657-15ABPE

Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOT-223, SOL-20 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers' component thermal specifications. FEATURES AND BENEFITS: • No interface material is needed • Copper with tin-lead plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are specified • Can be used with water soluble or no clean SMT solder creams or other pastes Standard P/N Height Above PC Board in. (mm) 217-36CT6 G .390 (9.9) 217-36CTT6 .390 (9.9) 217-36CTR6G .390 (9.9) Material: Copper, Tin, Lead Plated MECHANICAL DIMENSIONS Footprint Dimensions in. (mm) Package Format Package Quantity .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) .600 (15.2) x .740 (18.8) Bulk Tube Tape & Reel 1 20 250 217 HEAT SINK WITH DDPAK DEVICE Thermal Performance at Typical Load Natural Forced Convection Convection) 55°C @ 1W 55°C @ 1W 55°C @ 1W 16.0°C/W @ 200 LFM 16.0°C/W @ 200 LFM 16.0°C/W @ 200 LFM THERMAL PERFORMANCE 6 LAYER BOARD, D' PAK 125°C LEAD, 40°C AMBIENT 217-36CT6 Device Power Dissipation. W L Device only, NC KEY: R Device + HS, NC G Device + HS, 100 lfm l Device + HS, 200 lfm r Device + HS, 300 lfm SECTION A-A NOTES 1. Material to be “ESD” 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. TAPE DETAILS 217-36CTR6 REEL DETAILS All other products, please contact factory for price, delivery, and minimums. Dimensions: in. 30 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES Surface Mount Heat Sinks D 2PAK, TO-220, SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS 217 SERIES TUBE DETAILS TUBE: 16.25 Inches Long, Min. ESDMaterial with Nail Stops 20 Pieces per Tube 217-36CTT6 SOL 20 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) 217-36CT6 Dimensions: in. 230 AND 234 SERIES Standard P/N PATENT PENDING Compact, Wavesolderable Low-Profile Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuation Solderable Tab Option Mounting Style Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal No Tab 01 05 10 No Tab 01 05 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 230-75AB G .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-01 .750 (19.1) .570 (14.5) x .500 (12.7) 230-75AB-05 .500 (12.7) .750 (19.1) x .570 (14.5) 230-75AB-10 .875 (22.2) .570 (14.5) x .500 (12.7) 234-75AB .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-01 .790 (20.0) .570 (14.5) x .500 (12.7) 234-75AB-05 .500 (12.7) .790 (20.0) x .570 (14.5) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 230-75AB-01 230-75AB-10 TO-220 230 AND 234 SERIES 230-75AB-05 Thermal Performance at Typical Load Natural Forced Convection Convection) 57°C @ 2W 57°C @ 2W 57°C @ 2W 57°C @ 2W 57°C @ 2W 57°C @ 2W 57°C @ 2W 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 230 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 234 SERIES 234-75AB 234-75AB-01 234 SERIES 234-75AB-05 Dimensions: in. (mm) G Normally stocked 31 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 233 AND 236 SERIES Standard P/N PATENT PENDING Self-Locking Wavesolderable Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) TO-220 Mounting Solderable Configuration Tab Options 233-60AB G .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-01 .600 (15.2) .570 (14.5) x .500 (12.7) 233-60AB-05 .500 (12.7) .600 (15.2) x .570 (14.5) 233-60AB-10 G .725 (18.4) .570 (14.5) x .500 (12.7) 236-150AB 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-01 1.500 (38.1) .570 (14.5) x .500 (12.7) 236-150AB-05 G .500 (12.7) 1.500 (38.1) x .570 (14.5) 236-150AB-10 1.625 (41.3) .570 (14.5) x .570 (12.7) Material: Aluminum, Black Anodized Vert./Horiz. Vertical Horizontal Vertical Vert./Horiz Vertical Horizontal Vetrical No Tab 01 05 10 No Tab 01 05 10 Thermal Performance at Typical Load Natural Forced Convection Convection Mounting Style Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 58°C @ 2W 58°C @ 2W 58°C @ 2W 58°C @ 2W 58°C @ 2W 58°C @ 2W 58°C @ 2W 58°C @ 2W 11.0°C/W @ 400 LFM 11.0°C/W @ 400 LFM 11.0°C/W @ 400 LFM 11.0°C/W @ 400 LFM 4.80°C/W @ 400 LFM 4.80°C/W @ 400 LFM 4.80°C/W @ 400 LFM 4.80°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 233 AND 236 SERIES 233-60AB-01 236-150AB-01 233-60AB-10 236-150AB-10 233-60AB-05 236-150AB-05 236-150AB Dimensions: in. (mm) 233-60AB 275 AND 231 SERIES Standard P/N PATENT 5381041 Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. (mm) 275-75AB 275-75AB-01 275-75AB-10 231-69PAB 231-69PAB-13H 231-69PAB-XXX 231-75PAB 231-75PAB-13H (14V G) 231-75PAB-XXX 231-137PAB 231-137PAB-13H (15VG) 231-137PAB-XXX Footprint Dimensions in. (mm) .750 (19.1) .750 (19.1) .875 (12.7) .690 (18.4) .400 (38.1) .690 (38.1) .750 (12.7) .400 (41.3) .750 (34.9) 1.375 (10.2) .400 (10.2) 1.375 (10.2) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .835 (21.2) x .400 (12.7) .690 (17.5) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2) x .400 (14.5) .750 (19.1) x .835 (12.7) .835 (21.2) x .400 (12.7) .835 (21.2 x .400 (12.7) 1.375 (34.9) x .835 (12.7) .835 (21.2) x .400 (12.7) Mounting Solderable Configuration Tab Options Vert./Horiz. Vertical Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical Vert./Horiz. Horizontal Vertical No Tab 01 10 No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V No Tab 13H 13V, 14V, 15V Mounting Style TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 44 C @ 2W 44°C @ 2W 44°C @ 2W 45°C @ 2W 45°C @ 2W 45°C @ 2W 43°C @ 2W 43°C @ 2W 43°C @ 2W 32°C @ 2W 32°C @ 2W 32°C @ 2W 7.9°C/W @ 400 LFM 7.9°C/W @ 400 LFM 7.9°C/W @ 400 LFM 8°C/W @ 400 LFM 8°C/W @ 400 LFM 8°C/W @ 400 LFM 7.9°C/W @ 400 LFM 7.9°C/W @ 400 LFM 7.9°C/W @ 400 LFM 5.9°C/W @ 400 LFM 5.9°C/W @ 400 LFM 5.9°C/W @ 400 LFM Material: Aluminum, Pre-anodized Black (PAB), Anodized Black (AB) 275 AND 231 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 13H All versions No Tab TAB 14V TAB 13V NATURAL AND FORCED CONVECTION CHARACTERISTICS TAB 01 TAB 10 TAB 15V TAB 13H Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 32 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 235 SERIES Standard P/N Compact, Stress-Free Labor-Saving Locking-Tab Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vertical Horizontal Vertical No Tab 01 05 10 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 235-85AB G .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-01 .850 (21.6) 1.000 (25.4) x .500 (12.7) 235-85AB-05 .500 (12.7) .850 (21.6) x1.000 (25.4) 235-85AB-10 .975 (24.8) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized PATENT 5381041 235-85AB TO-220 MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection 40°C @ 2W 40°C @ 2W 40°C @ 2W 40°C @ 2W 6.8°C/W @ 400 LFM 6.8°C/W @ 400 LFM 6.8°C/W @ 400 LFM 6.8°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 235 SERIES 235-85AB-05 235-85AB-01 235-85AB-10 Dimensions: in. (mm) 243 SERIES Standard P/N Labor-Saving Clip-On Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Verl./Horiz. No Tab No Tab Clip Clip 243-1PAB 1.000 (25.4) .800 (20.3) x .270 (6.9) 243-3PAB G .800 (20.3) .800 (20.3) x .270 (6.9) Material: Aluminum, Pre-anodized Black Thermal Performance at Typical Load Natural Forced Convection Convection 50°C@ 2W 78°C@ 2W 4.5°C/W @ 400 LFM 8.2°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 243 SERIES SECTION A-A VIEW B-B Dimensions: in. (mm) 239 SERIES Standard P/N Snap-Down Self-Locking Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 239-75AB .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-03 .750 (19.1) 1.120 (28.4) x .435 (11.0) 239-75AB-04 .750 (19.1) 1.120 (28.4) x .435 (11.0) Material: Aluminum, Black Anodized PATENT PENDING MECHANICAL DIMENSIONS 239-75AB TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz Vertical Vertical No Tab 03 04 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole 239 SERIES SECTION A-A Thermal Performance at Typical Load Natural Forced Convection Convection 38°C @ 2W 38°C @ 2W 38°C @ 2W 6°C/W @ 400 LFM 6°C/W @ 400 LFM 6°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 239-75AB-03 239-75AB-04 Dimensions: in. (mm) G Normally stocked 33 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 273 SERIES Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection Vert./Horiz. Vertical Vertical No Tab 01 02 Mtg Hole Mtg Hole Mtg Hole 49°C @ 2W 49°C @ 2W 49°C @ 2W 273-AB G .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-01 .375 (9.5) .750 (19.1) x .750 (19.1) 273-AB-02 .375 (9.5) .750 (19.1) x .750 (19.1) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-218, TO-220 7.2°C/W @ 400 LFM 7.2°C/W @ 400 LFM 7.2°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 273 SERIES 273-AB 273-AB-01 273-AB-02 Dimensions: in. (mm) 274 SERIES Material: Aluminum, Black Anodized Low-Cost, Low-Height Wavesolderable Heat Sinks Height Above Standard PC Board P/N in. (mm) 274-1AB G .375 (9.5) 274-1AB-01 G .375 (9.5) 274-1AB-02 .375 (9.5) 274-2AB G .500 (12.7) 274-2AB-01 .500 (12.7) 274-2AB-02 .500 (12.7) 274-3AB G .250 (6.4) 274-3AB-01 .250 (6.4) 274-3AB-02 .250 (6.4) 281-1AB .375 (9.5) 281-2AB .500 (12.7) Footprint Dimensions in. (mm) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) .520 (13.2) x .750 (19.1) MECHANICAL DIMENSIONS Mounting Configuration Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vert./Horiz. Vertical Vertical Vertical Vertical TO-220 Solderable Tab Options No Tab 01 02 No Tab 01 02 No Tab 01 02 No Tab No Tab Mounting Style Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole Mtg Hole NATURAL AND FORCED CONVECTION CHARACTERISTICS 274 SERIES 274-XAB-02 274-XAB-01 274 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection 56°C @ 2W 8.0°C/W @ 400 LFM 56°C @ 2W 8.0°C/W @ 400 LFM 56°C @ 2W 8.0°C/W @ 400 LFM 50°C @ 2W 7.0°C/W @ 400 LFM 50°C @ 2W 7.0°C/W @ 400 LFM 50°C @ 2W 7.0°C/W @ 400 LFM 62°C @ 2W 9.0°C/W @ 400 LFM 62°C @ 2W 9.0°C/W @ 400 LFM 62°C @ 2W 9.0°C/W @ 400 LFM 56°C @ 2W 8.0°C/W @ 400 LFM 50°C @ 2W 7.0°C/W @ 400 LFM 281 SERIES Dimensions: in. (mm) 240 SERIES Standard P/N Labor-Saving Twisted Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) TO-220 Mounting Configuration Solderable Tab Options Mounting Style Vertical Vertical 22 22 Clip/Mtg Hole Clip/Mtg Slot 240-118ABH-22 G 1.180 (30.0) 1.000 (25.4) x .500 (12.7) 240-118ABS-22 1.180 (30.0) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 240 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection 55°C @ 4W 55°C @ 4W 5.3°C/W @ 400 LFM 5.3°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 240-118ABS-22 240-118ABH-22 Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 34 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 242 SERIES Standard P/N Low-Height, Low-Profile Twisted Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style Thermal Performance at Typical Load Natural Forced Convection Convection Vertical 22 Mtg Hole 48°C @ 2W 242-125AB-22 1.285 (32.6) .875 (22.2) x .250 (6.4) Material: Aluminum, Black Anodized 242-125AB-22 TO-220 MECHANICAL DIMENSIONS 242 SERIES 6.2°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 232 AND 238 SERIES Material: Aluminum, Black Anodized Staggered Fin Heat Sinks for Vertical Mounting TO-202, TO-220 Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style 232-200AB 232-200AB-23 238-200AB 238-200AB-23 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 2.000 (50.8) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) 1.380 (35.1) x .500 (12.7) Vertical Vertical Verlical Verlical 2, Twisted 2, Solderable 2, Twisted 2, Solderable Clip/Mtg Hole Clip/Mtg Hole Mtg Slot Mtg Slot MECHANICAL DIMENSIONS 232-200AB 238-200AB 232-200AB-23 238-200AB-23 238 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection 48°C @ 4W 48°C @ 4W 48°C @ 4W 48°C @ 4W 3.3°C/W @ 400 LFM 3.3°C/W @ 400 LFM 3.3°C/W @ 400 LFM 3.3°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 232 AND 238 SERIES Dimensions: in. (mm) 251 SERIES Standard P/N Slim-Profile Heat Sinks With Integral Clips Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 251-62AB .620 (15.7) .910 (23.1) x .380 (9.7) 251-80AB .845 (21.5) .910 (23.1) x .380 (9.7) 251-80AB-19 .875 (22.2) .910 (23.1) x .380 (9.7) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 251-62AB 15 Lead Multiwatt Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vert./Horiz. Vertical No Tab No Tab 19 Clip Clip Clip 66°C @ 3W 64°C @ 3W 64°C @ 3W 66°C/W @ 400 LFM 66°C/W @ 400 LFM 66°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 251 SERIES 251-80AB Thermal Performance at Typical Load Natural Forced Convection Convection 251-80AB-19 Dimensions: in. (mm) G Normally stocked 35 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS 244 SERIES Standard P/N Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Vert/Horiz, Vertical No Tab 50 244-145AB 1.450 (36.8) 1.300 (33.0) x 480 (12.1) 244-145AB-50 1.650 (41.9) 1.300 (33.0) x 480 (12.1) Material: Aluminum, Black Anodized MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 44°C @ 4W 44°C @ 4W 4.4°C/W @ 400 LFM 4.4°C/W @ 400 LFM Weight lbs. (grams) .0160 (7.25) .0170 (7.20) MECHANICAL DIMENSIONS Dimensions: in. (mm) 245 SERIES Standard P/N Low Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Ver.t/Horiz. Vertical No Tab 50 245-145AB 1.450 (36.8) 1.750 (44.5) x .380 (9.7) 245-145AB-50 1.650 (41.9) 1.750 (44.5) x .380 (9.7) Material: Aluminum, Black Anodized MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 38°C @ 4W 38°C @ 4W 3.2°C/W @ 400 LFM 3.2°C/W @ 400 LFM Weight lbs. (grams) .0160 (7.25) .0170 (7.20) MECHANICAL DIMENSIONS Dimensions: in. (mm) 246 SERIES Standard P/N Medium Height, Slim Profile Wavesolderable Folded Fin Heat Sinks Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 246-197AB 1.968 (50.0) 1.986 (50.4) x 3.75 (9.5) Vert./Horiz. 246-197AB-50 2.168 (55.1) 1.986 (50.4) x 3.75 (9.5) Vertical Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35°C @ 4W 35°C @ 4W 2.8°C/W @ 400 LFM 2.8°C/W @ 400 LFM Weight lbs. (grams) .0240 (10.90) .0250 (11.40) MECHANICAL DIMENSIONS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 36 G Normally stocked Board Level Heat Sinks BOARD LEVEL HEAT SINKS FOR TO-220, TO-218 AND MULTIWATT™ COMPONENTS 247 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 247-195AB 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vert./Horiz. 247-195AB-50 1.950 (49.5) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 25°C@ 4W 25°C@ 4W Weight lbs. (grams) 2.4°C/W @ 400 LFM 2.4°C/W @ 400 LFM .0330 (15.10) .0340 (15.60) MECHANICAL DIMENSIONS Dimensions: in. (mm) 248 SERIES Low Height, Medium Profile Wavesolderable Folded Fin Heat Sinks Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Vert/Horiz. Vertical No Tab 50 248-162AB 1.620 (41.1) 2.000 (50.8) x .750 (19.1) 248-162AB-50 1.620 (41.1) 2.000 (50.8) x .750 (19.1) Order SpeedClip™ 285SC or 330SC separately. Material: Aluminum, Black Anodized MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35°C @ 4w 35°C @ 4w Weight lbs. (grams) 2.5°C/W @ 400 LFM 2.5°C/W @ 400 LFM .026 (11.60) .027 (12.20) Order SpeedClips™ separatley for use with Series 246, 247, 248 or 249 MECHANICAL DIMENSIONS Dimensions: in. (mm) 249 SERIES Medium Height, Deep Profile Wavesolderable Folded Fin Heat Sinks Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) Mounting Configuration 249-113AB 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vert./Horiz, 249-113AB-50 1.130 (28.7) 1.900 (48.3) x .950 (24.1) Vertical Order SpeedClip™ 285SC or 330SC separately. (See 248 Series section). Material: Aluminum, Black Anodized Solderable Tab Options No Tab 50 MULTIWATT Thermal Performance at Typical Load Natural Forced Convection Convection 35°C@ 4W 35°C@ 4W 3.29°C/W @ 400 LFM 3.29°C/W @ 400 LFM Weight lbs. (grams) .020 (8.90) .021 (9.40) MECHANICAL DIMENSIONS Dimensions: in. (mm) G Normally stocked 37 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 288 SERIES Compact Wave-Solderable Low-Cost Heat Sinks Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) 288-1AB G 1.250 (31.8) 0.875 (22.2) x 0.215 (5.5) Mounting tabs are pre-tinned to ensure excellent wave-solder bond and good electrical connections for vertical mounting of TO-220 and TO-202 semiconductor packages. These heat sinks are designed for use where minimum PC TO-220, TO-202 Thermal Performance at Typical Load Natural Forced Convection Convection 85°C @ 4W 12°C/W @ 200 LFM Weight lbs. (grams) 0.0057 (2.59) board space is available. The 288-1AB is a stamped aluminum heat sink, black anodized, designed for applications requiring good heat dissipation from a heat sink occupying minimum space, available at minimum cost. 288 SERIES MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 271 SERIES Top-Mount Booster Heat Sinks for Use with 270/272/280 Series Standard P/N Height Above Semiconductor Case in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 271-AB G 0.500 (12.7) 1.750 (44.5) x 0.700 (17.8) TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 62°C @ 4W (NOTE A) 31 °C @ 4W (NOTE B) 5.1°C/W @ 400 LFM 1.8°C/W 400 LFM (NOTE B) Weight lbs. (grams) 0.0052 (2.36) Material: Aluminum, Black Anodized This top-hat style booster heat sink can be added to any of the 270, 272, or 280 Series for improved performance. MECHANICAL DIMENSIONS NOTE A: Thermal resistance with one 271-AB. NOTE B: Thermal resistance (total) as shown with (2) 271-AB types added to (1) 272-AB type. 271 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 38 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 270/272/280 SERIES Standard P/N Small Footprint Low-Cost Heat Sinks Height Above PC Board in. (mm) Horizontal Mounting Maximum Footing in. (mm) Solderable Tab Options 270-AB G 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) 272-AB G 0.375 (9.4) 1.750 (44.5) x 1.450 (36.8) 280-AB 0.375 (9.4) 1.750 (44.5) x 0.700 (17.8) Material: Aluminum, Black Anodized — 01,02 — These exceptionally low-cost heat sinks can be mounted horizontally under a TO-220 or TO-202 case style with a maximum height of only 0.375 in. (9.4). For added performance, a 271 Series heat sink can also be used for double-sided heat dissi- TO-220, TO-202 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 70°C @ 4W 42°C @ 4W 70°C @ 4W 0.0052 (2.36) 0.0105 (5.72) 0.0048 (2.18) 6.0°C/W @ 400 LFM 3.6°C/W @ 400 LFM 6.0°C/W @ 400 LFM pation. The 270-AB and 280-AB accept one power semiconductor; the 272-AB is designed for two power semiconductors. Specify solderable tab options for the 272 Series by the addition of suffix “O1” or “02” to the standard part number (i.e. 272-AB01 or 272-AB02). NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 270 SERIES 280 SERIES 272AB01 272 SERIES 272AB02 Dimensions: in. (mm) 289 AND 290 SERIES Standard P/N Low-Cost Single or Dual Package Heat Sinks Height Above PC Board in. (mm) 289-AB G 0.500 (12.7) 289-AP 0.500 (12.7) 290-1AB G 0.500 (12.7) 290-2AB G 0.500 (12.7) Material: Aluminum, Black Anodized Horizontal Mounting Maximum Footing in. (mm) 1.000 (25.4) x O.710 (18.1) 1.000 (25.4) x 0.710 (18.1) 1.000 (25.4) x 1.180 (30.0) 1.000 (25.4) x 1.180 (30.0) Low in cost and compact in overall dimensions, one 289 Series heat sink can accommodate one semiconductor; the 289 Series is available with a black anodized finish (289-AB) or with 289 SERIES MECHANICAL DIMENSIONS TO-218, TO-202, TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 50°C @ 2W 50°C @ 2W 44°C @ 2W 44°C @ 2W 0.0055 (2.49) 0.0055 (2.49) 0.0082 (3.72) 0.0081 (3.67) 44°C/W @ 400 LFM 44°C/W @ 400 LFM 35°C/W @ 400 LFM 35°C/W @ 400 LFM no finish (289-AP). Two semiconductors can be mounted to the 290-2AB style. NATURAL AND FORCED CONVECTION CHARACTERISTICS 290 SERIES Dimensions: in. (mm) G Normally stocked 39 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 250 SERIES High-Performance Slim Profile Heat Sinks With Integral Clips Standard P/N Height Above PC Board in. (mm) Footprint Dimensions in. (mm) 250-122AB 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-09 G 1.220 (31.0) 1.000 (25.4) x .500 (12.7) 250-122AB-25 1.380 (35.1) 1.000 (25.4) x .500 (12.7) Material: Aluminum, Black Anodized 250 SERIES MECHANICAL DIMENSIONS Multiwatt Mounting Configuration Solderable Tab Options Mounting Style Vert./Horiz. Vertical Vertical No Tab 09 25 Clip Clip Clip 250-122AB-09 Thermal Performance at Typical Load Natural Forced Convection Convection 50°C @ 4W 50°C @ 4W 50°C @ 4W 3.7°C/W @ 400 LFM 3.7°C/W @ 400 LFM 3.7°C/W @ 400 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 250-122AB-25 250-122AB Dimensions: in. (mm) 237 AND 252 SERIES High-Performance, High-Power Vertical Mount Heat Sinks Height Above PC Board in. (mm) Standard P/N Footprint Dimensions in. (mm) Mounting Configuration Solderable Tab Options Mounting Style TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 237-167AB2 1.675 (42.5) 1.000 (25-4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 237-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 237-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 46° C @ 4W 4.5° C/W @ 200 LFM 252-167AB2 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Twisted Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM 252-167AB3 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 3, Twisted Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM 252-167AB2-24 1.675 (42.5) 1.000 (25.4) x 1.000 (25.4) Vertical 2, Solderable Clip/Mtg Slot 40° C @ 4W 4.5° C/W @ 200 LFM Order SpeedClips™ 285SC or 330SC separately for rapid component installation, lowering manufacturing costs. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 227-167 252-167 237-167AB2 252-167AB2 NATURAL AND FORCED CONVECTION CHARACTERISTICS 237-167AB2-24 252-167AB2-24 237 AND 252 SERIES 237-167AB3 252-167AB3 237 AND 252 SERIES 237-167AB3 252-167AB3 291 SERIES Standard P/N Dimensions: in. (mm) Labor-Saving Clip-on Heat Sinks Height Above PC Board in. (mm) TO-220 Vertical Mounting Footprint Dimensions in. (mm) Mounting Style 291-C236AB 0.860 (21.)9 1.100 (27.0) x 0.360 (9.1) 291-H36AB G 0.860 (21.9) 1.100 (27.0) x 0.360 (9.1) Material: Aluminum, Black Anodized Designed for mounting horizontally or vertically on a circuit board, 291 Series heat sinks employ a unique clip for attachment of TO-220 case styles. TO-220 (Clip) TO-220 (Mtg. Hole) 80° C @ 2W 68° C @ 2W 24°C/W @ 600 LFM 16°C/W @ 600 LFM Weight lbs. (grams) 0.0026 (1.18) 0.0026 (1.18)) One type is available with a locking clip and one with a 0.140 in. (3.6) diameter mounting hole only. 291 SERIES MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 291-C2 All other products, please contact factory for price, delivery, and minimums. 291-H 40 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 286 SERIES Aluminum and Copper Low-Cost Wave-Solderable Heat Sinks Standard P/N Height Above PC Board in. (mm) Maximum Footprint in. (mm) Material 286-AB G 286-CBT G 286-CT 1.190 (30.2) 1.190 (30.2) 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) Aluminum, Anodized Copper, Black Copper, Tinned Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into predrilled circuit boards; scored mounting tabs may be bent after insertion to provide added stabili- MECHANICAL DIMENSIONS TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection 58°C @ 4W 58°C @ 4W 58°C @ 4W 7.4°CW @ 200 LFM 7.4°CW @ 200 LFM 7.4°CW @ 200 LFM Weight lbs. (grams) 0.0085 (3.86) 0.0250 (11.34) 0.0250 (11.34) ty. The 286 Series can be wavesoldered directly to the board. Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). NATURAL AND FORCED CONVECTION CHARACTERISTICS 286 SERIES Dimensions: in. (mm) 287 SERIES Wave-Solderable Low-Cost Heat Sinks Standard P/N Mounting Slot Mounting Hole Height Above PC Board in. (mm) 287-1AB G 287-1ABH G 1.180 (30.0) 287-2AB G 287-2ABH G 1.180 (30.0) Material: Aluminum, Black Anodized TO-220 Maximum Footprint “A” in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 1.000 (25.4) Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) 65°C @ 4W 55°10 @ 4W 7.8°CW @ 200 LFM 6.4°CW @ 200 LFM Weight lbs. (grams) 0.0090 (4.08) 0.0140 (6.35) mounting slot allows for correct positioning of TO-220 and similar semiconductor packages. MECHANICAL DIMENSIONS 287 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N 287-1AB 287-2AB 287-1ABH 287-2ABH Dim. “A” 0.500 (12.7) 1.000 (25.4) 0.500 (12.7) 1.000 (25.4) Dimensions: in. (mm) 695 SERIES Space-Saving Heat Sinks for Small Stud-Mounted Diodes Standard P/N Maximum Width in. (mm) Height in. (mm) 695-1B G 1.330 (33.8) 0.530 (13.7) Thermal Performance at Typical Load Natural Forced Convection Convection 72°C @ 4.0W Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design MECHANICAL DIMENSIONS STUD-MOUNT 5.2°C/W @ 400 LFM Weight lbs. (grams) 0.0030 (1.36) provides good heat dissipation for use where height is limited above the printed circuit board or base plate. NATURAL AND FORCED CONVECTION CHARACTERISTICS 695 SERIES Dimensions: in. (mm) G Normally stocked 41 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 256 SERIES Thermal Retainers Height (Less Mounting Tab) in. (mm) 0.190 (4.0) Standard P/N 256-DM G 260 SERIES 256-DM Material Beryllium Copper Weight lbs. (grams) 0.0005 (0.23) Cup Clips for TO-5 Case Style Semiconductors Characteristics TO-5 Thermal Resistance – Epoxy Insulated Thermal Resistance – Beryllium Oxide Insulated Breakdown Voltage – Epoxy Type (VAC), 60 Hz Breakdown Voltage – Beryllium Type (VAC), 60 Hz Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating Dusty Conditions: % Hipot Rating Dirty Conditions: % Hipot Rating Temperature Range — Continuous (C°) 14° C/W 16° C/W 500 1000 50 30 10 to 20 -73/+149 TO-5 Model Depth of Tapped Base 260-4T5E 260-4TH5E 260-4TH5B 0.093 (2.36) 0.125 (3.18) 0.125 (3.18) Thread Size: Mounting Style: TO-92 4 6 10 T S P = = = = = = #4-40 UNC #6-32 UNC #10-32 UNF tapped stud plain Base Style: Semiconductor Case Style: Insulation Type: H = hex 5 = TO-5 E = epoxy B = beryllium TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE Standard P/N 260-4T5E G 260-4TH5E G 260-6SH5E G 260-1OSH5E 260-4TH5B G 260-6SH5B G 260-10SH5B Insulation Type Outline Dimension L x W x I.D. in. (mm) Weight lbs. (grams) Case Style Epoxy Insulated Epoxy Insulatad Epoxy Insulated Epoxy Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated Beryllium Oxide Insulated 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) 0.445 (11.3) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.607 (15.4) x 0.370 (9.4) hex. x 0.290 (7.4) 0.0024 (1.09) 0.0031 (1.41) 0.0037 (1.68) 0.0042 (1.91) 0.0042 (1.91) 0.0039 (1.77) 0.0043 (1.95) TO-5 TO-5 TO-5 TO-5 TO-5 TO-5 TO-5 Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C”; Ceramic Spacers – beryllium oxide Base Mounting Configurations — TO-5 Plain Type — Epoxy bonded, or used with #4 pan head screws. Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness To determine the correct mounting screw lengths, add dimensions as follows: Stud Mounting Base. #6-32 UNC or #10-32 UNF studs. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness Epoxy Insulated For TO-5 G 260-4T5E Beryllium Oxide Insulated For TO-5 G 260-4TH5E All other products, please contact factory for price, delivery, and minimums. 260-6SH5E 260-10SH5E 42 G 260-4TH5B G 260-6SH5B 260-10SH5B G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 SERIES High-Efficiency Heat Sinks for Small Metal Can Power Semiconductors Single-Level Star 201, 202,204,205, 211 Series Available Standard P/N & Finish Types G 201CB, 201AB 202CB 203CB 204CB G, 204SB 205CB G, 205SB 205AB, 205AP 207CB G, 207SB G 207AB G, 207AP 209CB, 209SB 211CB 213CB, 213SB 213AB, 213AP 215CB, 215AB 215AP Dual-Level Star 203,207,213 Series Dual-Level Sunburst 209, 215 Series Semiconductor Case Diameter Min/Max in. (mm) Heat Sink Inside Dia. “A” in. (mm) Heat Sink Outside Dia. “B” in. (mm) Heat Sink Height “C” in. (mm) Natural Convection Forced Case Rise Convection Above Ambient (ΘCA@200 LFM) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.161 (4.1)/0.240 (6.1) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0,275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.275 (7.0)/0.370 (9.4) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.440 (11.2)/0.544 (13.8) 0.150 (3.8) 0.150 (3.8) 0.150 (3.8) 0.255 (6.5) 0.255 (6.5) 0.255 (6.5) 0.255 (6,5) 0.255 (6.5) 0.255 (6.5) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.420 (10.7) 0.640 (16.2) 0.490 (12.5) 0.640 (16.2) 0.550 (4.8) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 0.720 (18.3) 1.280 (32.5) 0.830 (21.1) 0.830 (21.1) 0.830 (21.1) 1.400 (35.6) 1.400 (35.6) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.187 (4.8) 0.187 (4.8) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.187 (4.8) 0.375 (9.5) 0.375 (9.5) 0.437 (11.1) 0.437 (11.1) 65°C @ 1W 73°C @ 1W 53°C @ 1W 68°C @ 1W 59°C @ 1W 68°C @ 1W 46°C @ 1W 53°C @ 1W 30°C @ 1W 50°C @ 1W 44°C @ 1W 51°C @ 1W 28°C @ 1W 32°C @ 1W 31°C/W 43°C/W 23°C/W 35°C/W 28°C/W 28°C/W 20°C/W 20°C/W 13°C/W 24°C/W 19°C/W 19°C/W 15°C/W 15°C/W Applicable Power Semiconductor Case Types Materials and Finishes Available for 200 Series: TO-18, TO-24, TO-28, TO-40, TO-44 CB TO-5, TO-9, TO-11, TO-12, TO-26, TO-29, TO-33, TO-43, TO-45 SB AB AP TO-8, TO-38 Beryllium copper; black ebonol "C" Finish Silver-bearing copper; black ebonol "C" Aluminum, black anodized Aluminum, no finish applied NATURAL AND FORCED CONVECTION CHARACTERISTICS 258 SERIES Thermal Links for Fused Glass Diodes Standard P/N 258 G DIODES Dimensions in. (mm) Weight lbs. (grams) Material Finish 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum DeltaCoate™ 151 on all surfaces except solder pads and base 0.0018 (0.82) MECHANICAL DIMENSIONS The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt. 292 SERIES 258 SERIES Dimensions: in. (mm) Heat Sink for Single TO-92 TO-92 Standard P/N Height Above PC Board in. (mm) Overall Fin Width in. (mm) Thermal Performance Natural Convection Finish Weight lbs. (grams) 292-AB G 0.750 (19.1) 0. 600 (15.3) 0.225° C/W @ 0.250 W Black Anodized 0.00049 (0.22) Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. Material: Aluminum, Black Anodized. MECHANICAL DIMENSIONS 292 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) G Normally stocked 43 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 634 SERIES Slim Profile Unidirectional Fin Vertical Mount Heat Sink Standard P/N Plain Pin Without Pin 634-10ABP G 634-10AB 634-15ABP 634-15AB 634-20ABP G 634-20AB Material: Aluminum, Black Anodized. Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave- MECHANICAL DIMENSIONS TO-220 and TO-218 Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) Weight lbs. (grams) 0.016 (7.48) 0.025 (11.21) 0.033 (14.95) solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. 634 SERIES TYPICAL THERMAL PERFORMANCE FOR 634-15ABP Notes: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. Dimensions: in. (mm) 637 SERIES Standard P/N High-Efficiency Heat Sinks For Vertical Board Mounting Height Above PC Board “A” in. (mm) 637-10ABP G 1.000 (25.4) 637-15ABP G 1.500 (38.1) 637-20ABP G 2.000 (50.8) 637-25ABP G 2.500 (63.5) Material: Aluminum, Black Anodized Maximum Footprint in. (mm) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight MECHANICAL DIMENSIONS TO-220 Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 76°C @ 6W 65°C @ 6w 55°C @ 6W 48°C @ 6W 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12) 5.8°C/W @ 200 LFM 5.5°C/W @ 200 LFM 4.7°C/W @ 200 LFM 4.2°C/W @ 200 LFM and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 44 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 626 AND 627 SERIES Standard P/N High-Efficiency Heat Sinks for Vertical Board Mounting Standard P/N Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) 626-10ABP 627-10ABP 1.000 (25.4) 626-15ABP 627-15ABP 1.500 (38.1) 626-20ABP 627-20ABP 2.000 (50.8) 626-25ABP 627-25ABP 2.500 (63-5) Wave-solderable pins. Material: Aluminum, Black Anodized Thermal Performance at Typical Load Natural Forced Convection Convection 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 76°C @ 6W 65°C @ 6W 55°C @ 6W 48°C @ 6W 5.8°C/W @ 200 LFM 5.5°C/W @ 200 LFM 4.7°C/W @ 200 LFM 4.2°C/M @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 626 AND 627 SERIES MECHANICAL DIMENSIONS TO-218, TO-220 Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks for Vertical Board Mounting Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 657-10ABP G 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABP G 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABP G 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABP G 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-220, TO-247, TO-218 657 SERIES 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM Weight lbs (grams) 0.0515 (23.36) 0.0760 (34.60) 0.1030 (47.00) 0.1250 (57.00) NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) All other products, please contact factory for price, delivery, and minimums. 46 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 657 SERIES Standard P/N High-Performance Notched Heat Sinks for Vertical Board Mounting Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 657-10ABPN 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPN G 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPN 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPN 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-220, TO-247, TO-218 657 SERIES 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 657 SERIES Standard P/N High-Performance Heat Sinks with SpeedClips™ for Vertical Board Mounting Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 657-10ABPSC 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657-15ABPSC 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 657-20ABPSC 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 657-25ABPSC G 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-220, TO-247, TO-218 657 SERIES 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 677 SERIES Standard P/N High-Performance, High-Power Heat Sinks for Vertical Board Mounting Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 677-10ABP 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 677-15ABP 1.500 (38.1) 1.650 (41.9) x 1.000 (25.4) 677-20ABP 2.000 (50.8) 1.650 (41.9) x 1.000 (25.4) 677-25ABP 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 677 SERIES TO-218, TO-220, TO-247 15-LEAD Multiwatt 52°C @ 6W 46°C @ 6W 40°C @ 6W 35°C @ 6W 3.1°C/W @ 200 LFM 2.8°C/W @ 200 LFM 2.5°C/W @ 200 LFM 2.2°C/W @ 200 LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS 677 SERIES (EXTRUSION PROFILE 8719) Dimensions: in. (mm) G Normally stocked 47 All other products, please contact factory for price, delivery, and minimums. Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 690 SERIES HIghest Efficiency/Lowest Unit Cost Heat Sinks Height Above PC Board in. (mm) Standard P/N Thermal Performance at Typical Load Natural Forced Convection Convection Outline Dimensions in. (mm) 690-3B G 1.310 (33.3) 690-66B 1.310 (33.3) 690-220B 1.310 (33.3) Material: Aluminum, Black Anodized 1.860 (47.2)-sq 1.860 (47.2)-sq 1.860 (47.2)-sq 44°C @ 7.5W 44°C @ 7.5W 44°C @ 7.5W These low-cost heat sinks provide the most power dissipation at the lowest unit cost and are available in three standard types to mount and cool one TO-3 or TO-66 metal power semiconductor type or two plastic package TO-220 power semiconductor types. For higher power TO-3, TO-66, TO-220 2.0°C/W @ 400 LFM 2.0°C/W @ 400 LFM 2.0°C/W @ 400 LFM Semiconductor Mounting Hole Pattern Weight lbs. (grams) (1) TO-3 (1) TO-66 (2) TO-220 0.0700 (31.75) 0.0700 (31.75) 0.0700 (31.75) semiconductors, the 690 Series can dissipate up to 20 watts while maintaining a mounting surface temperature rise above ambient air temperature of no more than 91°C. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES 690 SERIES TO-66 TO-3 *TWO TO-220’S Dimensions: in. (mm) 680 SERIES Standard P/N Maximum Efficiency Omnidirectional Heat Sinks Height Above PC Board “A” in. (mm) Horizontal Mounting Footprint Dimensions in. (mm) 680-5A G 0.500 (12.7) 680-75A G 0.750 (19.1) 680-10A G 1.000 (25.4) 680-125A G 1.250 (31.8) 680-5220 0.500 (12.7) 680-75220 0.750 (19.1) 680-10220 G 1.000 (25.4) 680-125220 G 1.250 (31.8) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS Thermal Performance at Typical Load Natural Forced Convection Convection 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 1.810 (46.0)-sq 70°C @ 7.5W 58°C @ 7.5W 52°C @ 7.5W 45°C @ 7.5W 7O°C @ 7.5W 58°C @ 7.5W 52°C @ 7.5W 45°C @ 7.5W Achieve optimum natural convection cooling per unit volume occupied above the printed circuit board for TO-3 (one semiconductor package per heat sink) or for two TO-220 style cases, when this low-cost heat sink is used. Any mounting attitude will provide free circulation TO-3, TO-220 3.0°C/W @ 400 LFM 2.4°C/W @ 400 LFM 2.0°C/W @ 400 LFM 1.5°C/W @ 400 LFM 3.0°C/W @ 400 LFM 2.4°C/W @ 400 LFM 2.0°C/W @ 400 LFM 1.5°C/W @ 400 LFM Semiconductor Mounting Hole Pattern Weight lbs. (grams) (1) TO-3 (1) TO-3 (1) TO-3 (1) TO-3 (2) TO-220 (2) TO-220 (2) TO-220 (2) TO-220 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) 0.0700 (31.75) 0.0900 (40.82) 0.0980 (44.45) 0.1100 (49.90) of air in natural convection applications. These 680 Series heat sinks can also be specified without any semiconductor mounting hole pattern by specifying suffix “K” (Example: 680-5K). 680 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS SEMICONDUCTOR MOUNTING HOLES 220 A K Dimensions: in. (mm) TO-3 All other products, please contact factory for price, delivery, and minimums. *TWO TO-220’S 48 G Normally stocked Board Level Heat Sinks BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 AND 603 SERIES Low-Height Heat Sinks Footprint Dimensions in. (mm) Standard P/N 601E 2.000 (50.8) x 1.250 (31.8) 601F 2.000 (50.8) x 1.250 (31.8) 601K 2.000 (50.8) x 1.250 (31.8) 603K 2.000 (50.8) x 2.000 (50.8) Material: Aluminum Alloy, Black Anodized DO-4/DO-5 Diodes Height in. (mm) Mounting Hole Dia. in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.562 (14.3) 0.200 (5.1) 0.270 (6.9) None None 52°C @ 5.0W 52°C @ 5.0W 52°C @ 5.0W 41°C @ 5.0W Use these low-height heat sinks on printed circuit board applications for TO-66 power semiconductors and DO-4 and DO-5 diodes, where close board-to-board spacing and efficient 4.5°C/W @ 175 LFM 4.5°C/W @ 175 LFM 4.5°C/W @ 175 LFM 4.0°C/W @ 175 LFM Weight lbs. (grams) 0.0500 (22.68) 0.0500 (22.68) 0.0500 (22.68) 0.0810 (36.74) heat dissipation are required. The 601 and 603 Series may also be attached to enclosure panels or brackets using isolation hardware where necessary. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 603 SERIES (EXTRUSION PROFILE 1284) 601 SERIES (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES K E F Dimensions: in. (mm) 635 SERIES Standard P/N Space-Saving Low-Cost Heat Sinks Height Above PC Board “A” in. (mm) TO-3 Outline Dimensions in. (mm) Thermal Performance at Typical Load Natural Forced Convection Convection 635-5B2 0.500 (12.7) 1.900 (48.3) x 1.420 (36.0) 635-75B2 0.750 (19.1) 1.900 (48.3) x 1.420 (36.0) 635-10B2 1.000 (25.4) 1.900 (48.3) x 1.420 (36.0) 635-125B2 1.250 (31.8) 1.900 (48.3) x 1.420 (36.0) Material: Aluminum Alloy, Black Anodized Use this low-cost TO-3 heat sink style for multiple TO-3 applications on a single printed circuit board, where two or more TO-3s must be placed in proximity and minimum space is 90°C @ 8.0W 77°C @ 8.0W 61°C @ 8.0W 53°C @ 8.0W Semiconductor Mounting Hole Pattern Weight lbs. (grams) TO-3 TO-3 TO-3 T0-3 0.0200 (9.07) 0.0220 (9.98) 0.024 (10.89) 0.028 (12.70) 6.0°C/W @ 300 LFM 4.8°C/W @ 300 LFM 3.6°C/W @ 300 LFM 3.1°C/W @ 300 LFM available for heat sinking. Four different heights are available, all with TO-3 mounting hole pattern in the base. Consult factory for TO-66, TO-220, and multilead IC hole patterns. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 635 SERIES Dimensions: in. (mm) G Normally stocked 49 All other products, please contact factory for price, delivery, and minimums.