286-AB

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS ALUMINUM AND COPPER LOW-COST WAVE-SOLDERABLE HEAT SINKS 286 SERIES Efficient heat removal at low cost can be achieved by inserting the 286 Series directly into pre-drilled circuit boards; scored mounting tabs may be bent after insertion to provide added stability. The 286 Series can be wave-soldered directly to the board. See also 286DB Series on page 55. Standard P/N 286-AB 286-CBTE 286-CTE Height Above PC Board Maximum Footprint in. (mm) in. (mm) Material 1.190 (30.2) 1.190 (30.2) 1.190 (30.2) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection Aluminum, Anodized Copper, Black Copper, Tinned 58°C @ 4W 58°C @ 4W 58°C @ 4W 7.4°CW @ 200 LFM 7.4°CW @ 200 LFM 7.4°CW @ 200 LFM Weight lbs. (grams) 0.0085 (3.86) 0.0250 (11.34) 0.0250 (11.34) Material: 286-AB style (aluminum, black anodized), 286-CBT style (copper, black paint tin tabs), and 286-CT style (copper, tinned). MECHANICAL DIMENSIONS 285 SC AND 330 SC SPEEDCLIPS™ TO-220 285 & 330 SERIES SpeedClips™ employ a locking safety tab for mounting. Must be ordered separately for these heat sink series. Use these SpeedClips™ with our 237, 240, and 252 Series heat sinks for the lowest production assembly time and cost. Order one SpeedClip™ for each heat sink purchased. Must be purchased with heat sinks. Standard P/N Nominal Installed Loading Force 285 SC 330 SC 10 lbs 4 lbs For Use With Series Material Weight lbs. (grams) 232, 237, 240, 252, 667 232, 237, 240, 252, 667 Carbon Steel Stainless Steel 0.00053 (0.24) 0.00074 (0.34) MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS Speed Clip 330 SC Speed Clip 285 SC 4 lb (17.8N) Nominal Force Installed 10 lb (44.5N) Nominal Force Installed Dimensions: in. (mm) Dimensions: in. (mm) WAVE-SOLDERABLE LOW-COST HEAT SINKS TO-220 695 SERIES 287 SERIES 287-1ABE 287-1ABH 287-2ABE 287-2ABH 1.180 (30.0) 1.180 (30.0) Thermal Performance at Typical Load Natural Forced Convection Convection Maximum Footprint “A” in. (mm) 1.000 (25.4) x 0.500 (12.7) 1.000 (25.4) x 1.000 (25.4) 65°C @ 4W 55°C @ 4W 7.8°CW @ 200 LFM 6.4°CW @ 200 LFM Stud-Mount Mount and effectively heat sink small stud-mounted diodes with the 695 Series space-saving heat sink type. Each unit is black anodized aluminum with an 0.200 in. (5.1) dia. mounting hole centered in the base. The folded fin design provides good heat dissipation for use where height is limited above the printed circuit board or base plate. Mount these cost-effective TO-220 heat sinks vertically into pre-drilled printed circuit boards. Soldered, pre-tinned tabs can be wavesoldered directly to the board. A 0.375 in. (9.5 mm) mounting slot allows for correct positioning of TO-220 and similar semiconductor packages. Height Above Standard P/N PC Board Mounting Slot Mounting Hole in. (mm) SPACE-SAVING HEAT SINKS FOR SMALL STUD-MOUNTED DIODES Weight lbs. (grams) Standard P/N Maximum Width in. (mm) 0.0090 (4.08) 0.0140 (6.35) 695-1B 1.330 (33.8) Height in. (mm) 0.530 (13.7) Thermal Performance at Typical Load Natural Forced Convection Convection 72°C @ 4.0W 5 .2°C/W @ 400 LFM Weight lbs. (grams) 0.008 (4.0) Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS MECHANICAL DIMENSIONS NATURAL AND FORCED CONVECTION CHARACTERISTICS NATURAL AND FORCED CONVECTION CHARACTERISTICS Standard P/N Dim. “A” 287-1AB 0.500 (12.7) 287-2AB 1.000 (25.4) 287-1ABH 0.500 (12.7) 287-2ABH 1.000 (25.4) Dimensions: in. (mm) 66 Dimensions: in. (mm) wakefield-vette.com Contact us: (603) 635-2800 67