STDP2690AD

STDP2690 Advanced DisplayPort to DisplayPort (dual mode) converter Datasheet Rev A MegaChips’ Proprietary Information MegaChips reserves the right to make any change herein at any time without prior notice. MegaChips does not assume any responsibility or liability arising out of application or use of any product or service described herein except as explicitly agreed upon. MegaChips’ Proprietary Information Page 1 of 34 STDP2690 Features • • • DisplayPort® dual-mode transmitter – DP 1.2a compliant – Link rate HBR2/HBR/RBR – 1, 2, or 4 lanes – AUX CH 1 Mbps – Supports eDP operation – HDMI/DVI operation with level translator DisplayPort receiver – DP 1.2a compliant – Link rate HBR2/HBR/RBR – 1, 2, or 4 lanes – AUX CH 1 Mbps – Supports eDP operation SPDIF audio output – 192 kHz/24 bits – Compressed/LPCM • Device configuration options – SPI Flash – I2C host interface • Deep color support – RGB/YCC (4:4:4) – 16-bit color – YCC (4:2:2) – 16-bit color – Color space conversion – YUV to RGB and RGB to YUV • Bandwidth – Video resolution up to 4K x 2K @ 30 Hz; 1920 x 1080 @ 120 Hz – Audio 7.1 Ch up to 192 kHz sample rate • Low power operation; active 493 mW, standby 21 mW • Package – 81 BGA (8 x 8 mm) • Power supply voltages – 3.3 V I/O; 1.2 V core • HDCP repeater with embedded keys • ASSR - eDP display authentication option Applications • AUX to I2C bridge for EDID/MCCS pass through • Audio-video accessory (dongle) for PC/notebooks and docking stations • Spread spectrum on DisplayPort interface for EMI reduction • Thunderbolt source and peripheral devices Image Capture DP Input Video Format Converter DP Dual Mode Transmitter DP Receiver SPDIF Audio SPDIF Transmitter DDC Controller I2C Slave C2690-DAT-01p DP++ Output Clock Generation OCM, SPI MegaChips’ Proprietary Information Page 2 of 34 I2C to AUX Bridge DDC AUX STDP2690 Contents 1. Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 2. Application overview . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3. Feature attributes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 4. 5. 6. 7. 3.1 Input interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.2 Output interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.3 Deep color support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.4 Supported video timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.5 Supported audio timings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.6 Control channel interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.7 HDCP 1.3 support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.8 Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 3.9 Power supply voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 3.10 ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .11 BGA footprint and pin lists . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1 Ball grid array diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.2 Full pin list sorted by pin number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.1 Pin list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 5.2 Bootstrap configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Package specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.1 Package drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 6.2 BGA8X8 dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 6.3 Marking field template and descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 6.4 Classification reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.1 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 7.2 DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 C2690-DAT-01p MegaChips’ Proprietary Information Page 3 of 34 STDP2690 7.3 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 7.3.1 DisplayPort receiver . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 7.3.2 DisplayPort transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 7.3.3 HDMI transmitter . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.3.4 Crystal specification . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 7.3.5 I2C interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 7.3.6 SPI interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 8. Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 9. Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 C2690-DAT-01p MegaChips’ Proprietary Information Page 4 of 34 STDP2690 List of Tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Table 19. Table 20. Table 21. Key to BGA diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Pin list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 DisplayPort receiver pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 System function pins. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 General purpose input/output and multi-function pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Transmitter pins . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 System power and ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Bootstrap configuration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Field descriptors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Maximum speed of operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 DisplayPort receiver electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 DisplayPort transmitter electrical parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 HDMI transmitter (DP++) DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 HDMI transmitter AC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Crystal specifications . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 I2C interface timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SPI interface timing, VDD = 3.3V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30 Order codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 Document revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 C2690-DAT-01p MegaChips’ Proprietary Information Page 5 of 34 STDP2690 List of Figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. STDP2690 in PC/notebook accessory application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 STDP2690 BGA diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Package drawing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Package dimensions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Marking template . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 I2C timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 SPI output or serial interface SPI ROM input timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 SPI input or serial interface SPI ROM output timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 C2690-DAT-01p MegaChips’ Proprietary Information Page 6 of 34 STDP2690 1. Description The STDP2690 is a high-speed DisplayPort to DisplayPort dual mode converter IC targeted for applications such as audio-video accessories, docking stations, Thunderbolt storage devices, etc. This device includes a VESA DP Standard Ver. 1.2a compliant receiver and transmitter, implementing single link DisplayPort input and output ports comprising four Main lanes, AUX CH, and HPD. The STDP2690 uses MegaChips’ latest generation DisplayPort dual mode transmitter technology that supports both DisplayPort and TMDS signal formats (DP++). DisplayPort receiver and transmitter support HBR2 speed, a data rate of 5.4 Gbps per lane with a total bandwidth of 21.6 Gbps link rate. The transmitter is capable of supporting HDMI or single link DVI output through a passive level translator (dongle). When configured as HDMI output, this device supports link rate up to 2.97 Gbps that corresponds to a pixel rate of 297 MHz, adequate for handling video timings up to FHD 120 Hz 3D formats. This device delivers deep color video up to 16-bits per color at 1080p 60 Hz and lower video resolutions. The STDP2690 allows audio transport from the source to desired audio rendering devices over the DP++ output or through the SPDIF port. The audio signal from the source can be routed simultaneously to DP++ and SPDIF output ports. For example, the STDP2690 allows routing of any two audio channels on the SPDIF port, while transporting up to eight channels on the DP++ port. The STDP2690 supports RGB and YCbCr colorimetric formats with color depth of 16, 12, 10, and 8 bits. This device features HDCP 1.3 content protection scheme with an embedded key option for secure transmission of digital audio-video content. It also operates as an HDCP repeater for the downstream sink. The eDP authentication option ASSR (Alternative Scrambler Seed Reset) is supported for embedded application. The AUX-to-I2C translator in the STDP2690 allows the upstream DisplayPort source to access EDID and transfer MCCS commands to a downstream sink over the HDMI interface when used with a level translator. This device has an on-chip microcontroller with SPI and I2C host interface for system configuration purposes. STDP2690 can be configured with an external SPI Flash for custom applications. In addition, it allows register level configuration from an external host controller through I2C interface. C2690-DAT-01p MegaChips’ Proprietary Information Page 7 of 34 STDP2690 2. Application overview Figure 1. STDP2690 in PC/notebook accessory application C2690-DAT-01p AUX CH STDP2690 DP Main Lanes AUX CH DDC MegaChips’ Proprietary Information Page 8 of 34 DP++ DP main lanes 27 MHz Crystal MUX DIsplayPort SPI Flash STDP2690 3. Feature attributes 3.1 Input interface • DP standard Ver. 1.2a compliant • Main link configuration (SST format only, no MST format support) – HBR2/HBR/RBR link rate – 1, 2, or 4 lanes • AUX CH: 1 Mbps Manchester transaction format • HPD: IRQ_HPD assertion • Video: EDID 1.4 and CEA861 video timing and formats from 24 to 48 bits/pixel in RGB or YCC422 or YcC444 colorimetry • Audio: DisplayPort 1.2a standard info frame packets and IEC60958/61937 type audio stream packets ranging from 16 to 24 bits/sample, 32 to 192 kHz sample rates 3.2 Output interface • DP++ transmitter interface featuring – AC coupled DisplayPort Ver. 1.2a interface – AC coupled HDMI 1.4 interface to external level translators • DP main link configuration (SST format only, no MST format support) – HBR2/HBR/RBR link rate – 1, 2, or 4 lanes • AUX CH: Manchester transaction format • HPD: IRQ_HPD assertion • Video: EDID 1.4 and CEA861 video timing and formats from 24 to 48 bits/pixel in RGB or YCC422 or YcC444 colorimetry • Audio: DisplayPort 1.2a standard info frame packets and IEC60958/61937 type audio stream packets ranging from 16 to 24 bits/sample, 32 to 192 kHz sample rates • HDMI link rate: 2.97 Gbps/data pair max C2690-DAT-01p MegaChips’ Proprietary Information Page 9 of 34 STDP2690 3.3 Deep color support • RGB/YCC (4:4:4) – 16-bit color • YCC (4:2:2) – 16-bit color • Color space conversion – YUV to RGB and RGB to YUV 3.4 Supported video timings • 4096 x 2160 (4K x 2K) 60 Hz: 24 bits/pixel (DP to DP only) • 4096 x 2160 (4K x 2K) 24 Hz/30 Hz: 24 bits/pixel (DP to HDMI) • 1920 x 1080 (FHD) 120 Hz: 24 bits/pixel • 2560 x 1600 (WQXGA) 60 Hz: 24 bits/pixel • Up to 1920 x 1080 (FHD) 60 Hz, 48, 36, 30 bits/pixel • All compatible 3D formats defined in DP 1.2a and HDMI 1.4 specifications • All standard CEA861 timing formats 3.5 Supported audio timings • All audio formats as specified in DP 1.2a and HDMI 1.4 specifications • SPDIF; 2-Ch LPCM, AC3, DTS, bit depth up to 24 bits, sample rate up to 192 kHz 3.6 Control channel interfaces • AUX CH, I2C host interface, SPI (optional), and UART (UART for test/debug purposes only) 3.7 HDCP 1.3 support • Key sets for DP RX and DP/HDMI TX integrated in one-time programmable ROM (OTP) • Standalone HDCP repeater capability • Supports eDP display authentication option ASSR (Alternate Scrambler Seed Reset) 3.8 Package • 81 BGA (8 x 8 mm), 0.8 ball pitch C2690-DAT-01p MegaChips’ Proprietary Information Page 10 of 34 STDP2690 3.9 Power supply voltages • 3.3 V I/O; 1.2 V core 3.10 ESD • 2 KV HBM, 500 V CDM C2690-DAT-01p MegaChips’ Proprietary Information Page 11 of 34 STDP2690 4. BGA footprint and pin lists 4.1 Ball grid array diagram The ball grid array (BGA) diagrams give the allocation of pins to the package, shown from the top looking down using the PCB footprint. Some signal names in BGA diagrams have been abbreviated. Refer toTable 2: Pin list on page 14 for full signal names sorted by pin number. Table 1. Key to BGA diagrams C2690-DAT-01p Function Type AVDD12_RX VCC/VDD AVDD33_RX VCC/VDD AVDD33_RCOSC VCC/VDD AVDD12_TX VCC/VDD AVDD33_TX VCC/VDD DVDD12 VCC/VDD DVDD33 VCC/VDD System ground VSS/GND No connect/Do not connect NC/DNC MegaChips’ Proprietary Information Page 12 of 34 Key NC STDP2690 The STDP2690 is available in a 81-pin BGA package. Figure 2. STDP2690 BGA diagram 01 02 03 04 05 06 07 08 09 A CPHY_ RX3_N CPH Y_RX3 _P C PHY_R X2_N CPH Y_ RX2_ P C PH Y_RX1 _N CPHY_R X1_P CPH Y_ RX0_ N C PHY_R X0_P C PHY_R XAU XP A B SPI_DI SPI_C SN AVD D1 2_R X AVD D12 _RX AVD D33 _RX C PH Y_RX_ REXT AVDD 12_ PL L TEST_MISN CPH Y_ RXAUXN B C SPI_C LK SPI_D O VSS VSS AVD D33 _RX AVDD 33_ RX AVD D33 _RC OSC TESTMOD E0 _ CONFIG1 U AR T_RX C D PWR_ CTRL I2 C_SD A D VD D1 2 VSS VSS VSS DVDD 12 TESTMOD E1 _ CONFIG2 UART_ TX D E CH RG_ CTRL I2 C_SC L D VD D1 2 VSS VSS VSS DVDD 12 VSS IRQ E F PWR_SEN SE SPD IF D VD D3 3 VSS VSS VSS VSS HPD _OUT_ AU X_ HPD CEC F G H PD_ IN HD MITX_D DC _SDA D VD D3 3 VSS VSS AVDD3 3_TX VSS RESETn XTAL G H D PTX_ AUXN HD MITX_D DC _SCL TX_ REXT AVDD 12_ TX AVDD1 2_TX AVDD1 2_TX AVDD1 2_OSC D VDD 25_ SM TCLK H J DPTX_AU XP D PTX_ L3N _ HDMI_TXCKN D PTX_ L3P_ H DMI_TXCKP DPTX_L 2N_ H DMI_TX0N DPTX_L 2P_ HD MI_ TX0 P DPTX_L1 N_ H DMI_TX1N D PTX_ L1P_ HDMI_TX1 P DPTX_L0 N_ HD MI_ TX2N DPTX_L 0P_ H DMI_TX2P J 01 02 03 04 05 06 07 08 09 C2690-DAT-01p MegaChips’ Proprietary Information Page 13 of 34 STDP2690 4.2 Full pin list sorted by pin number Table 2. Pin list Pin number A1 CPHY_RX3_N A2 CPHY_RX3_P A3 CPHY_RX2_N A4 CPHY_RX2_P A5 CPHY_RX1_N A6 CPHY_RX1_P A7 CPHY_RX0_N A8 CPHY_RX0_P A9 CPHY_RXAUXP B1 SPI_DI B2 SPI_CSN B3, B4 AVDD12_RX B5 AVDD33_RX B6 CPHY_RX_REXT B7 AVDD12_PLL B8 TEST_MISN B9 CPHY_RXAUXN C1 SPI_CLK C2 SPI_DO C3, C4 VSS C5, C6 AVDD33_RX C7 AVDD33_RCOSC C8 CONFIG1 C9 UART_RX D1 PWR_CTRL D2 I2C_SDA D3 DVDD12 D4, D5, D6 C2690-DAT-01p Net name VSS D7 DVDD12 D8 CONFIG2 D9 UART_TX E1 CHRG_CTRL E2 I2C_SCL MegaChips’ Proprietary Information Page 14 of 34 STDP2690 Table 2. Pin list (continued) Pin number E3 E4, E5, E6 DVDD12 VSS E7 DVDD12 E8 VSS E9 IRQ F1 PWR_SENSE F2 SPDIF F3 DVDD33 F4, F5, F6, F7 VSS F8 HPD_OUT_AUX_HPD F9 CEC G1 HPD_IN G2 HDMITX_DDC_SDA G3 DVDD33 G4, G5 VSS G6 AVDD33_TX G7 VSS G8 RESETn G9 XTAL H1 DPTX_AUXN H2 HDMITX_DDC_SCL H3 TX_REXT H4, H5, H6 C2690-DAT-01p Net name AVDD12_TX H7 AVDD12_OSC H8 DVDD25_SM H9 TCLK J1 DPTX_AUXP J2 DPTX_L3N_HDMI_TXCKN J3 DPTX_L3P_HDMI_TXCKP J4 DPTX_L2N_HDMI_TX0N J5 DPTX_L2P_HDMI_TX0P J6 DPTX_L1N_HDMI_TX1N J7 DPTX_L1P_HDMI_TX1P J8 DPTX_L0N_HDMI_TX2N J9 DPTX_L0P_HDMI_TX2P MegaChips’ Proprietary Information Page 15 of 34 STDP2690 5. Connections 5.1 Pin list I/O Legend: I = Input; O = Output; P = Power; G = Ground; IO = Bi-direction; AI = Analog input; AO = Analog output; AIO = Analog I/O; TRI = Tristate; TOL = Tolerance; PD = Internal 50K pulldown; PU = Internal 50K pull-up; OPENDR = Open drain output Note: Some pins can have multiple functionalities, which are configured under register control. The alternate functionality for each pin is listed in the Description column. Table 3. DisplayPort receiver pins Pin Assignment I/O Description Reset state B9 CPHY_RXAUXN AIO, 3V3 tol AC couple 0.1uF. Use 20 ohm damping resistor in series and 1M ohm pull down to GND before cap. Tristate A9 CPHY_RXAUXP AIO, 3V3 tol AC couple 0.1uF. Use 20 ohm damping resistor in series and 1M ohm pull up to 3.3 V before cap. Tristate B6 CPHY_RX_REXT AI, 3V3 tol Combo receiver external 249 ohm resistor to VDD33. NA A8 CPHY_RX0_P A7 CPHY_RX0_N A6 CPHY_RX1_P A5 CPHY_RX1_N AI, 3V3 tol CPHY_RX2_P AC couple 0.1uF. Use 100K ohm pull down to GND between the connector and AC-coupling cap. Input A4 A3 CPHY_RX2_N A2 CPHY_RX3_P A1 CPHY_RX3_N Table 4. System function pins Pin Assignment I/O Description Reset state B8 TEST_MISN I, 3V3 tol, TRI, INT PD Connect to GND Input, Low H9 TCLK AIO, 1V2 tol G9 XTAL AIO, 1V2 tol G8 RESETn AIO, 3V3 tol 3K ohm resistor to 3.3V NA B2 SPI_CSN IO, 3V3 tol, TRI, INT PU To SPI chip select. Also see bootstraps. Output, High C2 SPI_DO IO, 3V3 tol, TRI INT PD To SPI data out. Also see bootstraps. Output, Low Connect to 27 MHz crystal oscillator with 22 pF to 1.2V NA C2690-DAT-01p MegaChips’ Proprietary Information Page 16 of 34 STDP2690 Table 4. System function pins Pin Assignment I/O Description Reset state B1 SPI_DI IO, 3V3 tol, TRI, INT PD From SPI data in. Input, Low C1 SPI_CLK IO, 3V3 tol, TRI, INT PD To SPI clock. Also see bootstraps. Output, Low Table 5. General purpose input/output and multi-function pins Pin Assignment I/O Description Reset state F9 CEC 3.3V IO, 5V tol, To CONN PIN14 with 5 M res to GND. OPENDR F8 HPD_OUT_AUX_H PD IO, 3V3 tol, TRI To the upstream HPD signal pin on the DP connector. 100K res to GND. E9 IRQ IO, 3V3 tol, TRI GPIO/IRQ out for host interface. Also see bootstrap TRI, Low function. D9 UART_TX IO, 3V3 tol, OPENDR To debug port UART_TX/alt I2C_SDA/GPIO. Needs OPENDR external 2K res to 3.3V, FS, FT C9 UART_RX IO, 3V3 tol, OPENDR To debug port UART_RX/alt I2C_SCL/GPIO. Needs Input external 2K res to 3.3V, FS, FT F2 SPDIF IO, 3V3 tol, TRI, PU To external buffer for SPDIF output or use as GPIO. Output, High Also see bootstrap function. G1 HPD_IN IO, 5V tol, OPENDR From HDMI connector. Needs 100K to GND. D1 PWR_CTRL IO, 3V3 tol, TRI Use as GPIO Output E1 CHRG_CTRL IO, 3V3 tol, TRI Use as GPIO Output D2 I2C_SDA IO, 3V3 tol, TRI GPIO/I2C_SDA slave or master, FS, FT TRI E2 I2C_SCL IO, 3V3 tol, TRI GPIO/I2C_SCL slave or master, FS, FT TRI F1 PWR_SENSE IO/AI, 3V3 tol, OPENDR GPIO/power sense analog/level sensing input, FS, FT OPENDR G2 HDMI_DDC_SDA GPIO/HDMI DDC SDA, FS, FT OPENDR H2 HDMI_DDC_SCL IO, 5V tol, OPENDR GPIO/HDMI DDC SCL, FS, FT OPENDR D8 CONFIG2 OPENDR Output Input Input IO, 3V3 tol, TRI GPIO, 3.3V pad C8 CONFIG1 Input Table 6. Transmitter pins Pin Assignment I/O Description Reset state H3 TX_REXT AI, 1V2 tol Transmitter, external 249 ohm resistor to VDD12 NA H1 DPTX_AUXN AIO, 1V2 tol Dual mode transmitter DPTX_AUXN. AC couple to TX connector. External 100 K resistor to GND. Tristate J1 DPTX_AUXP AIO, 1V2 tol Dual mode transmitter DPTX_AUXP. AC couple to TX connector. External 100 K resistor to VDD33. Tristate C2690-DAT-01p MegaChips’ Proprietary Information Page 17 of 34 STDP2690 Table 6. Transmitter pins Pin Assignment J2 Description Reset state DPTX_L3N_HDMI_ AIO, 1V2 tol TXCKN Dual mode transmitter HDMI_TXCKN or DPTX_L3N. AC couple to TX connector. Output J3 DPTX_L3P_HDMI_ TXCKP Dual mode transmitter HDMI_TXCKP or DPTX_L3P. Output AC couple to TX connector. J4 DPTX_L2N_HDMI_ AIO, 1V2 tol TX0N Dual mode transmitter HDMI_TX0N or DPTX_L2N. AC couple to TX connector. Output J5 DPTX_L2P_HDMI_ TX0P AIO, 1V2 tol Dual mode transmitter HDMI_TX0P or DPTX_L2P. AC couple to TX connector. Output J6 DPTX_L1N_HDMI_ AIO, 1V2 tol TX1N Dual mode transmitter HDMI_TX1N or DPTX_L1N. AC couple to TX connector. Output J7 DPTX_L1P_HDMI_ TX1P AIO, 1V2 tol Dual mode transmitter HDMI_TX1P or DPTX_L1P. AC couple to TX connector. Output J8 DPTX_L0N_HDMI_ AIO, 1V2 tol TX2N Dual mode transmitter HDMI_TX2N or DPTX_L0N. AC couple to TX connector. Output J9 DPTX_L0P_HDMI_ TX2P Dual mode transmitter HDMI_TX2P or DPTX_L0P. AC couple to TX connector. Output Note: I/O AIO, 1V2 tol AIO, 1V2 tol The default DP and HDMI output signals mapping match the standard DP and HDMI connector pin mapping, However lane swapping and polarity swapping is possible through software configuration. Table 7. System power and ground Pin Assignment Description F3, G3 DVDD33 I/O VDD, 3.3V digital supply. De-couple using 100 nF. D3, D7, E3, E7 DVDD12 Core VDD, 1.2V digital supply. De-couple using 100 nF. C7 AVDD33_RCOSC 3.3V RC-oscillator analog supply. De-couple using 100 nF. B7 AVDD12_PLL 1.2V analog PLL supply. De-couple using 10 uF and 100 nF. B3, B4 AVDD12_RX 1.2V analog receiver supply. EMI filter rail and de-couple using 10 uF and 100 nF. B5, C5, C6 AVDD33_RX 3.3V analog receiver supply. EMI filter rail and de-couple using 10 uF and 100 nF. G6 AVDD33_TX 3.3V analog transmitter supply. EMI filter rail and de-couple using 10 uF and 100 nF. H4, H5, H6 AVDD12_TX 1.2V analog transmitter supply. EMI filter rail and de-couple using 10 uF and 100 nF. H7 AVDD12_OSC 1.2V analog crystal oscillator supply. De-couple using 100 nF. H8 DVDD25_SM Decoupling point for internal 2.5V LDO supply. De-couple using 10 uF and 100 nF. C3, C4, D4, D5, D6, E4, E5, E6, E8, F4, VSS F5, F6, F7, G4, G5, G7 C2690-DAT-01p Common GND. Connect to GND plane MegaChips’ Proprietary Information Page 18 of 34 STDP2690 5.2 Bootstrap configuration DC Levels on some device pins are specified during de-asserting edge of power-on reset (RESETn goes High). The levels specified below must be adhered to for normal function of the device. Table 8. Bootstrap configuration BS signal name Internal Assignment Function PU/PD IROM_DEBUGn_Bootstrap5 PULL UP SPI_CSN Reserved. SPI_CSN must not be Pulled Down during Power-On RESET. XTAL_OSC_SEL_Bootstrap4 PULL UP SPDIF_OUT Reserved. SPDIF_OUT must not be Pulled Down during Power-On RESETn. ICD_DEBUG_Bootstrap3 PULL DN SPI_DO Reserved. SPI_DO must not be Pulled Up during Power-On RESETn. XROM_EN_Bootstrap2 PULL DN SPI_CLK Reserved. SPI_CLK must not be Pulled Up during PowerOn RESETn. RESERVED_Bootstrap1 PULL DN IRQ Reserved. IRQ pin must not be Pulled Up during Power-On RESETn. ATE_MODE_EN_Bootstrap0 Open drain UART_TX Reserved. UART_TX must be Pulled Up during Power-On RESETn. Note: When the pin corresponding to a specific bootstrap is left NC, it will take the value of the assigned by the internal PULLUP (Level 1) or PULLDN (Level0). The internal resistor used is around 50k ohm. To select a non-default value on a bootstrap, an external PULLUP or PULLDN resistor tied to the opposite direction that overcomes the internal PULLUP or PULLDN needs to be used. C2690-DAT-01p MegaChips’ Proprietary Information Page 19 of 34 STDP2690 6. Package specifications Package type: 81 BGA (8 x 8 mm / ball pitch 0.8 mm) 6.1 Package drawing Figure 3. Package drawing C2690-DAT-01p MegaChips’ Proprietary Information Page 20 of 34 STDP2690 6.2 BGA8X8 dimensions Figure 4. Package dimensions Note: (1) – LFBGA stands for Low profile Fine pitch Ball Grid Array. – Low profile: 1.20mm < A = 1.70mm / Fine pitch: e < 1.00mm. – The total profile height (Dim A) is measured from the seating plane “C” to the top of the component. – The maximum total package height is calculated by the RSS method (Root Sum Square): A Max = A1 Typ + A2 Typ + A4 Typ + v (A1² + A2² + A4² tolerance values). (2) – The typical ball diameter before mounting is 0.50mm. (3) – The tolerance of position that controls the location of the pattern of balls with respect to datums A and B. For each ball there is a cylindrical tolerance zone eee perpendicular to datum C and located on true position with respect to datums A and B as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. 4) – The tolerance of position that controls the location of the balls within the matrix with respect to each other. For each ball there is a cylindrical tolerance zone fff perpendicular to datum C and located on true position as defined by e. The axis perpendicular to datum C of each ball must lie within this tolerance zone. Each tolerance zone fff in the array is contained entirely in the respective zone eee above The axis of each ball must lie simultaneously in both tolerance zones. (5) – The terminal A1 corner must be identified on the top surface by using a corner chamfer, ink or metalized markings, or other feature of package body or integral heat slug. – A distinguishing feature is allowable on the bottom surface of the package to identify the terminal A1 corner. Exact shape of each corner is optional. C2690-DAT-01p MegaChips’ Proprietary Information Page 21 of 34 STDP2690 6.3 Marking field template and descriptors The STDP2690 marking template is shown below. Figure 5. Marking template Field descriptors are shown below. Table 9.Field descriptors Field Description Marking A Product code STDP2690 B 2-character assembly plant code 99 C 3-character BE sequence code “XYZ” D 2-character diffusion plant code VQ E 3-character country of origin code MYS F 1-digit assembly year “Y” G 2-digit assembly week “WW” H Standard MegaChips logo M I 2-character version code AD J Ball A1 identifier a DOT 6.4 Classification reflow profile Please refer to the DisplayPort Application Note: Classification reflow profile for SMD devices (C0353-APN-06) for reflow diagram and details. C2690-DAT-01p MegaChips’ Proprietary Information Page 22 of 34 STDP2690 7. Electrical specifications 7.1 Absolute maximum ratings Applied conditions greater than those listed under “Absolute maximum ratings” may cause permanent damage to the device. The device should never exceed absolute maximum conditions since it may affect device reliability. Table 10. Absolute maximum ratings Parameter Symbol Min Typ Max Units VVDD_3.3 -0.3 3.3 3.63 V VVDD_1.2 -0.3 1.2 1.26 V Input voltage for tolerance for 5V I/O pin VIN5Vtol -0.3 - 5.5 V Input voltage tolerance for 3.3V I/O pin(1,2) VIN3V3tol -0.3 - 3.63 V ESD - Human Body Model (HBM) VESD - - ±2 kV ESD - Charged Device Model (CDM) VESD - - ±500 V Latch-up ILA - - ±200 mA Ambient operating temperature TA 0 - 70 °C Storage temperature TSTG -40 - 125 °C Operating junction temperature TJ 0 70 125 °C Thermal resistance (Junction to Ambient) θJA - 52.4 - °C/W Thermal resistance (Junction to Case) θJC - 24.4 - °C/W Peak IR reflow soldering temperature TSOL - - 260 °C 3.3 V supply voltages (1,2) 1.2 V supply voltages (1.2) (1,2) Note (1): All voltages are measured with respect to GND. Note (2): Absolute maximum voltage ranges are for transient voltage excursions. 7.2 DC characteristics Table 11. DC characteristics Symbol Min Typ Max(1) Units 3.3 V supply voltages (analog and digital) VVDD_3.3 3.14 3.3 3.47 V 1.2 V supply voltages (analog and digital) VVDD_1.2 1.14 1.2 1.26 V Parameter Power Power Measurement conditions: 1920 x 1080 / 120 Hz test pattern: ON-OFF dot. 493 mW Sleep mode 21 mW C2690-DAT-01p MegaChips’ Proprietary Information Page 23 of 34 STDP2690 Table 11. DC characteristics Parameter Symbol Min Typ Max(1) Units - 45.3 286 - mA Supply current Measurement conditions: 1920 x 1080 / 120 Hz test pattern: ON-OFF dot Moire VDD (analog and digital power) = 3.3 V VDDA (analog and digital power) = 1.2 V In all configuration, 8 bits input is used. Inputs High voltage VIH 2.0 - - V Low voltage VIL - - 0.8 V Input hysteresis voltage VHYST 300 - - mV High current (VIN = 3.3V) IIH - - ±10 μA Low current (VIN = 0 V) IIL - - ±10 μA Capacitance (VIN = 2.4 V) CIN - - 5 pF High voltage (IOH = 8mA) VOH 2.4 - - V Low voltage (IOL = -8 mA) VOL - - 0.4 V Tri-state leakage current IOZ - - ±10 μA Outputs Note: 7.3 The values in the Max column represent absolute maximum current consumption under high voltage (+5%) and nominal temperature. These values are measured in an environment that includes some discreet components. Other conditions include: a) Power measurement values are to be used for regulator sizing only, and not directly for package thermal calculations. b) IC performance is only guaranteed when operating within the “DC Characteristics”. c) All inputs are 3.3V tolerant. AC characteristics Table 12. Maximum speed of operation Clock domain Max speed of operation Reference Input Clock (TCLK) 27 MHz Reference Internal Clock (RCLK) 324 MHz On-Chip Microcontroller Clock (OCLK) 100 MHz SPDIF audio output 192 kHz 2-Wire Serial Slave (SLAVE_SCL) 400 kHz 2-Wire DDC2bi Slave (VGAx_SCL) 400 kHz 2-Wire Serial Master (MSTRx_SCL) 400 kHz C2690-DAT-01p MegaChips’ Proprietary Information Page 24 of 34 STDP2690 7.3.1 DisplayPort receiver Table 13. DisplayPort receiver electrical parameters Parameter Symbol Min Typ Max Units Comments DisplayPort link RX does not require local crystal for link clock generation DisplayPort receiver system parameters HBR2 Unit Interval (5.4Gbps) UI_HBR2 - 185 - ps Turbo Unit Interval (3.2Gbps) UI_TURBO - 312 - ps HBR Unit Interval (2.7Gbps) UI_HBR - 370 - ps RBR Unit Interval (1.62Gbps) UI_RBR - 617 - ps Link clock down spreading Down Spread Amplitude 0 - 0.5 % Modulation frequency range 0f 30kHz to 33kHz 0.25 - - UI For RBR DisplayPort receiver TP3 parameters Minimum Receiver Eye Width at Rx-side TRX-EYE_CONN connector pins Lane intra-pair Skew Tolerance LRXSKEW_INTRA_PA - - 50 ps IR_HBR2 Lane intra-pair Skew Tolerance LRXSKEW_INTRA_PA - - 60 ps IR_HBR Lane intra-pair Skew Tolerance LRXSKEW_INTRA_PA - - 260 ps IR_RBR Jitter Closed Loop Tracking Bandwidth Jitter Closed Loop Tracking Bandwidth C2690-DAT-01p FRX-TRACKING- 5.4 - - BW_RBR MHz FRX-TRACKINGBW_HBR 10 - - MegaChips’ Proprietary Information Page 25 of 34 MHz For HBR2. Represents the skew contribution from the cable in addition to the stressed EYE at TP3_EQ. For HBR. Represents the skew contribution from the cable in addition to the stressed EYE at TP3. For RBR. Represents the skew contribution from the cable in addition to the stressed EYE at TP3. Minimum CDR closed loop tracking bandwidth at the receiver when the input is a PRBS7 pattern Minimum CDR closed loop tracking bandwidth at the receiver when the input is a PRBS7 pattern STDP2690 Table 13. DisplayPort receiver electrical parameters Parameter Jitter Closed Loop Tracking Bandwidth Symbol Min FRX-TRACKING- Typ 10 - Max - Units Comments MHz Minimum CDR closed loop tracking bandwidth at the receiver when the input is a PRBS7 pattern UI For HBR2. Measured at 1E-9 BER using HBR2 Compliance EYE pattern. mV For HBR2. Measured at 1E-9 BER using HBR2 Compliance EYE pattern. BW_HBR2 DisplayPort receiver TP3_EQ parameters Minimum Receiver Eye TRXWidth TJ_8b10b_HBR2 - 0.38 RX Differential Peak-to- TRX-DIFFpPeak EYE Voltage p_HBR2 90 - - - 7.3.2 DisplayPort transmitter Table 14. DisplayPort transmitter electrical parameters Parameter Symbol Min Typ Max Unit 185 - ps Comments DisplayPort transmitter system parameters HBR2 unit interval (5.4 Gbps) UI_HBR2 Turbo unit interval (3.2 Gbps) UI_TURBO - 312 - ps HBR unit interval (2.7 Gbps) UI_HBR - 370 - ps RBR unit interval (1.62 Gbps) UI_RBR - 617 - ps Link clock down spreading Down Spread Amplitude 0 - 0.5 % 0.8 - 6.0 dB - Frequency high limit = +300 ppm Frequency low limit = 5300 ppm Modulation frequency range 0f 30 kHz to 33 kHz DisplayPort transmitter TP2 parameters Ratio of output voltage level 1/ level 0 Ratio of output voltage level 2/ level 1 VTX-OUTPUTRATION_RBR_HB 0.1 - 5.1 dB 0.8 - 6.0 dB R Ratio of output voltage level 3/ level 2 C2690-DAT-01p MegaChips’ Proprietary Information Page 26 of 34 Measured on nontransition bits at preemphasis level 0 setting STDP2690 Table 14. DisplayPort transmitter electrical parameters Parameter Symbol Ratio of output voltage level 1/ level 0 Ratio of output voltage level l 2/ level 1 VTX-OUTPUT- Max output voltage level Lane-to-lane output skew Typ Max Unit 5.2 - 6.9 dB VTX-PREEMP- 3.5 dB 1 - 4.4 dB - - 0.25 dB - - 1.2 V - - 2 UI Applied to all pairwise combinations of supported lanes - - 4UI+500ps ps Applied to all pairwise combinations of supported lanes - - 30 dB Applies to all support lanes 2 - - dB OFF VTX-DIFFp-pMAX LTX-SKEWINTER_PAIR_HBR LTX-SKEWINTER_PAIR_HBR 2 Lane intra-pair output skew LTX-SKEWINTRA_PAIR Delta of pre-emphasis Level 1 vs. level 0 Delta of pre-emphasis level 2 vs. level 1 VTX-PREEMP- 1.6 - - dB Delta of pre-emphasis level 3 vs. level 2 1.6 - - dB Non-transition reduction output Voltage level 2 - - 3 dB - - 3 dB - - 1.4 dB - - 0.62 UI - - 0.49 UI Non-transition reduction output Voltage level 1 Measured on nontransition bits at preemphasis level 0 setting - _RBR Lane-to-Lane output skew Comments 1.6 RATION_HBR2 Ratio of output voltage level 3/ level 2 Maximum preemphasis when disabled Min DELTA VTXDIFF_REDUCTIO N Non-transition reduction output Voltage level 0 Applied to all valid voltage settings. No Pre-emphasis Post Cursor2 applied VTx_DIFF at each nonzero nominal preemphasis level must not be lower than the specific amount less than VTx_DIFF at the zero nominal preemphasis level. Modulation frequency range 0f 30 kHz to 33 kHz DisplayPort transmitterTP3_EQ parameters Maximum TX total jitter TTXTJ_8b10b_HBR2 Maximum TX deterministic jitter C2690-DAT-01p TTXDJ_8b10b_HBR2 MegaChips’ Proprietary Information Page 27 of 34 For HBR2. Measured at 1E-9 BER using HBR2 Compliance EYE pattern. STDP2690 Table 14. DisplayPort transmitter electrical parameters Parameter Symbol Min Typ Max Unit Maximum TX total jitter TTX- - - 0.4 UI - - 0.25 UI - - 0.23 UI Comments TJ_D10.2_HBR2 Maximum TX deterministic jitter Maximum TX random jitter TTXDJ_D10.2_HBR2 TTX- For HBR2. Measured at 1E-9 BER using D10.2 compliance pattern. RJ_D10.2_HBR2 TX differential peak-to- TTX-DIFFppeak EYE voltage p_HBR2 110 - - mV For HBR2. Measured at 1E-9 BER using HBR2 Compliance EYE pattern. 7.3.3 HDMI transmitter Table 15. HDMI transmitter (DP++) DC characteristics DC characteristics Min Typ Max Units Single-ended output voltage 400 500 - mV Single-ended high level output voltage, VH AVDD - mV AVDD=1.2volt Single-ended low level output voltage, VL AVDD-500 - mV AVDD=1.2volt - Comments Table 16. HDMI transmitter AC characteristics DC characteristics Min Typ Max Units Intra-pair skew at source connector, max - - 0.15 Tbit Intra-pair skew at source connector, max - - 0.2 Tcharacter TMDS differential clock jitter, max - - 0.25 Tbit Rise time/fall time 75 - - ps Comments 7.3.4 Crystal specification Mode: fundamental Table 17. Crystal specifications Parameters Min Typ Max Units Nominal frequency - 27 - MHz Tolerance - ± 50 - ppm Load capacitance - 22 - pF ESR (effective series resistance) - - 40 Ohm C2690-DAT-01p MegaChips’ Proprietary Information Page 28 of 34 Comments STDP2690 Table 17. Crystal specifications Parameters Min Typ Max Units Drive level - - 100 uW Shunt capacitance - 7 - pF Comments 7.3.5 I2C interface timing Table 18. I2C interface timing Symbol Parameter Conditions Min Measured Max Unit fSCL SCL clock rate Fast mode 0 393 400 kHz tHD-STA Hold time START After this period, the 1st clock starts 0.6 0.95 - μs tLOW Low period of clock SCL 1.3 1.1 - μs tHIGH High period of clock SCL 0.6 0.75 - μs Tsu;STA Setup time for a repeated START 0.6 1.09 - μs tHD;DAT Data hold time 0 0.96 0.9(1) μs tSU;DAT Data setup time 100 600 - ns TBUF Bus free time between STOP and START 1.3 1.7 ms - μs Cb Capacitance load for each bus line - 400 pF tr Rise time 20 220 300 ns tf Fall time 20 25 300 ns Vnh Noise margin at high level 0.2 VDD 0.3 - V Vnl Noise margin at low level 0.1 VDD 0.28 - Note: For master The maximum tHD;DAT only has to be met if the device does not stretch the low period tLOW of the SCL signal. In the diagram below, S = start, P = stop, Sr = Repeated start, and SP= Repeated stop conditions. Figure 6. I2C timing SDA tf tLOW tSU;DAT tr tf tHD;STA tSP tr tBUF SCL S tHD;STA C2690-DAT-01p tHD;DAT tHIGH tSU;STA Sr MegaChips’ Proprietary Information Page 29 of 34 tSU;STO P S STDP2690 7.3.6 SPI interface timing Table 19. SPI interface timing, VDD = 3.3V Symbol Parameter Min Max Units FCLK Serial clock frequency - 50 MHz TSCKH Serial clock high time 9 - ns TSCKL Serial clock low time 9 - ns TSCKR Serial clock rise time (slew rate) 0.1 - V/ns TSCKF Serial clock fall time (slew rate) 0.1 - V/ns TCES CE# active setup time 5 - ns TCEH CE# active hold time 5 - ns TCHS CE# not active setup time 5 - ns TCHH CE# not active hold time 5 - ns TCPH CE# high time 50 - ns TCHZ CE# high to high-Z output - 8 ns TCLZ SCK low to low-Z output 0 - ns TDS Data in setup time 5 - ns TDH Data in hold time 5 - ns TOH Output hold from SCK change 0 - ns TV Output valid from SCK - 8 ns C2690-DAT-01p MegaChips’ Proprietary Information Page 30 of 34 STDP2690 Figure 7. SPI output or serial interface SPI ROM input timing ROM_CSn (CE#) ROM_SCLK (SCK) ROM_SDO (SI ) ROM_SDI (SO) Figure 8. SPI input or serial interface SPI ROM output timing ROM_CSn (CE#) ROM_SCLK (SCK) ROM_SDI (SO) ROM_SDO (SI ) C2690-DAT-01p MegaChips’ Proprietary Information Page 31 of 34 STDP2690 8. Ordering information Table 20. Order codes Part number Description STDP2690-AD 81 BGA (8 x 8 mm) delivered in trays STDP2690-ADT 81 BGA (8 x 8 mm) delivered in tape and reel C2690-DAT-01p MegaChips’ Proprietary Information Page 32 of 34 STDP2690 9. Revision history Table 21. Document revision history Date Revision 07-Mar-2016 A C2690-DAT-01p Changes Initial release. MegaChips’ Proprietary Information Page 33 of 34 STDP2690 Notice Semiconductor products may possibly experience breakdown or malfunction. Adequate care should be taken with respect to the safety design of equipment in order to prevent the occurrence of human injury, fire or social loss in the event of breakdown or malfunction of semiconductor products The overview of operations and illustration of applications described in this document indicate the conceptual method of use of the semiconductor product and do not guarantee operability in equipment in which the product is actually used. The names of companies and trademarks stated in this document are registered trademarks of the relevant companies. MegaChips Co. provides no guarantees nor grants any implementation rights with respect to industrial property rights, intellectual property rights and other such rights belonging to third parties or/and MegaChips Co. in the use of products and of technical information including information on the overview of operations and the circuit diagrams that are described in this document. The product described in this document may possibly be considered goods or technology regulated by the Foreign Currency and Foreign Trade Control Law. In the event such law applies, export license will be required under said law when exporting the product. This regulation shall be valid in Japan domestic. In the event the intention is to use the product described in this document in applications that require an extremely high standard of reliability such as nuclear systems, aerospace equipment or medical equipment for life support, please contact the sales department of MegaChips Co. in advance. All information contained in this document is subject to change without notice. Copyright © 2016 MegaChips Corporation All rights reserved MegaChips Corporation Head Quarters 1-1-1 Miyahara, Yodogawa-ku Osaka 532-0003, Japan TEL: +81-6-6399-2884 MegaChips Corporation Taiwan Branch RM. B 2F, Worldwide House, No.129, Min Sheng E. Rd., Sec. 3, Taipei 105, Taiwan TEL: +886-2-2547-1297 MegaChips Corporation Tokyo Office 17-6 Ichiban-cho, Chiyoda-ku, Tokyo 102-0082, Japan TEL: +81-3-3512-5080 MegaChips Corporation Tainan Office RM. 2, 8F, No.24, Da Qiao 2 Rd., Yong Kang Dist., Tainan 710, Taiwan TEL: +886-6-302-2898 MegaChips Corporation Makuhari Office 1-3 Nakase Mihama-ku Chiba 261-8501, Japan TEL: +81-43-296-7414 MegaChips Corporation Zhunan Office No.118, Chung-Hua Rd., Chu-Nan, Miao-Li 350, Taiwan TEL: +886-37-666-156 MegaChips Corporation San Jose Office 2033 Gateway Place, Suite 400, San Jose, CA 95110 U.S.A. TEL: +1-408-570-0555 MegaChips Corporation Shenzhen Office Room 6307, Office Tower, Shun Hing Square, 5002 Shen Nan Dong Road, Luohu District, Shenzhen 518000, P. R. China TEL: +86-755-3664-6990 MegaChips Corporation India Branch 17th Floor, Concorde Block UB City, Vittal Mallya Road, Bangalore 560-001, India TEL: +91-80-4041-3999 C2690-DAT-01p MegaChips’ Proprietary Information Page 34 of 34 34