430039-501

OptoTEC™ Series HOT20-31-F2A-0909 Thermoelectric Module Note: This product has reached end of production and is available on a limited basis only. This product series has been replaced with the improved HiTemp ET Series product offering. Consider using ET20-31-F2A-0909 HiTemp ET Series module as a replacement. The OptoTECTM Series is a miniature thermoelectric module (TEM). This product series is primarily used in applications to stabilize the temperature of sensitive optical components in telecom and photonics industries. This product line is available in multiple configurations and surface finishing options. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the OptoTEC Series is designed for lower current and lower heatpumping applications. Custom designs are available to accommodate metallization, pretinning, ceramic patterns, and solder posts, however MOQ applies. Americas: +1.919.597.7300 Europe: +46.31.420530 Asia: +86.755.2714.1166 ets.sales@lairdtech.com www.lairdtech.com FEATURES APPLICATIONS Laser diodes CCD cameras Calibration equipment Infrared (IR) sensors • Pump lasers • Crystal oscillators • Optical transceivers Miniature geometric sizes Precise temperature control Reliable solid state operation No sound or vibration DC operation • RoHS compliant • • • • • • • • • SPECIFICATIONS PERFORMANCE Hot Side Temperature (°C) Qmax (Watts) Delta Tmax (°C) Imax (Amps) Vmax (Volts) Module resistance (ohms) SUFFIX 11 TB 00 22 GG THICKNESS PRIOR TO TINNING 0.086”± 0.002” 0.086”± 0.0005” 0.098”± 0.005” 0.098”± 0.005” 0.098”± 0.005” SEALING OPTIONS SUFFIX RT EP 25 4.2 67 2.0 3.5 1.62 SEALANT RTV Epoxy COLOR White Black FLATNESS & PARALLELISM 0.0002” / 0.002” 0.0005” / 0.0005” NA / NA NA / NA NA / NA TEMP RANGE -60 to 204 °C -55 to 150 °C 50 4.7 77 2.0 4.0 1.82 HOT FACE COLD FACE Lapped Lapped Metallized Pre-tinned AuPlated Lapped Lapped Metallized Pre-tinned AuPlated LEAD LENGTH 2.0” 2.0” 2.0” 2.0” 2.0” DESCRIPTION Non-corrosive, silicone adhesive sealant Low density syntactic foam epoxy encapsulant Page 1 of 2 HOT20-31-F2A-0909 PERFORMANCE CURVES MECHANICAL DRAWING Ceramic Material: 96% Alumina Ceramics Solder Construction: 271°C, Proprietary OPERATING TIPS • • • • Max operating temperature: 175°C Do not exceed Imax or Vmax when operating module Reference assembly guidelines for recommended installation Solder tinning also available on metallized ceramics LAIRD-ETS-HOT20-31-F2A-0909-DATA-SHEET-101416 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Page 2 of 2