678-39-C

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 601 & 603 SERIES UNIVERSAL 678 SERIES VERTICAL HEAT SINK FOR POWER DEVICES 678-39-S & 678-39-C LOW-HEIGHT HEAT SINKS DO-4/DO-5 Diodes MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Wakefield-Vette introduces Universal 678 series, high performance, low cost and versatile heat sink with screw or clip for all kinds of standard packages. This type of heat sink provides both vertical and horizontal mounting options on PCB to accommodate natural and forced convection cooling method. SPECIFICATIONS • • • • 603 SERIES (EXTRUSION PROFILE 1284) 601 SERIES (EXTRUSION PROFILE 1284) SEMICONDUCTOR MOUNTING HOLES K E F Heat Sink: Aluminum Alloy 6063-T5 or Equivalent with either degreased or black anodized finish Spring Clip: Music Wire, Per ASTM A228 with bright nickel plating Solder Foot: Cold-rolled Steel, Per ASTM A-366 with pure tin over copper strike. RoHS compliant. Insulator (Optional): t-Global H48-1, L37-3F and H48-6S. The thickness of the insulating material not to exceed 10 mil (0.01”). 678-39-C Dimensions: in. (mm) TO-3 • • Minimum assembly cost and labor - Spring Clips make the mounting holes and fasteners obsolete in assembly operations & reduce costs. Design Flexibility - Universal mountable and “one fits all” give designers total freedom to fit their packaging designs with ideal device pack style and to orient the heat sink to meet their power dissipations with optimized cooling method. (see page 7 of data sheet). Thermal Resistance Part Number Description Length Width @ Forced Air Flow 678-39-S MECHANICAL DIMENSIONS MAXIMUM PERFORMANCE NATURAL CONVECTION HEAT SINK FOR ALL METAL-CASE SEMICONDUCTORS FEATURES AND BENEFITS Universal Heat Sink for TO Devices w/Screw Hole, 1.520" Black Anodize (38.61mm) Universal Heat Sink for TO Devices w/ Clip, Black Anodize 1.520" (38.61mm) 2.362" (60.00mm) 0.6°C/W @ 600 LFM 2.362" (60.00mm) 0.6°C/W @ 600 LFM THERMAL PERFORMANCE 641 SERIES Available with a standard TO-3 mounting hole pattern predrilled for cost-effective mounting in limited-height applications, the 641 Series provides maximum performance in natural convection with an optimized heat sink surface area. The 641K type with an open channel area of 1.300 in. (33.0) and no predrilled mounting holes can be adapted to meet mounting requirements for most metal case power semiconductor types. Standard P/N 641A 641K Outline Dimensions in. (mm) 4.125 (104.8) x 3.000 (76.2) 4.125 (104.8) x 3.000 (76.2) Height in. (mm) 1.000 (25.4) 1.000 (25.4) Thermal Performance at Typical Load Mounting Hole Pattern Natural Convection (1) TO-3 None 36°C @ 15W 36°C @ 15W Forced Convection 0.9°C/W @ 250 LFM 0.9°C/W @ 250 LFM Weight lbs. (grams) 0.2900 (131.54) 0.2900 (131.54) Material: Aluminum Alloy, Black Anodized. MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS 641 SERIES (EXTRUSION PROFILE 1371) SEMICONDUCTOR MOUNTING HOLES A K Dimensions: in. (mm) 76 77