667-25ABSPE

BOARD LEVEL HEAT SINKS BOARD LEVEL HEAT SINKS BOARD LEVEL POWER SEMICONDUCTOR HEAT SINKS TO-92 Power semiconductors packaged in a TO-92 style plastic case can be cooled effectively at little additional cost with the addition of the 292-AB heat sink. The 292-AB is effective over the typical power range of such devices. 0.225°C/W @ 0.250 W Black Anodized 0.00049 (0.22) Thermal Performance at Typical Load Height Above Maximum PC Board “A” Footprint Natural Forced in. (mm) in. (mm) Convection Convection Standard P/N Standoff Pin Plain Pin 667-10ABESP 667-15ABESP 667-20ABESP 667-25ABESP Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 667-10ABPP 667-15ABPP 667-20ABPP 667-25ABPP 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) 52 -7 TO-220 61 21 8 4 637 SERIES Wave-solderable pins on 1 in. centers for vertical mounting on printed circuit boards. Maximum semiconductor package width 0.625 in. (15.9). Use this heat sink where weight and board space occupied must be minimized. Refer to the Accessory products section for thermal interface materials, thermal compounds, and other accessories products. Standard P/N 637-10ABEP 637-15ABEP 637-20ABEP 637-25ABEP Height Above PC Board “A” in. (mm) Maximum Footprint in. (mm) 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63.5) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Thermal Performance at Typical Load Natural Forced Convection Convection Weight lbs. (grams) 76°C @ 6W 65°C @ 6W 55°C @ 6W 48°C @ 6W 0.023 (10.43) 0.035 (15.88) 0.050 (22.68) 0.062 (28.12) 5 .8°C/W @ 200 LFM 5 .5°C/W @ 200 LFM 4 .7°C/W @ 200 LFM 4 .2°C/W @ 200 LFM 04 6 1 0 02 06 0 02 0 ERUTAREPMET KNIS TAEH )Cϒ( TNEIBMA EVOBA ESIR 2 001 08 P -766 PBA01 766 PBA52- 6 1-7 A0 PB 66 3 )STTAW( NOITAPISSID REWOP HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL BOARD MOUNTING 0 4 BA ECNATSISER LAMREHT )TTAW/Cϒ( TNEIBMA OT KNIS Dimensions: in. (mm) )MPF( YTICOLEV RIA 006 004 002 5.8°C/W @ 200 LFM 5.5°C/W @ 200 LFM 4.7°C/W @ 200 LFM 4.2°C/W @ 200 LFM 0.0240 (11.0) 0.0340 (15.6) 0.0460 (21.0) 0.0580 (26.2) Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 008 76°C @ 6W 66°C @ 6W 58°C @ 6W 48°C @ 6W Order 330 SC or 285 SC SpeedClip™ separately. NATURAL AND FORCED CONVECTION CHARACTERISTICS 0001 5 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) 1.375 (34.9) x 0.500 (12.7) Weight lbs. (grams) 0.500 0.500REF (12.7) REF (12.7) deepS pilC CS033 bl 4 lanimoN ecroF dellatsnI deepS pilC CS582 bl 01 lanimoN ecroF dellatsnI 0.093 0.093 DIA (2.4) DIA (2.4) NOMINAL) (NOMINAL) 390.0 AID )4.2( )LANIMON( 1.375 1.375 REF REF 390.(34.9) 0 AID (34.9) )4.2( 651.0 )0.4( 0.062 0.062REF REF (1.6) (1.6) 0.730 0.730 (18.5) (18.5) FER )7.21( STANDOFF PINS “SP” 0.180 DIA 0.180 (4.6) DIA 1.000 (4.6) 1.000 (25.4) (25.4) AID 081.0 )6.4( 000.1 )4.52( 037.0 )5.81( PLAIN PINS “PP” NATURAL AND FORCED CONVECTION CHARACTERISTICS Speed Clip Speed 330SC Clip 330SC 4lb Nominal 4 lb Force Nominal Force Installed 573.1 FER )9.430.093 ( 0.093 DIA (2.4) (2.4) DIA Installed Speed 0.044(1.1) (1.1)(STANDOFF) (STANDOFF) 0.044 076.0 )0.71( A 0.130 (3.3) 0.130 (3.3) )FFODNATS( )1.1( 440.0.670 0 0.670 (17.0) (17.0) )3.3( 031A.0 0.125 (3.2) DIA 0.125 (3.2) DIA RAISED x 0.030 (0.8) HIGH RAISEDBOSS BOSS x 0.030 (0.8) HIGH 005.0 667 SERIES (EXTRUSION PROFILE 8073) AID )2.3( 521.0 HGIH )8.0( 030.0 x SSOB DESIAR Dimensions: 626 & 627 SERIES Standard P/N Standard P/N 626-10ABEP 626-15ABEP 626-20ABEP 626-25ABEP 627-10ABP 627-15ABP 627-20ABP 627-25ABP 0.156 (4.0) 0.156 260.0 FER )6.1( (4.0) in. (mm) Speed Clip Clip 285SC 285SC 10 10lblb Nominal Nominal Force Force Installed Installed 100 0 200 AIR VELOCITY (FPM) AIR VELOCITY (FPM) 400 600 800 80 4 60 40 20 0 25 7- P 1.000 (25.4) 1.500 (38.1) 2.000 (50.8) 2.500 (63-5) Maximum Footprint in. (mm) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 1.375 (34.9) x .500 (12.7) 3 66710ABP 667-2 5ABP 2 0 1 4 8 12 16 POWER DISSIPATION (WATTS) POWER DISSIPATION (WATTS) HIGH-EFFICIENCY HEAT SINKS FOR VERTICAL BOARD MOUNTING Height Above PC Board “A” in. (mm) 1000 5 0 20 THERMAL RESISTANCE THERMAL RESISTANCE SINK TO (ϒC/WATT) SINK TOAMBIENT AMBIENT (°C/WATT) 0. 600 (15.3) Finish Weight lbs. (grams) AB 0.750 (19.1) Thermal Performance Natural Convection 0A BP 292-AB Overall Fin Width in. (mm) Excellent performance, choice of wave-solderable plain pins (PP-Type) or wave-solderable hex-shaped standoff pins (SP-Type), and reduced assembly cost. 66 Height Above PC Board in. (mm) 667 SERIES 7-1 Standard P/N LABOR-SAVING SPEEDCLIP™ HEAT SINKS FOR VERTICAL BOARD MOUNTING TO-220 66 HEAT SINK FOR SINGLE TO-92 HEATSINK SINKTEMPERATURE TEMPERATURE HEAT RISEABOVE ABOVEAMBIENT AMBIENT RISE (ϒC)(°C) 292 SERIES TO-220 and TO-218 Thermal Performance at Typical Load Natural Forced Convection Convection 76°C @ 6W 65°C @ 6W 55°C @ 6W 48°C @ 6W 5.8°C/W @ 200 LFM 5.5°C/W @ 200 LFM 4.7°C/W @ 200 LFM 4.2°C/M @ 200 LFM Wave-solderable pins. Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 626 AND 627 SERIES NATURAL AND FORCED CONVECTION CHARACTERISTICS Material: Aluminum, Black Anodized MECHANICAL DIMENSIONS 637 SERIES (EXTRUSION PROFILE 5183) NATURAL AND FORCED CONVECTION CHARACTERISTICS Dimensions: in. (mm) Dimensions: in. (mm) 70 wakefield-vette.com Contact us: (603) 635-2800 71