XHRA-2HPA Datasheet
2016/11/04
XMOS © 2016, All Rights Reserved
Document Number: X008627
XHRA-2HPA Datasheet
1
Table of Contents
1
xCORE-AUDIO Processors . . . . . . . . . . . . .
2
XHRA-2HPA Features . . . . . . . . . . . . . . . .
3
Pin Configuration . . . . . . . . . . . . . . . . . .
4
Signal Description . . . . . . . . . . . . . . . . . .
5
Example Application Diagram . . . . . . . . . . .
6
Functional Description and System Components
7
Board Integration . . . . . . . . . . . . . . . . . .
8
Example XHRA-2HPA Board Designs . . . . . . .
9
DC and Switching Characteristics . . . . . . . . .
10 Package Information . . . . . . . . . . . . . . . .
11 Ordering Information . . . . . . . . . . . . . . . .
12 Host Driver Support . . . . . . . . . . . . . . . . .
13 Apple MFi compatibility . . . . . . . . . . . . . . .
Appendices . . . . . . . . . . . . . . . . . . . . . . . . .
A
Configuration . . . . . . . . . . . . . . . . . . . .
B
Schematics Design Check List . . . . . . . . . . .
C
PCB Layout Design Check List . . . . . . . . . . .
D
Associated Design Documentation . . . . . . . .
E
Revision History . . . . . . . . . . . . . . . . . . .
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33
TO OUR VALUED CUSTOMERS
It is our intention to provide you with accurate and comprehensive documentation for the hardware and
software components used in this product. To subscribe to receive updates, visit http://www.xmos.com/.
XMOS Ltd. is the owner or licensee of the information in this document and is providing it to you “AS IS” with
no warranty of any kind, express or implied and shall have no liability in relation to its use. XMOS Ltd. makes
no representation that the information, or any particular implementation thereof, is or will be free from any
claims of infringement and again, shall have no liability in relation to any such claims.
XMOS and the XMOS logo are registered trademarks of XMOS Ltd in the United Kingdom and other countries,
and may not be used without written permission. Company and product names mentioned in this document
are the trademarks or registered trademarks of their respective owners.
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
1
2
xCORE-AUDIO Processors
The xCORE-AUDIO Hi-Res family of parts offer 2-channel, 5.1 and 7.1 channel USB
audio interfaces. Audio data from PC, Mac and Android devices can be streamed
through the device to I2S, DSD and/or S/PDIF interfaces. Sample rates of up to 384
KHz, and sample depths of up to 32 bits are supported.
The family of products has configuration options that include CODEC customisation,
HID input and output options, and USB identification.
The XHRA-2HPA offers 2 channels of high resolution USB audio for applications
that include DACs, headphone-amplifiers, USB headphones, docking solutions and
more.
PC
MAC USB
Android
USB
PHY
Isochronous
Endpoint
Handler
I2S
generation
GPI
Control
Endpoint
Handler
GPIO Control I2C
Figure 1:
XHRA-2HPA
GPIO
DSD
generation
dev
ctrl
P
I
N
M
U
X
I2S
DSD
S/PDIF
S/PDIF
generation
I2C
Key features of the XHRA-2HPA include:
· USB connectivity: USB Audio Class 2.0 or 1.0; low latency
· Digital audio connectivity: I2S, DSD and S/PDIF output
· Configurable I/O: HID, GPIO
· Configurable CODEC: I2C
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
2
3
XHRA-2HPA Features
· USB: 2 high resolution channels OUT
• PCM up to 384 KHz (44.1, 48, 88.2, 96, 176.4, 192, 352.8, 384) sample rates
• Asynchronous Isochronous transfer from host
• Native DSD, DoP64 and DoP128
· CODEC: I2S or DSD
• 16, 24, or 32 bit PCM
• DSD64 and DSD128
· Optional S/PDIF output
• Up to 192 KHz; 16/24 bit resoultion
· Flexible integration and control
• 8 GPIO for system control
• 8 GPI for HMI with optional HID inputs
• I2C master port for configuration and control
• Basic configuration through straps
• External flash for program code and advanced configuration
· Multiple OS support
• Windows
• Mac OS X
• Android
· Field upgrade capability
· Ambient Temperature Range
• Commercial qualification: 0 °C to 70 °C
· Power
• Bus/Self powered.
• Consumption: 400 mW.
· 64-pin TQFP package 0.5 mm pitch
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
MCLK
NC
NC
NC
NC
VDD
CLK
RST_N
VDD
VDDIO
PLLVSS
PLLVDD
VDD
GPI_5
GPI_4
GPI_3
63
62
61
60
59
58
57
56
55
54
53
52
51
50
49
Pin Configuration
64
3
4
LRCK
1 DSD_L
48
GPI_7
DOUT
2 DSD_R
47
GPI_2
VDDIO
3
46
GPI_6
BCLK
4 DSD_CLK
45
GPI_1
GPIO_4
5 S_SP_0 / S_DSD_128
44
VDDIO
GPIO_5
6 S_SP_1
43
GPI_0
GPIO_6
7
42
SPDIF
GPIO_7
8
41
VDD
VDD
9
40
VDD
VDD
10
39
VDD
SPI_CS_N
11
MCLK_SEL 38
GPIO_3
SPI_CLK
12
S_DSD_MODE 37
GPIO_2
VDDIO
13
S_USB_HOST 36
GPIO_1
NC
14
S_AUD_STRM 35
GPIO_0
SELF_PWR
15 QSPI_D0
34
VDDIO
NC
16
33
NC
X008627
27
28
29
30
31
32
SDATA
SCLK
NC
VDD
NC
23
USB_VBUS
USB_VDD
22
USB_VDD33
26
21
NC
USB_DM
20
VDD
25
19 QSPI_D3
HID_EN
USB_DP
18 QSPI_D2
384K_EN
USB_RTUNE 24
17 QSPI_D1
UAC1_SEL
GND
XHRA-2HPA
XHRA-2HPA Datasheet
4
5
Signal Description
This section lists the signals and I/O pins available on the XHRA-2HPA. Pins marked
ST have a Schmitt Trigger on their input. PU and PD refers to weak pull up and pull
down present on the pins.
Power pins (9)
Signal
Function
Type
GND
Digital ground
GND
Properties
PLLVDD
Analog PLL power
PWR
PLLVSS
Analog ground for PLL
PWR
USB_VDD
Digital core power
PWR
USB_VDD33
USB Analog power
PWR
VDD
Digital core power
PWR
VDDIO
Digital I/O power
PWR
Signal
Function
Type
BCLK
I2S serial bit clock;
Alternate function: DSD_CLK – DSD serial clock in
DSD mode
I/O
LRCK
I2S left right clock;
Alternate function: DSD_L – DSD left channel signal
in DSD mode
I/O
DOUT
I2S serial data out to DAC or CODEC;
Alternate function: DSD_R – DSD right channel data
signal in DSD mode
Output
SPDIF
S/PDIF transmitter output
Output
MCLK
Audio Master clock input – (24.576MHz and
22.5792MHz)
Input
Signal
Function
Type
Properties
SDATA
Master serial data (I2C interface)
I/O
PD
SCLK
Master clock output (I2C interface)
Output
PD
Signal
Function
Type
Properties
GPIO_0
Programmable I/O pin;
Default function: S_AUD_STRM – shows status of
Audio stream. High – Audio stream active, Low – No
audio stream
I/O
PD
Audio I/O pins (33)
Properties
Two wire configuration interface pins (2)
GPIO pins (8)
(continued)
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
6
Signal
Function
Type
Properties
GPIO_1
Programmable I/O pin;
Default function: S_USB_HOST – shows whether USB
host connected or not. High – Connected, Low – Not
connected
I/O
PD
GPIO_2
Programmable I/O pin;
Default function: S_DSD_MODE – shows whether
DSD mode is active or not. High – DSD mode, Low –
PCM mode
I/O
PD
GPIO_3
Programmable I/O pin;
Default function: MCLK_SEL – used to select
the audio master clock between 24.576MHz and
22.5792MHz to support different audio sample
rates
I/O
PD
GPIO_4
Programmable I/O pin;
Default function: S_SP_0 – in PCM mode it denotes
the currently active audio sample rate.
Alternate function: S_DSD_128 – in DSD mode it
denotes the DSD format. High – DSD128, Low –
DSD64
I/O
PD
GPIO_5
Programmable I/O pin;
Default function: S_SP_1 – in PCM mode it denotes
the currently active audio sample rate.
I/O
PD
GPIO_6
Programmable I/O pin
I/O
PD
GPIO_7
Programmable I/O pin
I/O
PD
Signal
Function
Type
Properties
GPI_0
Programmable input;
Alternate function: PLAY_PAUSE – HID play/pause
button input
Input
PD
GPI_1
Programmable input;
Alternate function: VOLP – HID volume up button
input
Input
PD
GPI_2
Programmable input;
Alternate function: VOLM – HID volume down button
input
Input
PD
GPI_3
Programmable input;
Alternate function: PREV – HID previous track select
button input
Input
PD
GPI_4
Programmable input;
Alternate funciton: NEXT – HID next track select
button input
Input
PD
GPI_5
Programmable input;
Alternate function: PREV – HID mute button input
Input
PD
GPI_6
Programmable input
Input
PD
GPI_7
Programmable input
Input
PD
GPI pins (8)
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
7
Configuration I/O pins (5)
Signal
Function
Type
Properties
SELF_PWR
Selects USB power option; Pull up – Self power;
Alternate function: QSPI_D0 – Data line of Quad-SPI
Input
PD
UAC1_SEL
Selects USB Audio Class 1.0 version; Pull up – UAC
1.0.
Alternate function: QSPI_D1 – Data line of Quad-SPI
Input
PD
384K_EN
Enables the 384KHz and 352.8KHz audio sample
rates; Pull up – Enable.
Alternate funciton: QSPI_D2 – Data line of Quad-SPI
Input
PD
HID_EN
Enables the HID button inputs on GPI pins; Pull up –
Enable.
Alternate function: QSPI_D3 – Data line of Quad-SPI
Input
PD
Signal
Function
Type
Properties
USB_DM
USB Serial Data Inverted
I/O
USB_DP
USB Serial Data
I/O
USB_RTUNE
USB resistor
I/O
USB_VBUS
USB Power Detect Pin
I/O
Signal
Function
Type
SPI_CS_N
SPI chip select line (Active low) for external flash
device.
Output
SPI_CLK
SPI clock
Output
QSPI_D0...D4
Four data lines of the Quad-SPI acting as alternate
functions of Configuration I/Os mentioned above
Inputs
Signal
Function
Type
Properties
CLK
PLL reference clock of 24MHz
Input
PD, ST
RST_N
Global reset input
Input
PU, ST
Signal
Function
Type
Properties
NC
No connection pins
Input
USB pins (5)
Quad-SPI serial flash interface pins (6)
Properties
System pins (2)
Reserved/NC pins (10)
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
8
Figure 2 shows the pin in relation to the block diagram.
64
5
26
SELF_PWR
UAC1_SEL
384K_EN
HID_EN
15
USB
PHY
25
24
23
Isochronous
Endpoint
Handler
43
I2S
generation
45
47
49
50
Control
Endpoint
Handler
51
46
48
DSD
generation
17
P
I
N
M
U
X
MCLK
LRCLK
DSD_L
DOUT
DSD_R
BCLK
DSD_CLK
1
2
4
42
S/PDIF
RST_N 57
58
CLK
SPI_CLK 12
11
SPI_CS
SDATA
SCLK
29
28
8
7
6
5
38
37
S/PDIF
generation
dev
ctrl
GPIO Control I2C
35
19
36
18
GPIO_0
GPIO_1
GPIO_2
GPIO_3
GPIO_4
GPIO_5
GPIO_6
GPIO_7
Figure 2:
Pins in
relation to
the block
diagram
USB_DM
USB_DP
USB_RTUNE
USB_VBUS
GPI_0
GPI_1
GPI_2
GPI_3
GPI_4
GPI_5
GPI_6
GPI_7
Example Application Diagram
Figure 3 shows a simplified schematic with the XHRA-2HPA device. The following
section discusses the individual parts of the system.
VDDIO
CSN
IO0
Flash IO1
IO2
IO3
CLK
USB
5V
Figure 3:
Simplified
Reference
Schematic
6
1V
IN Supply
Enable
Out
IN
3V3 Out
Supply
VDDIO
XHRA-2HPA GPIO_0
SPI_CS_N
SELF_PWR
UAC1_SEL
384K_EN
HID_EN
43.2 ohm SPI_CLK
USB_RTUNE
USB_DM
USB_DP
USB_VBUS
Reset
RST_N
supervisor
USB_VDD
VDD
PLLVDD
PLLVSS
1V
3V3
24 MHz
GPIO_1
GPIO_2
SDATA
SCLK
LRCK
DOUT
BCLK
CODEC
MCLK
24.576/
22.5792
GPIO_3
S/PDIF
D-type
GND
VDDIO
CLK
S/PDIF
out
Analog
Supply
Functional Description and System Components
The XHRA-2HPA streams 2-channel high resolution audio from a USB host to
a number of potential interfaces, including I2S/DSD and S/PDIF. An I2C bus is
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
9
included that can be used to tailor the device to a number of different operating
modes and system configurations.
The XHRA-2HPA needs to be provided with a clock and a Quad SPI flash. A CODEC
containing a DAC can be used to drive stereo line out. The external Quad SPI flash
is used to store the firmware and can also store configuration information. S/PDIF
output can be connected to a suitable optical/coaxial transmitter circuit.
The XHRA-2HPA drives the I2C bus at 100 KHz. Two external 3K3 resistors should
pull-up both SDA and SCLK lines. The configuration data can contain I2C commands
to configure external devices such as CODECs, DACs and clock generation ICs etc.
6.1
Clocks
Two clocks are required for the device.
· 24 MHz clock to clock the USB side. (CLK)
· Audio master clock for the asynchronous clocking mode. (MCLK)
If the master clock is fixed at 24.576 MHz, then only 48, 96, 192, and 384 KHz can
be supported; and the other frequencies should be disabled in the configuration
(byte 6, Appendix A.2). If the master clock is fixed at 22.5792 MHz, then only 44.1,
88.2, 176.4, and 352.8 KHz can be supported, and the other sample rates should
be disabled in the configuration (byte 6, Appendix A.2).
All sample rates can be supported if the master clock can switch between 24.576
MHz and 22.5792 MHz. This switch is controlled by GPIO_3 (MCLK_SEL) in default
case. If GPIO_3 is high then the master clock should run at 24.576 MHz; otherwise
it should run at 22.5792 MHz. If needed, GPIO_3 can be reassigned through the
flash configuration.
6.2
CODEC
By default, XHRA-2HPA can work with any codec that supports I2S and/or DSD. To
work with the default settings, the CODEC should expect:
· data transfer using I2S mode
· a master clock of 24.576 MHz for 48, 96, 192 (and 384) KHz sample rates
· a master clock of 22.5792 MHz for 44.1, 88.2, 176.4 (and 352.8) KHz sample
rates.
CODECs that are configurable over I2C can be configured by storing a series
of configuration sequences in the flash. These configuration sequences can,
for example, store an initialisation sequence, switch sample rates, or mute the
device. Similary, the CODEC reset line can be controlled by any GPIO through flash
configuration.
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
10
Example usage of CODECs is provided in the reference design platforms of XHRA2HPA . Please refer to Appendix D for more information on the associated reference
design platforms.
6.3
Flash
A Quad SPI flash memory with a minimum size of 1 MByte must be attached to the
device. The pins of the QSPI interface are shown in the Figure 4; the four data lines
are shared with configuration straps (see Appendix A).
Figure 4:
QSPI pins
Pin
Signal
Description
SPI_CS_N
SS
Slave Select
SELF_POWER
IO0
Data bit 0
UAC1_SEL
IO1
Data bit 1
384K_EN
IO2
Data bit 2
HID_EN
IO3
Data bit 3
SPI_CLK
SCLK
Clock
Customers must program the QSPI flash memory with the device firmware binary and any optional configuration information. Further information on the
XHRA-2HPA firmware binary is available at http://www.xmos.com/products/audio/
xcore-audio-hi-res-2.
The XHRA-2HPA device reads from the flash during booting. It expects each byte to
be transferred with the least-significant nibble first. The programming tool which
flashes the QSPI memory must make sure that the least significant nibble of a byte
is transferred first. It should also ensure that the Quad SPI mode is enabled in the
status register.
Figure 5 shows the list of currently supported Quad-SPI flash devices.
Figure 5:
Supported
Quad-SPI
flash devices
Vendor
Device Part Number
Spansion
S25FL116K
Spansion
S25FL132K
Spansion
S25FL164K
ISSI
IS25LQ080B
ISSI
IS25LQ016B
ISSI
IS25LQ032B
6.4
Configuration information
Configuration information is stored in the flash. This includes information such
as the USB Vendor and Product Identification (VID/PID), serial number, and GPIO
assignment. This is detailed in Appendix A.2. Basic configurations can be created
by strapping IO pins, see Appendix A.1.
If no configuration information is found in the flash, the XHRA-2HPA device will
use default values.
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
6.5
11
S/PDIF output (optional)
The device generates S/PDIF output. This can be connected to either an optical
transmitter, or to a coaxial driver. If S/PDIF output is used, then the signal should
first be fed through a D-type flip flop in order to synchronise the S/PDIF signal to
the master-clock.
7
Board Integration
This section details the guidelines to be followed in designing a PCB with XHRA2HPA device.
7.1
USB connections
USB_VBUS should be connected to the VBUS pin of the USB connector. A 2.2 uF
capacitor to ground is required on the VBUS pin. A ferrite bead may be used to
reduce HF noise.
For self-powered systems, a bleeder resistor may be required to stop VBUS from
floating when no USB cable is attached.
USB_DP and USB_DN should be connected to the USB connector.
7.2
USB signal routing and placement
The USB_DP and USB_DN lines are the positive and negative data polarities of a
high speed USB signal respectively. Their high-speed differential nature implies
that they must be coupled and properly isolated. The board design must ensure
that the board traces for USB_DP and USB_DN are tightly length matched. In
addition, according to the USB 2.0 specification, the USB_DP and USB_DN differential
impedance must be 90 Ω.
Figure 6:
USB trace
separation
showing a
low speed
signal, two
differential
pairs and a
high-speed
clock
Low-speed
non-periodic
signal
20 mils
(0.51mm)
7.2.1
USB_DP0
USB_DN0
3.9 mils
(0.10mm)
USB_DP1
20 mils
(0.51mm)
High-speed
periodic
signal
USB_DN1
3.9 mils
(0.10mm - calculated
on the stack up)
50 mils
(1.27mm)
General routing and placement guidelines
The following guidelines will help to avoid signal quality and EMI problems on high
speed USB designs. They relate to a four-layer (Signal, GND, Power, Signal) PCB.
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
12
0.12 mm
0.10 mm
USB_DP
0.12 mm
USB_DN
0.1 mm
GND
1.0 mm
FR4 Dielectric
Power
Figure 7:
Example USB
board stack
0.1 mm
For best results, most of the routing should be done on the top layer (assuming
the USB connector and XHRA-2HPA are on the top layer) closest to GND. Reference
planes should be below the transmission lines in order to maintain control of the
trace impedance.
We recommend that the high-speed clock and high-speed USB differential pairs are
routed first before any other routing. When routing high speed USB signals, the
following guidelines should be followed:
· High speed differential pairs should be routed together.
· High-speed USB signal pair traces should be trace-length matched. Maximum
trace-length mismatch should be no greater than 4mm.
· Ensure that high speed signals (clocks, USB differential pairs) are routed as far
away from off-board connectors as possible.
· High-speed clock and periodic signal traces that run parallel should be at least
1.27mm away from USB_DP/USB_DN (see Figure 6).
· Low-speed and non-periodic signal traces that run parallel should be at least
0.5mm away from USB_DP/USB_DN (see Figure 6).
· Route high speed USB signals on the top of the PCB wherever possible.
· Route high speed USB traces over continuous power planes, with no breaks. If a
trade-off must be made, changing signal layers is preferable to crossing plane
splits.
· Follow the 20 × h rule; keep traces 20 × h (the height above the power plane)
away from the edge of the power plane.
· Use a minimum of vias in high speed USB traces.
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· Avoid corners in the trace. Where necessary, rather than turning through a 90
degree angle, use two 45 degree turns or an arc.
· DO NOT route USB traces near clock sources, clocked circuits or magnetic
devices.
· Avoid stubs on high speed USB signals.
7.3
Power supplies
The device has the following power supply pins:
· VDD pins for the digital core, including a USB_VDD pin that powers the USB PHY
· VDDIO pins for the I/O lines
· PLLVDD pins for the PLL
· A USB_VDD33 pin for the analogue supply to the USB-PHY
Several pins of each type are provided to minimize the effect of inductance within
the package, all of which must be connected. The power supplies must be brought
up monotonically and input voltages must not exceed specification at any time.
The VDD supply must ramp from 0 V to its final value within 10 ms to ensure
correct startup.
The VDDIO supply must ramp to its final value before VDD reaches 0.4 V.
The PLLVDD supply should be separated from the other noisier supplies on the
board. The PLL requires a very clean power supply, and a low pass filter (for
example, a 4.7 Ω resistor and 100 nF multi-layer ceramic capacitor) is recommended
on this pin.
The following ground pins are provided:
· PLLVSS for PLLVDD
· GND for all other supplies
All ground pins must be connected directly to the board ground.
The VDD and VDDIO supplies should be decoupled close to the chip by several
100 nF low inductance multi-layer ceramic capacitors between the supplies and
GND (for example, 4x100nF 0402 low inductance MLCCs per supply rail). The
ground side of the decoupling capacitors should have as short a path back to the
GND pins as possible. A bulk decoupling capacitor of at least 10 uF should be
placed on each of these supplies.
RST_N is an active-low asynchronous-assertion global reset signal. Following a
reset, the PLL re-establishes lock after which the device boots up.RST_N must be
asserted low during and after power up for 100 ns.
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7.4
14
Land patterns and solder stencils
The land pattern recommendations in this document are based on a RoHS compliant
process and derived, where possible, from the nominal Generic Requirements for
Surface Mount Design and Land Pattern Standards IPC-7351B specifications. This
standard aims to achieve desired targets of heel, toe and side fillets for solderjoints.
Solder paste and ground via recommendations are based on our engineering and
development kit board production. They have been found to work and optimized
as appropriate to achieve a high yield. The size, type and number of vias used in
the center pad affects how much solder wicks down the vias during reflow. This in
turn, along with solder paster coverage, affects the final assembled package height.
These factors should be taken into account during design and manufacturing of
the PCB.
The following land patterns and solder paste contains recommendations. Final land
pattern and solder paste decisions are the responsibility of the customer. These
should be tuned during manufacture to suit the manufacturing process.
The package is a 64 pin Thin Quad Flat Pack package with exposed heat slug on a
0.5mm pitch. An example land pattern is shown in Figure 8.
9.76
5.31
0.50
5.31
9.76
0.28
Figure 8:
Example land
pattern
1.60
For the 64 pin TQFP package, a 3x3 array of squares for solder paste is recommended as shown in Figure 9. This gives a paste level of 48%.
7.5
Ground and Thermal Vias
Vias under the heat slug into the ground plane of the PCB are recommended for a
low inductance ground connection and good thermal performance. A 3 x 3 grid of
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15
5.31
1.635
1.23
Figure 9:
Solder stencil
for centre
pad
5.31
1.23
vias, with a 0.6mm diameter annular ring and a 0.3mm drill, equally spaced across
the heat slug, would be suitable.
7.6
Moisture Sensitivity
XMOS devices are, like all semiconductor devices, susceptible to moisture absorption. When removed from the sealed packaging, the devices slowly absorb moisture
from the surrounding environment. If the level of moisture present in the device
is too high during reflow, damage can occur due to the increased internal vapour
pressure of moisture. Example damage can include bond wire damage, die lifting,
internal or external package cracks and/or delamination.
All XMOS devices are Moisture Sensitivity Level (MSL) 3 - devices have a shelf life
of 168 hours between removal from the packaging and reflow, provided they
are stored below 30C and 60% RH. If devices have exceeded these values or an
included moisture indicator card shows excessive levels of moisture, then the parts
should be baked as appropriate before use. This is based on information from Joint
IPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For Nonhermetic
Solid State Surface-Mount Devices J-STD-020 Revision D.
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16
Example XHRA-2HPA Board Designs
An example layout is shown in Figure 10.
Figure 10:
Example
layout,
showing a
4-layer PCB
layout of the
part, from
top to
bottom
It is essential to place decouplers close to the device. In the layout shown in
Figure 10, power is supplied on VDD and VDDIO through a decoupler located very
close to the pin, with power supplied through a via underneath the device.
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9
17
DC and Switching Characteristics
9.1
Figure 11:
Operating
conditions
Symbol
Parameter
MIN
TYP
MAX
UNITS
VDD
Tile DC supply voltage
0.95
1.00
1.05
V
VDDIOL
I/O supply voltage
3.135
3.30
3.465
V
VDDIOR
I/O supply voltage
3.135
3.30
3.465
V
USB_VDD
USB tile DC supply voltage
0.95
1.00
1.05
V
VDD33
Peripheral supply
3.135
3.30
3.465
V
PLL_AVDD
PLL analog supply
0.95
1.00
1.05
V
Cl
xCORE Tile I/O load
capacitance
Ta
Ambient operating
temperature
Tj
Junction temperature
Tstg
Storage temperature
9.2
Figure 12:
DC characteristics
A
B
C
D
X008627
25
pF
0
70
°C
125
°C
-65
150
°C
Notes
DC Characteristics
Symbol
Parameter
MIN
MAX
UNITS
Notes
V(IH)
Input high voltage
2.00
3.60
V
A
V(IL)
Input low voltage
-0.30
0.70
V
A
V(OH)
Output high voltage
V
B, C
V(OL)
Output low voltage
V
B, C
I(PU)
Internal pull-up current (Vin=0V)
µA
D
I(PD)
Internal pull-down current
(Vin=3.3V)
100
µA
D
I(LC)
TYP
Input leakage current
10
µA
2.20
0.40
-100
-10
All pins except power supply pins.
All general-purpose I/Os are nominal 4 mA.
Measured with 4 mA drivers sourcing 4 mA, 8 mA drivers sourcing 8 mA.
Used to guarantee logic state for an I/O when high impedance. The internal pull-ups/pull-downs
should not be used to pull external circuitry. In order to pull the pin to the opposite state, a 4K7
resistor is recommended to overome the internal pull current.
9.3
Figure 13:
ESD stress
voltage
Operating Conditions
ESD Stress Voltage
Symbol
Parameter
HBM
Human body model
CDM
Charged Device Model
MAX
UNITS
-2.00
MIN
TYP
2.00
KV
-500
500
Notes
V
XHRA-2HPA
XHRA-2HPA Datasheet
9.4
Figure 14:
Reset timing
18
Reset Timing
Symbol
Parameters
MIN
T(RST)
Reset pulse width
5
T(INIT)
Initialization time
TYP
MAX
UNITS
Notes
µs
150
µs
A
A Shows the time taken to start booting after RST_N has gone high.
9.5
Figure 15:
xCORE Tile
currents
Power Consumption
Symbol
Parameter
I(DDCQ)
Quiescent VDD current
PD
Tile power dissipation
IDD
MIN TYP MAX
UNITS
Notes
45
mA
A, B, C
325
µW/MIPS
A, D, E, F
Active VDD current
170 375
mA
A, G, H
I(ADDPLL)
PLL_AVDD current
5
mA
I
I(VDD33)
VDD33 current
26.7
mA
J
I(USB_VDD)
USB_VDD current
8.27
mA
K
7
A
B
C
D
E
F
G
Use for budgetary purposes only.
Assumes typical tile and I/O voltages with no switching activity.
Includes PLL current.
Assumes typical tile and I/O voltages with nominal switching activity.
Assumes 1 MHz = 1 MIPS.
PD(TYP) value is the usage power consumption under typical operating conditions.
Measurement conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 500 MHz, average device resource
usage.
H Typical application and conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 500 MHz, USB Audio stereo
out @ 192 kHz.
I PLL_AVDD = 1.0 V
J HS mode transmitting while driving all 0’s data (constant JKJK on DP/DM). Loading of 10 pF.
Transfers do not include any interpacket delay.
K HS receive mode; no traffic.
9.6
Figure 16:
Clock
Clock
Symbol
Parameter
MIN
TYP
MAX
UNITS
f
Frequency
9
24
25
MHz
Notes
SR
Slew rate
0.10
TJ(LT)
Long term jitter (pk-pk)
2
%
A
f(MAX)
Processor clock frequency
500
MHz
B
V/ns
A Percentage of CLK period.
B Assumes typical tile and I/O voltages with nominal activity.
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Package Information
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20
Part Marking
HPA - Product family
O - Number of output channels
I - Number of input channels
T - Temperature grade
HPAOIT
MCYYWWXX
Figure 17:
Part marking
scheme
11
Wafer lot code
Ordering Information
Figure 18:
Orderable
part numbers
12
LLLLLL.LL
MC - Manufacturer
YYWW - Date
XX - Reserved
Product Code
XHRA-2HPA-TQ64-C
Marking
HPA20C
Qualification
Commercial
Channels
2 OUT
Host Driver Support
XHRA-2HPA enumerates as USB Audio Class 2.0/1.0 compliant device in the host
machine and requires a Audio Class compliant driver for its operation. USB Audio
Class 2.0 and 1.0 are natively supported in Apple OSX (UAC 2.0 since OSX 10.6.4
version) and therefore doesn’t need a driver installation. Windows operating
systems do not natively support Audio Class 2.0 and hence require third party
drivers to be installed. XMOS therefore provides a free Windows USB Audio driver
for evaluation and prototyping and also a path to a more feature-rich production
driver from Thesycon.
12.1
Windows Evaluation Driver
The Evaluation Driver is a fully featured evaluation version of the Thesycon
‘TUSBAudio’ USB Audio 2.0 Class Driver for Windows. It is available as a free
download from xmos.com for evaluation and prototyping purposes only. The
driver is locked to the default VID and PID of the XHRA-2HPA device and works
with Windows XP, Vista, 7, 8 and 8.1 (32 and 64bit).
Note: For more information please refer to ’Thesycon Driver’ section in the USB
2.0 Driver for Windows document.
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21
XMOS Stereo Driver for Production
The XMOS Stereo Driver is based on the Thesycon ’TUSBAudio’ USB Audio 2.0 Class
Driver for Windows and is available free-of-charge to qualified XMOS customers for
prototyping and production runs of up to 10,000 units.
The XMOS USB Audio 2.0 Stereo Driver uses the XMOS USB VendorID (VID) and an
XMOS assigned customer ProductID (PID). For more information please refer to
’XMOS Stereo Driver’ section in the USB 2.0 Driver for Windows document.
13
Apple MFi compatibility
XHRA-2HPA can operate with Apple iPod, iPhone, and iPad devices that feature USB
host support. Information regarding this functionality is protected by the Made For
iPod (MFi) program and associated licensing.
Please contact XMOS for details and further documentation.
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Appendices
A
Configuration
The system is configured through one of two mechanisms:
· a limited number of straps or
· the flash that contains configuration information.
Flash configuration overwrites all strap options.
A.1
Configuration straps
There are four pins that can used to configure basic functionality. To select a
function, the pin must be pulled to VDDIO with a 3.3K resistor. Do not strap the
pin directly to VDDIO.
The straps are not required if the configuration information is stored in flash.
The straps have the following meanings:
· SELF_PWR. If this is selected, the device will be self-powered. By default, the
device will advertise itself as bus-powered. Select this function if you have an
external power-supply.
· UAC1_SEL. If this is selected, the device will advertise as a USB-Audio class 1.0
device instead of Audio class 2.0. This makes the device operate with reduced
set of features, i.e. USB in full speed mode, audio sampling rates of upto 96KHz
only and no DFU support.
· 384K_EN. If this is selected, the device will enable 384 KHz and 352.8 KHz audio
sample rates (in addition to the other lower sample rates).
· HID_EN. If this is selected, the device will take HID audio control inputs over the
GPI pins.
If no configuration straps are used, and there is no information in flash, then the
device will configure to:
· Bus-powered (ie, VBUS should power 1V and 3V3)
· Up to 192 KHz sample rate only.
· USB Audio class 2.0.
· HID inputs disabled.
This is a useful default for applications like a headphone amplifier.
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23
Flash Configuration
Configuration can be stored in the QSPI flash. Byte 0 of the configuration is stored
in address 0x80000. At most 2048 bytes of configuration can be stored. Presence
of configuration data in flash is identified by length bytes and marker bytes at the
beginning of the configuration section. If no configuration is found during the
booting of the device, then the strap values combined with default values will be
used for the operation.
The parameters that can be configured in flash are described in the remainder of
this section.
Note: Configuration section starts at address 0x80000 of the QSPI flash memory.
A.2.1
Bytes 0..18
· Bytes 0 and 1: Length of the configuration section in bytes excluding these
length bytes. (stored LSB first)
· Byte 2 and 3: Marker bytes. Must store 0xA5,0x00.
· Bytes 4 and 5: USB VID: this is the Vendor ID of your company as registered
with USB (stored LSB first)
· Bytes 6 and 7: USB PID: this is the Product ID of this product as identified by
your company (stored LSB first).
· Byte 8: USB Maximum power in units of 2mA. Default is 0xFA i.e., 500mA
· Byte 9: stores four flags that are used instead of the straps (see the previous
section for the complete definition of each bit):
· bit 0: SELF_PWR.
· bit 1: UAC1_SEL
· bit 2: 384K_EN
· bit 3: HID_EN
· bits 4-7: reserved, store 0
· Byte 10: stores two bit flags that configure the I2S format. By default, I2S comes
up in I2S default mode (that is, the data is one clock later than the LRCLK), but it
can be configured to use left aligned mode or right aligned mode instead. At
most one of bit 0 or 1 should be set:
· bit 0: Select left aligned mode.
· bit 1: Select right aligned mode.
· Byte 11: stores eight flags that configure which sample rates are supported. At
least 1 bit should be set:
· bit 0: 48 KHz supported
· bit 1: 96 KHz supported
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· bit 2: 192 KHz supported
· bit 3: 384 KHz supported (ignored if bit 2 of Byte 9 is 0)
· bit 4: 44.1 KHz supported
· bit 5: 88.2 KHz supported
· bit 6: 176.4 KHz supported
· bit 7: 352.8 KHz supported (ignored if bit 2 of Byte 9 is 0)
· Bytes 12-19: Reserved, store 0x00.
A.2.2
Byte 20 and further
From byte 20 onwards the USB strings are stored following one after the other:
· The Vendor/Manufacturer String, the name of your company.
· The Product String, the name of the product.
· The Serial number String, the serial number of the product.
All strings are stored as a length byte followed by the string itself as unicode
characters in UTF-16LE format. The length byte counts the number of bytes used
for the string. Near the end of this section, we will show some examples, and how
to build unicode strings.
The strings are followed by bytes specifying the Language ID as described by
USB.org, for example it is 0x0409 for English and it is stored with LSB first.
Immediately after the Language ID follows a stream of bytes that describe events
and associated I2C write-commands or GPIO commands that can be used to
configure external hardware, CODECs, etc. An event refers to an asynchronous
change in the system like sample frequency change, USB connected/disconnected
etc.
Each section comprises an EVENT (a byte with a value in the range 0x00 to 0x7E
called event ID) followed by one or more COMMANDs. A COMMAND can be a
single byte GPIO command, single byte sleep command or a three-byte I2C write
command.
· GPIO commands will pull a specific GPIO pin high or low.
· Sleep command enables to provide delay inbetween command execution.
· I2C commands comprise an I2C bus-address, an I2C register number, and an
I2C register value; these three bytes will be sent over the I2C bus at 100 KHz.
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A.2.3
25
Events
Figure 19 shows the different possible events and their IDs:
Figure 19:
Event IDs
X008627
Event ID
Description
0x00
48 KHz selected
0x02
96 KHz selected
0x04
192 KHz selected
0x06
384 KHz selected
0x08
44.1 KHz selected
0x0A
88.2 KHz selected
0x0C
176.4 KHz selected
0x0E
352.8 KHz selected
0x14
Audio streaming started
0x16
Audio streaming stopped
0x18
Initialisation event (called once at the beginning)
0x1A
USB connected
0x1C
USB disconnected
0x1E
DSD mode selected
0x20
PCM mode selected
0x22
DSD128 selected
0x24
DSD64 selected
0xFE
No more events (used to terminate the sequence)
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XHRA-2HPA Datasheet
A.2.4
26
Commands
The one-byte GPIO and Sleep commands supported are listed in Figure 20.
Figure 20:
Command
IDs
Command ID
Description
0xD0
Set GPIO 0 low.
0xD2
Set GPIO 1 low.
0xD4
Set GPIO 2 low.
0xD6
Set GPIO 3 low.
0xD8
Set GPIO 4 low.
0xDA
Set GPIO 5 low.
0xDC
Set GPIO 6 low.
0xDE
Set GPIO 7 low.
0xE0
Set GPIO 0 high.
0xE2
Set GPIO 1 high.
0xE4
Set GPIO 2 high.
0xE6
Set GPIO 3 high.
0xE8
Set GPIO 4 high.
0xEA
Set GPIO 5 high.
0xEC
Set GPIO 6 high.
0xEE
Set GPIO 7 high.
0xF0
Sleep 1 ms.
0xF2
Sleep 10 ms.
0xF4
Sleep 100 ms.
The three-byte I2C write commands supported are:
· 0bAAAA AAA1, 0xRR, 0xVV: where
· AAAAAAA are the I2C address bits (7 bits),
· 0xRR is the register number,
· 0xVV is the register value.
A.2.5
Example
For example, let us consider the following byte sequence is the configuration.
0x34, 0x00, 0xA5, 0x00
0x33, 0x71, 0xDE, 0xAD, 0xFA, 0x00,
0x00, 0xFF, 0x00, 0x00, 0x00, 0x00,
0x00, 0x00, 0x00, 0x00,
0x08, 0x00, 0x58, 0x00, 0x4D, 0x00, 0x4F, 0x00, 0x53,
0x08, 0x00, 0x78, 0x00, 0x48, 0x00, 0x52, 0x00, 0x41,
0x04, 0x00, 0x31, 0x00, 0x30, 0x09, 0x04,
0x14, 0xE2, 0x00, 0x11, 0x56, 0x00, 0xEE, 0xDC,
0xFE
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The above bytes in flash means:
· 0x34, 0x00: Length field denoting (0x0034) 52 bytes in configuration.
· 0xA5,0x00: Marker bytes.
· 0x33 0x71: VID 0x7133 (two bytes at address 4 and 5)
· 0xDE 0xAD: PID 0xADDE (two bytes at address 6 and 7)
· 0xFA: USB power - 500mA (one byte at address 8)
· 0x00: Straps all low: i.e., self powered, UAC 2.0, No 384 KHz and HID inputs
disabled. (byte at address 9)
· 0x00: Use default I2S mode. (byte at address 10)
· 0xFF: Enable all sample rates (byte at address 11)
· 0x00 0x00 0x00 0x00 0x00 0x00 0x00 0x00: Reserved bytes (bytes 12..19)
· 0x08 0x58 0x00 0x4D 0x00 0x4F 0x00 0x53 0x00:
Vendor string, uses 8 bytes (0x08),
0x58 0x00 (‘X’), 0x4D 0x00 (‘M’), 0x4F 0x00 (‘O’), 0x53 0x00 (‘S’),
forms the string “XMOS”.
· 0x08 0x78 0x00 0x48 0x00 0x52 0x00 0x41 0x00:
Product string, uses 8 bytes (0x08),
0x78 0x00 (‘x’), 0x48 0x00 (‘H’), 0x52 0x00 (‘R’), 0x41 0x00 (‘A’)
forms the string “xHRA”.
· 0x04 0x31 0x00 0x30 0x00:
Serial number string, uses 4 bytes (0x04),
the unicode characters are 0x31 0x00 (‘1’) and 0x30 0x00 (‘0’), forming the
string “10”.
· 0x09 0x04: Language ID 0x0409 corresponds to “English (United States)”.
· 0x14: If Audio stream is started (event).
· 0xE2: Set GPIO 1 High (command).
· 0x00: If 48 KHz sample rate is selected (event)
· 0x11 0x56 0x00: Write the value 0x00 to register 0x56 of I2C device 0x11
(Device address 0x10, with write bit (LSB) set).
· 0xEE: Set GPIO 7 High.
· 0xDC: Set GPIO 6 Low.
· 0xFE: No more events
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A.2.6
28
Default behaviour
If no flash configuration is present, the following default values are used:
· The VID defaults to the XMOS vendor ID, 0x20B1.
· The PID defaults to a value that depends on the device part.
· The vendor string defaults to “XMOS”
· The product string defaults to a value that depends on the device part.
· The serial number defaults to none.
In addition to this, there is a default set of events that are used if there is no flash
configuration found.
· 0x14 0xE0: if audio stream started, set GPIO 0 high.
· 0x16 0xD0: if audio stream stopped, set GPIO 0 low.
· 0x1A 0xE4: if USB connected, set GPIO 1 high.
· 0x1C 0xD4: if USB disconnected, set GPIO 1 low.
· 0x1E 0xE4: if DSD mode selected, set GPIO 2 high.
· 0x20 0xD4: if PCM mode selected, set GPIO 2 low.
· 0x00 0xE6 0xD8 0xDA:
if 48 KHz selected, set GPIO 3 high, GPIO 4 low, GPIO 5 low.
· 0x02 0xE6 0xE8 0xDA:
if 96 KHz selected, set GPIO 3 high, GPIO 4 high, GPIO 5 low.
· 0x04 0xE6 0xD8 0xEA:
if 192 KHz selected, set GPIO 3 high, GPIO 4 low, GPIO 5 high.
· 0x06 0xE6 0xE8 0xEA:
if 384 KHz selected, set GPIO 3 high, GPIO 4 high, GPIO 5 high.
· 0x08 0xD6 0xD8 0xDA:
if 44.1 KHz selected, set GPIO 3 low, GPIO 4 low, GPIO 5 low.
· 0x0A 0xD6 0xE8 0xDA:
if 88.2 KHz selected, set GPIO 3 low, GPIO 4 high, GPIO 5 low.
· 0x0C 0xD6 0xD8 0xEA:
if 176.4 KHz selected, set GPIO 3 low, GPIO 4 low, GPIO 5 high.
· 0x0E 0xD6 0xE8 0xEA:
if 352.8 KHz selected, set GPIO 3 low, GPIO 4 high, GPIO 5 high.
· 0xFE: No more events
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These are disabled when any event is present in the flash, and should hence be
added to flash if this behaviour is expected.
Figure 21 shows the GPIO state changes corresponding to the sample rate change
events.
Active Sample rate
Figure 21:
Sample rate
encoding
X008627
GPIO_3
GPIO_5
GPIO_4
(MCLK_SEL)
(S_SP_1)
(S_SP_0)
48 KHz
1
0
0
96 KHz
1
0
1
192 KHz
1
1
0
384 KHz
1
1
1
44.1 KHz
0
0
0
88.2 KHz
0
0
1
176.4 KHz
0
1
0
352.8 KHz
0
1
1
In DSD mode
DSD64
0
X
0
DSD128
0
X
1
XHRA-2HPA
XHRA-2HPA Datasheet
B
30
Schematics Design Check List
This section is a checklist for use by schematics designers using the
XHRA-2HPA. Each of the following sections contains items to check for
each design.
B.1
Power supplies
VDDIO supply is within specification before the VDD (core) supply is
turned on. Specifically, the VDDIO supply is within specification before
VDD (core) reaches 0.4V (Section 7.3).
The VDD supply ramps monotonically (rises constantly) from 0V to its
final value (0.95V - 1.05V) within 10ms (Section 7.3).
The VDD supply is capable of supplying 300 mA (Section 7.3).
PLLVDD is filtered with a low pass filter, for example an RC filter, see
.
Section 7.3
B.2
Power supply decoupling
The design has multiple decoupling capacitors per supply, for example
at least four 0402 or 0603 size surface mount capacitors of 100nF in
value, per supply (Section 7.3).
A bulk decoupling capacitor of at least 10uF is placed on each supply
(Section 7.3).
B.3
Power on reset
The RST_N pin is asserted (low) during or after power up. The device
is not used until this reset has taken place. A voltage supervisor type
reset device is recommended to guarantee a good reset. This also has
the benefit of resetting the system should the relevant supply go out
of specification.
B.4
Clock
The CLK input pin is supplied with a clock with monotonic rising edges
and low jitter.
B.5
QSPI Flash
Customers must store the firmware in the QSPI Flash with any additional configuration data required to modify the default behavior
(Section 6.3).
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XHRA-2HPA
XHRA-2HPA Datasheet
C
31
PCB Layout Design Check List
This section is a checklist for use by PCB designers using the XHRA2HPA. Each of the following sections contains items to check for each
design.
C.1
Ground Plane
Multiple vias (eg, 9) have been used to connect the center pad to the
PCB ground plane. These minimize impedance and conduct heat away
from the device. (Section 7.5).
Other than ground vias, there are no (or only a few) vias underneath
or closely around the device. This create a good, solid, ground plane.
C.2
Power supply decoupling
The decoupling capacitors are all placed close to a supply pin (Section 7.3).
The decoupling capacitors are spaced around the device (Section 7.3).
The ground side of each decoupling capacitor has a direct path back
to the center ground of the device.
C.3
PLLVDD
The PLLVDD filter (especially the capacitor) is placed close to the
PLLVDD pin (Section 7.3).
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XHRA-2HPA
XHRA-2HPA Datasheet
D
32
Associated Design Documentation
Document Title
Information
Document Number
xCORE-AUDIO HiRes-2 DAC/HPA
Reference Platform Hardware Manual
Reference design manual
X3357
X008627
XHRA-2HPA
XHRA-2HPA Datasheet
E
33
Revision History
Date
Description
2015-05-01
Preliminary release
2015-05-19
Updated configuration and block diagram
2015-07-03
Added supported QSPI flash devices and minor text changes
2015-07-09
Updated DC characterisitcs
2015-09-03
Updated ordering information, part marking and clock (Section: 9.6) details
2015-10-19
Removed reference to iOS - not supported
2016-11-03
Updated QSPI Flash / configuration data requirements 6.3
Copyright © 2016, All Rights Reserved.
Xmos Ltd. is the owner or licensee of this design, code, or Information (collectively, the “Information”) and
is providing it to you “AS IS” with no warranty of any kind, express or implied and shall have no liability in
relation to its use. Xmos Ltd. makes no representation that the Information, or any particular implementation
thereof, is or will be free from any claims of infringement and again, shall have no liability in relation to any
such claims.
X008627
XHRA-2HPA
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