THERMAL MANAGEMENT
SOLUTIONS & THERMAL INTERFACE
Thermal Management Solutions for BGAs............. 7
Thermal Interface ........................................... 8
THERMAL MANAGEMENT
SOLUTIONS FOR BGAs
BGA THERMAL SOLUTIONS MATRIX
The following table represents Wakefield-Vette’s recommendations for a variety of standard BGA sizes. However, this
is by no means a complete list of components that can be used with these heat sinks. To determine suitability for your
particular component, request a BGA heat sink evaluation kit.
BGA
Sizes (mm)
17
19
21
21
23
23
25
27
29
31
31
33
35
35
35
37.5
37.5
45.7 x 35.5
40
37.5
40
40
42.5
45
45
47.5
50
50
50
50
50
up to 45
up to 45
Heat Sink
Footprint (mm)
Heat Sink Height
(inches)
Recommended
Series #
Attachment
Method
17 x 17
19 x 19
21 x 21
21 x 21
22 x 22
22 x 22
25 x 25
28 x 28
30 x 30
31 x 28
31 x 31
32 x 32
35 x 35
35 x 35
35 x 35
37 x 37
37 x 37
37 x 47
38 x 38
38 x 38
40 x 28
40 x 40
41 x 41
43 x 43
43 x 43
47 x 47
50 x 50
51 x 51
52 x 51
53 x 47
64 x 51
73 x 50
73 x 50
.40
1.00
.40
.25 .35 .45 .60
.40 .60
.75
.25 .35 .45 .60
.25 .35 .45 .60
.77
.65
.80
.35 .40
.65
.25 .35 .45 .60
.25 .35 .45 .60
.50
.65
.80
.30 .50 1.00
.29
.35
.26 .53
.41
.20 .25 .35 .45 .60
.15
.80
.40 .65 .80 1.00
.20 1.00
.80
.40 .65 .80 1.00
.24
.50 1.00
.95
D10650
602
D10850
624
604
605
625
658
606
607
611
610
612
642
630
613
659
617
614
660
643
655
615
628
662
616
698
618
622
798
620
609
619
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Clip
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Adhesive
Clip
Clip
RoHS COMPLIANCE
Please note that Wakefield-Vette part numbers designated with an “E” in this catalog denote new parts in compliance
with the RoHS initiative, with the exception of our Precision Clamps. Wakefield-Vette will still continue to offer nonRoHS compliant versions of these parts. Please be aware that many Wakefield-Vette Standard parts have always been
compliant since their design inception and therefore will not carry the “E” designation.
Wakefield-Vette requests that you refer to the RoHS compliance tool on our website at www.wakefield-vette.com to
verify RoHS compliance. If you require further clarification or information regarding RoHS, please contact the factory.
Contact us: (603) 635-2800
7
THERMAL INTERFACE
THERMAL INTERFACE MATERIAL PART NUMBER GUIDE
All of the heat sinks shown in this catalog are available with any of the following thermal tape and interface materials,
pre-applied at the factory. Use the “T” series, thermally enhanced, pressure sensitive adhesives to attach the heat sink to
the electronic package and provide a good thermal link to the heat sink. Specify these materials in applications where the
heat sink will be fixed to the electronic package by some mechanical means other than a tape. Please note that none of
these materials are for use in applications requiring electrical isolation from the electronic device. All options other than
-T1 and -T4 are RoHS compliant.
Note: To obtain the estimated thermal resistance of the interface material in your application, divide the thermal
impedance value by the area of the pad in square inches. For example, a 2” x 2” piece of T4 has a resistance of 1.10
C-in^2/W v 4 in^2=0.275 C/W
“T” Series Thermally Enhanced Pressure Sensitive Adhesives
Manufacturer
Thermal Impedance
Thickness,
Suffix
Product
C-in^2/W
Inches
-T1
Chomerics, T405
0.47
0.006
-T1E
Chomerics, T405R
0.47
0.006
-T3
Chomerics, T412
0.25
0.009
-T4
Chomerics, T410
1.10
0.007
-T4E
Chomerics, T410R
1.10
0.007
-T5
Chomerics, T411
1.00
0.011
-T6
3M, 8810
0.88
0.010
-T7
Bergquist, BP 108
1.28
0.008
Package Surface, Comments
Metal/ceramic; aluminum carrier
RoHS-compliant version of -T1
Metal/ceramic; very good
performance and conformity
Plastic
RoHS-compliant version of -T4
Plastic; conforms to out-of-flat packages
Metal/ceramic; very good
adhesion and conformity
Metal/ceramic; electrically insulating
ORDERING INFORMATION
Once you have chosen heat sink and thermal interface material that meets your thermal & mechanical
requirements it is easy to designate the part number. Simply add the interface material suffix referenced
on the chart above to the base part number for the heat sink. The base part number already includes
information regarding its size and finish.
Example:
To order the 658 Series heat sink at .350” tall with the T5 thermal interface material, specify part number:
8
658-35AB - T5
From Catalog Page XX
From Table on Page XX
wakefield-vette.com
INTEGRATED CIRCUIT
COOLING
TITLE
HEAT SINKS
Heat Sinks For BGAs, Super BGAs, & FPBGAs .................... 12–27
Deltem™ Composite Heat Sinks For BGAs ........................ 18
Heat Sinks For Microprocessors & ASICs .......................... 28–30
Pin Fin Heat Sinks ....................................................... 31
Elliptical Fin Heat Sinks ................................................ 32
Pin Fin & Elliptical Fin Heat Sinks .................................. 33
Ceramic Heat Sink For To Devices w/ OmniKlip ................ 34–35
Wave Series Heat Sink With Integrated Clip Assembly ....... 36–43
With the increase in heat dissipation from microelectronics devices and the reduction
in overall form factors, thermal management becomes a more important element of
electronic product design.
Both the performance reliability and life expectancy of electronic equipment are inversely
related to the component temperature of the equipment. The relationship between the
reliability and the operating temperature of a typical silicon semi-conductor device
shows that a reduction in the temperature corresponds to an exponential increase in the
a component may be achieved by effectively controlling the device operating temperature
within the limits set by the device design engineers.
Heat sinks are devices that enhance heat dissipation from a hot surface,usually the
case of a heat generating component, to a cooler ambient, usually air. For the following
discussions, air is assumed to be the cooling fluid. In most situations, heat transfer across
the interface between the solid surface and the coolant air is the least efficient within the
system, and the solid-air interface represents the greatest barrier for heat dissipation. A
heat sink lowers this barrier mainly by increasing the surface area that is in direct contact
with the coolant. This allows more heat to be dissipated and/or lowers the device operating
temperature. The primary purpose of a heat sink is to maintain the device temperature
below the maximum allowable temperature specified by the device manufacturers.
INTEGRATED CIRCUIT COOLING HEAT SINKS
reliability and life expectancy of the device. Therefore, long life and reliable performance of
11
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, & FPBGAs
659 SERIES
624 SERIES
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
The 624 Series is an omnidirectional pin fin heat sink for both natural and
forced-convection applications.
PRODUCT FEATURES
Applications include network routers and switches, high-resolution
printers, digital cameras, consumer video games, digital video disks (DVD)
and global positioning systems (GPS).
• Available in four standard
heights, .25 inch, .35 inch,
.45 inch, and .60 inch.
Standard
P/N
624-25AB
624-35AB
624-45AB
624-60AB
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
Base Dimensions
in. Sq.
.827 (21)
.827 (21)
.827 (21)
.827 (21)
Fin Height
“A”
Typical
in. (mm)
Applications
.250 (6.4)
21mm BGA
.350 (8.9)
21mm BGA
.450 (11.4)
21mm BGA
.600 (15.2)
21mm BGA
•
Weight
lbs. (grams)
.009 (4.09)
.011 (4.99)
.015 (6.81)
.026 (11.80)
Standard
P/N
Base Dimensions
in. (mm)
Height
in. (mm)
Typical
Application
659-65AB
1.45 (36.8) sq 0
.650 (16.5)
37mm BGA
Heat Sink
Finish
Weight
lbs. (grams)
Black Anodized
0.050 (22.68)
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
Available with pressure
sensitive adhesives for
quick and easy mounting.
See Page 8.
Dimensions: in. (mm)
Case-to-Ambient Thermal Resistance, C/W
Material: Aluminum, Black Anodized
MECHANICAL DIMENSIONS
624
624 THERMAL PERFORMANCE
Series Heat Sink Thermal Performance
655 SERIES
30
624-25-T4
624-35-T4
25
624-45-T4
624-60-T4
20
Standard Base Dimensions Dimension “A” Dimension “B”
Typical
P/N
in. (mm)
in. (mm)
in. (mm)
Applications
15
655-26AB
655-53AB
10
5
200
300
400
500
0.260 (6.6)
0.525 (13.3)
0.125 (3.2)
0.145 (3.7)
40mm BGA
40mm BGA
Black Anodized
Black Anodized
Weight
lbs. (grams)
0.038 (17.01)
0.050 (22.68)
PRODUCT FEATURES
• Available in four standard
heights, .25 inch, .35 inch,
.45 inch, and .60 inch.
MECHANICAL DIMENSIONS
625 SERIES
Applications include network routers and switches, high-resolution
printers, digital cameras, consumer video games, digital video disks
(DVD) and global positioning systems (GPS).
Standard
P/N
Base Dimensions
in. Sq.
625-25AB
625-35AB
625-45AB
625-60AB
.984 (25)
.984 (25)
.984 (25)
.984 (25)
Fin Height
“A”
Typical
Weight
in. (mm)
Applications
lbs. (grams)
0.250 (6.4)
0.350 (8.9)
0.450 (11.4)
0.600 (15.2)
25 mm BGA
25 mm BGA
25 mm BGA
25 mm BGA
.012 (5.45)
.014 (6.36)
.018 (8.17)
.030 (13.62)
Material: Aluminum, Black Anodized
Case-to-Ambient Thermal Resistance, C/W
Dimensions: in. (mm)
The 625 Series is an omnidirectional pin fin heat sink for both natural
and forced-convection applications.
Available with pressure
sensitive adhesives for
quick and easy mounting.
See Page 8.
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Dimensions: in.
600
Approach Velocity, LFM
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
12
1.600 (40.6) sq
1.600 (40.6) sq
Heat Sink
Finish
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
0
Performance shown is with T4 thermal adhesive applied.
•
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
AND POWERPC™
16
625-45-T4
658-25AB
658-35AB
658-45AB
658-60AB
Base Dimensions Dimension “A”
in. (mm)
in. (mm)
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
1.100 (27.9) sq
0.250 (6.4)
0.350 (8.9)
0.450 (11.4)
0.600 (15.2)
Typical
Applications
27mm BGA
27mm BGA
27mm BGA
27mm BGA
MECHANICAL DIMENSIONS
20
625-25-T4
Standard
P/N
658 SERIES
Heat Sink
Finish
Weight
lbs. (grams)
Black Anodized
Black Anodized
Black Anodized
Black Anodized
0.013 (5.67)
0.015 (6.70)
0.019 (8.50)
0.031 (14.17)
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
625
THERMAL PERFORMANCE
625
Series Heat Sink Thermal Performance
18
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
AND POWERPC™
MECHANICAL DIMENSIONS
625-25-T4
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
625-60-T4
14
12
10
KEY:
658-25AB
+ 658-35AB
658-45AB
o 658-60AB
8
6
4
2
0
200
300
400
Approach Velocity, LFM
Performance shown is with T4 thermal adhesive applied.
500
600
Dimensions: in.
Dimensions: in. (mm)
13
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, & FPBGAs
662 SERIES
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR LIMITED HEIGHT BGAs
660 SERIES
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
Standard
P/N
Base Dimensions
in. (mm)
Height
in. (mm)
Typical
Application
Heat Sink
Finish
Weight
lbs. (grams)
660-29AB
1.530SQ. (38.9)SQ.
0.285 (7.2)
37mm BGA
Black Anodized
0.031 (14.17)
Standard
P/N
Base Dimensions
in. (mm)
662-15AG 1.713 (43.5) sq
662-15AB 1.713 (43.5) sq
Height
in. (mm)
0.150 (3.8)
0.150 (3.8)
T
ypical
Applications
4
5mm BGA
45mm BGA
Heat Sink
Finish
Weight
lbs. (grams)
Gold Iridite
0.019 (8.50)
Black Anodized 0
.019 (8.50)
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
MECHANICAL DIMENSIONS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
Dimensions: in. (mm)
Dimensions: in. (mm)
628 SERIES
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
642 SERIES
PRODUCT FEATURES
The 642 Series is an unidirectional pin fin heat sink for both natural and
forced-convection applications.
• Available in four standard
heights, .25 inch, .35 inch,
.45 inch, and .60 inch.
Applications include network routers and switches, high-resolution
printers, digital cameras, consumer video games, digital video disks (DVD)
and global positioning systems (GPS).
•
Available with pressure
sensitive adhesives for
quick and easy mounting.
See Page 8.
Standard
P/N
642-25AB
642-35AB
642-45AB
642-60AB
Base Dimensions Fin Height “A”
in. Sq.
in. (mm)
1.378 (35)
.250 (6.4)
1.378 (35)
.350 (8.9)
1.378 (35)
.450 (11.4)
1.378 (35)
.600 (15.2)
Standard
P/N
Typical
Applications
35 mm BGA
35 mm BGA
35 mm BGA
35 mm BGA
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
Base Dimensions
in. (mm)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
1.750 (44.5) x 1.700 (43.2)
Dimensions “A”
Typical
in. (mm)
Applications
0.200 (5.1)
0.250 (6.4)
0.350 (8.9)
0.400 (10.2)
0.650 (16.5)
45mm BGA
45mm BGA
45mm BGA
45mm BGA
45mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Black Anodized
B
lack Anodized
Black Anodized
Weight
lbs. (grams)
0.031 (14.17)
0.038 (17.01)
0.044 (19.84)
0.050 (22.68)
0.056 (25.51)
Notes: 1. Optional factory pre-applied pressure-sensitive adhesive. See Page 8.
NATURAL CONVECTION CHARACTERISTICS
MECHANICAL DIMENSIONS
Weight
lbs. (grams)
.022 (9.99)
.027 (12.26)
.031 (14.07)
.039 (17.71)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
642
THERMAL PERFORMANCE
642
Series
Heat Sink Thermal Performance
Case-to-Ambient Thermal Resistance, C/W
MECHANICAL DIMENSIONS
14
642-25-T4
642-35-T4
12
642-45-T4
8
6
4
Dimensions: in. (mm)
2
0
200
300
400
500
Approach Velocity, LFM
Performance shown is with T4 thermal adhesive applied.
14
FORCED CONVECTION CHARACTERISTICS
642-60-T4
10
600
KEY:
628-20AB
628-25AB
628-35AB
628-40AB
628-65AB
15
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, & FPBGAs
798 SERIES
PIN FIN HEAT SINK FOR BGAs
630 SERIES
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
The 630 Series is an omnidirectional pin fin heat sink for both
natural and forced-convection applications.
PRODUCT FEATURES
Applications include network routers and switches, highresolution printers, digital cameras, consumer video games,
digital video disks (DVD) and global positioning systems (GPS).
• Available in four standard
heights, .25 inch, .35 inch,
.45 inch, and .60 inch.
Standard
P/N
Base Dimensions
in. Sq.
630-25AB
630-35AB
630-45AB
630-60AB
1.378 (35)
1.378 (35)
1.378 (35)
1.378 (35)
Fin Height
“A”
Typical
Weight
in. (mm)
Applications
lbs. (grams)
.250 (6.4)
. 350 (8.9)
.450 (11.4)
.600 (15.2)
35mm BGA
35mm BGA
35mm BGA
35mm BGA
.009 (4.09)
.011 (4.99)
.015 (6.81)
.026 (11.80)
•
Standard
P/N
Base Dimensions
in. (mm)
798-40AB
798-65AB
798-80AB
798-100AB
Dimensions “A”
in. (mm)
2.100 (53.3) x 1.860 (47.2)
2.100 (53.3) x 1.860 (47.2)
2.100 (53.3) x 1.860 (47.2)
2.100 (53.3) x 1.860 (47.2)
0
.400 (10.2)
0
.650 (16.5)
0.800 (20.3)
1.000 (25.4)
Typical
Applications
45mm BGA
45mm BGA
45mm BGA
45mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Black Anodized
Black Anodized
0.063 (28.35)
0.106 (48.19)
0.113 (51.03)
0.131 (59.53)
FORCED CONVECTION THERMAL PERFORMANCE DATA
(FLOW PARALLEL TO EXTRUSION DIRECTION)
MECHANICAL DIMENSIONS
Available with pressure
sensitive adhesives for
quick and easy mounting.
See Page 8.
Weight
lbs. (grams)
Material: Aluminum, Black Anodized
Dimensions: in. (mm)
MECHANICAL DIMENSIONS
630 THERMAL PERFORMANCE
NOTES:
KEY:
798-40AB
1 . Heat sink mounting surface flatness: 0.004” TIR
798-65AB
798-80AB
798-100AB
2. Optional factory pre-applied pressure-sensitive adhesive.
See Page 8.
643 SERIES
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
The Series 643-35AP is an omnidirectional pin fin heat sink for both
natural and forced-convection applications designed to fit a 40 mm BGA.
•
Applications include network routers and switches, high-resolution
printers, digital cameras, consumer video games, digital video disks
(DVD) and global positioning systems (GPS).
Dimensions: in.
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
698 SERIES
Standard
P/N
643-35AP
Standard
P/N
Base Dimensions
in. (mm)
Dimensions “A”
in. (mm)
Typical
Applications
698-40AB
698-65AB
698-80AB
698-100AB
2.100 (53.3) sq.
2.100 (53.3) sq.
2.100 (53.3) sq.
2.100 (53.3) sq.
0.400 (10.2) sq.
0.650 (16.5) sq.
0.800 (20.3) sq.
1.000 (25.4) sq.
45mm BGA
45mm BGA
45mm BGA
45mm BGA
Heat Sink
Finish
Black Anodized
Black Anodized
Black Anodized
Black Anodized
Weight
lbs. (grams)
Base Dimensions
in. (mm)
1.60 (40.64) x 1.10 (27.94)
Fin Height
in. (mm)
0.350 (8.89)
Typical
Applications
Weight
lbs. (grams)
40 mm BGA
.070 (31.78)
0.075 (34.02)
0.119 (53.86)
0.125 (56.70)
0.144 (65.20)
643 THERMAL PERFORMANCE
919541
Series Heat Sink Thermal Performance
FORCED CONVECTION THERMAL PERFORMANCE DATA
(FLOW PARALLEL TO EXTRUSION DIRECTION)
KEY:
698-40AB
698-65AB
698-80AB
698-100AB
Dimensions: in. (mm)
be purchased without
heat sink)
MECHANICAL DIMENSIONS
Case-to-Ambient Thermal Resistance, C/W
MECHANICAL DIMENSIONS
Available with pressure
sensitive adhesives to
ensure good thermal
performance. See page 8.
• Can be ordered with
the 829SC clip. Order clip
separately. (Clip cannot
Material: Aluminum, Plain Finish
Notes: 1. Optional factory preapplied pressure-sensitive adhesive. See Page 8.
16
PRODUCT FEATURES
10
9
8
7
6
5
4
3
2
1
0
0
Dimensions: in.
100
200
300
400
500
600
700
Approach Air Velocity, LFM
Performance shown is with S5 interface material applied.
17
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
DELTEM™ COMPOSITE HEAT SINKS FOR BGAs
DELTEM™ D10650-40
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, & FPBGAs
PIN FIN HEAT SINK FOR BGAs HEAT SINK/CLIP
ASSEMBLY FOR BGAs AND POWERPC™ PACKAGES
PIN FIN HEAT SINK
Standard
Base Dimensions
Height
P/N
in. (mm)
in. (mm)
Weight
lbs. (grams)
D10650-40
0.004 (1.91)
0.650 (16.5) sq
0.400 (10.2)
Standard
P/N
609-50AB
609-100AB
Base Dimensions
in. (mm)
Dimensions “A”
in. (mm)
Typical
Applications
0
.500 (12.7)
1.00 (25.4)
40&45mm BGA
40&45mm BGA
2.895 (73.5) x 2.000 (50.8)
2.808 (71.32) x 1.700 (43.2)
Heat Sink
Finish
Black Anodized
Black Anodized
Height
in. (mm)
Typical
Applications
Weight
lbs. (grams)
0.850 (21.6) sq
0.400 (10.2)
21mm BGA
0.006 (3.9)
THERMAL RESISTANCE
SINK TO AMBIENT (ϒC/WATT)
D10850-40
DELTEM™ D10850-40
Base Dimensions
in. (mm)
2.808
Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 8.
5
4
609-50AB
* 609-100AB
3
2
1
0
100
200
300
AIR VELOCITY (LFM)
400
500
*Performance is for shrouded conditions.
609-100 will perform better than 609-50 in
cases with bypass.
“A”
DIM.
(609-50AB)
MECHANICAL DIMENSIONS
DELTEM™ D10650-40 PIN FIN HEAT SINK
0.094 (42.5)
0.130 (59.0)
FORCED CONVECTION THERMAL PERFORMANCE DATA
(FLOW PARALLEL TO EXTRUSION DIRECTION)
MECHANICAL DIMENSIONS
Standard
P/N
Weight
lbs. (grams)
Note: Optional factory pre-applied thermal interface material.
S3 (Bergquist Q-Pad 3, 0.14 °C in2/w)
S4 (Bergquist Softface, 0.07 °C in2/w)
Notes: Available with pressure sensitive adhesives for quick and easy mounting. See Page 8.
PIN FIN HEAT SINK
609 SERIES
(609-100AB)
DELTEM™ D10850-40 PIN FIN HEAT SINK
609-50AB HEAT SINK
AND CLIP ASSEMBLY
Designed to fit a .063” thick PCB
electronic package thickness of .110”
Dimensions: in. (mm)
619 SERIES
Standard
P/N
Dimensions: in. (mm)
Base Dimensions
in. (mm)
Height
in. (mm)
Typical
Applications
Heat Sink
Finish
61995AB124D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA Black Anodized
61995AB054D1 2.871 (72.92) x 1.98 (50.29) 0.953 (24.21) 40&45mm BGA Black Anodized
Dimensions: in. (mm)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
FAN HEAT SINK FOR BGA AND POWERPC™ PACKAGES
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Thermal
Performance
Weight
lbs.(grams)
1.2° C/W
1.2° C/W
.150 (68.10)
.150 (68.10)
Note: O
ptional factory pre-applied thermal interface material. See 609 series.
MECHANICAL DIMENSIONS
AIR VELOCITY (LFM)
600
800
1000
0
30
80
25
20
60
15
40
10
20
5
0
0
0
0.25
0.50
0.75
HEAT DISSIPATED (WATTS)
1.00
1.25
200
400
600
800
FEATURES AND BENEFITS
1000
16
100
14
80
12
10
60
8
40
6
4
20
2
0
THERMAL RESISTANCE SINK TO
AMBIENT (C)
400
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
200
100
THERMAL RESISTANCE SINK TO
AMBIENT (C)
HEAT SINK TEMPERATURE RISE
ABOVE AMBIENT AIR (C)
0
AIR VELOCITY (LFM)
• Captivated clips for ease of assembly.
• Low acoustic noise.
• Impingement air flow.
• Accommodates BGA packages up
to 45 mm in size.
0
0
0.25
0.50
0.75
1.00
1.25
HEAT DISSIPATED (WATTS)
See 609 Series for PCB hole layout for clip attachment
18
Dimensions: in.
19
Thermal Interface Material Option
Blank
None
S3
Bergquist Qpad 3
S4
Bergquist Softface
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
Height
in. (mm)
Heat Sink
Finish
Weight
lbs. (grams)
Standard
P/N
Base Dimensions
in. (mm)
Height
in. (mm)
.750 (19.1) sq
1.000 (25.4)
Plain
.021 (9.59)
605-75AB
.880 (22.4) sq
.750 (19.1)
2
1
300
400
500
600
700
8
6
4
604-60AB
2
0
100
200
300
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
604 SERIES
4
3
2
Weight
lbs. (grams)
200
300
400
500
.012 (5.60)
AIR VELOCITY (LFM)
.016 (7.47)
600
700
7
6
5
4
2
3
4
2
3
1
2
12
604-40AB
10
8
6
4
604-60AB
0
2
100
1
700
200
0
100
300
400
500
600
700
AIR VELOCITY (LFM)
200
300
400
500
600
700
3
606 SERIES
2
200
400
7
6
5
4
7
6
5
8
7
6
4
3
2
1
200
300
400
500
600
700
7
6
5
4
3
2
1
0
100
300
400
Standard
500
600
P/N
500
600
700 Base Dimensions
in. (mm)
1.185 (30.1) sq
700
604-40AB
10
7
8
6
6
5
4
4
2
3
0
2
100 Height
200
1
.767 (19.5)
0
100
Heat Sink
400
500
300
in. (mm)
200
600
Finish
AIR VELOCITY (LFM)
Weight
700
lbs. (grams)
Black Anodized
300
400
500
.041 (18.7)
600
700
AIR VELOCITY (LFM)
MECHANICAL DIMENSIONS
606 THERMAL PERFORMANCE
10
9
8
7
6
5
4
3
2
1
0
100
8
7
7
6
6
5
4
3
5
4 7
610-35AB
3 6
2
1
2 5
610-40AB
1 4
0
100
200
300
400
500
AIR VELOCITY (LFM)
200
5
UNIDIRECTIONAL FIN HEAT604-60AB
SINK FOR BGAs
1
300
400
500
AIR VELOCITY (LFM)
NCE SINK TO
(C)
5
4
300
AIR VELOCITY (LFM)
ANCE SINK TO
CE
SINK TO
T (C)
C)
TANCE SINK TO
NT (C)
6
5
Material: Aluminum, Black Anodized
10
9
8
7
6
5
4
3
2
1
0
100
6
12
0
100
200
7
14
6
606-77AB
wakefield-vette.com
7
0
100
AIR VELOCITY (LFM)
1
L RESISTANCE SINK TO
AMBIENT (C)
5
600
700
2
8
0
100
700
AIR VELOCITY (LFM)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
4
14
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE
SINK(C)
TO
AMBIENT
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
6
8
600
7
0
100
3
604 THERMAL PERFORMANCE
7
AIR VELOCITY (LFM)
20
500
AIR VELOCITY (LFM)
7
5
400
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE
SINK TO
AMBIENT
(C)
AMBIENT (C)
200
10
8
6
500
.030
(13.5)
AIR VELOCITY (LFM)
600
4
605 THERMAL PERFORMANCE
604-40AB
AIR VELOCITY (LFM)
400
500
6
600
700
600
700
0 3
100
2
300
400
500
600
700
AIR VELOCITY (LFM)
200
300
400
500
600
700
8
7
6
5
4
3
2
100
AIR VELOCITY (LFM)
6
Contact us: (603) 635-2800
5
3
200
1
0
100
7
4
THERMAL RESISTANCE SINK TO
AMBIENT (C)
3
Black Anodized
Black Anodized
7
300
400
8
614-30AB
10
9
8
7
66
21
610-35AB
K TO
4
Heat Sink 1
Finish
0
100
MECHANICAL DIMENSIONS
200
300
10
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
12
Material: Aluminum, Black Anodized
0
100
Black Anodized
200
Weight
lbs. (grams)
12
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
.400 (10.2)
.600 (15.2)
1
100
14
AIR VELOCITY (LFM)
.850 (21.6) sq
.850 (21.6) sq
2
Heat Sink
0
Finish
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
7
0
100
604-40AB
604-60AB
605 SERIES
3
MECHANICAL DIMENSIONS
602 THERMAL PERFORMANCE
Height
in. (mm)
4
THERMAL RESISTANCE SINK TO
THERMAL RESISTANCE SINK
TO (C)
AMBIENT
AMBIENT (C)
MECHANICAL DIMENSIONS
Base Dimensions
in. (mm)
5
14
Material: Aluminum, Black Anodized
Material: Aluminum, Plain Finish
Standard
P/N
THERMAL RESISTANCE SINK TO
AMBIENT (C)
Base Dimensions
in. (mm)
602-100AP
6
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
Standard
P/N
7
ANCE SINK TO
O (C)
T
602 SERIES
THERMAL RESISTANCE SINK TO
AMBIENT (C)
HEAT SINKS FOR BGAs, SUPER BGAs, PBGAs, & FPBGAs
8
1
0
100
INTEGRATED CIRCUIT
COOLING HEAT SINKS
200
300
400
500
600
700
604-60AB
0
100
2
0
100
200
300
400
500
600
6
5
607-65AB
1.200 (30.5) x 1.105 (28.1)
3
2
Height 1
in. (mm)
0
Heat Sink
Finish
.650 (16.5)
100
Weight
lbs. (grams)
Anodized
200 Black 300
400
500.041 (18.7)
600
700
600
700
0
100
INTEGRATED CIRCUIT
COOLING HEAT SINKS
7
6
5
7
6
5
4
3
2
611 SERIES
1
UNIDIRECTIONAL FIN HEAT SINK FOR
BGAs
4
0
100
3
2
1
0
100
AIR VELOCITY (LFM)
Material: Aluminum, Black Anodized
500
700
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
7
4
UNIDIRECTIONAL FIN HEAT
SINK FOR BGAs
Base Dimensions
in. (mm)
400
AIR VELOCITY (LFM)
HEAT SINKS FOR BGAs, SUPER BGAs,
PBGAs, & FPBGAs
8
Standard
P/N
300
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
607 SERIES
200
T
4
Standard
P/N
Base Dimensions
in. (mm)
611-80AB
1.200 (30.5) sq
200 Material:
300 Aluminum,
400
500Anodized
600
Black
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMA
THERM
2
200
300
400
500
Height
in. (mm)
Heat Sink
Finish
AIR VELOCITY
Weight (LFM)
.800 (20.3)
Black Anodized
.036 (16.3)
600
700
lbs. (grams)
10
9
8
7
6
5
4
3
2
1
0
100
700
AIR VELOCITY (LFM)
3
2
1
0
100
200
300
400
500
600
700
10
8
7
604-40AB
6
5
6
4
4
3
2
2
1
0
100
604-60AB
200
300
0
100
AIR VELOCITY (LFM)
611 THERMAL PERFORMANCE
THERMAL RESISTANCE SINK TO
AMBIENT (C)
4
12
MECHANICAL DIMENSIONS
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
14
200
400
500
AIR VELOCITY (LFM)
300
400
600
700
500
600
700
AIR VELOCITY (LFM)
10
9
8
7
6
5
4
3
2
1
0
100
610-35AB
610-40AB
7
6
5
4
3
2
1
0
100
200
300
400
500
600
THERMAL RESISTANCE SINK TO
AMBIENT (C)
607 THERMAL PERFORMANCE
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
MECHANICAL DIMENSIONS
200
300
400
500
600
700
8
7
6
5
4
3
2
100
AIR VELOCITY (LFM)
700
8
2
1
Standard
0
P/N
100
610-35AB
610-40AB
Base Dimensions
in. (mm)
200
300
400
500
1.240 (31.5)
sq
AIR VELOCITY (LFM)
1.240 (31.5) sq
Height
in. (mm)
600
.350 (8.9)
.400 (10.2)
700
Heat Sink
Finish
4
3
2
1
610
6 SERIES
0
100
Black Anodized
Black Anodized
Material: Aluminum, Black Anodized
5
4
Weight
3lbs. (grams)
(10.0)
2.022
200
300
.024 (10.8)
1
MECHANICAL DIMENSIONS
5
4
3
2
1
0
100
200
300
400
500
AIR VELOCITY (LFM)
600
700
10
9
8
7
6
5
4
3
2
1
0
100
TANCE SINK TO
NT (C)
6
5
4
ANCE SINK TO
T (C)
wakefield-vette.com
7
600
700
200
300
400
500
600
700
614-30AB
6
610-40AB
5
4
3
2
200
300
400
500
600
AIR VELOCITY (LFM)
300
400
500
AIR VELOCITY (LFM)
8
7
6
700
1
200
614-30AB
612 SERIES
6
5
614-100AB (dashed)
4
614-50AB
3
2
100
200
300
6
5
UNIDIRECTIONAL
FIN HEAT SINK FOR BGAs
4
3
Standard
P/N
Base Dimensions
2
in. (mm)
612-65AB
1.390 (35.3) sq 1
Material: Aluminum, Black Anodized
0
100
Height
in. (mm)
Heat Sink
Finish
Weight
lbs. (grams)
.650 (16.5)
Black Anodized
.054 (24.5)
200
300
400
500
600
700
AIR VELOCITY (LFM)
612 THERMAL PERFORMANCE
400
500
600
700
MECHANICAL
DIMENSIONS
AIR VELOCITY (LFM)
610-35AB
0
100
22
500
7
AIR VELOCITY (LFM)
610 THERMAL PERFORMANCE
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
0
100
400
AIR VELOCITY (LFM)
8
THERMAL RESISTANCE SINK TO
AMBIENT (C)
OMNIDIRECTIONAL PIN FIN HEAT SINK FOR BGAs
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
3
5
THERMAL RESISTANCE SINK TO
AMBIENT (C)
4
6
600
700
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
AIR VELOCITY (LFM)
8
7
614-30AB
6
5
2
1
200
200
300
400
300
400
500
600
700
AIR VELOCITY (LFM)
614-50AB
3
2
100
3
0
100
614-100AP (dashed)
4
4
500
600
700
AIR VELOCITY (LFM)
Contact us: (603) 635-2800
23
8
7
6
5
4
3
2
100
2
200
300
400
500
600
0
0
100
200
300
400
500
600
700
100
200
300
400
500
600
700
700
AIR VELOCITY (LFM)
THERMA
0
100
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
300
400
500
600
700
INTEGRATED CIRCUIT
COOLING HEAT SINKS
8
7
7
5
4
3
613 SERIES
2
1
200
300
400
500
Standard
AIR VELOCITY
(LFM)
600
P/N
613-50AB
6
5
5
4
4
3
THERMAL RESISTANCE SINK TO
AMBIENT (C)
HEAT SINKS FOR BGAs, SUPER BGAs,
PBGAs, & FPBGAs
6
7
6
0
100
UNIDIRECTIONAL
2 FIN HEAT SINK FOR BGAs
3
700
Base Dimensions
in. (mm)
1.450 (36.8) sq
2
1
1
0
Height
100
0in. (mm)
100
200
200
.500 (12.7)
300
Heat Sink
300
400
Finish
Weight
600
700
lbs. (grams)
500
AIR VELOCITY (LFM)
400
500
600
Black Anodized
700
.046 (20.8)
AIR VELOCITY (LFM)
Material: Aluminum, Black Anodized
8
7
614-30AB
6
5
614-50AB
3
2
100
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
614-100AB (dashed)
4
200
300
Standard
P/N
400
500
615-41AB
Base Dimensions
in. (mm)
600
AIR VELOCITY (LFM)
700
1.600 (40.6) sq
615 SERIES
Height
in. (mm)
Heat Sink
Finish
Weight
lbs. (grams)
.410 (10.4)
Black Anodized
.046 (21.0)
Material: Aluminum, Black Anodized
7
6
4
5
3
4
2
3
1
0
100
200
300
400
500
600
700
AIR VELOCITY (LFM)
2
1
10 613 THERMAL PERFORMANCE
9
8
610-35AB
7
6
5
610-40AB
4
3
2
1
0
100
200
300
400
500
0
100
200
300
AIR
VELOCITY
(LFM)
400
500
600
600
700
MECHANICAL DIMENSIONS
8
7
615 THERMAL PERFORMANCE
THERMAL RESISTANCE SINK TO
AMBIENT (C)
MECHANICAL DIMENSIONS
5
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
200
AIR VELOCITY (LFM)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
INTEGRATED CIRCUIT
COOLING HEAT SINKS
3
2
1
0
100
614-30AB
6
5
614-100AP (dashed)
4
614-50AB
3
2
100
200
300
400
500
600
700
5
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
4
3
2
Standard
P/N 1
614-30AB
0
614-50AB
100
614-100AP
Base Dimensions
in. (mm)
200
1.500 (38.1) sq
1.500 (38.1) sq
300
1.500
(38.1)400
sq
Height
in. (mm)
500
AIR VELOCITY (LFM)
Heat Sink
Finish
.300 (7.6)
.500 (12.7)
600
1.000
(25.4) 700
Black Anodized
Black Anodized
Plain
6
5
4
3
2
1
200
300
400
500
600
700
AIR VELOCITY (LFM)
8
7
614-30AB
614 SERIES
6
5
4
3
616 SERIES
614-100AB (dashed)
Weight
lbs. (grams)
614-50AB
.030 (13.8)
2
.048 (21.8)
100
200
.046 (20.9)
Material: Aluminum, Black Anodized or Plain
300
400
500
600
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
AIR VELOCITY (LFM)
7
7
0
100
AIR VELOCITY (LFM)
700
8
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
2
Standard
P/N
Base Dimensions
1
in. (mm)
Height
in. (mm)
Heat Sink
Finish
Weight
lbs. (grams)
616-80AB
1.85 (47.0) sq
.800 (20.3)
Black Anodized
.054 (24.5)
Material: Aluminum, Black Anodized
700
3
AIR VELOCITY (LFM)
0
100
200
300
400
500
600
700
AIR VELOCITY (LFM)
3
2
1
0
100
200
300
400
500
600
614-30AB
6
5
614-100AP (dashed)
4
614-50AB
3
2
100
200
300
400
7
6
5
4
3
2
1
0
100
500
600
AIR VELOCITY (LFM)
700
AIR VELOCITY (LFM)
300
400
500
600
700
4
3
2
wakefield-vette.com
3
2
3
2
1
0
100
200
300
400
500
600
700
AIR VELOCITY (LFM)
1
0
100
STANCE SINK TO
ENT (C)
24
200
AIR VELOCITY (LFM)
700
5
THERMAL RESISTANCE SINK TO
AMBIENT (C)
4
7
616 THERMAL PERFORMANCE
200
Contact us: (603) 635-2800
NCE SINK TO
(C)
5
8
MECHANICAL DIMENSIONS
8
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
614 THERMAL PERFORMANCE
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
MECHANICAL DIMENSIONS
300
400
500
AIR VELOCITY (LFM)
7
6
5
618-20AB
600
700
25
THERMAL RE
AM
5
4
UNIDIRECTIONAL
FIN HEAT SINK FOR BGAs
3
2
100
1.450 (36.8) x 1.850 (47.0)
Heat Sink
Finish
200(20.3) 300
.800
Weight
lbs. (grams)
400
500
600
Black Anodized
700 (37.2)
.082
2
200
300
400
500
600
1
0
100
Height
in. (mm)
2.00 (50.8) sq
2.00 (80.8) sq
.200 (5.1)
1.000 (25.4)
Material: Aluminum, Black Anodized or Plain
200
300
400
500
600
700
AIR VELOCITY (LFM)
Heat3Sink
Finish
Black Anodized
2
Plain
1
0
100
THERMAL RESISTANCE SINK TO
AMBIENT (C)
3
Weight
lbs. (grams)
200
300
400
500
600
300
400
500
600
700
618 THERMAL PERFORMANCE
1
300
400
500
600
700
7
6
618-20AB
5
4
3
2
1
0
100
200
300
400
500
600
700
6
618-20AB
5
300
4
3
400
500
600
700
AIR VELOCITY (LFM)
2
1
wakefield-vette.com
TANCE SINK TO
T (C)
SISTANCE SINK TO
BIENT (C)
3
3
2
300
400
.063
(28.6)
500
600
700
AIR VELOCITY (LFM)
200
300
400
3
300
400
500
600
AIR VELOCITY (LFM)
2
3
02
100
1
200
300
400
500
600
700
AIR VELOCITY (LFM)
200
300
400
500
600
700
AIR VELOCITY (LFM)
500
600
700
Standard
700 P/N
622-80AB
7
6
618-20AB
5
4
UNIDIRECTIONAL
FIN HEAT SINK FOR BGAs
3
Base Dimensions
in. (mm)
2.050 (52.1) x 2.000 (50.8)
2
1
Height
in. (mm)
618-100AB
Heat Sink
Weight
lbs. (grams)
Finish
0
.800 (20.3)
100
200
300
Material: Aluminum, Black Anodized
Black
400Anodized
500
600
.123
(56.0)
700
AIR VELOCITY (LFM)
1
MECHANICAL DIMENSIONS
0
100
200
300
400
500
AIR VELOCITY (LFM)
3
2
1
200
4
0
100
622 SERIES
200
1
5
300
400
500
AIR VELOCITY (LFM)
600
700
600
622 THERMAL PERFORMANCE
700
3
2
1
0
100
200
300
400
500
600
700
AIR VELOCITY (LFM)
Contact us: (603) 635-2800
5
200
620 THERMAL PERFORMANCE
2
618-100AB
0
100
4
0
100
618-100AB
7
1
5
Weight
lbs. (grams)
3
AIR VELOCITY (LFM)
4
INTEGRATED
CIRCUIT
700
COOLING HEAT SINKS
600
620 SERIES
100
Black Anodized
2
700
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
26
500
1
.235 (6.0)
700
AIR VELOCITY (LFM)
AIR VELOCITY (LFM)
200
200
3
(21.0)
.122 (55.5)
0
100
2
200
1
1 .046
3
0
100
2
0
100
2
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
MECHANICAL DIMENSIONS
4
THERMAL RESISTANCE SINK TO
AMBIENT (C)
2
Base Dimensions
in. (mm)
3
2
Heat Sink
Finish 0
4
700
618 SERIES
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
5
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
6
618-20AB
618-100AP
400
3
Height
in. (mm)
MECHANICAL DIMENSIONS
5
1
AIR VELOCITY (LFM)
3
300
AIR VELOCITY (LFM)
6
0
100
0
100
Base Dimensions
in. (mm)
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
3
8
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
617 THERMAL PERFORMANCE
Standard
P/N
0
620-24AB
2.500 (63.5) x 2.000 (50.8)
100 Material:
200 Aluminum,
300 Black
400Anodized
500
600
AIR VELOCITY (LFM)
MECHANICAL DIMENSIONS
1
THERMAL RESISTANCE SINK TO
617-80AB
Height
in. (mm)
Material: Aluminum, Black Anodized
4
200
UNIDIRECTIONAL FIN HEAT SINK FOR BGAs
THERMAL RESISTANCEAMBIENT
SINK TO (C)
AMBIENT (C)
Base Dimensions 1
in. (mm)
0
2
THERMAL RESISTANCE SINK TO
AMBIENT (C)
Standard
P/N
3
THERMAL RESISTANCE SINK TO
AMBIENT (C)
6
THERMAL RESISTANCE SINK TO
AMBIENT (C)
7
THERMAL RESISTANCE SINK TO
AMBIENT (C)
THERMAL RESISTANCE SINK TO
AMBIENT (C)
617 SERIES
Standard
P/N
1
AIR VELOCITY (LFM)
HEAT SINKS FOR BGAs, SUPER8 BGAs, PBGAs, & FPBGAs
7
2
0
100
INTEGRATED CIRCUIT
COOLING HEAT SINKS
8
3
27
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
HEAT SINKS FOR MICROPROCESSORS & ASICs
569, 579, 589,
599 SERIES
HEAT SINKS & CLIP FOR INTEL’S PENTIUM, PENTIUM MMX, AMD’S K6 & K62,
CYRIX’S 6X86 & MEDIA GX, CENTAUR/IDT’S WINCHIP C6
PRODUCT FEATURES
• Compact design heat sinks can
comfortably fit a variety of
Robust Socket 7-based PC boxes.
Standard
Base Dimensions
P/N
in. (mm)
• Robust clip attachments.
569-100AK
579-150AK
589-150AK
599X-100AB
• Clips are not captive to sink.
Material: Aluminum, Black Anodized
To order heat sink with optional
interface material pre-applied at
the factory, add S4 or S5 suffix
to the part number.
(See Product Designation)
Thermal Resistance
at 200 LFM
(°C/W)
Interface
Material
Options
1.00 (25.4)
1.50 (38.10)
1.50 (38.10)
1.00 (25.4)
1.7
1.6
1.5
1.9
Pages 74–76
Pages 74–76
Pages 74–76
Pages 74–76
18 x 18 PGA
Standard
P/N
Base Dimensions
in. (mm)
649-33AB
649-51AB
1.70 (43.2) sq
1.86 (47.2) sq
Height
in. (mm)
Base Thickness
in. (mm)
0.315 (8.0)
0.510 (13.0)
0.090 (2.3)
0.090 (2.3)
Clip
Color
Gray
Gray
649 SERIES
Heat Sink
Finish
Weight
lbs. (grams)
Black Anodized
Black Anodized
0.044 (19.84)
0.056 (25.51)
MECHANICAL DIMENSIONS
MECHANICAL DIMENSIONS
2.34
.42
1.00
1.50
.23
5x9SC
RC01-1
•
2.34 (59.44) x 2.68 (67.95)
2.15 (54.71) x 1.95 (49.53)
2.15 (54.71) x 3.10 (78.74)
1.96 (49.78) x 2.67 (67.95)
Fin
Height
in. (mm)
SPIDERCLIP™ HEAT SINK ASSEMBLY
FOR MOTOROLA MC68040™, MC68060
1.50
Wakefield
2.68
PRODUCT DESIGNATION
569 - 100 XX - XX
OPTIONAL THERMAL INTERFACE
PAD (SEE PRODUCT DES.)
569-100AK SERIES
ROCKER CLIP OPTION
(SEE PRODUCT DES.)
THERMAL INTERFACE
HEIGHT
S4 = DELTALINK IV
BLANK = NO THERMAL PAD
100 = 1.00"
Dimensions: in.
CLIP
SPRING CLIP OPTION
(SEE PRODUCT DES.)
AK = SPRING CLIP
LOW-COST HEAT SINKS
FOR DIPs AND SRAMs
14-16 Pin DIPs
MODEL NUMBER
Dimensions: in. (mm)
Dimensions: in. (mm)
649-51AB SPIDERCLIP™
ASSEMBLY
649-33AB SPIDERCLIP™
ASSEMBLY
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
650 & 651 SERIES
These extruded heat sinks serve as low-cost heat dissipation solutions for DIPs with pin counts
from 14 to 16. Use an epoxy such as Wakefield-Vette Engineering DeltaBond™ 152 or 155, or use
Wakefield-Vette 2-part DeltaBond™ 156 modified acrylic adhesive. The 650 and 651 are also available
in natural aluminum finish. They can be ordered as 650P or 651P.
Standard Length Width
P/N
in. (mm)
in. (mm)
650B
651B
0.250 (6.4)
0.750 (19.1)
MECHANICAL DIMENSIONS
0.740 (18.9)
0.415 (10.5)
Height Typical Weight
in. (mm)
Applications
lbs. (grams)
0.240 (6.1)
0.240 (6.1)
14-Pin, 16-Pin DIP
14-Pin, 16-Pin DIP
0.003 (1.36)
0.005 (2.27)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
NOTES:
1. Finish: black anodize
650B
Dimensions: in. (mm)
28
651B
2. TIR: Total Indicator Reading. This is
a measure of flatness across the
greatest dimension of a surface.
29
INTEGRATED CIRCUIT
COOLING HEAT SINKS
INTEGRATED CIRCUIT
COOLING HEAT SINKS
HEAT SINKS FOR MICROPROCESSORS & ASICs
669 SERIES
SPIDERCLIP™ HEAT SINK ASSEMBLY FOR INTELDX4™,
AMD AM486DX2, AND AM486DX4
661 SERIES
HEAT SINK WITHOUT CLIP
Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Xilinx, TI,
Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more.
669 Series SpiderClip™ Heat Sink Assemblies may be applied to the following:
These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking,
Cloud Computing, and many more Industries.
• Intel 80486DX and 80486DX2™ (168 PGA)
• Intel DX4™ (168 PGA)
• Intel 80486SX (168 PGA) and I860XR (208 PGA)
• AMD Am 486 Microprocessors AM486DX2,
AM486DX4
Standard
Base Dimensions
P/N
in. (mm)
669-32AG
669-33AB
669-40AB
669-52AB
661-32AG
661-33AB
661-40AB
661-52AB
PIN FIN HEAT SINK
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
1.70 (43.2) sq
• Intel 82495 Cache Controller
• AMD Am 29000 Microcontrollers
• Intel I960CA, I960CF Enbedded Controllers
Forced Convection
Base
Thickness
in. (mm)
Clip
Color
Standard
Finish
Weight
lbs. (grams)
0.315 (8.0)
0.315 (8.0)
0.400 (10.2)
0.520 (13.2)
0.315 (8.0)
0.315 (8.0)
0.400 (10.2)
0.520 (13.2)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
0.090 (2.3)
Black
Black
Black
Black
N/A
N/A
N/A
N/A
Gold Iridite
Black Anodized
Black Anodized
Black Anodized
Gold Iridite
Black Anodized
Black Anodized
Black Anodized
0.044 (19.84)
0.044 (19.84)
0.044 (19.84)
0.050 (22.68)
0.044 (19.84)
0.044 (19.84)
0.044 (19.84)
0.050 (22.68)
Natural
Convection
200 LFM
400 LFM
600 LFM
12
15
18
21
23
28
33
12
15
18
21
23
28
33
19mm
19mm
19mm
19mm
19mm
19mm
19mm
21mm
21mm
21mm
21mm
21mm
21mm
21mm
12.74 C/W
12.05 C/W
11.35 C/W
10.66 C/W
10.55 C/W
10.27 C/W
9.99 C/W
12.4 C/W
11.73 C/W
11.06 C/W
10.38 C/W
10.27 C/W
9.98 C/W
9.7 C/W
6.6 C/W
6.3 C/W
5.97 C/W
5.66 C/W
5.36 C/W
4.91 C/W
4.52 C/W
6.61 C/W
5.84 C/W
5.51 C/W
5.20 C/W
4.9 C/W
4.55 C/W
4.18 C/W
4.79 C/W
4.51 C/W
4.16 C/W
3.89 C/W
3.64 C/W
3.36 C/W
3.07 C/W
4.37 C/W
4.09 C/W
3.76 C/W
3.49 C/W
3.26 C/W
2.98 C/W
2.73 C/W
4.16 C/W
3.86 C/W
3.47 C/W
3.21 C/W
2.99 C/W
2.71 C/W
2.49 C/W
3.7 C/W
3.42 C/W
3.07 C/W
2.84 C/W
2.62 C/W
2.42 C/W
2.21 C/W
903
12
15
18
21
23
28
33
23mm
23mm
23mm
23mm
23mm
23mm
23mm
12.06 C/W 5.72 C/W
11.41 C/W 5.39 C/W
10.76 C/W 5.05 C/W
10.11 C/W 4.74 C/W
9.99 C/W 4.44 C/W
9.70 C/W 4.09 C/W
9.41 C/W 3.83 C/W
3.95 C/W
3.67 C/W
3.35 C/W
3.1 C/W
2.87 C/W
2.62 C/W
2.43 C/W
3.24 C/W
2.99 C/W
2.67 C/W
2.46 C/W
2.31 C/W
2.12 C/W
1.96 C/W
904
12
15
18
21
23
28
33
27mm
27mm
27mm
27mm
27mm
27mm
27mm
11.38 C/W
10.78 C/W
10.17 C/W
9.56 C/W
9.44 C/W
9.13 C/W
8.82 C/W
4.84 C/W
4.48 C/W
4.13 C/W
3.82 C/W
3.51 C/W
3.26 C/W
3.07 C/W
3.11 C/W
2.84 C/W
2.56 C/W
2.32 C/W
2.11 C/W
1.97 C/W
1.82 C/W
2.32 C/W
2.12 C/W
1.88 C/W
1.72 C/W
1.6 C/W
1.49 C/W
1.39 C/W
905
12
15
18
21
23
28
33
29mm
29mm
29mm
29mm
29mm
29mm
29mm
11.04 C/W
10.46 C/W
9.87 C/W
9.28 C/W
9.16 C/W
8.84 C/W
8.53 C/W
4.08 C/W 2.55 C/W 1.98 C/W
3.82 C/W 2.32 C/W 1.78 C/W
3.58 C/W 2.14 C/W 1.58 C/W
3.33 C/W 1.96 C/W 1.44 C/W
3.13 C/W 1.82 C/W 1.34 C/W
2.82 C/W 1.64 C/W 1.2 C/W
2.59 C/W 1.47 C/W 1.07 C/W
901
902
669-33AB, 669-40AB, 669-52AB
669-32AG SPIDERCLIP™
ASSEMBLY
669-52AB SPIDERCLIP™
ASSEMBLY
Dimensions: in.
(mm)
Chip
Size
Series Height
Dimensions “A”
Height
in. (mm)
MECHANICAL DIMENSIONS
669-32AG
900 SERIES
17 x 17 SPGA
Dielectric Breakdown (Nylon Clip Coating)
Dielectric Strength: 100 VDC/mil
Breakdown Voltage: 200 VDC (minimum)
NATURAL AND FORCED
CONVECTION CHARACTERISTICS
Forced Convection
Natural
Convection 200 LFM 400 LFM 600 LFM
Chip
Size
Series Height
12
15
18
21
23
28
33
12
15
18
21
23
28
33
31mm
31mm
31mm
31mm
31mm
31mm
31mm
33mm
33mm
33mm
33mm
33mm
33mm
33mm
10.71 C/W
10.14 C/W
9.57 C/W
9.01 C/W
8.88 C/W
8.56 C/W
8.24 C/W
10.37 C/W
9.82 C/W
9.28 C/W
8.73 C/W
8.60 C/W
8.27 C/W
7.94 C/W
3.49 C/W
3.18 C/W
2.93 C/W
2.72 C/W
2.5 C/W
2.26 C/W
2.09 C/W
3.32 C/W
3.14 C/W
2.89 C/W
2.67 C/W
2.45 C/W
2.24 C/W
2.03 C/W
2.28 C/W
2.03 C/W
1.86 C/W
1.69 C/W
1.54 C/W
1.38 C/W
1.27 C/W
2.18 C/W
1.99 C/W
1.78 C/W
1.60 C/W
1.43 C/W
1.28 C/W
1.15 C/W
1.69 C/W
1.5 C/W
1.33 C/W
1.2 C/W
1.07 C/W
.96 C/W
.88 C/W
1.62 C/W
1.45 C/W
1.3 C/W
1.13 C/W
.99 C/W
.87 C/W
.77 C/W
908
12
15
18
21
23
28
33
35mm
35mm
35mm
35mm
35mm
35mm
35mm
10.03 C/W
9.5 C/W
8.98 C/W
8.46 C/W
8.32 C/W
7.99 C/W
7.65 C/W
3.06 C/W 1.97 C/W
2.85 C/W 1.81 C/W
2.6 C/W 1.64 C/W
2.4 C/W
1.5 C/W
2.19 C/W 1.34 C/W
1.97 C/W 1.19 C/W
1.82 C/W 1.06 C/W
1.49 C/W
1.34 C/W
1.19 C/W
1.07 C/W
.97 C/W
.83 C/W
.7 C/W
909
12
15
18
21
23
28
33
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
37.5mm
9.60 C/W
9.11 C/W
8.61 C/W
8.11 C/W
7.98 C/W
7.63 C/W
7.29 C/W
2.93 C/W
2.71 C/W
2.52 C/W
2.25 C/W
2.04 C/W
1.82 C/W
1.6 C/W
1.90 C/W 1.36 C/W
1.72 C/W 1.19 C/W
1.53 C/W 1.05 C/W
1.36 C/W .88 C/W
1.2 C/W .75 C/W
1.01 C/W .63 C/W
.87 C/W .52 C/W
910
12
15
18
21
23
28
33
40mm
40mm
40mm
40mm
40mm
40mm
40mm
9.18 C/W
8.71 C/W
8.24 C/W
7.77 C/W
7.63 C/W
7.27 C/W
6.92 C/W
2.84 C/W
2.64 C/W
2.4 C/W
2.21 C/W
2 C/W
1.77 C/W
1.58 C/W
1.86 C/W 1.36 C/W
1.65 C/W 1.18 C/W
1.44 C/W .98 C/W
1.27 C/W .86 C/W
1.15 C/W .73 C/W
.99 C/W
.62 C/W
.85 C/W
.51 C/W
906
907
Material: AL 6063
Finish: Black Anodize
Series
Chip Size
19-
901
KEY:
669-32AG
669-33AB
669-40AB
669-52AB
30
0
.315 (8.0) Pin Height, low density pin pattern
0.315 (8.0) Pin Height, high density pin pattern
0.400 (10.2) Pin Height, high density pin pattern
0.520 (13.2) Pin Height, high density pin pattern
Construction
2-
Height
12-
Chip Height
1-
Finish
B-
Interface
1
19
2= Pin Fin
12 = 11.6
1 = .9-2.1
B = BLK ANO 0 = None
21
15 = 14.6
2 = 2.2-3.4
1 = T725
23
18 = 17.6
27
21 = 20.6
29
23 = 22.6
31
28 = 27.6
33
33 = 32.6
35
37.5
Refer to Page 33 for
Installation Instructions
31
工商网监
湘ICP备2023018690号
