243-1PABE

BOARD LEVEL 0 HEAT SINKS100 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 200 100 1000 25 80 20 60 15 40 10 20 5 600 800 0 0 243 SERIES 400 200 0.5 400 1.0 600 1.5 0 1000 2.5 800 2.0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) 0 THERMAL RESISTANCE SINK TO AMBIENT (C) BOARD LEVEL HEAT SINKS 200 80 60 40 20 0 0 200 0.5 HEAT DISSIPATED (WATTS) LABOR-SAVING CLIP-ON HEAT SINKS TO-220 265 SERIES VERTICAL MOUNT HEAT SINK TO-220 H 1.000 (25.4) .800 (20.3) .800 (20.3) x .270 (6.9) .800 (20.3) x .270 (6.9) Vert./Horiz. Verl./Horiz. No Tab No Tab Clip Clip 50°C@ 2W 78°C@ 2W 4.5°C/W @ 400 LFM 8.2°C/W @ 400 LFM 265-118ABHE-22 1 .18 (30.0) Natural Convection 1.00 (25.4) x .50 (12.7) 56°C rise @ 4W Material: Aluminum, Black Anodized Material: Aluminum, Pre-anodized Black NATURAL AND FORCED CONVECTION CHARACTERISTICS 600 800 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 80 Forced Convection 7.0°C/W @ 200LFM 60 40 20 0 1 200 0 MECHANICAL DIMENSIONS 400 100 Thermal Performance at Typical Load 2 400 3 600 4 800 THERMAL RESISTANCE SINK TO AMBIENT (C) 243-1PAB 243-3PAB Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) Standard P/N Thermal Performance at Typical Load Footprint Dimensions Mounting Solderable Mounting Natural Forced in. (mm) Configuration Tab Options Style Convection Convection Height Above PC Board in. (mm) 200 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) AIR VELOCITY (LFM) 0 0 200 0 1 200 100 80 60 40 20 0 H HEAT DISSIPATED (WATTS) NATURAL AND FORCED CONVECTION CHARACTERISTICS MECHANICAL DIMENSIONS 800 1000 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 2.0 0 1000 2.5 80 8 60 6 AIR VELOCITY (LFM) 40 0 200 0 0 80 200 2 60 286DB SERIES 239 SERIES 239-75AB 239-75ABE-03 239-75ABE-04 Height Above Footprint PC Board Dimensions Mounting Solderable Mounting in. (mm) in. (mm) Configuration Tab Options Style .750 (19.1) .750 (19.1) .750 (19.1) 1.120 (28.4) x .435 (11.0) 1.120 (28.4) x .435 (11.0) 1.120 (28.4) x .435 (11.0) Vert./Horiz Vertical Vertical No Tab 03 04 Clip/Mtg Hole Clip/Mtg Hole Clip/Mtg Hole Thermal Performance at Typical Load Natural Forced Convection Convection 38°C @ 2W 6°C/W @ 400 LFM 38°C @ 2W 6°C/W @ 400 LFM 38°C @ 2W 6°C/W @ 400 LFM 200 400 4 1000 100 20 18 Height Above Maximum 80 16 Standard PC Board Footprint 14 P/N in. (mm) in. (mm) 60 12 10 (12.7) 286DBE .95 (24.1) 1.00 (25.4) x .50 40 8 6 Material: Aluminum, Black Anodized 20 4 2 0 0 1 2 3 4 5 0 200 400 600 800 1000 MECHANICAL DIMENSIONS 20 0 200 0.5 0 800 239-75AB-03 239-75AB-04 1000 10 80 8 60 6 40 4 20 2 0 200 2 400 4 600 6 600 0 1000 2.5 TO-220 800 1000 10 Natural 60 Convection 8 Forced Convection 65°C rise @ 4W 6 9.0°C/W @ 200LFM 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 800 8 0 1000 10 0 HEAT DISSIPATED (WATTS) 200 400 600 800 100 1000 10 80 8 60 6 40 4 20 2 0 0 2 200 4 400 6 600 8 800 0 10 1000 HEAT DISSIPATED (WATTS) Dimensions: in. (mm) 54 wakefield-vette.com Contact us: (603) 635-2800 0 H AIR VELOCITY (LFM) 800 100 0 400 100 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) SECTION A-A 20 HEAT DISSIPATED NATURAL AND(WATTS) FORCED CONVECTION CHARACTERISTICS THERMAL RESISTANCE SINK TO AMBIENT (C) 239-75AB NATURAL AND FORCED CONVECTION CHARACTERISTICS HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) MECHANICAL DIMENSIONS 600 800 2.0 2 200 40 15 AIR VELOCITY (LFM) 200 AIR VELOCITY (LFM) 400 600 1.5 80 Thermal Performance at Typical Load Material: Aluminum, Black Anodized 200 400 1.0 0 60 5 HEAT DISSIPATED (WATTS) 0 800 8 20 200 80 10 VERTICAL MOUNT HEAT SINK 600 600 6 0 1000 10 40 AIR VELOCITY (LFM) 400 800 0 100 HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) Standard P/N PATENT PENDING HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0 600 HEAT DISSIPATED (WATTS) 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) SNAP-DOWN SELF-LOCKING HEAT SINKS 400 4 1000 2 25 20 100 HEAT DISSIPATED (WATTS) TO-220 1000 10 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 600 800 THERMAL RESISTANCE SINK TO AMBIENT (C) 400 600 THERMAL RESISTANCE SINK TO AMBIENT (C) 200 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0 Dimensions: in. (mm) 100 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 400 100 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) VIEW B-B SECTION A-A 200 THERMAL RESISTANCE SINK TO AMBIENT (C) THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 0 55