271-AB

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES COMPACT WAVE-SOLDERABLE LOW-COST HEAT SINKS TO-220 and TO-202 Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH 270/272/280 SERIES TO-220 271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Thermal Performance at Typical Load Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) 288-1ABE 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Natural Convection 85°C @ 4W Forced Convection Weight lbs. (grams) 12°C/W @ 200 LFM 0.0057 (2.59) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS Dimensions: in. (mm) 270, 272, & 280 SERIES SMALL FOOTPRINT LOW-COST HEAT SINKS TO-220 and TO-202 These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissipation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). Standard P/N Dimensions: in. (mm) 270-AB 272-AB 280-AB Height Above PC Board in. (mm) 0.375 (9.4) 0.375 (9.4) 0.375 (9.4) Horizontal Mounting Maximum Footing Solderable in. (mm) Tab Options 1.750 (44.5) x 0.700 (17.8) 1.750 (44.5) x 1.450 (36.8) 1.750 (44.5) x 0.700 (17.8) — 01,02 — Thermal Performance at Typical Load Natural Convection Forced Convection 70°C @ 4W 6.0°C/W @ 400 LFM 42°C @ 4W 3.6°C/W @ 400 LFM 70°C @ 4W 6.0°C/W @ 400 LFM Weight lbs. (grams) 0.0052 (2.36) 0.0105 (5.72) 0.0048 (2.18) Material: Aluminum, Black Anodized TOP-MOUNT BOOSTER HEAT SINKS FOR USE WITH 270/272/280 SERIES TO-220 271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. Standard P/N Height Above Semiconductor Case in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 271-AB 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) Thermal Performance at Typical Load Natural Convection 62°C @ 4W (NOTE A) 31 °C @ 4W (NOTE B) Forced Convection 5.1°C/W @ 400 LFM 1.8°C/W 400 LFM (NOTE B) Weight lbs. (grams) 270 SERIES 280 SERIES 0.0052 (2.36) Material: Aluminum, Black Anodized 272 SERIES 62 Dimensions: in. (mm) 272AB01 272AB02 63