218-40CTE5

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 217 SERIES SURFACE MOUNT HEAT SINKS D2PAK; TO-220; SOT-223; SOL-20 Compatible with surface mount technology (SMT) automated production techniques for ease of assembly and a variety of soldering methods, these heat sinks allow greater packaging densities and reduction in PC-board area, increasing the power dissipation of surface mount devices (SMDs) while maintaining and improving manufacturers’ component thermal specifications. 217 SERIES SURFACE MOUNT HEAT SINKS D2PAK; TO-220; SOL-20 MECHANICAL DIMENSIONS BOARD LAYOUT RECOMMENDATIONS TUBE DETAILS FEATURES AND BENEFITS • No interface material is needed • Copper with matte tin plating for improved solderability and assembly • Both the component and the heat sink are installed on the PC-board utilizing standard SMT assembly equipment for ”Tape & Reel” and “Tube” formats • EIA standards and ESD protection are specified • Can be used with water soluble or no clean SMT solder creams or other pastes Package Quantity 1 20 250 Thermal Performance at Typical Load Natural Forced Convection Convection 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM 55°C @ 1W 16.0°C/W @ 200 LFM Material: Copper, Matte Tin Plated Tube: 16.25 Inches Long, Min. esd Material with Nail Stops 20 Pieces per Tube 217-36CTT6 MECHANICAL DIMENSIONS THERMAL PERFORMANCE 6 LAYER BOARD, D’ PAK 125°C LEAD, 40°C AMBIENT SOL 20 REF: JEDEC TO-263 (DD PAK) REF: JEDEC MO-169 (DD PAK) Dimensions: in. Device Tab dT, C 218 SERIES Standard P/N SURFACE MOUNT HEAT SINK Height Above PC Board in. (mm) Maximum Footprint in. (mm) .40 (10.2) .40 (10.2) .90 (22.9) x .315 (8.0) 1.03 (26.2) x .50 (12.7) 218-40CTE3 218-40CTE5 Device Power Dissipation. W 62°C rise @ 2W 62°C rise @ 2W  Device + HS, NC  Device + HS, 100 lfm  Device + HS, 200 lfm  Device + HS, 300 lfm AIR VELOCITY (LFM) 200 400 600 AIR VELOCITY (LFM) 800 100 1000 25 80 20 60 15 40 10 20 5 0 0 200 0.5 400 1.0 600 1.5 800 2.0 0 1000 2.5 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0 NOTES 1. Material to be “ESD” 2. Approximately 6 Meters per Reel 3. 250 Pieces per Reel. 200 100 1000 25 80 20 60 15 40 10 20 5 0 218-40CT3 200 0.5 wakefield-vette.com SINK TEMPERATURE RISE OVE AMBIENT AIR (C) 0 80 60 40 20 200 400 600 400 1.0 Solid line = 218-40CT5 218-40CT5 800 600 1.5 800 2.0 0 1000 2.5 800 Dashed Line = 218-40CT3 AIR VELOCITY (LFM) AIR VELOCITY (LFM) 100 600 HEAT DISSIPATED (WATTS) 1000 20 18 16 14 12 10 8 6 4 0 SINK TEMPERATURE RISE BOVE AMBIENT AIR (C) TAPE DETAILS 400 0 HEAT DISSIPATED (WATTS) 217-36CTR6 REEL DETAILS 21°C/W @ 200LFM 21°C/W @ 200LFM NATURAL AND FORCED CONVECTION CHARACTERISTICS  Device only, NC Dimensions: in. 46 Thermal Performance at Typical Load Natural Convection Forced Convection MECHANICAL DIMENSIONS THERMAL RESISTANCE SINK TO AMBIENT (C) KEY: SMT Devices Material: Copper, Matte Tin Plated SECTION A-A 217-36CT6 217-36CT6 THERMAL RESISTANCE SINK TO AMBIENT (C) Package Format Bulk Tube Tape & Reel Contact us: (603) 635-2800 100 200 400 600 800 1000 10 80 8 60 6 40 4 20 2 MAL RESISTANCE SINK TO AMBIENT (C) Height Above PC Board Dimensions in. (mm) in. (mm) .360 (9.1) .600 (15.2) x .740 (18.8) .360 (9.1) .600 (15.2) x .740 (18.8) .360 (9.1) .600 (15.2) x .740 (18.8) AL RESISTANCE SINK TO AMBIENT (C) Footprint Standard P/N 217-36CTE6 217-36CTTE6 217-36CTRE6 47