647-10ABEP

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 647 SERIES HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL BOARD MOUNTING TO-220 Wave-solderable pins on 1 in. centers for vertical mounting of larger devices on printed circuit boards. Maximum semiconductor package width: 0.625 (15.9). Refer to the Accessory Products section for thermal interface materials, 126 Series silicone-free thermal compounds, and other accessories products. Standard P/N 647-1OABEP 647-15ABEP 647-175ABEP 647-20ABEP 647-25ABEP Height Above PC Board “A” in. (mm) 1.000 (25.4) 1.500 (38.1) 1.750 (44.5) 2.000 (50.8) 2.500 (63.5) Thermal Performance at Typical Load Maximum Footprint in. (mm) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) Natural Convection Forced Convection 42°C @ 6W 37°C @ 6W 34°C @ 6W 31°C @ 6W 25°C @ 6W 3.8°C/W @ 200 LFM 3.5°C/W @ 200 LFM 3.3°C/W @ 200 LFM 3.1°C/W @ 200 LFM 2.8°C/W @ 200 LFM Weight lbs. (grams) 0.055 (24.95) 0.075 (34.02) 0.090 (40.82) 0.104 (47.17) 0.125 (56.70) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS TO-218; TO-247; TO-220 Standard P/N 657-10ABEPN 657-15ABEPN 657-20ABEPN 657-25ABEPN HIGH-PERFORMANCE NOTCHED HEAT SINKS FOR VERTICAL BOARD MOUNTING Thermal Performance at Typical Load Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) Natural Convection Forced Convection 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 657 SERIES (EXTRUSION PROFILE 6533) Dimensions: in. (mm) 647 SERIES (EXTRUSION PROFILE 5195) Dimensions: in. (mm) TO-218; TO-247; TO-220 Standard P/N 657-10ABEP 657-15ABEP 657-20ABEP 657-25ABEP HIGH-PERFORMANCE HEAT SINKS FOR VERTICAL BOARD MOUNTING Height Above PC Board “A” in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) Maximum Footprint in. (mm) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 657 SERIES 657 SERIES Thermal Performance at Typical Load Natural Forced Convection Convection 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM Weight lbs (grams) 0.0515 (23.36) 0.0760 (34.60) 0.1030 (47.00) 0.1250 (57.00) Standard P/N 657-10ABEPSC 657-15ABEPSC 657-20ABEPSC 657-25ABEPSC MECHANICAL DIMENSIONS Height Above PC Board “A” in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) Maximum Footprint in. (mm) Thermal Performance at Typical Load 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) 1.650 (41.9) x 1.000 (25.4) Natural Convection 41°C @ 6W 38°C @ 6W 32°C @ 6W 25°C @ 6W Forced Convection 3.7°C/W @ 200 LFM 3.3°C/W @ 200 LFM 2.9°C/W @ 200 LFM 2.7°C/W @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) 72 HIGH-PERFORMANCE HEAT SINKS WITH SPEEDCLIPS™ TO-218; TO-247; TO-220 FOR VERTICAL BOARD MOUNTING MECHANICAL DIMENSIONS Wave-solderable pins. Material: Aluminum, Black Anodized Dimensions: in. (mm) 657 SERIES 657 SERIES (EXTRUSION PROFILE 6533) 657 SERIES (EXTRUSION PROFILE 6533) 73