901-19-2-33-2-B-0

PIN FIN HEAT SINK 900 Series Wakefield-Vette’s 900 Series Heat Sinks for Chipset can match up to devices from Intel, Broadcom, Xilinx, TI, Motorola, ATI, AMD, Nvidia, Vishay, Powerex, Infineon, Microsemi, and many more. These heat sinks are designed for air flow applications in the Telecom, Data Center, Networking, Cloud Computing, and many more Industries. Material: AL 6063 Finish: Black Anodize FORCED CONVECTION SERIES 901 902 903 904 905 FORCED CONVECTION Height CHIP SIZE NATURAL CONVECTION 200 LFM 400 LFM 600 LFM 200 LFM 400 LFM 600 LFM 12 19mm 12.74 C/W 6.6 C/W 4.79 C/W 4.16 C/W 12 31mm 10.71 C/W 3.49 C/W 2.28 C/W 1.69 C/W 15 19mm 12.05 C/W 6.3 C/W 4.51 C/W 3.86 C/W 15 31mm 10.14 C/W 3.18 C/W 2.03 C/W 1.5 C/W 18 19mm 11.35 C/W 5.97 C/W 4.16 C/W 3.47 C/W 18 31mm 9.57 C/W 2.93 C/W 1.86 C/W 1.33 C/W 21 19mm 10.66 C/W 5.66 C/W 3.89 C/W 3.21 C/W 21 31mm 9.01 C/W 2.72 C/W 1.69 C/W 1.2 C/W 23 19mm 10.55 C/W 5.36 C/W 3.64 C/W 2.99 C/W 23 31mm 8.88 C/W 2.5 C/W 1.54 C/W 1.07 C/W 28 19mm 10.27 C/W 4.91 C/W 3.36 C/W 2.71 C/W 28 31mm 8.56 C/W 2.26 C/W 1.38 C/W .96 C/W 33 19mm 9.99 C/W 4.52 C/W 3.07 C/W 2.49 C/W 33 31mm 8.24 C/W 2.09 C/W 1.27 C/W .88 C/W 12 21mm 12.4 C/W 6.61 C/W 4.37 C/W 3.7 C/W 12 33mm 10.37 C/W 3.32 C/W 2.18 C/W 1.62 C/W 15 21mm 11.73 C/W 5.84 C/W 4.09 C/W 3.42 C/W 15 33mm 9.82 C/W 3.14 C/W 1.99 C/W 1.45 C/W 18 21mm 11.06 C/W 5.51 C/W 3.76 C/W 3.07 C/W 18 33mm 9.28 C/W 2.89 C/W 1.78 C/W 1.3 C/W 21 21mm 10.38 C/W 5.20 C/W 3.49 C/W 2.84 C/W 21 33mm 8.73 C/W 2.67 C/W 1.60 C/W 1.13 C/W 23 21mm 10.27 C/W 4.9 C/W 3.26 C/W 2.62 C/W 23 33mm 8.60 C/W 2.45 C/W 1.43 C/W .99 C/W 28 21mm 9.98 C/W 4.55 C/W 2.98 C/W 2.42 C/W 28 33mm 8.27 C/W 2.24 C/W 1.28 C/W .87 C/W 33 21mm 9.7 C/W 4.18 C/W 2.73 C/W 2.21 C/W 33 33mm 7.94 C/W 2.03 C/W 1.15 C/W .77 C/W 12 23mm 12.06 C/W 5.72 C/W 3.95 C/W 3.24 C/W 12 35mm 10.03 C/W 3.06 C/W 1.97 C/W 1.49 C/W 15 23mm 11.41 C/W 5.39 C/W 3.67 C/W 2.99 C/W 15 35mm 9.5 C/W 2.85 C/W 1.81 C/W 1.34 C/W 18 23mm 10.76 C/W 5.05 C/W 3.35 C/W 2.67 C/W 18 35mm 8.98 C/W 2.6 C/W 1.64 C/W 1.19 C/W 21 23mm 10.11 C/W 4.74 C/W 3.1 C/W 2.46 C/W 21 35mm 8.46 C/W 2.4 C/W 1.5 C/W 1.07 C/W 23 23mm 9.99 C/W 4.44 C/W 2.87 C/W 2.31 C/W 23 35mm 8.32 C/W 2.19 C/W 1.34 C/W .97 C/W 28 33 23mm 23mm 9.70 C/W 9.41 C/W 4.09 C/W 3.83 C/W 2.62 C/W 2.43 C/W 2.12 C/W 1.96 C/W 28 33 35mm 35mm 7.99 C/W 7.65 C/W 1.97 C/W 1.82 C/W 1.19 C/W 1.06 C/W .83 C/W .7 C/W 12 27mm 11.38 C/W 4.84 C/W 3.11 C/W 2.32 C/W 12 37.5mm 9.60 C/W 2.93 C/W 1.90 C/W 1.36 C/W 15 27mm 10.78 C/W 4.48 C/W 2.84 C/W 2.12 C/W 15 37.5mm 9.11 C/W 2.71 C/W 1.72 C/W 1.19 C//W 18 27mm 10.17 C/W 4.13 C/W 2.56 C/W 1.88 C/W 18 37.5mm 8.61 C/W 2.52 C/W 1.53 C/W 1.05 C/W 21 27mm 9.56 C/W 3.82 C/W 2.32 C/W 1.72 C/W 21 37.5mm 8.11 C/W 2.25 C/W 1.36 C/W .88 C/W 23 27mm 9.44 C/W 3.51 C/W 2.11 C/W 1.6 C/W 23 37.5mm 7.98 C/W 2.04 C/W 1.2 C/W .75 C/W 28 27mm 9.13 C/W 3.26 C/W 1.97 C/W 1.49 C/W 28 37.5mm 7.63 C/W 1.82 C/W 1.01 C/W .63 C/W 33 27mm 8.82 C/W 3.07 C/W 1.82 C/W 1.39 C/W 33 37.5mm 7.29 C/W 1.6 C/W .87 C/W .52 C/W 12 29mm 11.04 C/W 4.08 C/W 2.55 C/W 1.98 C/W 12 40mm 9.18 C/W 2.84 C/W 1.86 C/W 1.36 C/W 15 29mm 10.46 C/W 3.82 C/W 2.32 C/W 1.78 C/W 15 40mm 8.71 C/W 2.64 C/W 1.65 C/W 1.18 C/W 18 29mm 9.87 C/W 3.58 C/W 2.14 C/W 1.58 C/W 18 40mm 8.24 C/W 2.4 C/W 1.44 C/W .98 C/W 21 29mm 9.28 C/W 3.33 C/W 1.96 C/W 1.44 C/W 21 40mm 7.77 C/W 2.21 C/W 1.27 C/W .86 C/W 23 29mm 9.16 C/W 3.13 C/W 1.82 C/W 1.34 C/W 23 40mm 7.63 C/W 2 C/W 1.15 C/W .73 C/W 28 29mm 8.84 C/W 2.82 C/W 1.64 C/W 1.2 C/W 28 40mm 7.27 C/W 1.77 C/W .99 C/W .62 C/W 33 29mm 8.53 C/W 2.59 C/W 1.47 C/W 1.07 C/W 33 40mm 6.92 C/W 1.58 C/W .85 C/W .51 C/W Series 901- T h e r m a l SERIES 906 907 908 909 910 HEIGHT CHIP SIZE NATURAL CONVECTION Chip Size Construction Height Chip Height Finish 19- 2- 12- 1- B- 12 = 11.6 15 = 14.6 18 = 17.6 21 = 20.6 23 = 22.6 28 = 27.6 33 = 32.6 1 = .9-2.1 2 = 2.2-3.4 19 21 23 27 29 31 33 35 37.5 40 2= Pin Fin C o o l i n g S o l u t i o n s Interface 1 0 = None 1 = T725 B = BLK ANO f r o m S m a r t www.wakefield-vette.com t o F i n i s h PIN FIN HEAT SINK 900 Series Wakefield-Vette’s heat sink assembles onto chip set using the space that is between the PCB and the substrate of the solder balls. The solder balls provide a minimal gap of .5mm to .7mm. Attachment feature is below a .4mm thickness. The clipping system will not interfere or damage chip. Contact area is the edge of chip. ASSEMBLY INSTRUCTION: Step 1: Hook the clip under one side of the BGA chip set. Step 2: Rotate assembly down until opposite side clip engages substrate edge of BGA chip set. Random Vibration Test Frequency ：5 Hz to 500 Hz Acceleration ：3.13 grms P.S.D ：0.01 g2/HZ (5 Hz) 0.02 g2/HZ (20 Hz to 500 Hz) Test Axis ：X, Y, Z axis Test Time ：10 mins (Each axis) Total Test Time ：30 mins T h e r m a l C o o l i n g S o l u t i o n s Step 3: Make sure the sop rods are clearing from edges of BGA chip set. Step 4: Press firmly down to make sure clips fully engage edges of chip set. Heat Sink should not move around easily. SHOCK TEST SPECIFICATION： Wave Form ：Half sine wave Acceleration ：50 g Duration Time ：11 ms No. of Shock ：Each axis 3 times Shock Direction ：±X, ±Y, ±Z axis Reliability & Communication Testing Instruments f r o m S m a r t www.wakefield-vette.com t o F i n i s h