PCM20B-300X400X0.18

PCM20 Phase Change Material Features Naturally tacky and easy to use Low thermal resistance Long term reliability Good thermal conductivity Customized parts Maximize the contact area between surfaces Applications Electronic components: IC / CPU / MOS LED/ M/B/ P/S/ Heat Sink/ LCD-TV/ NotebookPC/ PC/ TelecomDevice/ Wireless Hub etc.... Thermal Conductivity 1 ~ 2.5 W/m.K DDR II Module / DVD Applications / Hand-Set applications etc... REACH Compliant RoHS Compliant PCM20 phase-change thermal interface materials) are desinged to fill air gaps and voids between the heatgenerator and heatsinks, while at the same time displacing entrapped air between power dissipating components. The performance of the heat sink benefits a lot from the low heat resistance while improving the microprocessor performance, DC- DC converter of memory module and the reliability of power module. PCM20 characteristics: -At room temperature, PCM20 materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. -once the temperature reaches to the phase change temperature, the pad will fully change phase and attain minimum bond-line thickness and maximum surface wetting. This results in practically no thermal contact resistance due to a very small thermal resistance path. -These property results in PCM20 material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces. The material is nonconductive, however, as the material has endured the phase change at high temperature, may make the metal get to the metal, so the phase change interface material cannot be used as electrical insulating material PCM20 Property Unit PCM20G Colour PCM20B Gray Black Thermal conductivity Phase Changing Temperature Density Thickness Storage temp Operating Temperature Shelf life PCM20Y Pink Yellow 0.03 0.05 0.05 2.5 1.0 1.0 50～60 50～60 50～60 2.2 1.3 1.35 0.09 0.127 0.127 ＜40 ＜40 ＜45 ＜45 -45～125 -45～125 -45～125 -45～125 Carrier Thermal impedance PCM20P Aluminum foil ℃in2/w W/m·K ℃ g/cm2 mm ℃ ℃ Month 0.035 2 50～60 1.2 0.076/0.127 12 24 12 12 Available with an adhesive backing 1. 2. 3. 4. Part Number Size X-Y-Z Adhesivebacking – 0-None, 1A-one side, 2A-two sides Quantity Tel:+442081332062 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology