430874-501

CP Series CP14-199-06 Thermoelectric Modules The Ceramic Plate (CP) Series of Thermoelectric Modules (TEMs) is considered ‘the standard’ in the thermoelectric industry. This broad product line of high-performance and highly reliable TEMs is available in numerous heat pumping capacities, geometric shapes, and input power ranges. Assembled with Bismuth Telluride semiconductor material and thermally conductive Aluminum Oxide ceramics, the CP Series is designed for higher current and large heat-pumping applications. FEATURES Americas: +1.919.597.7300 Europe: +46.31.420530 Asia: +86.755.2714.1166 ets.sales@lairdtech.com www.lairdtech.com PERFORMANCE SPECIFICATIONS Hot Side Temperature (°C) Qmax (Watts) Delta Tmax (°C) Imax (Amps) Vmax (Volts) Module Resistance (Ohms) SUFFIX L1 L2 THICKNESS (PRIOR TO TINNING) 0.150”± 0.001” 0.150”± 0.0005” SEALING OPTION SUFFIX RT EP SEALANT RTV Epoxy APPLICATIONS Precise temperature control Compact geometric sizes Reliable solid state operation No sound or vibration Environmentally friendly DC operation • RoHS compliant • • • • • • COLOR White Black • • • • • • • 25°C 80.9 67 6.0 22.7 3.49 FLATNESS & PARALLELISM 0.001” / 0.001” 0.0005” / 0.0005” TEMP RANGE -60 to 204°C -55 to 150°C Medical lasers Lab science instrumentation Clinical diagnostic systems Photonics laser systems Electronic enclosure cooling Food & beverage cooling Chillers (liquid cooling) 50°C 88.8 75 6.0 25.7 3.94 HOT FACE Lapped Lapped COLD FACE Lapped Lapped LEAD LENGTH 10” 10” DESCRIPTION Non-corrosive, silicone adhesive sealant Low density syntactic foam epoxy encapsulant Page 1 of 2 CP14-199-06 Performance Curves at Th = 25°C THERMO ELECTRIC Ceramic Material: Alumina (AI2O3) Solder Construction: 138°C, Bismuth Tin (BiSn) OPERATING TIPS • • • • Max operating temperature: 80°C Do not exceed Imax or Vmax when operating module Reference assembly guidelines for recommended installation Solder tinning also available on metallized ceramics LAIRD-ETS-CP14-199-06-DATA-SHEET-101416 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2016 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights Page 2 of 2