637-15ABP

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 260 SERIES CUP CLIPS FOR TO-5 CASE STYLE SEMICONDUCTORS Characteristics TO-5 Thermal Resistance – Epoxy Insulated Breakdown Voltage – Epoxy Type (VAC), 60 Hz 14° C/W 500 Recommended Operating Voltage, AC or DC Clean Conditions: % Hipot Rating Dusty Conditions: % Hipot Rating Dirty Conditions: % Hipot Rating 50 30 10 to 20 Temperature Range — Continuous (C°) -73/+149 Model Depth of Tapped Base 260-4T5E 260-4TH5E 0.093 (2.36) 0.125 (3.18) TO-5 THERMAL LINKS FOR FUSED GLASS DIODES Diodes 258 SERIES The thermal resistance from diode leads to chassis or heat sink is 12°C/watt, when unit is mounted with TYPE 120 Joint Compound. If a 10°C/watt chassis or sink to ambient impedance is available, the thermal resistance from the diode leads to ambient is reduced from about 150°C/watt to 22°C/watt. Thread Size: 4 = #4-40 UNC Base Style: H = hex 6 = #6-32 UNC Semiconductor Mounting T = tapped Case Style: 5 = TO-5 Style: S = stud Insulation E = epoxy P = plain Standard P/N Dimensions in. (mm) Material 258 0.500 (12.7) x 0.250 (6.4) x 0.340 (8.6) Aluminum Finish DeltaCoate™ 151 on all surfaces except solder pads and base Weight lbs. (grams) 0.0018 (0.82) MECHANICAL DIMENSIONS TO-5 CASE STYLE CUP CLIPS — ORDERING GUIDE Standard P/N 260-4T5E 260-4TH5E 260-6SH5E Outline Dimension Insulation Type Epoxy Insulated Epoxy Insulated Epoxy Insulated L x W x I.D. in. (mm) 0.370 (9.4) x 0.380 (9.7) dia. x 0.290 (7.4) 0.400 (10.2) x 0.370 (9.4) hex. x 0.290 (7.4) 0.557 (14.1) x 0.370 (9.4) hex. x 0.290 (7.4) Weight lbs. (grams) Case Style 0.0024 (1.09) 0.0031 (1.41) 0.0037 (1.68) TO-5 TO-5 TO-5 Materials and Finish: Cups – beryllium copper, black ebonol “C”; Bases – brass, black ebonol “C” Dimensions: in. (mm) Base Mounting Configurations — TO-5 Plain Type — Epoxy bonded, or used with #4 pan head screws. Tapped Base — #4-40 UNC screw (not supplied) fits tapped hole. Care should be taken not to use too long a screw, which could short against the semiconductor case. For correct screw lengths: Correct Screw Length (L) = Depth of Base + Panel Thickness + Washer Thickness To determine the correct mounting screw lengths, add dimensions as follows: Stud Mounting Base. #6-32 UNC. Nuts and washers not supplied. Stud hole must be slightly countersunk to ensure flat mounting. Correct Screw Length (L) = Depth of Base + EPOXY INSULATED FOR TO-5 Panel Thickness + Washer Thickness 260 SERIES 634 SERIES SLIM PROFILE UNIDIRECTIONAL FIN VERTICAL MOUNT HEAT SINK TO-220 and TO-218 These slim profile unidirectional fin heat sinks offer users two assembly alternatives for vertically mounting TO-220 and TO-218 components. Models are available with or without wave-solderable pins on 0.40 in. (10.2) centers, making them ideal for a variety of applications where quick assembly is needed and space is at a premium. Standard P/N Plain Pin Without Pin 634-10ABEP 634-15ABEP 634-20ABEP 634-10AB 634-15AB 634-20AB Height Above PC Board in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) Footprint Dimensions in. (mm) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) 0.640 (16.26) x 0.640 (16.26) Weight lbs. (grams) 0.016 (7.48) 0.025 (11.21) 0.033 (14.95) Material: Aluminum, Black Anodized. MECHANICAL DIMENSIONS TYPICAL THERMAL PERFORMANCE FOR 634-15ABP NOTES: 1. Thermal compound is assumed between device and heat sink. 2. Tab temp with longer heat sink (634-20ABP) will typically be about 15% cooler. Tab temp with shorter heat sink (634- I0ABP) will typically be about 25% higher. 260-4T5E 260-4TH5E 260-6SH5E Dimensions: in. (mm) 68 69