219-263A

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS 219 SERIES HEAT SINKS FOR TO-263 DEVICES 219-263A HEAT SINK FOR TO-263 DEVICES HEAT SINK FOR TO-263 DEVICES Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body. Innovation in SMT compatible heat sinks to meet the needs of newer higher power SMT semiconductors. The 219 Series heat sinks unique design (Patent Pending) combines the technology of automatically assembling the tin plated solderable wires/rods with that of extruded aluminum anodized heat sink body to configure these SMT heat sinks. Rods/wires named "Rollers" are mated mechanically to the heat sink body by forging to reduce the interface thermal resistance between the drains & heat dissipation body. FEATURES AND BENEFITS FEATURES AND BENEFITS • • • • • • • • • • Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish. Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets. Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time. Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks. Available in bulk packaging or Tape & Reel. Increased thermal performance up to 30% over bright copper heat sinks from improved radiation of the black finish. Increased surface areas by 3 times therefore thermal performance up to 300% over the aluminum stamped heat sinks on markets. Light weight aluminum construction allows faster pick and place assembly reducing the manufacturing cycle time. Radius mounted “Rollers” are designed for maximizing heat transfer from component and to avoid “bottle neck” heat transfer like the Aluminum stamped heat sinks. Available in bulk packaging or Tape & Reel. Height Off Base Power Dissipation @ Thermal Resistance Package Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type Height Off Base Power Dissipation @ Thermal Resistance Package Part Number Description Attachment Length Width (Height Of Fin) Temperature Rise @ Forced Air Flow Type 219-263A 219-263A-TR TO-263 SMD HEAT SINK ANODZD Solderable Feet 0.500" 1.020" (12.70mm) (25.91mm) 0.480" (12.19mm) MECHANICAL DIMENSIONS 2W @ 30°C 8°C/W @ 500 LFM TAPE AND REEL INFORMATION Bulk TO-263 SMD HEAT SINK ANODZD Solderable Feet 0.500" 1.020" (12.70mm) (25.91mm) 0.480" (12.19mm) 2W @ 30°C 8°C/W @ 500 LFM Tape & Reel TAPE AND REEL INFORMATION MECHANICAL DIMENSIONS THERMAL RESISTANCE THERMAL RESISTANCE TAPE DETAILS REEL DETAILS 48 219-263A-TR wakefield-vette.com Contact us: (603) 635-2800 49