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74LVC16374A; 74LVCH16374A
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Rev. 11 — 16 January 2013
Product data sheet
1. General description
The 74LVC16374A and 74LVCH16374A are 16-bit edge-triggered flip-flops featuring
separate D-type inputs with bus hold (74LVCH16374A only) for each flip-flop and 3-state
outputs for bus-oriented applications. It consists of two sections of eight positive
edge-triggered flip-flops. A clock input (nCP) and an output enable (nOE) are provided for
each octal.
The flip-flops store the state of their individual D-inputs that meet the set-up and hold time
requirements on the LOW-to-HIGH clock (CP) transition.
When pin nOE is LOW, the contents of the flip-flops are available at the outputs. When pin
nOE is HIGH, the outputs go to the high-impedance OFF-state. Operation of input nOE
does not affect the state of the flip-flops.
Inputs can be driven from either 3.3 V or 5 V devices. When disabled, up to 5.5 V can be
applied to the outputs. These features allow the use of these devices in mixed 3.3 V and
5 V applications.
Bus hold on data inputs eliminates the need for external pull-up resistors to hold unused
inputs.
2. Features and benefits
5 V tolerant inputs/outputs for interfacing with 5 V logic
Wide supply voltage range from 1.2 V to 3.6 V
CMOS low power consumption
Multibyte flow-through standard pinout architecture
Low inductance multiple supply pins for minimum noise and ground bounce
Direct interface with TTL levels
All data inputs have bus hold (74LVCH16374A only)
High-impedance outputs when VCC = 0 V
Complies with JEDEC standard:
JESD8-7A (1.65 V to 1.95 V)
JESD8-5A (2.3 V to 2.7 V)
JESD8-C/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-B exceeds 200 V
CDM JESD22-C101E exceeds 1000 V
Specified from 40 C to +85 C and 40 C to +125 C
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
3. Ordering information
Table 1.
Ordering information
Type number
Package
74LVC16374ADL
Temperature
range
Name
Description
Version
40 C to +125 C
SSOP48
plastic shrink small outline package; 48 leads;
body width 7.5 mm
SOT370-1
40 C to +125 C
TSSOP48
plastic thin shrink small outline package;
48 leads; body width 6.1 mm
SOT362-1
40 C to +125 C
HXQFN60U plastic thermal enhanced extremely thin quad flat SOT1134-1
package; no leads; 60 terminals; UTLP based;
body 4 6 0.5 mm
74LVCH16374ADL
74LVC16374ADGG
74LVCH16374ADGG
74LVC16374ABX
74LVCH16374ABX
4. Functional diagram
1
24
1OE
2OE
1
1OE
48
1CP
24
2OE
25
2CP
47
1D0
1Q0
2
46
1D1
1Q1
3
1D0
44
1D2
1Q2
5
1D1
43
1D3
1Q3
6
1D2
41
1D4
1Q4
8
1D3
40
1D5
1Q5
9
1D4
38
1D6
1Q6
11
1D5
37
1D7
1Q7
12
1D6
36
2D0
2Q0
13
1D7
35
2D1
2Q1
14
33
2D2
2Q2
16
32
2D3
2Q3
17
30
2D4
2Q4
19
29
27
26
2D5
2Q5
2D6
2Q6
2D7
2Q7
1CP
2D0
2D1
2D2
2D3
20
2D4
22
2D5
23
2D6
2CP
2D7
48
25
Logic symbol
74LVC_LVCH16374A
Product data sheet
C3
EN2
C4
3D
1
2
46
3
44
5
43
6
41
8
40
9
38
11
37
12
36
4D
2
13
35
14
33
16
32
17
30
19
29
20
27
22
26
23
1Q0
1Q1
1Q2
1Q3
1Q4
1Q5
1Q6
1Q7
2Q0
2Q1
2Q2
2Q3
2Q4
2Q5
2Q6
2Q7
001aaa254
001aaa253
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Fig 1.
47
EN1
Pin numbers are shown for SSOP48 and TSSOP48
packages only.
Fig 2.
IEC logic symbol
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
2 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
1D0
D
1Q0
Q
2D0
D
CP
2Q0
Q
CP
FF1
FF2
1CP
2CP
1OE
2OE
to 7 other channels
to 7 other channels
001aaa255
Fig 3.
Logic diagram
VCC
data input
to internal circuit
mna705
Fig 4.
Bus hold circuit
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
3 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
5. Pinning information
5.1 Pinning
74LVC16374A
74LVCH16374A
1OE
1
48 1CP
1Q0
2
47 1D0
1Q1
3
46 1D1
GND
4
45 GND
1Q2
5
44 1D2
1Q3
6
43 1D3
VCC
7
42 VCC
1Q4
8
41 1D4
1Q5
9
40 1D5
GND 10
39 GND
1Q6 11
38 1D6
1Q7 12
37 1D7
2Q0 13
36 2D0
2Q1 14
35 2D1
GND 15
34 GND
2Q2 16
33 2D2
2Q3 17
32 2D3
VCC 18
31 VCC
2Q4 19
30 2D4
2Q5 20
29 2D5
GND 21
28 GND
2Q6 22
27 2D6
2Q7 23
26 2D7
2OE 24
25 2CP
001aaa231
Fig 5.
Pin configuration SOT370-1 (SSOP48) and SOT362-1 (TSSOP48)
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
4 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
terminal 1
index area
74LVC16374A
74LVCH16374A
D1
A32
A1
D5
A31
A30
B20
A29
B19
A28
B18
A27
D4
D8
A26
A2
A25
B1
B17
B2
B16
A3
A24
A4
A23
B15
B3
A5
A22
B4
B14
B5
B13
B6
B12
A6
A21
A7
A20
A8
A19
B7
B11
A9
A18
GND(1)
A10
D6
D2
A11
B8
A12
B10
B9
A13
A14
A15
D7
A17
A16
D3
001aaj618
Transparent top view
(1) The die substrate is attached to this pad using conductive die attach material. It cannot be used as a supply pin or input.
Fig 6.
Pin configuration SOT1134-1 (HXQFN60U)
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
5 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
5.2 Pin description
Table 2.
Symbol
Pin description
Pin
Description
SOT370-1 and SOT362-1
SOT1134-1
1OE, 2OE
1, 24
A30, A13
output enable input (active LOW)
GND
4, 10, 15, 21, 28, 34, 39, 45
A32, A3, A8, A11, A16, A19, A24, A27
ground (0 V)
VCC
7, 18, 31, 42
A1, A10, A17, A26
supply voltage
1Q0 to 1Q7 2, 3, 5, 6, 8, 9, 11, 12
B20, A31, D5, D1, A2, B2, B3, A5
data output
2Q0 to 2Q7 13, 14, 16, 17, 19, 20, 22, 23
A6, B5, B6, A9, D2, D6, A12, B8
data output
1D0 to 1D7 47, 46, 44, 43, 41, 40, 38, 37
B18, A28, D8, D4, A25, B16, B15, A22 data input
2D0 to 2D7 36, 35, 33, 32, 30, 29, 27, 26
A21, B13, B12, A18, D3, D7, A15, B10 data input
1CP, 2CP
A29, A14
48, 25
clock input
6. Functional description
Table 3.
Function selection[1]
Operating mode
Load and read register
Load register and disable outputs
[1]
Input
Internal flip-flop
Output nQ0 to nQ7
nOE
nCP
nDn
L
l
L
L
L
h
H
H
H
l
L
Z
H
h
H
Z
H = HIGH voltage level;
h = HIGH voltage level one set-up time prior to the HIGH-to-LOW CP transition;
L = LOW voltage level;
l = LOW voltage level one set-up time prior to the HIGH-to-LOW CP transition;
= LOW-to-HIGH transition;
Z = high-impedance OFF-state.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
IIK
input clamping current
Conditions
VI < 0 V
[1]
Min
Max
Unit
0.5
+6.5
V
50
-
mA
0.5
+6.5
V
VI
input voltage
IOK
output clamping current
VO > VCC or VO < 0 V
-
50
mA
VO
output voltage
output HIGH-or LOW-state
[2]
0.5
VCC + 0.5
V
output 3-state
[2]
0.5
+6.5
V
-
50
mA
IO
output current
VO = 0 V to VCC
ICC
supply current
-
100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
6 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Table 4.
Limiting values …continued
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
Conditions
Ptot
total power dissipation
Tamb = 40 C to +125 C
Min
Max
Unit
(T)SSOP48 package
[3]
-
500
mW
HXQFN60U package
[4]
-
1000
mW
[1]
The minimum input voltage ratings may be exceeded if the input current ratings are observed.
[2]
The output voltage ratings may be exceeded if the output current ratings are observed.
[3]
Above 60 C, the value of Ptot derates linearly with 5.5 mW/K.
[4]
Above 70 C, the value of Ptot derates linearly with 1.8 mW/K.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
Conditions
VCC
supply voltage
VI
input voltage
VO
output voltage
Min
Typ
Max
Unit
1.65
-
3.6
V
1.2
-
-
V
0
-
5.5
V
active mode
0
-
VCC
V
power-down mode; VCC = 0 V
0
-
5.5
V
functional
Tamb
ambient temperature
t/V
input transition rise and fall rate
40
-
+125
C
VCC = 1.65 V to 2.7 V
0
-
20
ns/V
VCC = 2.7 V to 3.6 V
0
-
10
ns/V
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VIH
VIL
HIGH-level
input voltage
LOW-level
input voltage
74LVC_LVCH16374A
Product data sheet
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
1.08
-
-
1.08
-
V
0.65 VCC
-
-
0.65 VCC
-
V
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
V
VCC = 2.7 V to 3.6 V
VCC = 1.2 V
VCC = 1.65 V to 1.95 V
2.0
-
-
2.0
-
V
VCC = 1.2 V
-
-
0.12
-
0.12
V
VCC = 1.65 V to 1.95 V
-
-
0.35 VCC
-
VCC = 2.3 V to 2.7 V
-
-
0.7
-
0.7
V
VCC = 2.7 V to 3.6 V
-
-
0.8
-
0.8
V
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
0.35 VCC V
© NXP B.V. 2013. All rights reserved.
7 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
VOH
VOL
HIGH-level
output
voltage
LOW-level
output
voltage
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
VCC 0.2
VCC
-
VCC 0.3
-
V
IO = 4 mA; VCC = 1.65 V
1.2
-
-
1.05
-
V
IO = 8 mA; VCC = 2.3 V
1.8
-
-
1.65
-
V
IO = 12 mA; VCC = 2.7 V
2.2
-
-
2.05
-
V
IO = 18 mA; VCC = 3.0 V
2.4
-
-
2.25
-
V
IO = 24 mA; VCC = 3.0 V
2.2
-
-
2.0
-
V
IO = 100 A;
VCC = 1.65 V to 3.6 V
-
0
0.2
-
0.3
V
IO = 4 mA; VCC = 1.65 V
-
-
0.45
-
0.65
V
IO = 8 mA; VCC = 2.3 V
-
-
0.6
-
0.8
V
VI = VIH or VIL
IO = 100 A;
VCC = 1.65 V to 3.6 V
VI = VIH or VIL
IO = 12 mA; VCC = 2.7 V
-
-
0.4
-
0.6
V
IO = 24 mA; VCC = 3.0 V
-
-
0.55
-
0.8
V
II
input leakage VCC = 3.6 V; VI = 5.5 V or GND
[2]
current
-
0.1
5
-
20
A
IOZ
OFF-state
output
current
VI = VIH or VIL; VCC = 3.6 V;
VO = 5.5 V or GND [2]
-
0.1
5
-
20
A
IOFF
power-off
leakage
current
VCC = 0 V; VI or VO = 5.5 V
-
0.1
10
-
20
A
ICC
supply
current
VCC = 3.6 V; VI = VCC or GND;
IO = 0 A
-
0.1
20
-
80
A
ICC
additional
supply
current
per input pin;
VCC = 2.7 V to 3.6 V;
VI = VCC 0.6 V; IO = 0 A
-
5
500
-
5000
A
CI
input
capacitance
VCC = 0 V to 3.6 V;
VI = GND to VCC
-
5.0
-
-
-
pF
IBHL
bus hold
LOW current
VCC = 1.65; VI = 0.58 V [3][4]
10
-
-
10
-
A
VCC = 2.3; VI = 0.7 V
30
-
-
25
-
A
75
-
-
60
-
A
VCC = 3.0; VI = 0.8 V
IBHH
10
-
-
10
-
A
30
-
-
25
-
A
75
-
-
60
-
A
200
-
-
200
-
A
VCC = 2.7 V
300
-
-
300
-
A
VCC = 3.6 V
500
-
-
500
-
A
bus hold
VCC = 1.65; VI = 1.07 V
HIGH current V = 2.3; V = 1.7 V
CC
I
VCC = 3.0; VI = 2.0 V
IBHLO
bus hold
LOW
overdrive
current
74LVC_LVCH16374A
Product data sheet
VCC = 1.95 V
[3][5]
[3][4]
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
8 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Table 6.
Static characteristics …continued
At recommended operating conditions. Voltages are referenced to GND (ground = 0 V).
Symbol Parameter
IBHHO
[1]
bus hold
HIGH
overdrive
current
40 C to +85 C
Conditions
40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
200
-
-
200
-
A
VCC = 2.7 V
300
-
-
300
-
A
VCC = 3.6 V
500
-
-
500
-
A
VCC = 1.95 V
[3][5]
All typical values are measured at VCC = 3.3 V (unless stated otherwise) and Tamb = 25 C.
[2]
The bus hold circuit is switched off when VI > VCC allowing 5.5 V on the input pin.
[3]
Valid for data inputs (74LVCH16374A) only; control inputs do not have a bus hold circuit.
[4]
The specified sustaining current at the data inputs holds the input below the specified VI level.
[5]
The specified overdrive current at the data input forces the data input to the opposite logic input state.
10. Dynamic characteristics
Table 7.
Dynamic characteristics
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10.
Symbol Parameter
tpd
propagation
delay
40 C to +85 C
Conditions
Min
Max
Min
Max
-
14
-
-
-
ns
VCC = 1.65 V to 1.95 V
2.1
6.9
13.5
2.1
15.6
ns
VCC = 2.3 V to 2.7 V
1.5
3.7
6.7
1.5
7.7
ns
VCC = 2.7 V
1.5
3.4
6.0
1.5
7.5
ns
1.5
3.1
5.4
1.5
7.0
ns
nCP to nQn; see Figure 7
[2]
VCC = 1.2 V
VCC = 3.0 V to 3.6 V
ten
enable time
nOE to nQn; see Figure 9
[2]
VCC = 1.2 V
-
20
-
-
-
ns
VCC = 1.65 V to 1.95 V
1.5
5.9
13.1
1.5
15.1
ns
VCC = 2.3 V to 2.7 V
1.5
3.4
6.9
1.5
8.0
ns
VCC = 2.7 V
1.5
3.6
6.0
1.5
7.5
ns
1.0
2.7
5.2
1.0
6.5
ns
-
12
-
-
-
ns
VCC = 1.65 V to 1.95 V
2.8
4.6
9.1
2.8
10.5
ns
VCC = 3.0 V to 3.6 V
tdis
disable time
nOE to nQn; see Figure 7
VCC = 1.2 V
tW
pulse width
74LVC_LVCH16374A
Product data sheet
40 C to +125 C Unit
Typ[1]
[2]
VCC = 2.3 V to 2.7 V
1.0
2.5
4.9
1.0
5.7
ns
VCC = 2.7 V
1.5
3.4
5.1
1.5
6.5
ns
VCC = 3.0 V to 3.6 V
1.5
3.1
4.9
1.5
6.5
ns
nCP HIGH; see Figure 7
VCC = 1.65 V to 1.95 V
5.0
-
-
5.0
-
ns
VCC = 2.3 V to 2.7 V
4.0
-
-
4.0
-
ns
VCC = 2.7 V
3.0
-
-
3.0
-
ns
VCC = 3.0 V to 3.6 V
3.0
1.5
-
3.0
-
ns
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
9 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Table 7.
Dynamic characteristics …continued
Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 10.
Symbol Parameter
tsu
set-up time
hold time
th
maximum
frequency
fmax
40 C to +85 C
Conditions
40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
nDn to nCP; see Figure 8
VCC = 1.65 V to 1.95 V
4.0
-
-
4.0
-
ns
VCC = 2.3 V to 2.7 V
3.0
-
-
3.0
-
ns
VCC = 2.7 V
1.9
-
-
1.9
-
ns
VCC = 3.0 V to 3.6 V
1.9
0.3
-
1.9
-
ns
VCC = 1.65 V to 1.95 V
3.0
-
-
3.0
-
ns
VCC = 2.3 V to 2.7 V
2.5
-
-
2.5
-
ns
VCC = 2.7 V
1.1
-
-
1.1
-
ns
VCC = 3.0 V to 3.6 V
+1.5
0.3
-
1.5
-
ns
VCC = 1.65 V to 1.95 V
100
-
-
80
-
ns
VCC = 2.3 V to 2.7 V
125
-
-
100
-
ns
nDn to nCP; see Figure 8
see Figure 7
VCC = 2.7 V
150
-
-
120
-
MHz
VCC = 3.0 V to 3.6 V
150
300
-
120
-
MHz
-
-
1.0
-
1.5
ns
VCC = 1.65 V to 1.95 V
-
14.1
-
-
-
pF
VCC = 2.3 V to 2.7 V
-
16.4
-
-
-
pF
VCC = 3.0 V to 3.6 V
-
18.5
-
-
-
pF
tsk(o)
output skew
time
VCC = 3.0 V to 3.6 V
[3]
CPD
power
dissipation
capacitance
per input; VI = GND to VCC
[4]
[1]
Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.8 V, 2.5 V, 2.7 V and 3.3 V respectively.
[2]
tpd is the same as tPLH and tPHL.
ten is the same as tPZL and tPZH.
tdis is the same as tPLZ and tPHZ.
[3]
[4]
Skew between any two outputs of the same package switching in the same direction. This parameter is guaranteed by design.
CPD is used to determine the dynamic power dissipation (PD in W).
PD = CPD VCC2 fi N + (CL VCC2 fo) where:
fi = input frequency in MHz; fo = output frequency in MHz
CL = output load capacitance in pF
VCC = supply voltage in Volts
N = number of inputs switching
(CL VCC2 fo) = sum of the outputs
74LVC_LVCH16374A
Product data sheet
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16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
11. Waveforms
1/fmax
VI
nCP input
VM
VM
GND
tW
t PHL
t PLH
VOH
VM
nQn output
001aaa256
VOL
Measurement points are given in Table 8.
VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 7.
Clock (nCP) to output (nQn) propagation delays, clock pulse width, and the maximum frequency
VI
VM
nCP input
GND
t su
t su
th
th
VI
VM
nDn input
GND
VOH
VM
nQn output
VOL
001aaa257
Measurement points are given in Table 8.
The shaded areas indicate when the input is permitted to change for predictable performance.
VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 8.
Data set-up and hold times for the nDn input to the nCP input
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
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74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
VI
nOE input
VM
GND
tPLZ
tPZL
VCC
output
LOW-to-OFF
OFF-to-LOW
VM
VX
VOL
tPHZ
VOH
tPZH
VY
output
HIGH-to-OFF
OFF-to-HIGH
GND
VM
outputs
enabled
outputs
enabled
outputs
disabled
mna362
Measurement points are given in Table 8.
VOL and VOH are the typical output voltage levels that occur with the output load.
Fig 9.
3-state enable and disable times
Table 8.
Measurement points
Supply voltage
Input
VCC
VI
VM
VM
VX
VY
1.2 V
VCC
0.5 VCC
0.5 VCC
VOL + 0.15 V
VOH 0.15 V
1.65 V to 1.95 V
VCC
0.5 VCC
0.5 VCC
VOL + 0.15 V
VOH 0.15 V
2.3 V to 2.7 V
VCC
0.5 VCC
0.5 VCC
VOL + 0.15 V
VOH 0.15 V
2.7 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
VOH 0.3 V
3.0 V to 3.6 V
2.7 V
1.5 V
1.5 V
VOL + 0.3 V
VOH 0.3 V
74LVC_LVCH16374A
Product data sheet
Output
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
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74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
VI
tW
90 %
negative
pulse
VM
0V
tf
tr
tr
tf
VI
90 %
positive
pulse
0V
VM
10 %
VM
VM
10 %
tW
VEXT
VCC
VI
RL
VO
G
DUT
RT
RL
CL
001aae331
Test data is given in Table 9.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 10. Test circuit for measuring switching times
Table 9.
Test data
Supply voltage
Input
VI
tr, tf
CL
RL
tPLH, tPHL
tPLZ, tPZL
tPHZ, tPZH
1.2 V
VCC
2 ns
30 pF
1 k
open
2 VCC
GND
1.65 V to 1.95 V
VCC
2 ns
30 pF
1 k
open
2 VCC
GND
2.3 V to 2.7 V
VCC
2 ns
30 pF
500
open
2 VCC
GND
2.7 V
2.7 V
2.5 ns
50 pF
500
open
2 VCC
GND
3.0 V to 3.6 V
2.7 V
2.5 ns
50 pF
500
open
2 VCC
GND
74LVC_LVCH16374A
Product data sheet
Load
VEXT
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
13 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
12. Package outline
SSOP48: plastic shrink small outline package; 48 leads; body width 7.5 mm
SOT370-1
D
E
A
X
c
y
HE
v M A
Z
25
48
Q
A2
A1
A
(A 3)
θ
pin 1 index
Lp
L
24
1
detail X
w M
bp
e
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (1)
e
HE
L
Lp
Q
v
w
y
Z (1)
θ
mm
2.8
0.4
0.2
2.35
2.20
0.25
0.3
0.2
0.22
0.13
16.00
15.75
7.6
7.4
0.635
10.4
10.1
1.4
1.0
0.6
1.2
1.0
0.25
0.18
0.1
0.85
0.40
8o
o
0
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT370-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-118
Fig 11. Package outline SOT370-1 (SSOP48)
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
14 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm
SOT362-1
E
D
A
X
c
HE
y
v M A
Z
48
25
Q
A2
(A 3)
A1
pin 1 index
A
θ
Lp
L
1
detail X
24
w M
bp
e
2.5
0
5 mm
scale
DIMENSIONS (mm are the original dimensions).
UNIT
A
max.
A1
A2
A3
bp
c
D (1)
E (2)
e
HE
L
Lp
Q
v
w
y
Z
θ
mm
1.2
0.15
0.05
1.05
0.85
0.25
0.28
0.17
0.2
0.1
12.6
12.4
6.2
6.0
0.5
8.3
7.9
1
0.8
0.4
0.50
0.35
0.25
0.08
0.1
0.8
0.4
8o
o
0
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
SOT362-1
REFERENCES
IEC
JEDEC
JEITA
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
MO-153
Fig 12. Package outline SOT362-1 (TSSOP48)
74LVC_LVCH16374A
Product data sheet
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Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
15 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
HXQFN60U: plastic thermal enhanced extremely thin quad flat package; no leads;
60 terminals; UTLP based; body 4 x 6 x 0.5 mm
B
D
SOT1134-1
A
terminal 1
index area
E
A
A1
detail X
e2
e1
1/2 e
e
C A B
C
v
w
L1
D2
D6
A11
A16
B8
eR
y1 C
y
D3
B10
D7
A10
L
C
C A B
C
v
w
b
A17
e
B11
B7
e3
Eh
e4
1/2 e
B1
B17
A1
terminal 1
index area
A26
D5
D1
B20
B18
A32
D8
A27
X
D4
Dh
k
0
2.5
Dimensions
Unit
mm
5 mm
scale
A
A1
b
max 0.50 0.05 0.35
nom 0.48 0.02 0.30
min 0.46 0.00 0.25
D
Dh
E
Eh
e
e1
e2
e3
e4
eR
4.1
4.0
3.9
1.90
1.85
1.80
6.1
6.0
5.9
3.90
3.85
3.80
0.5
1
2.5
3
4.5
0.5
k
L
0.25 0.35
0.20 0.30
0.15 0.25
L1
0.125
0.075
0.025
v
w
y
0.07 0.05 0.08
y1
0.1
sot1134-1_po
References
Outline
version
IEC
JEDEC
JEITA
SOT1134-1
---
---
---
European
projection
Issue date
08-12-17
09-01-22
Fig 13. Package outline SOT1134-1 (HXQFN60U)
74LVC_LVCH16374A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
16 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
13. Abbreviations
Table 10.
Abbreviations
Acronym
Description
CDM
Charged Device Model
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
TTL
Transistor-Transistor Logic
14. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74LVC_LVCH16374A v.11
20130116
Product data sheet
-
74LVC_LVCH16374A v.10
•
•
Modifications:
Minor non-technical text changes and corrections
Document revision history correction
74LVC_LVCH16374A v.10
20120301
Product data sheet
-
74LVC_LVCH16374A v.9
74LVC_LVCH16374A v.9
20111219
Product data sheet
-
74LVC_LVCH16374A v.8
74LVC_LVCH16374A v.8
20110621
Product data sheet
-
74LVC_LVCH16374A v.7
74LVC_LVCH16374A v.7
20100323
Product data sheet
-
74LVC_LVCH16374A v.6
74LVC_LVCH16374A v.6
20090212
Product data sheet
-
74LVC_LVCH16374A v.5
74LVC_LVCH16374A v.5
20031212
Product specification
-
74LVC_H16374A v.4
74LVC_H16374A v.4
19980317
Product specification
-
74LVC16374A_
74LVCH16374A v.3
74LVC16374A_
74LVCH16374A v.3
19980317
Product specification
-
74LVC16374A v.2
74LVC16374A v.2
19970822
Product specification
-
74LVC16374A v.1
74LVC16374A v.1
-
-
-
-
74LVC_LVCH16374A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
17 of 20
74LVC16374A; 74LVCH16374A
NXP Semiconductors
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74LVC_LVCH16374A
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
18 of 20
NXP Semiconductors
74LVC16374A; 74LVCH16374A
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74LVC_LVCH16374A
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 11 — 16 January 2013
© NXP B.V. 2013. All rights reserved.
19 of 20
NXP Semiconductors
74LVC16374A; 74LVCH16374A
16-bit edge-triggered D-type flip-flop; 5 V tolerant; 3-state
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
10
11
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 6
Functional description . . . . . . . . . . . . . . . . . . . 6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 6
Recommended operating conditions. . . . . . . . 7
Static characteristics. . . . . . . . . . . . . . . . . . . . . 7
Dynamic characteristics . . . . . . . . . . . . . . . . . . 9
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 17
Legal information. . . . . . . . . . . . . . . . . . . . . . . 18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 18
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 19
Contact information. . . . . . . . . . . . . . . . . . . . . 19
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP B.V. 2013.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 16 January 2013
Document identifier: 74LVC_LVCH16374A
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