending this command, ensure circular memory architecture is satisfied by performing CHK_MEM. Otherwise, invalid data is obtained. 11.3 ANALOG CONFIGURATION COMMANDS These kind of commands allow the SPI host to configure the analog properties of the device. 11.3.1 RD_APC (0x44) Read APC Register SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 29 30 31 SCLK Command (44h) Data Byte 2 & Byte 3 Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB LSB MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 APC Register Status Register 0 : Bytes #1 & #2 RD_APC Opcode Byte Sequence: MOSI 0x44 MISO SR0 Description: Read the current contents of the APC register. State before Execution Idle State after Execution Idle Registers Affected None 0x44 B30 B31 0x00 0x00 0x00 0x00 Interrupt No 0x00 0x00 APC xxxxx APC This command reads out the contents of APC register. After sending SR0, the device will send out the APC register data. This command has 4 bytes. 11.3.2 WR_APC1 (0x45) Load APC Register SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCLK Command (45h) MOSI D0 B0 D1 D2 D3 D4 D5 D6 D7 D8 MSB LSB LSB MISO Data Byte 2 Data Byte 1 B1 B2 B3 B4 B5 B6 B7 B8 Opcode X X X X MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 Status Register 0 : Byte #1 Status Register 0 : Bytes #1 & #2 WR_APC1 D9 D10 D11 MSB LSB 0x45 - 51 - Interrupt No Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Byte Sequence: MOSI 0x45 MISO SR0 st SR0: 1 byte Description: Load the data to the APC register with volume setting from VOL pin State before Execution Idle State after Execution Idle Registers Affected APC The WR_APC1 command loads the desired data into the APC Register. There are three bytes involved: the first byte is command code, the second byte has data for APC and the third byte contains APC. The five most significant bits of the third byte are ignored. In this command, volume setting is from VOL pin, rather than the VOL bits . Care must be taken as changing the volume level if the device is executing an active command. Otherwise unintended transients may occur on the analog path. 11.3.3 WR_APC2 (0x65) Load APC Register SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 SCLK Command (65h) MOSI D0 B0 D1 D2 D3 D4 D5 D6 D7 D8 MSB LSB LSB MISO Data Byte 2 Data Byte 1 B1 B2 B3 B4 B5 B6 B7 B8 D9 D10 D11 X X X MSB LSB X MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 Status Register 0 : Byte #1 Status Register 0 : Bytes #1 & #2 WR_APC2 Opcode 0x65 Byte Sequence: MOSI 0x65 MISO SR0 Interrupt No st SR0: 1 byte Description: Load the data to the APC register with volume setting from bits State before Execution Idle State after Execution Idle Registers Affected APC The WR_APC2 command loads the desired data into the APC Register. There are three bytes involved: the first byte is command code, the second byte has data for APC and the third byte contains APC. The five most significant bits of the third byte are ignored. In this command, volume setting is from the bits , rather than VOL pin. Care must be taken as changing the volume level if the device is executing an active command. Otherwise unintended transients may occur on the analog path. - 52 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.3.4 WR_NVCFG (0x46) Write APC data into Non-Volatile Memory SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Data Byte 1 Command (46h) MOSI LSB MISO B0 MSB MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 WR_NVCFG Opcode Byte Sequence: 0x46 0x00 Interrupt MOSI 0x46 0x00 MISO SR0 No Description: Write the current content of the APC register into the NVCFG register State before Execution Idle State after Execution Idle Registers Affected None This command writes the data of the APC register into the NVCFG register. This value is loaded from NVCFG register to the APC register after a power-on condition or RESET. The CMD_ERR bit of SR0 is set if ISD1700 is not in idle state when this command is sent. 11.3.5 LD_NVCFG (0x47) Load APC register from Non-Volatile Memory SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (47h) Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 LD_NVCFG Opcode 0x00 Interrupt Byte Sequence: MOSI 0x47 0x00 MISO SR0 0x47 No Description: Load the current non-volatile NVCFG to the APC register. State before Execution Idle State after Execution Idle Registers Affected APC This command loads the contents of the NVCFG register into the APC register. The CMD_ERR bit of SR0 is set if ISD1700 is not in idle state when this command is sent. 11.4 DIRECT MEMORY ACCESS COMMANDS - 53 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE These types of commands allow the SPI host to perform random access to any memory location by specifying the start and the end addresses. For the record and playback operations, the next pair of addresses can be preloaded. As a result, the subsequent operation jumps to the next start address seamlessly, when the operation on the first pair of addresses is finished. All these commands require a START_ADDRESS and an END_ADDRESS. They operate from START_ADDRESS to END_ADDRESS inclusively. Because the memory is configured as a circular fashion, an END_ADDRESS smaller than START_ADDRESS is allowed. In this case, the ISD1700 will wrap around from the last row of the memory to the address 0x010 (excluding the SEs) and continue until END_ADDRESS is reached. If an END_ADDRESS is smaller than START_ADDRESS and an END_ADDRESS is also smaller than 0x10, then it will cause the device to loop endlessly, as the END_ADDRESS never matches the current address. Thus, precautions must be paid to address to the beginning of the memory. Also, care must be taken in accessing the SE rows (0x000-0x00F) and SEs should be handled independently. 11.4.1 SET PLAY (0x80) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 X X X X SCLK Command (80h) Data Byte 1 Start Address (16 bits) MOSI S0 LSB MISO B0 MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 S1 S2 S3 33 34 35 36 37 S7 S8 S9 S10 X S6 S5 MSB LSB MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2 32 S4 38 39 Status Register 0 : Bytes #1 & #2 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 End Address (24 bits) E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 X X X X X X X X X X X X X MSB LSB B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Bytes #1 & #2 SET_PLAY Opcode 0x80 0x00 Byte Sequence: MOSI 0x80 0x00 MISO SR0 Status Register 0 : Byte #1 Interrupt SR0 Yes SR0 0x00 SR0 Description: Start a playback operation from start address to end address inclusive or stop at EOM, depending on the D11 of APC. State before Execution Idle State after Execution Idle Registers Affected SR0, SR1:PLAY, RDY The SET_PLAY command initiates playback operation from start address and stops at end address . In SET_PLAY mode, the device only responds to - 54 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE SET_PLAY, STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set if other commands are sent while in this mode. The RDY bit of SR1 is Low until the device has latched the addresses and begun the playback operation. If no further command is sent, the device will play until the end address . Once the RDY bit of SR1 returns to High, another SET_PLAY can be sent immediately. By doing so, a second pair of START_ address and END_address is loaded into a FIFO buffer. So when the device reaches the EOM from the first end address, it doesn’t stop. Instead it automatically jumps to the second start address to continue to playback operation. The purpose of executing two consecutive SET_PLAY commands is to minimize any potential dead time between two recorded messages and allow the device to concatenate two individual messages smoothly. 11.4.2 SET_REC (0x81) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 X X X X SCLK Command (81h) Data Byte 1 Start Address (16 bits) MOSI S0 LSB MISO B0 MSB LSB B1 B2 B3 B4 B5 B6 B7 B8 S1 S2 S3 33 34 35 36 37 S6 S5 S7 S8 S9 S10 X MSB LSB MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2 32 S4 38 39 Status Register 0 : Bytes #1 & #2 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 End Address (24 bits) E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 X X X X X X X X X X X X X MSB LSB B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Bytes #1 & #2 SET_REC Opcode 0x81 0x00 Byte Sequence: MOSI 0x81 0x00 MISO SR0 Status Register 0 : Byte #1 Interrupt SR0 Yes SR0 0x00 SR0 Description: Start a record operation from start address to end address inclusive. State before Execution Idle State after Execution Idle Registers Affected SR0, SR1:REC, RDY The SET_REC command records from start address and stops at end address . In SET_REC mode, the device only responds to SET_REC, STOP, RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set if other commands are sent while in this mode. The RDY bit of SR1 is Low until the device has latched addresses and begun recording. If no further command is sent, the device will record until end address and write an EOM marker there. Once the RDY bit of SR1 - 55 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE returns to High, another SET_REC command can be sent. By doing so, a second pair of START_ address and END_address is loaded into a FIFO buffer. So when the device reaches the first end address, no EOM is written there and it automatically jumps to the second start address, then continue the recording operation. During the record process, power supply cannot be interrupted. Otherwise, it will cause the device malfunctioned. 11.4.3 SET_ERASE (0x82) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 16 15 17 18 19 21 20 22 24 23 25 26 27 28 29 30 31 X X X X SCLK Command (82h) Start Address (16 bits) Data Byte 1 MOSI S0 MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 S1 S2 S3 33 34 35 36 37 S5 S7 S8 S9 S10 X S6 MSB LSB MSB B9 B10 B11 B12 B13 B14 B15 B16 B17 B18 B19 B20 B21 B22 B23 B24 B25 B26 B27 B28 B29 B30 B31 Status Register 0 : Bytes #1 & #2 Status Register 0 : Bytes #1 & #2 32 S4 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 End Address (24 bits) E0 E1 E2 E3 E4 E5 E6 E7 E8 E9 E10 X X X X X X X X X X X LSB X X MSB B32 B33 B34 B35 B36 B37 B38 B39 B40 B41 B42 B43 B44 B45 B46 B47 B48 B49 B50 B51 B52 B53 B54 B55 Status Register 0 : Byte #1 Status Register 0 : Bytes #1 & #2 SET_ERASE Opcode 0x82 0x00 Byte Sequence: MOSI 0x82 0x00 MISO SR0 Interrupt SR0 Yes SR0 0x00 SR0 Description: Start an erase operation from start address to end address inclusive. State before Execution Idle State after Execution Idle Registers Affected SR0, SR1:ERASE, RDY The SET_ERASE command erases rows from start address to end address inclusively. In this mode, the device will only respond to RESET, CLR_INT, RD_STATUS and PD commands. The CMD_ERR bit of SR0 is set when other commands are sent. The RDY bit of SR1 is Low until erasure is completed and an interrupt is generated. During the erase process, power supply cannot be interrupted. Otherwise, it will cause the device malfunctioned. 11.5 ADDITIONAL COMMAND The additional command enhances the functionality and performance of the device in order to fulfill extra features and requirements that the designers may wish. - 56 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.5.1 EXTCLK (0x4A) SS 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 SCLK Command (4Ah) Data Byte 1 MOSI MSB LSB LSB MISO B0 B1 B2 B3 B4 B5 B6 B7 B8 MSB B9 B10 B11 B12 B13 B14 B15 Status Register 0 : Bytes #1 & #2 EXTCLK Opcode 0x4A 0x00 Byte Sequence: MOSI 0x4A 0x00 MISO Interrupt No SR0 Description: Enable or disable the external clock mode State before Execution Idle State after Execution Idle Registers Affected None The EXTCLK command toggles the enable and disable of the external clock (XCLK) mode on the device. When XCLK mode is activated, the internal oscillator of the device is disabled. Instead, an external clock is required to apply to the Rosc pin and the external resistor at Rosc pin must be removed. When XCLK mode is disabled, then the external clock signal must be disconnected from Rosc pin and an external resistor must be connected back, so that the device runs from its internal clock accordingly. This mode is very useful for synchronization of the I1700 device with an external component, such as microcontroller, when precision timing is essential. An active XCLK state can also be reset by RESET command or RESET pin. Hence, the device will operate via its internal oscillator, provided that the external resistor is hooked up to the Rosc pin. The frequencies of the required external clock with respect to the various sampling frequencies are listed in the below table, but duty cycle is not important since it will be taken care internally by the device. Sampling Freq. [kHz] External Clock Freq. [MHz] 12 8 6.4 5.3 4 3.072 2.048 1.638 1.356 1.024 - 57 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.6 GENERAL GUIDELINES FOR WRITING PROGRAM CODE Besides realizing the basic functions under Standalone mode (if not, one should study the contents of Section 8), the software engineers must also fully understand the definition of each SPI command and how to implement each of them correctly (if not, one should review and comprehend the contents from Section 10 through Section 11.5). Then the next move is how to link up the operating codes together and perfectly, so that the program runs smoothly. The following rules, but not limited to, should be applied. Rule #1: “Is the command just sent being accepted and executed correctly?” In order to validate this, one has to ensure that: (a) Is the device ready to accept the new instruction? Solution : Before any new instruction is sent, one can query the device’s ready status and confirm that from either the RDY bit of SR1 or the RDY INT pin. (b) Is the prior command sent being accepted? Solution : One can check and confirm whether the CMD_ERR bit of SR0 is set (=1) or not after the instruction code is sent. All these can be achieved by utilizing the RD_STATUS command. Rule #2: After the newly instruction code is accepted and executed, one needs to know “Does the operation function as expected?” The LED indication associated with certain operations in Standalone mode is not automatically embedded in the SPI similar functions. Hence, enabling the LED feature (bit C4) on all the operations is a good habit because this will provide a direct visual illustration to the end user, such as LED on during recording or LED blinking during playback, if LED is connected appropriately, and etc. Rule #3: While an operation is in progress, one needs to know “When the current operation completes”. So that the next instruction code can be sent immediately to make the best use of the microcontroller’s time and efficiency. This requires a feedback from ISD1700 device and can be achieved by monitoring the status change on either the INT bit of SR0 or the RDY INT pin. Rule #4: One must also be conscious about the characteristics of the interrupt. Once an interrupt is set, its status remains unaltered until it is cleared. The only way to clear an interrupt is to issue a CLR_INT command. In order to avoid any confusion on monitoring the interrupt status of consecutive instruction codes, one must immediately clear the interrupt set by the just-finished operation before the next instruction code is sent. Rule #5: As mentioned earlier, some commands (14 out of 24) have no interference on the interrupt status. These commands are: - PU, PD, RESET, CLR_INT, RD_STATUS, DEV_ID, - RD_APC, WR_APC1, WR_APC2, WR_NVCFG, LD_NVCFG, - RD_PLAY_PTR, RD_REC_PTR, EXTCLK Since most of these commands perform inquiries from the device or changing the internal setting within the device, some people may think the device would perform the task fairly quick. Thus, a common mistake will occur that two consecutive command codes are submitted without checking whether the device is ready to accept the next command (as nd Rule #1) or inserting an appropriate delay between the codes. As a result, the 2 command - 58 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE will be ignored. Bear in mind that no matter how quick the related task in ISD1700 can be performed, but its speed is still slower than that of code transmission from microcontroller. Therefore, after any of these commands is issued, one need to monitor the status on either the RDY bit of SR1 or the RDY INT pin to guarantee that the device is in Ready mode prior to a new instruction being sent. Otherwise, the new instruction will be omitted. Nevertheless, some programmers may prefer to insert a delay between two instruction codes for simplicity, rather than to monitor the Ready status. If that’s the case, one must insert a “sufficient” delay between the instruction codes. With a “sufficient” delay provided, one then can guarantee that the next instruction code will be successfully accepted after the execution on the current operation completes. Remember the frequency that the ISD1700 operates is pending upon an external resistor (typically, the common used ones have +/-5% or +/-10% accuracy for cost reason). Another precaution is that microcontrollers run code in µsec, but the ISD1700 completes a task in msec. Since the time for ISD1700 to accomplish a task is a variable factor pending upon the type of task, sampling frequency and other external factors, one may need to do the trial and error experiments in order to search for an optimum number. For example, with 8kHz sampling frequency, one can use 100 msec as a starting point, then adjust back and forth to search for that number. Due to the uncontrollable external factors, the approach of utilizing delay is not recommended, unless additional buffer on the delay is factored in. Rule #6: Set initial SPI condition as listed in Section 10.2 before any SPI command is sent. Rule #7: To access the sound effects, one needs to use Set commands. The debounce time needed for certain operation in Standalone mode is not required in SPI mode. 11.7 EXAMPLES OF VARIOUS OPERATING SEQUENCES The following flow chart examples illustrate various generic approaches on certain types of operating sequences. The flow charts review the typical required steps among different kinds of operations. The objective is to ensure each desired operation is performed as expected without any omission. These examples merely serve as references for writing program codes and make no representation that they are guaranteed to be functional at any systems flawlessly. Its software engineers’ responsibility to debug their own program code faultlessly in their system designed according to the applications. The operating sequences on the ISD1700 devices are not limited to those as shown. The following example sequences are mainly to demonstrate: - Record, Stop and Playback sequence. - SetErase, SetRec and SetPlay sequence. - Wr_APC2, SetRec and SetPlay sequence. - Playback 3 messages as 1 message sequence. Once the programmers get familiar with the methodology, they can apply the similar techniques on the related SPI commands and generate their own sequences with respect to the applications required. These examples offer a number of advantages, ultimately resulting in less effort and resources spending on programming, providing a viable path for code development in an effective and efficient way. - 59 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.7.1 Record, Stop and Playback operations Apply Power / Reset Send PU * Y Check CMD_ERR N Y Is CMD_ERR bit set ? N Wait T PUD Clr_Int * N Y Check RDY bit Device Ready Y N Send Record * Wait Record Duration Send Stop Monitor INT status for Completion Clr_Int * Send Play * Monitor INT status for Completion PD - 60 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.7.2 SetRec and SetPlay operations Apply Power / Reset Send PU Y * Check CMD_ERR Y Is CMD_ERR bit set ? N N Wait TPUD Clr_Int * N Y Check RDY bit Device Ready Y N Send SetErase * Monitor INT status for Completion Clr_Int * Send SetRec * Monitor INT status for Completion Clr_Int * Send SetPlay * Monitor INT status for Completion PD - 61 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.7.3 Wr_APC2, SetRec and SetPlay operations Apply Power / Reset Send PU Y * Check CMD_ERR Y Is CMD_ERR bit set ? N N Wait TPUD Clr_Int * Send Wr_APC2 * N Check RDY bit Y Device Ready Y N Send SetRec * Monitor INT status for Completion Clr_Int * Send SetPlay * Monitor INT status for Completion PD - 62 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 11.7.4 Playback 3 Messages as 1 Message (using SetPlay) Apply Power / Reset Send PU Y * Y Check CMD_ERR N Is CMD_ERR bit set ? N Wait TPUD Clr_Int * Y Check RDY bit Device Ready Y N Note: Utilizing 3 consecutive SetPlay on 3 individual messages as shown, then these 3 messages will be played back sequentially as one message with almost no dead silence between each message. Send SetPlay Msg1 Check CMD_ERR Check RDY bit N * * Send SetPlay Msg3 Send SetPlay Msg2 Check CMD_ERR Check CMD_ERR * * Monitor INT status for Msg 2 Completion Monitor INT status for Msg 1 Completion Clr_Int Clr_Int Monitor INT status for Msg 3 Completion Check RDY bit * PD - 63 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12 TIMING DIAGRAMS The following estimated timing diagrams are for basic operation and are not in proper scale. The LED and optional SE indications include automatically in certain operations under Standalone mode, but not under the SPI mode. 12.1 RECORD OPERATION Figure 12.1: Record Operation with No Sound Effect Tf Tr REC TDeb RDY TSc1 TRU TSE1 TRD TRU TER TRD TRU TSE2 TRD TSet1 LED Mic+/-, AnaIn Figure 12.2: Record Operation with Sound Effect - 64 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.2 PLAYBACK OPERATION > T Deb Tr Tf PLAY TDeb TRD RDY TSc1 TSc2 TRU TLH TCyc LED Sp+, Sp- Figure 12.3: Playback Operation for entire message > TDeb Tr Tf TDeb PLAY TDeb TRDTSet1 RDY TSc1 TSc2 TRU TLH TCyc LED Sp+, Sp- Figure 12.4: Start and Stop Playback Operation - 65 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.3 ERASE OPERATION > TDeb Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TE TSc2 TLS2 LED Figure 12.5: Single Erase Operation with No Sound Effect Tr >T Deb Tf ERASE TDeb TRD RDY TSc1 TSc2 TE TRU TSE2 TRD TSc2 LED Sp+, Sp- Figure 12.6: Single Erase Operation with Sound Effect - 66 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.4 FORWARD OPERATION > T Deb Tr Tf FWD TDeb TRD RDY TLS1 or T LS2 TSc1 TSc2 LED Figure 12.7: Forward Operation with No Sound Effect Tr TDeb Tf FWD TDeb TRD RDY TSc1 TSc2 TRU TSE1 or TSE2 TRD LED Sp+, Sp- Figure 12.8: Forward Operation with Sound Effect - 67 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.5 GLOBAL ERASE OPERATION Tr Tf ERASE TDeb TRD RDY TSc1 TSc2 TGE1 or (TE + TLS2 or TSE2) 3x(T LS1 or TSE1) TGE2 TLS4 or TSE4 LED Sp+, SpNote: If SEs are recorded, then Sp+/- will have output. Figure 12.9: Global Erase Operation with or without Sound Effects 12.6 RESET OPERATION Tf Tr RESET TReset TSet2 Device returns to Power Down state RDY LED Figure 12.10: Reset Operation - 68 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE LOOPING PLAYBACK OPERATION 12.7 Tr Tf After 2nd Message starts playback PLAY TDeb TRD RDY TSc1 TSc2 TRU TCyc TRD TLS1 or TSE1 2xT Sc2TRU LED 1st Message 2nd Message (If SE1 recorded) Sp+, Sp- Figure 12.11: Playback Two Consecutive messages Tr Tf Looping playback of 2 consecutive messages until PLAY is released PLAY TDeb TRD RDY TSc1TSc2 TRU TCyc TLS2 or TRD T 2xTSc2TRU SE2 T TRD TLS1 or 2xT Sc2TRU SE1 LED 1st Message 1st Message 2nd Message (If SE1 recorded) (If SE2 recorded) Sp+, Sp- Figure 12.12: Looping Playback with Two messages - 69 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.8 GLOBAL ERASE OPERATION TO RESTORE CIRCULAR MEMORY ARCHITECTURE Tf Tr ERASE TDeb TRD RDY TGE1 TLErr TSc1 3x(T LS1 or TSE1) TGE2 TLS4 or TSE4 LED Sp+, SpNote: If SEs are recorded, then Sp+/- will have output. Figure 12.13: Global Erase Operation to recover a broken circular memory architecture 12.9 PLAYBACK OPERATION WITH AUD OUTPUT > T Deb Tr Tf PLAY TDeb TRD RDY TSc1 TSc2 TRU TLH TCyc LED TRU TRD AUD Figure 12.14: Playback Operation with ramp up and ramp down effect at AUD output - 70 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 12.10 SPI OPERATION TSSmin TSSH SS TSSS TSCKlow TSCKhi SCLK TDIS TDIH LSB MOSI MSB TPD MISO TDF (TRISTATE) LSB MSB Figure 12.15: SPI Operation PARAMETER SYMBOL MIN TYP MAX UNITS TSSS 500 nsec TSSH 500 nsec Data in Setup Time TDIS 200 nsec Data in Hold Time TDIH 200 nsec SS Setup Time SS Hold Time Output Delay TPD 500 nsec Output Delay to HighZ TDF 500 nsec TSSmin SS HIGH 1 µsec SCLK High Time TSCKhi 400 nsec SCLK Low Time TSCKlow 400 nsec CLK Frequency Power-Up Delay Notes: [1] F0 [1] 1,000 TPUD 50 KHz msec Timing parameter given is based upon 8 kHz sampling freq and varied according to sampling freq. - 71 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 13 ABSOLUTE MAXIMUM RATINGS ABSOLUTE MAXIMUM RATINGS (DIE) [1] Condition Value 0 Junction temperature 150 C Storage temperature range -65 C to +150 C Voltage Applied to any pads (VSS - 0.3V) to (VCC + 0.3V) Power supply voltage to ground potential -0.3V to +7.0V 0 ABSOLUTE MAXIMUM RATINGS (PACKAGED PARTS) Condition 0 [1] Value 0 Junction temperature 150 C Storage temperature range -65 C to +150 C Voltage Applied to any pins (VSS - 0.3V) to (VCC + 0.3V) Voltage applied to any pin (Input current limited to +/-20 mA) (VSS – 1.0V) to (VCC + 1.0V) Power supply voltage to ground potential -0.3V to +7.0V [1] 0 0 Stresses above those listed may cause permanent damage to the device. Exposure to the absolute maximum ratings may affect device reliability. Functional operation is not implied at these conditions. - 72 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 13.1 OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITIONS VALUES Operating temperature range Supply voltage (VCC) Ground voltage (VSS) Input voltage (VCC) 0°C to +50°C [1] +2.4 V to +5.5 V [2] 0V [1] 0 V to 5.5 V Voltage applied to any pins (VSS –0.3 V) to (VCC +0.3 V) OPERATING CONDITIONS (PACKAGED PARTS) CONDITIONS VALUES Operating temperature range (Case temperature) Supply voltage (VDD) Ground voltage (VSS) Input voltage (VDD) [1] +2.4V to +5.5V [2] 0V [1] 0V to 5.5V Voltage applied to any pins [1] VCC = VCCA = VCCD= VCCP [2] VSS = VSSA = VSSD = VSSP1 VSSP2 -40°C to +85°C (VSS –0.3V) to (VDD +0.3V) - 73 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 14 ELECTRICAL CHARACTERISTICS 14.1 DC PARAMETERS SYMBOL VDD VIL VIH VOL VOH IDD_Record IDD_Playback IDD_Erase ISB IILPD1 IILPD2 RMIC+,RMICRAnaIn VIN1 VIN2 AMSP Speaker Output Load AUX Output Load Speaker Output Power RSPK RAux Pout Speaker Output Voltage VOUT1 AUX Output Swing AUX Output DC Level AUD Volume Output VOUT2 VOUT3 IAUD AVol 1.2 -3.0 0 to -28 V V mA dB Total Harmonic Distortion THD 1 % Notes: [1] [2] [3] [4] [5] MIN 2.4 VSS-0.3 0.7xVDD VSS-0.3 0.7xVDD TYP [1] PARAMETER Supply Voltage Input Low Voltage Input High Voltage Output Low Voltage Output High Voltage Record Current Playback Current Erase Current Standby Current Input Leakage Current Input Current Low Preamp Input Impedance AnaIn Input Impedance MIC Differential Input AnaIn Input Voltage Gain from MIC to SP+/- 20 20 20 1 -3 MAX 5.5 0.3xVDD VDD 0.3xVDD VDD 10 ±1 -10 7 42 15 300 1 40 6 UNITS V V V V V mA mA mA µA µA µA kΩ kΩ mV V dB Ω kΩ mW mW mW mW V 8 5 670 313 117 49 VDD 1 CONDITIONS [2] IOL = 4.0 mA [2] IOH = -1.6 mA VDD = 5.5 V, No load, Sampling freq = 12 kHz [3] [4] Force VDD Force VSS , others at Vcc Power-up AGC When active [5] Peak-to-Peak Peak-to-Peak VIN = 15~300 mV, AGC = 4.7 µF, VCC = 2.4V~5.5V Across both Speaker pins When active VDD = 5.5 V 1Vp-p, VDD = 4.4 V 1 kHz sine wave at VDD= 3 V AnaIn. RSPK VDD= 2.4 V = 8 Ω. RSPK = 8Ω (Speaker), Typical buzzer Peak-to-Peak When active VDD =4.5 V, REXT= 390 Ω 8 steps of 4dB each reference to output 15 mV p-p 1 kHz sine wave, Cmessage weighted Conditions: VCC = 4.5V, 8 kHz sampling frequency and TA = 25°C, unless otherwise stated. LED output during Record operation. VCCA, VCCD and VCCP are connected together. VSSA, VSSP1, VSSP2 and VSSD are connected together. REC , PLAY , FT , FWD , ERASE , VOL and RESET must be at VCCD. Balanced input signal applied between MIC+ and MIC- as shown in the applications example. Single-ended MIC+ or MIC- input is recommended no more than 150 mV p-p. - 74 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 14.2 AC PARAMETERS CHARACTERISTIC [2] Sampling Frequency [3] Duration Rising Time Falling Time Debounce Time Ramp Up Time Ramp Down Time Initial Scan Time after power is applied Initial Scan Time from PD state End Recording Time LED High Time LED Flash Time for SE1 LED Flash Time for SE2 LED Flash Time for SE3 LED Flash Time for SE4 SE1 Recorded Duration SE2 Recorded Duration SE3 Recorded Duration SE4 Recorded Duration Erase Time Global Erase Wait Time Global Erase Time RESET Pulse Settle Time Settle Time after Reset LED Error Time LED Cycle frequency Notes: SYMBOL FS TDur Tr Tf TDeb TRU TRD TSc1 MIN 4 192/FS TYP [1] MAX 12 UNITS CONDITIONS [4] kHz Sect. 6.1.2 sec 100 nsec 100 nsec [4] [6] sec 128/FS sec 128/FS sec [4] DRN/(8*FS) sec DRN= device row# TSc2 DRN/(16*FS) sec TER TLH TLS1 TLS2 TLS3 TLS4 TSE1 TSE2 TSE3 TSE4 TE TGE1 TGE2 TReset TSet1 TSet2 TLErr TCyc 32/FS 0.5K/FS sec sec sec sec sec sec sec sec sec sec sec sec sec µsec sec sec sec Hz 3.5K/FS 7.5K/FS 11.5K/FS 15.5K/FS 4K/FS 4K/FS 4K/FS 4K/FS 10MRN/FS 20K/FS 34/FS 1 128/FS 64/FS 27.5K/FS 4 1 After a PB operation is [4] run [4] [4] SE1 not recorded [5] SE2 not recorded [5] SE3 not recorded [5] SE4 not recorded [5] [4] [5] [4] [5] [4] [5] [4] [5] MRN=message row # [4] [5] All Fs [4] [4] [4] [4] [5] Pending upon FS [1] Typical values: VCC = 4.5 V, FS = 8 kHz and @ TA = 25°C, unless otherwise stated. Characterization data shows that sampling frequency resolution is ±5 percent across temperature and voltage ranges. [3] Characterization data shows that duration resolution is ±5 percent across temperature and voltage ranges. [4] Vcc=2.4 V~5.5V [5] K = 1024 [6] Debounce time is only applicable to operations in standalone mode and is not applicable to the related SPI commands. [2] - 75 - Publication Release Date: Nov 6, 2010 Revision 2.1 [4] ISD1700 DESIGN GUIDE 15 TYPICAL APPLICATION CIRCUITS The following typical applications examples on ISD1700 Series are for references only. They make no representation or warranty that such applications shall be suitable for the use specified. Each design has to be optimized in its own system for the best performance on voice quality, current consumption, functionalities and etc. The below notes apply to the following applications examples: * ** These capacitors may be needed in order to optimize for the best voice quality, which is also dependent upon the layout of the PCB. Depending on system requirements, they can be 10 µF, 4.7 µF or other values. Please refer to the applications notes or consult Nuvoton for layout advice. It is important to have a separate path for each ground and power back to the related terminals to minimize the noise. Also, the power supplies should be decoupled as close to the device as possible. Example #1: Recording using microphone input via push-button controls Reset 24 23 25 26 19 22 VCC 7 6 4.7 K Ω 5 4.7 µ F 4 3 REC PLAY ERASE RESET LED 0.1µ F 2 D1 1 KΩ FWD VCCD 1 VOL FT VSSD 28 MOSI 0.1 µF * ** * VCCP VCCP VSSP1 16 0.1µF ISD1700 Gnd Vcc VCCA 0.1µ F 14 SCLK ** VCCA VCCD VCCP VCCD VCCA 21 VSSA 8 SS vAlert * * 0.1 µ F VSSP2 12 MISO 4.7 K Ω 10 0.1 µ F 11 0.1 µ F Rosc *** AnaIn 20 ROSC 18 4.7 µ F 15 Speaker or Buzzer SP- 13 VCC Speaker MIC - 9 4.7 KΩ SP+ MIC+ AUD AUD/AUX 17 8050C VCCD INT/RDY 27 100 K Ω AUX 390 Ω 0.1 µ F Optional AGC Optional: based upon the applications *** At 8kHz sampling freq, Rosc = 80 K : Digital ground; - 76 - : Analog ground; : Ground for SP+; : Ground for SP- Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Example #2: Recording using AnaIn input via push-button controls - 77 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Example #3: Connecting the SPI Interface to a microcontroller - 78 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Example #4: Connecting the ISD1700 with PowerSpeech W567 15.1 GOOD AUDIO DESIGN PRACTICES To ensure the highest quality of voice reproduction, it is important to follow good audio design practices in layout and power supply decoupling. See recommendations from below links or other Application Notes in our websites. Design Considerations for ISD1700 Family AN-CC1002 Design Considerations for ISD1700 Family Good Audio Design Practices http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin11.pdf Single-Chip Board Layout Diagrams http://www.Nuvoton-usa.com/products/isd_products/chipcorder/applicationinfo/apin12.pdf - 79 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 16 ORDERING INFORMATION Product Number Descriptor Key I17xxxxxxx Product Name: I = ISD Product Series: Tape & Reel: 17 = 1700 Blank = None Duration: 30 : 20 – 60 secs 60 : 40 – 120 secs R Temperature: I = Industrial (-40°C to +85°C) 120 : 80 – 240 secs 240 : 160 – 480 secs = Tape & Reel Blank = Package Type: X = Die E = Thin Small Outline Package (TSOP) S = Small Outline Integrated Circuit (SOIC) Package P = Plastic Dual Inline Package (PDIP) Commercial • Die (0°C to +50°C) • Package (0°C to +70°C) Package Option: Y = Green When ordering ISD1700 devices, please refer to the above ordering scheme. Contact the local Nuvoton Sales Representatives for any questions and the availability. For the latest product information, please contact the Nuvoton Sales/Rep or access Nuvoton’s worldwide web site at http://www.Nuvoton-usa.com - 80 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE 17 VERSION HISTORY VERSION DATE DESCRIPTION 0 October 2006 Initial version 1 January 2007 Revise Rosc resistor value and standby current parameter Update read status command: description & figure 1.1 May 2007 Update the description on Reset pin 1.2 Dec 2007 Update AC parameters 1.31 July 2008 Change Company logo. 2.0 Feb 4, 2010 Remove preliminary sign. 2.1 Nov 6, 2010 Description update. - 81 - Publication Release Date: Nov 6, 2010 Revision 2.1 ISD1700 DESIGN GUIDE Nuvoton products are not designed, intended, authorized or warranted for use as components in systems or equipment intended for surgical implantation, atomic energy control instruments, airplane or spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments, or for other applications intended to support or sustain life. Furthermore, Nuvoton products are not intended for applications wherein failure of Nuvoton products could result or lead to a situation wherein personal injury, death or severe property or environmental damage could occur. Nuvoton customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Nuvoton for any damages resulting from such improper use or sales. The contents of this document are provided only as a guide for the applications of Nuvoton products. Nuvoton makes no representation or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to discontinue or make changes to specifications and product descriptions at any time without notice. No license, whether express or implied, to any intellectual property or other right of Nuvoton or others is granted by this publication. Except as set forth in Nuvoton's Standard Terms and Conditions of Sale, Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. The contents of this document are provided “AS IS”, and Nuvoton assumes no liability whatsoever and disclaims any express or implied warranty of merchantability, fitness for a particular purpose or infringement of any Intellectual property. In no event, shall Nuvoton be liable for any damages whatsoever (including, without limitation, damages for loss of profits, business interruption, loss of information) arising out of the use of or inability to use the contents of this documents, even if Nuvoton has been advised of the possibility of such damages. Application examples and alternative uses of any integrated circuit contained in this publication are for illustration only and Nuvoton makes no representation or warranty that such applications shall be suitable for the use specified. The 100-year retention and 100K record cycle projections are based upon accelerated reliability tests, as published in the Nuvoton Reliability Report, and are neither warranted nor guaranteed by Nuvoton. This product incorporates SuperFlash®. This datasheet and any future addendum to this datasheet is(are) the complete and controlling ISD® ChipCorder® product specifications. In the event any inconsistencies exist between the information in this and other product documentation, or in the event that other product documentation contains information in addition to the information in this, the information contained herein supersedes and governs such other information in its entirety. This datasheet is subject to change without notice. Copyright© 2005, Nuvoton Electronics Corporation. All rights reserved. ChipCorder® and ISD® are trademarks of Nuvoton Electronics Corporation. SuperFlash® is the trademark of Silicon Storage Technology, Inc. All other trademarks are properties of their respective owners. - 82 - Publication Release Date: Nov 6, 2010 Revision 2.1
ISD1750SYR
1. 物料型号:文档中提到的物料型号是ISD1700系列,这是由Nuvoton®生产的ChipCorder®语音记录和播放设备。

2. 器件简介:ISD1700系列是一款高质量、完全集成的单芯片多信息语音记录和播放设备,适用于各种电子系统。用户可以选择每个设备的消息持续时间,范围从26秒到120秒,具体取决于特定设备。每个设备的采样频率也可以通过外部电阻调整,从4 kHz到12 kHz,使用户在持续时间与录音质量之间具有更大的灵活性。

3. 引脚分配:文档提供了详细的引脚分配图,包括PDIP/SOIC和TSOP封装的引脚排列。

4. 参数特性:ISD1700系列具有以下特性: - 集成的消息管理系统,适用于单芯片、按键式应用。 - 可调整的采样频率,由外部振荡器电阻控制。 - 宽范围选择的消息持续时间。 - 消息和操作指示器,包括四个可定制的声音效果和可选的vAlert(声音警报)。

5. 功能详解:文档详细描述了ISD1700系列的功能,包括独立模式和SPI模式的操作,以及如何通过SPI接口进行控制。

6. 应用信息:ISD1700系列适用于需要高质量自然语音和音频再现的应用,具有2.4V至5.5V的工作电压范围,典型的100年消息保留时间和100,000次记录周期。

7. 封装信息:ISD1700系列提供多种封装类型,包括裸片、PDIP、SOIC和TSOP。
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