234-75AB

AIR VELOCITY (LFM) 800 100 1000 25 80 20 60 15 40 10 BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS 20 5 0 0 1000 2.5 400 1.0 600 1.5 800 2.0 100 1000 25 80 20 60 15 40 10 20 5 0 0 200 0.5 HEAT DISSIPATED (WATTS) 80 Thermal Performance 60 Natural Convection 40 56°C rise @ 4W 20 2 400 0 TO-220 200 400 80 60 40 20 0 1 200 800 1000 10 80 8 60 6 40 4 20 2 0 400 4 .750 (19.1) .750 (19.1) .500 (12.7) .875 (22.2) .790 (20.0) .790 (20.0) .500 (12.7) Footprint Solderable Dimensions Mounting Tab Mounting in. (mm) Configuation Option Style .570 (14.5) x .500 (12.7) .570 (14.5) x .500 (12.7) .750 (19.1) x .570 (14.5) .570 (14.5) x .500 (12.7) .570 (14.5) x .500 (12.7) .570 (14.5) x .500 (12.7) .790 (20.0) x .570 (14.5) 600 6 0 1000 10 800 8 0 200 400 600 800 1000 10 100 80 8 60 6 40 4 20 2 0 0 2 200 HEAT DISSIPATED (WATTS) 4 400 6 600 234 SERIES 0 8 800 230-75AB-01 234 SERIES 234-75AB-01 77°C rise @ 4W 60 Forced Convection 15 40 12°C/W @ 200LFM 10 20 5 0 0 1000 2.5 0 MECHANICAL DIMENSIONS 200 0.5 400 1.0 600 1.5 800 2.0 1000 25 80 20 60 15 40 10 20 5 0 0 1000 2.5 0 NATURAL AND(WATTS) FORCED HEAT DISSIPATED CONVECTION CHARACTERISTICS 200 200 0.5 600 800 100 80 60 40 20 0 0 1 200 2 400 3 600 4 800 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 400 200 800 1000 10 60 6 40 4 20 2 0 1 200 2 400 3 600 4 800 0 5 1000 HEAT DISSIPATED (WATTS) AIR VELOCITY (LFM) 800 1000 10 8 6 40 4 20 2 0 0 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 80 wakefield-vette.com60 600 600 8 0 THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 50 100 400 400 80 AIR VELOCITY (LFM) 200 800 2.0 100 HEAT DISSIPATED (WATTS) 0 600 1.5 800 AIR VELOCITY (LFM) THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 200 400 1.0 600 HEAT DISSIPATED (WATTS) AIR VELOCITY (LFM) 0 400 100 200 400 600 800 1000 10 80 8 60 6 40 4 20 2 0 0 262 SERIES 0 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 20 0 234-75AB-05 100 80 60 200 HORIZONTAL AND VERTICAL MOUNT HEAT SINK AIR VELOCITY (LFM) 400 Standard P/N 600 .53 (13.4) .75 (19.1) 800 40 20 Material: Aluminum, Black Anodized 0 200 0 400 1.0 600 1.5 100 80 800 2.0 5 0 1000 2.5 200 600 80 60 40 20 0 1 200 2 400 3 600 15 20 5 0 0 200 0.5 0 200 100 600 400 1.0 600 1.5 800 2.0 NATURAL AND FORCED HEAT DISSIPATED (WATTS) CONVECTION CHARACTERISTICS 4 800 1000 20 18 16 14 12 10 8 6 4 2 0 5 1000 400 600 800 100 0 1000 2.5 1000 10 80 8 60 6 40 4 20 2 0 0 1 200 2 400 3 600 4 800 0 5 1000 HEAT DISSIPATED (WATTS) Contact us: (603) 635-2800 400 20 80°C rise @ 2W 10°C/W @ 200LFM 40 80°C rise @ 2W 10°C/W @ 200LFM10 AIR VELOCITY (LFM) AIR VELOCITY (LFM) 200 1000 25 60 HEAT DISSIPATED (WATTS) 0 800 AIR VELOCITY (LFM) 800 100 0 600 Thermal Performance at Typical Load AIR VELOCITY (LFM) 400 400 Natural Convection Forced Convection .75 (19.1) x .50 (12.78) 10 x .50 (12.7) .53 (13.4) 0 200 0.5 1000 25 15 262-75ABE-05 262-75ABE-01 0 TO-220 AIR VELOCITY (LFM) Height Above Maximum PC Board Footprint 20 in. (mm) in. (mm) MECHANICAL DIMENSIONS HEAT DISSIPATED (WATTS) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 80 100 RATURE RISE NT AIR (C) 1000 25 THERMAL RESISTANCE SINK TO AMBIENT (C) 800 THERMAL RESISTANCE SINK TO AMBIENT (C) 600 Thermal Performance at Typical Load Natural Convection 230 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS 10 1000 THERMAL RESISTANCE SINK TO AMBIENT (C) Material: Aluminum, Black Anodized .86 (21.8) x .69 (17.5) 100 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) .39 (9.9) 400 230-75AB-05 230 AND 234 SERIES AIR VELOCITY (LFM) THERMAL RESISTANCE SINK TO AMBIENT (C) 241-69ABE-03 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) Height Above Maximum Standard PC Board Footprint P/N in. (mm) in. (mm) 200 230-75AB-10 HEAT DISSIPATED (WATTS) AIR VELOCITY (LFM) 0 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM 7.5°C/W @ 400 LFM Dimensions: in. (mm) 241 SERIES HORIZONTAL MOUNT HEAT SINK Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W Clip/Mtg Hole 57°C @ 2W MECHANICAL DIMENSIONS 234-75AB TO-220 Vert./Horiz. No Tab Vertical 01 Horizontal 05 Vertical 10 Vert./Horiz No Tab Vertical 01 Horizontal 05 Thermal Performance at Typical Load Natural Forced Convection Convection THERMAL RESISTANCE SINK TO AMBIENT (C) 200 2 6 Height Above PC Board in. (mm) Material: Aluminum, Black Anodized HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 600 100 0 8 AIR VELOCITY (LFM) THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 400 1000 10 230-75AB 4 230-75ABE-01 2 230-75ABE-05 230-75ABE-10 0 234-75AB 2 3 4 5 400 600 800 1000 234-75ABE-01 HEAT DISSIPATED (WATTS) 234-75ABE-05 AIR VELOCITY (LFM) 200 800 Standard P/N 0 HEAT DISSIPATED NATURAL AND (WATTS) FORCED CONVECTION CHARACTERISTICS 0 600 100 THERMAL RESISTANCE SINK TO AMBIENT (C) MECHANICAL DIMENSIONS 1 200 1000 20 18 16 14 at Typical Load 12 10 Forced Convection8 6 7.3°C/W @ 200LFM 4 2 0 3 4 5 600 800 1000 800 1000 10 80 8 60 6 0 100 200 400 600 800 1000 10 80 8 60 6 51 NCE SINK TO (C) 0 800 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0 600 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) Material: Aluminum, Black Anodized 230 & 234 SERIES RATURE RISE NT AIR (C) 1.00 (25.4) x .50 (12.7) 100 800 2.0 THERMAL RESISTANCE SINK TO AMBIENT (C) 1.18 (30.0) 400 COMPACT, WAVE-SOLDERABLE LOW-PROFILE SELF-LOCKING HEAT SINKS 0 1000 2.5 TO-220 600 1.5 BOARD LEVEL HEAT SINKS THERMAL RESISTANCE SINK TO AMBIENT (C) Maximum Footprint in. (mm) 200 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 206-1PABEH Height Above PC Board in. (mm) 0 800 AIR VELOCITY (LFM) AIR VELOCITY (LFM) VERTICAL MOUNT HEAT SINK HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) Standard P/N 400 1.0 600 HEAT DISSIPATED (WATTS) THERMAL RESISTANCE SINK TO AMBIENT (C) 206 SERIES 400 ANCE SINK TO T (C) 200 0.5 200 THERMAL RESISTANCE SINK TO AMBIENT (C) 0 0 THERMAL RESISTANCE SINK TO AMBIENT (C) AIR VELOCITY (LFM) 600 THERMAL RESISTANCE SINK TO AMBIENT (C) 400 HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) BOARD LEVEL HEAT SINKS 200 THERMAL RESISTANCE SINK TO AMBIENT (C) HEAT SINK TEMPERATURE RISE ABOVE AMBIENT AIR (C) 0