TflexTM 300 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high
rate of compliancy allows the material to “totally blanket” the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With
a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures.
Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.
Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner
offers a guaranteed dielectric barrier, and easier part handling for mass production.
FEATURES AND BENEFITS
• Extreme compliancy allows material to “totally blanket” component(s)
• Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
• Low compression set enables the pad to be reused many times
APPLICATIONS
• Notebook and desktop computers
• Telecommunication hardware
• Flat panel displays
• Memory modules
• Power conversion equipment
• Set top box
• Lighting ballast
• Automotive electronics
• LED lighting
• Handheld electronics
• Optical disk drives
• Vibration dampening
global solutions: local support
Americas: +1.888.246.9050
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
TM
TflexTM 300 Series
Thermal Gap Filler
Innovative Technology
for a Connected World
TFLEXTM 300 TYPICAL PROPERTIES
TEST METHOD
Color
Thermal Conductivity
Hardness (Shore 00)
Density
Thickness Range
Filled silicone
elastomer
NA
Light green
Visual
1.2 W/mK
27
(at 3 second delay)
ASTM D5470
1.78 g/cc
ASTM D2240
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
340
360
380
3100
3150
3200
10
20
30
40
50
60
70
80
90
100 110
P re ssure psi
0.020" - .200"
(0.5 - 5.0mm)*
P res s ure
v s Deflec
tion
(A S T M
D575) 3100
330
340
360
380
Thickness Tolerance
±10%
UL Flammability Rating
94 V0
UL
Temperature Range
-40ºC to 160ºC
NA
Volume Resistivity
10 ^13 ohm-cm
ASTEM D257
Outgassing TML
0.56%
ASTM E595
Outgassing CVCM
0.10%
ASTM E595
600 ppm/C
IPC-TM-650
2.4.24
Coefficient Thermal
Expansion (CTE)
330
Helium
Pyncometer
P erc ent Deflec tion
Construction
T herm al
R es s itanc e
in 2 /W
320
P res s ure v s . thermal res is tanc e (AS T M
D 5470)
⁰
C-
TFLEXTM 300
320
3150
90%
80%
70%
60%
50%
40%
30%
20%
10%
0%
0
3200
10
20
30
40
50
60
P re ssure psi
70
80
90
100
110
STANDARD THICKNESSES
0.020 to 0.200-inch (0.5 to 5.0mm)*
0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments
0.250-inch (6.4 mm) also available with TG liner option only.
*Inquire about availability of material and options above 0.200-inches
OPTIONS
Tgard™ “TG” dielectric barrier available to aid in handling and PET dielectric “H” liner available for applications where easy slide assembly is desirable
MATERIAL NAME AND THICKNESS
EXAMPLES
Tflex™ indicates elastomeric gap filler product line
3xxx indicates high recovery ‘3 series’ 1.2 W/mK material
-DC1 designates proprietary tack eliminated coating
-TG indicates Tgard™ liner option
-H indicates hard PET liner option
Tflex™ 3120 = standard 0.120-inch thick Tflex™ 300 material
Tflex™ 3120DC1 = 0.120-inch thick material with DC1 coating
Tflex™ 3120TG = 0.120-inch thick material with Tgard™ liner
Tflex™ 3120H = 0.120-inch thick material with hard PET liner
THR-DS-TFLEX-300 1010
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility
for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall
not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in
effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the
property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A15293-00 Rev D, 10/2009.
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