THERMAL INTERFACE PRODUCTS
Thermal Compounds, Adhesives & Interface Materials ...... 140–145
High Performance Thermal Compound ........................... 140
General & Thermal High Performance Epoxy .................... 146–155
performance of both standard and custom heat dissipation components. Included
are thermal joint compounds; filled epoxy systems; adhesives; thermally conductive
insulating wafers, washers, pads and mounting hardware.
THERMAL INTERFACE PRODUCTS
Cost-effective accessory products that facilitate installation and improve the thermal
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS
THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS
120 SERIES
126 SERIES
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating
surfaces with a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent
thermal resistance of only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no
measurable increase in case temperature of a mounted semiconductor on a heat sink after the 6-month
stabilization period (Time versus Thermal Resistivity graph below).
120 SERIES - THERMAL JOINT COMPOUND
TYPICAL VALUES FOR THERMAL RESISTANCE,
CASE TO SINK (Øcs) WHEN THERMAL JOINT
COMPOUNDS ARE USED
Case Style Characteristics
Mounting Torque
in inch • pounds
(N•M)
TO-3
8 (0.9)
TO-66
9 (0.9)
TO-220
8 (0.9)
0.19 (4.8) stud x 0.44 (11.2) hex
15 (1.7)
0.25 (6.4) stud x 0.69 (17.5) hex
30 (3.39)
0.38 (9.7) stud x 1.06 (26.9) hex
75 (8.47)
0.50 (12.7) stud x 1.06 (26.9) hex
125 (14.12)
0.75 (19.1) stud x 1.25 (31.8) hex
600 (67.79)
Characteristic
Typical
Thermal
Resistance
(°C/W)
0.09
0.14
0.50
0.16
0.10
0.07
0.07
0.052
Volume Resistivity
Dielectric Strength
Specific Gravity
Thermal Conductivity @ 36°C
Thermal Resistivity (P)
Bleed, % after 24 hrs @ 200°C
Evaporation, % after 24 hrs @ 200°C
Color
Shelf life
Operating Temperature Range (°C)
Description
5 X 1014 ohm-cm
225 volts/mil
2.1 min.
0.735 W/(m)(K)
5.1(Btu) (in.)/(hr)(ft2)(°F)
56 (°C)(in.)/watt
0.5
0.5
opaque white
5 years
-40/+200
The 126 Series is a nontoxic, synthetic, ester-based (nonsilicone) Thermal Joint Compound with metal
oxide fillers designed to enhance thermal performance characteristics of plastic and metal package
devices exceeding that of silicone-based compounds. Solved are problems associated with contamination
of wave solder baths and migration of silicone-based products. Shelf life: 5 years.
126 SERIES THERMAL JOINT COMPOUND
Characteristics Description
Appearance
Solids Content, wt %
Thermal Conductivity at 36°C
Interface Thermal Resistance
Bleed, 24 hrs at 200°C, wt%
Evaporation, 24 hrs at 200°C, wt%
Volume Resistivity
Dielectric Strength
Specific Gravity @ 60°F
Penetration
Operating Range
120-SA
120-2
120-5
120-8
120-80
120-320
HIGH PERFORMANCE THERMAL
COMPOUND
122 SERIES
122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to
provide premium performance at an affordable price. It is formulated to significantly reduce contact
thermal resistance where power densities are concentrated in devices such as flip chip, reduced die
size, and ‘overclock’ microprocessors. When applied as a thin film between a Wakefield-Vette heat sink
and device it possesses superior thermal conductivity compared to traditional ‘grease’. It is compatible
with automated or manual dispensing methods and is fully RoHS compliant.
122 SERIES THERMAL JOINT COMPOUND
122 SERIES - ORDER GUIDE
Typical Characteristics
Series - P/N
Container Size
122-10CC
122-2
122-30CC
10cc syringe
2 oz (0.06 kg) jar
30cc syringe
140
Smooth Gray paste
2.5 W / m °K,
17.3 (Btu) (in.)/(hr) (ft2) (°F)
0.02 °C in 2 / W
0.015 wt%, 24 hrs at 200°C
0.150 wt%, 24 hrs at 200°C
1.4 x 1010 ohm-cm
225 volts/mil
2.23 (gm/cc) at 25°C
-40°C to 205°C
5 years
126-2
126-4
126-4S
126-5LB
Container Size
2 oz (0.6 kg) jar
4 oz (0.11 kg) tube
4 oz (0.11 kg) syringe
5 lb (2.27 kg) can
DELTABOND™152
DELTABOND™ 152
Appearance
Thermal Conductivity
Thermal Resistance
Bleed
Evaporation
Volume Resistivity
Dielectric Strength
Specific Gravity
Operating Range
Shelf Life
Series - P/N
DeltaBond™ 152 adhesive is ideal for general cementing; thermally bonding semiconductors and
components to chassis or heat sinks, while electrically isolating one from the other; fabricating heat sinks
or thermal links; and for all permanent bonding of assemblies which require high thermally conductive
interfaces. It produces a rigid, high strength bond to most materials when cured. DeltaBond™ 152
is available in bi-packs, kits, and quarts. Order one bottle of hardener A-4 or B-4 per one quart of
DeltaBond™ 152 separately. Shelf life: 152KA 1 year, all others 2 years.
Container Size
4 gram plastic pak
2 oz (0.06 kg) jar
5 oz (0.14 kg) tube
8 oz (0.23 kg) jar
5 lb (2.27 kg) can
20 lb (9.08 kg) can
Description
126 SERIES - ORDER GUIDE
DELTABOND™ 152
120 SERIES - ORDER GUIDE
Series - P/N
Smooth, white homogeneous paste
65% min
.69 W / m 0K, 4.8 (Btu)(in.)/(hr) (ft2) (°F)
0.043°C/W TO-3 at 0.0008 thick film
0.09% max
0.6 max
2.3 x 1012 ohms-cm
200 volts/mil
2.93 (gm/cc)
280 to 320
-40°C to 200°C
Characteristics Hardener Type
Mixing Proportions and Working Properties
Typical Properties Fully Cured A4
Characteristics
B4
Thermal conductivity -
W/(m) (°K) 0.836 0.908
(Btu) (in.)/(hr) (ft2) (°F) 5.8
6.3
Thermal resistivity - (°C) (in.) watt
47
42
Bond shear strength 77°F
2,900
2,300
1 in. overlap - psi
125°F
2,200
2,000
etched aluminum to
etched aluminum 212°F
400
800
Heat distortion point - °F
130
225
Minimum dielectric strength,
v/mil, 0.125 in. sample 400 400
Max operation Continuous 65 150
temp - °C
Intermittent 100 190
NOTES:
A4
Parts of hardener per 100 parts
of resin by weight
7.5
*Working Time - at 77°F
45 min
†Initial cure time 77°F
8 hrs
150°F 45 min
250°F
20 min
‡Post-cure time at a temp in °F
4 hrs @200°F
‡Alternate room temp. aging
4 days
time at 77°F
Working consistency (77°F)
viscous liquid
Working viscosity (77°F) cps 25,000
B4
3.5
30 min
6 hrs
30 min
15 min
4 hrs @ 200°F
4 days
paste
—
DELTABOND™152
Ordering Guide - Resin and Hardener
* Since the hardener/resin reaction is
Resin
Hardener
Model
exothermic, it is important that batch
Number P
art No.
Container
Part Number
|size be matched to hardener speed.
Working times given are for approximate
152-1A Bi-Pack (1 oz)
Included in PIN 152-1 A (“A-4”) Type
batch sizes: A—200 gms, B—200 gms.
DeltaBond™ 152
152-1B
Bi-Pack (1 oz)
Included in P/N 152-1 B (“B-4”) Type
Larger batch sizes will greatly reduce
152-KA Kit (7 oz Resin, 0.5 oz Hardener)
lncluded in P/N 152-KA
working time.
1
52-Q 1 quart (4 lbs)
A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
** For optimum electrical properties, dry
All
hardener
part
numbers:
A-4,
B-4
parts for 15 minutes at 150°F (65°C)
or 30 minutes at 75°F (24°C) to slowly
evaporate the thinner and then final cure for 4 hours at 275°F (135°C).
† After initial cure, material may be handled, removed from fixture, etc., but has not yet achieved full properties
and should be room temperature aged or post-cured as shown to achieve full physical and electrical properties.
‡ After initial cure, material may be brought to full physical and electrical properties during post-cure or may be
room temperature aged for charted length of time to achieve same full properties.
The information contained herein is based on data believed to be reliable but we do not assume responsibility
for accuracy. All such information is used at the customer’s own risk, conditions of use being beyond our control.
141
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS
DELTABOND™ 154
DELTABOND™ 153
DeltaCast™ 153 is a pourable casting resin having thermal expansion characteristics similar to aluminum
and copper allowing assemblies to operate over a very wide temperature range. Ideal for encapsulating
components and assemblies, this series’ major advantages and uses include potted systems (virtually
indestructible), protecting components and systems from moisture and contaminants, securing proprietary
circuitry, mechanical support of devices, removal of heat from hot components and the assembly equalizing
temperatures, and high voltage isolation. DeltaCast™ 153 is available in quarts and gallons. Order one bottle
of hardener A4 or B4 per one quart of DeltaCast™ 153 separately. Shelf life: 2 years.
DELTACAST™153
DELTABOND™154
Ordering Guide - Resin and Hardener
Model
Part No.
Number
DeltaBond™
Resin
154-Q 1
Hardener Type
Typical Properties Fully Cured A4
Thermal conductivity -
W/(m) (°K)
0.836
(Btu) (in.)/(hr) (ft2) (°F) 5.8
Thermal resistivity - (°C) (in.) watt 47
Bond shear strength 77°F
2,500
1 in. overlap - psi 125°F —
etched aluminum to
etched aluminum 212°F —
Heat distortion point - °F
130
Minimum dielectric strength,
v/mil, 0.125 in. sample 400
Max operation Continuous 65
temp - °C
Intermittent 100
Part Number
A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
All hardener part numbers: A-4, B-4
Mixing Proportions and Working Properties
B4
Characteristics
A4
Parts of hardener per 100 parts
7.5
of resin by weight
*Working Time - at 77°F 45 min
† Initial cure time 77°F 8 hrs
150°F 45 min
250°F 20 min
‡Post-cure time at a temp in °F 4 hrs @200°F
‡Alternate room temp. aging 4 days
time at 77°F
Working consistency (77°F) heavy liquid
Working viscosity (77°F) cps 10,000
0.908
6.3
42
1,900
—
—
225
400
150
190
B4
DELTABOND™ 155
3.5
30 min
6 hrs
30 min
15 min
4 hrs @ 200°F
4 days
DeItaBond™ 155 is an epoxy adhesive formulated for use within the semiconductor industry. An easy
to mix spread thixotropic paste, it offers high heat transfer, low shrinkage, and a coefficient of thermal
expansion comparable to that of copper and aluminum. This adhesive is principally used to form thermally
conductive joints in fabricated heat sinks and between heat sinks and power devices. When used to bond
semiconductors to heat sinks, it also serves as an electrical insulator. Its strong bond to a wide variety of
substrates resists severe temperature cycling. DeItaBond™ 155 is only available in kit size. Simply squeeze
out equal lengths and mix to uniform color. Shelf life: 1 year.
viscous liquid
30,000
DELTABOND™ 155
Characteristics
Typical Properties Fully Cured
DELTACAST™153
DeltaCast™ 153 153-Q
Hardener
Part Number
1 quart (4 lbs) A-4 (0.316 lb), B-4 (0.14 lb), (order 1 only)
All hardener part numbers: A-4, B-4
DELTABOND™ 154
DeltaBond™ 154 is a medium viscosity, aluminum-filled resin with the best thermal conductivity of this
series.It is, however, neither a good electrical insulator nor conductor. Its principal application is that of
a good thermal mechanical adhesive for applications such as bonding fins to base plates or structural
mounting blocks or brackets to heat sinks. Order one bottle of hardener A4 or B4 per one quart of
DeltaBond™ 154 separately. Shelf life: 2 years.
Characteristics
Mixing Proportions and Working Properties
A4
B4
Parts of hardener per 100 parts
of resin by weight 11.0
4.5
*Working Time - at 77°F
45 min
30 min
† Initial cure time 77°F
8 hrs
6 hrs
150°F
45 min
30 min
250°F
20 min
15 min
‡Post-cure time at a temp in °F
4 hrs @200°F 4 hrs @ 200°F
‡Alternate room temp. aging
4 days
4 days
time at 77°F
Working consistency (77°F)
viscous liquid
paste
Working viscosity (77°F) cps
25,000
—
0.836
5.8
47
2,600
—
—
130
400
65
100
DELTABOND™ 155
Mixing Proportions and Working Properties
Parts of hardener per 100 parts of resin
*Working Time - at 77°F
†Initial cure time 77°F
150°F
250°F
‡Post-cure time at a temp in °F
‡Alternate room temp. aging
time at 77°F
Working consistency (77°F)
Working viscosity (77°F) cps
DELTABOND™ 155
Model
Number
Resin
Part No.
Hardener
Container
Part Number
(3 oz resin, 3 oz hardener)
Included in P/N 155
Hardener Type
Typical Properties Fully Cured A4
4 days
paste
paste
* Since the hardener/resin reaction is exothermic, it is
important that batch size be matched to hardener
speed. Working times given are for approximate batch
sizes: A—200 gms, B—200 gms. Larger batch sizes will
greatly reduce working time.
† After initial cure, material may be handled, removed
from fixture, etc., but has not yet achieved full properties
and should be room temperature aged or post-cured as
shown to achieve full physical and electrical properties.
B4
Thermal conductivity -
W/(m) (°K) 1.053
1.154
(Btu) (in.)/(hr) (ft2) (°F) 7.3 8.0
Thermal resistivity - (°C) (in.) watt 37
34
Bond shear strength 77°F 3,000
2,400
1 in. overlap - psi 125°F 2,300
2,100
etched aluminum to
etched aluminum 212°F 500 800
Heat distortion point - °F 130 225
Minimum dielectric strength,
v/mil, 0.125 in. sample NA* NA*
Max operation Continuous 65
150
temp - °C
Intermittent 100
190
wakefield-vette.com
by volume 100
90 min
8 hrs
45 min
20 min
4 hrs @ 200°F
NOTES:
Ordering Guide - Resin and Hardener
DeltaBond™ 155 155 Kit
DELTABOND™ 154
DELTABOND™ 154
Hardener Type
DeltaBond™155
Thermal conductivity -
W/(m) (°K)
(Btu) (in.)/(hr) (ft2) (°F)
Thermal resistivity - (°C) (in.) watt
Bond shear strength 77°F
1 in. overlap - psi 125°F
etched aluminum to
etched aluminum 212°F
Heat distortion point - °F
Minimum dielectric strength,
v/mil, 0.125 in. sample
Max operation Continuous
temp - °C
Intermittent
Ordering Guide - Resin and Hardener
Resin
Model
Part No.
Container
Number
142
quart (2.5 lbs)
DELTACAST™153
Characteristics
Characteristics
Hardener
Container
‡ After initial cure, material may be brought to full physical
and electrical properties during post-cure or may be
room temperature aged for charted length of time to
achieve same full properties.
The information contained herein is based on
data believed to be reliable but we do not assume
responsibility for accuracy. All such information is used
at the customer’s own risk, conditions of use being
beyond our control.
Contact us: (603) 635-2800
143
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
THERMAL COMPOUNDS, ADHESIVES & INTERFACE MATERIALS
DELTABOND™ 156
DeltaBond™ 156 Thermally Conductive Adhesive is a modified acrylic adhesive designed for permanent
mounting on components where heat must be effectively transmitted. Recommended for electromechanical
assemblies to bond components and dissipate heat, it replaces mechanical fasteners and compressible
pads, silicone grease, and epoxies; eliminates air entrapment, and other variables related to epoxy mixing.
This soft paste requires no mixing and flows easily to allow thin bond lines. Primer activated, cure begins
upon assembly. DeltaBond™ Activator fixtures at room temperature in less than 5 minutes. Full strength is
developed in 4 to 12 hours and fillets become dry to the touch in 24 hours. It is not recommended to use
this durable adhesive without the use of DeltaBond™ Activator. DeltaBond™ 156 is available in kit size; order
156-K (25 ml Syringe and Activator Kit). Shelf life: 1 year.
DELTABOND™ 156
DELTABOND™ 156
Characteristics
Typical Electrical Properties
Typical Properties Fully Cured
Test
Description
Results
Test
ASTM
Temperature Range -65 to 300°F
(-54 to 149°C)
300°F to (177°C)
Intermittent
Tensile Strength, at break
2360 psi
Modulus 233,000 psi
Elongation, at break
7.75%
Outgassing
2.5% TLM
0.05% CVCM
Coefficient of Thermal Expansion 7.1 x 10 -4 (cm/cm°C)
Tensile Shear
2500psi
Thermal Conductivity, K 3.47 Btu x in./hr ft2 °F
(absolute at 86°F (30°C)
(0.50 W/m °C)
D638
D638
D638
E595
D1002
Note: The absolute thermal conductivity test was developed specifically
for measuring thermal properties of thin film adhesive bonds.
Results
Dielectric Strength
220 volts/mil
Dielectric Constant, 77°F (25°C)
100 Hz 14.92
1000 Hz 14.26
1MM Hz 12.34
Dissipaton Factor, 77°F (25°C)
100 Hz 0.05
1000 Hz 0.03
1MM Hz 0.06
Volume Resistivity
5.2x1011 (ohms-cm)
Surface Resistivity
8.6 x 1013 (ohms)
ASTM
D149
D150
Characteristics
Material Thickness
Color
Tear Strength, lb/in. Typical100
Volume Resistivity, megohm-cm, Minimum Normal
Breakdown Voltage, Minimum
Dielectric Constant at 60 Hz and 100 V Maximum
Continuous Use Temperature, °C
Thermal Conductivity, cal/cm sec. °C, Minimum
Thermal Resistance (TO-3), 1 in.2 °C/W
Recommended Mounting Pressure, lb/in.2
DeltaBond™ 156
156-K
Container
Resin Kit Hardener Syringe - 0.85 fl oz - 25 ml - 2 oz
net/0.44 oz fl contents bottle -12ml
DeltaPads™
173-7 Series
DeltaPads™
173-9 Series
DeltaPads™
174-9 Series
Kapton®
175-6 Series
0.007 in.
Gray
100
1.0 x 109
4,000
2.70
-60/+200
3 x 10-3
0.33
350/550
0.009 in.
Gray
100
1.0 x 109
5,000
2.40
-60/+200
3 x 10-3
0.50
350/550
0.009 in.
Tan
100
1.0 x 1013
5,000
2.50
-60/+200
1 x 10-2
0.25
350/550
0.006 in.
Gray
ASTM 0624
1 x 1013
6,000
5.5 @ 1,000 Hz
-60/+200
1.2 x 10-3
0.40
350/550
Test Method
Micrometer
Visual
ASTM D257
ASTM 0149
ASTM D 150
–
–
–
Formula*
D150
*P (pressure in psi) =
D257
D257
T (torque [in.- lb] x N (number of fasteners)
0.2 x D (Thread Dia) x A (contact surface area square inches)
173-7 Series
Ordering Guide - Resin and Hardener
Part No.
175 SERIES
The 173, 174, and 175 Series are highly efficient thermally conductive insulators designed for
semiconductor interface to heat sinks. Their properties eliminate messy concerns associated
with thermal greases.
Note: DeltaBond™ Thermally Conductive Adhesive-High Strength
contains a metallic filler which, in certain applications, may have
an effect on electrical properties. Therefore, test each particular
application to ensure that electrical properties are as required.
Resin
173 & 174 SERIES
GREASELESS THERMALLY CONDUCTIVE
KAPTON® REINFORCED INSULATORS
DELTABOND™ 156
Model
Number
DELTAPADS™ THERMALLY
CONDUCTIVE INSULATORS
TO-3, TO-66, TO-220,DO-4, DO-5 SHEET
Hardener
Part Number
Included in kit hardener with brush applicator 4.2 oz total wt/kt
173-9 Series
174-9 Series
No
Adhesive
Adhesive
Backing
No
Adhesive
No
Adhesive
175-6 Series
Greaseless
–
173-7-220P
173-7-230P
173-7-240P
–
–
–
–
–
–
–
173-7-1212P
–
–
–
173-7-240A
–
–
–
–
–
–
–
–
173-9-210P
–
173-9-230P
173-9-240P
–
–
–
–
–
–
–
173-9-1212P
–
–
–
–
–
–
174-9-310P
–
–
–
–
174-9-1212P
175-6-210P
175-6-220P
175-6-230P
175-6-240P
175-6-250P
175-6-280P
175-6-310P
175-6-320P
175-6-330P
175-6-410P
175-6-610P
–
MECHANICAL DIMENSIONS
NOTES:
* Since the hardener/resin reaction is exothermic, it is
important that batch size be matched to hardener
speed. Working times given are for approximate batch
sizes: A—200 gms, B—200 gms. Larger batch sizes will
greatly reduce working time.
† After initial cure, material may be handled, removed
from fixture, etc., but has not yet achieved full properties
and should be room temperature aged or post-cured as
shown to achieve full physical and electrical properties.
TO-66
TO-3
TO-220
D04/05
‡ After initial cure, material may be brought to full physical
and electrical properties during post-cure or may be
room temperature aged for charted length of time to
achieve same full properties.
The information contained herein is based on
data believed to be reliable but we do not assume
responsibility for accuracy. All such information is used
at the customer’s own risk, conditions of use being
beyond our control.
144
wakefield-vette.com
SHEET
Dimensions: in. (mm)
TO-5
DUAL TO-220
Contact us: (603) 635-2800
TO-66 (RECTANGLE)
145
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
GENERAL & THERMAL HIGH PERFORMANCE EPOXY
BONDATHERM™
BONDATHERM™ CARTRIDGES
KEY FEATURES OF THE BONDATHERM
EQUALIZER KITS:
•
•
•
•
•
•
Wakefield-Vette Part Number
FEATURES
•
•
•
•
•
•
•
Eliminates improper ratios and mixing errors
Reduces material waste
Eliminates employee contact with resins
Eliminates messy hand mixing and transferring
Increases productivity
Resins are protected from moisture contamination
Description
Packaging
BT-101-50M
BT-102-50M
BT-301-50M
BT-301-200M
Non-Sag 5 Minute BondaTherm Epoxy Adhesive
Toughened, Flexible Adhesive System
Fast Curing Thermally Conductive Adhesive
Fast Curing Thermally Conductive Adhesive
50ml Dual Catridges
50ml Dual Catridges
50ml Dual Catridges
200ml Dual Catridges
BT-01-50M
BT-01-200M
BT-02-50M
BT-02-200M
BondaTherm Equalizer Dispense Gun (50ml)
BondaTherm Equalizer Dispense Gun (200ml)
BondaTherm Equalizer Static Mixer (50ml)
BondaTherm Equalizer Static Mixer (200ml)
-
BT-101-50M-EQZ
BT-102-50M-EQZ
BT-301-50M-EQZ
BT-301-200M-EQZ
Two Dual Cartridges (BT-101-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-102-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-301-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-301-200M), One Gun (BT-01-200M), Three Mixers (BT-02-200M)
Kit
Kit
Kit
Kit
BT-103-50M
BT-302-50M
5 Minute Clear Bondatherm Epoxy Adhesive
Fast Curing Aluminum Filled Bondatherm Epoxy Adhesive
50ml Dual Catridges
50ml Dual Catridges
BT-401-H
BT-402-H
BT-403-H
Silver Filled Bondatherm 2 gram Epoxy Hinge Packs
Thermally Conductive Epoxy Potting UL Listed 100 gram Bondatherm Hinge Pack
Aluminum Filled Bondatherm Epoxy Adhesive for Heat Sinks 100 gram Hinge Pack
2 gram hinge pack
100 gram hinge pack
100 gram hinge pack
BONDATHERM™ CARTRIDGES
BT-101-50M
These high bond strength adhesives are clear 100% solids, two component, non-sag adhesives with a quick
setting time of 5–46 minutes at room temperature. They are excellent for bonding plated metals, pewter,
glass, wood, ceramic, felt, cement, gem stones, most plastics and rubbers. These adhesives were tested in
our laboratory for flame retardancy properties. According to our test results they meet the requirements
of UL94HB.
APPLICATIONS:
These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and
jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the
popular BondaTherm Equalizer Kit dual barrel cartridge dispensing system and bulk packaging.
146
wakefield-vette.com
Non-sag consistency
High bond strength
Fast room temperature cure – three speeds to choose from
Water & chemical resistance
Outstanding thermal shock resistance
1:1 mix ratio
Impact resistance
Specifications
Color
Mix ratio by volume
Mixed viscosity, 25°C cps*
Solids content, %
Specific gravity, 25°C
Semi-transparent (available in black)
1:01
Non-Sag
100
1.15
Shore D hardness
10-3005NS
10-3020NS
10-3046NS
86
72
65
Work Life, 25°C, minutes
10-3005NS
10-3020NS
10-3046NS
3-5
10-15
25-30
Handling time, 25°C, minutes
10-3005NS
10-3020NS
10-3046NS
15-20
30-35
55-60
Cure time, 25°C, hours
24-48
Coefficient of thermal expansion
(in/in/°C)
60x10-6
Operating temperature range, °C
Dielectric strength,V/mil
Izod Impact ft-lb/in
Dielectric constant, 1KHz at 25°C
Dissipation factor, 1KHz at 25°C
Volume resistivity, ohm-cm at 25°C
BT-101-50M
INSTRUCTIONS FOR USE:
1. Thoroughly mix equal parts of resin to catalyst
by weight or volume.
2. Apply evenly to both surface(s) to be bonded.
3. Application to the substrates should be made
within five minutes. Larger quantities and/or
higher temperatures will reduce the working
time. Avoid mixing large quantities and/or
at high temperature due to the possibility of
creating a high exothermic temperature.
4. Join the coated surfaces. Allow to cure at 60°F
(16°C) or higher until adhesive is set. Heat may
be added up to 200°F (93°C) to accelerate
the cure.
5. Avoid moving parts during cure. Pressure to the
substrates is recommended. Maximum shear
strength is obtained with a 3-5 mil bond line.
50 to +130
420
2.7
4
0.017
2.0 x 1014
-
Shear strength, psi
Aluminum (etched)
Cold rolled steel
Copper
Brass
Stainless Steel
Galvanized Steel
ABS
PVC
1,500
1,000
960
725
750
900
500
335
Polycarbonate
Compression strength, psi
250
8,500
Adhesive coverage: a .005-inch bond line will yield approximately 320 sq. ft./gallon
Contact us: (603) 635-2800
147
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
GENERAL & THERMAL HIGH PERFORMANCE EPOXY
BT-102-50M
A two component system that forms strong structural bonds at room temperature. This unique adhesive
system provides high peel and shear strengths. This is excellent for bonding many metals and woods, most
plastics and rubbers and masonry products.
BT-102-50M is a toughened, flexible, and impact resistant epoxy adhesive. BT-102-50M is a two
component system that forms strong structural bonds at room temperature. This unique adhesive system
provides high peel and shear strengths. BT-102-50M is excellent for bonding many metals and woods,
most plastics and rubbers and masonry products. This system is designed for electronic, aerospace and
other demanding industrial applications. This product is available in the popular BondaTherm Equalizer
dual barrel cartridge system.
FEATURES
•
•
•
•
•
•
Impact resistant
Excellent electrical insulator
High peel and shear
Outstanding structural bonds
Convenient 1:1 Ratio
Retention of strength after environmental aging
Typical Specifications
Mixed viscosity, 25°C, cps
150,000
Specific gravity, 25°C,
Resin
Catalyst
1.32
1.2
Gel time, 100 grams, 25°C
Tensile shear strength, psi
Durometer, shore D
Dielectric strength, V/mil
Dielectric constant, 60 Hz
Dissipation factor, 60 Hz
Volume resistivity, ohm-cm
Thermal conductivity, btu·in/hr·ft2·°F
Coefficient of thermal expansion, per °C
70 minutes
2,600
70
410
4.4
0.02
1.1 x 1015
4
10 x 10-5
Adhesive coverage: a .005-inch bond line will yield approximately
320 sq. ft./gallon
148
INSTRUCTIONS FOR USE:
1. Surfaces must be clean and grease free. Use an
oil free solvent such as acetone to wipe surfaces.
Adhesion can be substantially increased by
abrading the surfaces to be bonded with emery
cloth, sand paper, carbide grinding tools, and
sand blasting. A roughened, porous surface will
produce the best results. Any oxidized metal films
should be removed just prior to application of the
epoxy adhesive mixture.
2. Thoroughly mix equal parts of resin and catalyst
by volume.
3. Apply mixed product evenly to both surfaces.
4. Join the adhesive coated surfaces within 60
minutes of mixing resin and catalyst.
5. Cure according to one of the following schedules:
77°F
24-48 hours
150°F
2 hours
180°F
1 hour
200°F
30 minutes
STORAGE, HANDLING, AND AVAILABILITY:
• Store in a cool, dry place in original containers.
• Keep containers closed and stir well before using.
wakefield-vette.com
BT-301-50M & BT-301-200M
BONDATHERM™ CARTRIDGES
BONDATHERM™ CARTRIDGES
The BT-301-50M and BT-301-200M have simple 1:1 mix ratios and develop a 1,400 psi Lap Shear
strength (aluminum to aluminum) in four hours at room temperature. After just twenty four hours
the strength is over 2,200 psi. This is perfect for any thermally conductive applications. Both
cartridges are a two component fast curing thermally conductive epoxy adhesive.
These products are specifically formulated for use in the convenient BondaTherm Equalizer dual
barrel cartridge system. The BT-301-50M and BT-301-200M offer fast heat dissipation for a wide
range of electronic applications. The black resin and white hardener provide an excellent visual
indication of a complete mix.
FEATURES
•
•
•
•
•
Fast room temperature cure
Thermally conductive
Forms strong bonds to a variety of substrates
Electrically insulating
Vibration and impact resistant
Typical Properties
Color
Resin
Hardener
Mixed
Black
White
Dark Gray
Viscosity, @25°C, cps
Resin
Hardener
70,000
70,000
Specific Gravity, @25°C
Resin
Hardener
1.5
1.5
Gel Time, 25°C, 15 grams
15 minutes
Durometer, Shore D
@25°C
@70°C
80
50
Lapshear Strength (Al to Al), psi
After 4 hours
After 24 hours
1,413
2,231
Thermal Conductivity, W/m - °K
Dielectric Strength, V/mil
Dielectric Constant, 25°C, 100Hz
Volume Resistivity, ohm-cm, 25°C
1.04
440
5.3
2.4 x 1012
Coefficient of Thermal Expansion, ppm/°C
Below Tg
Above Tg
45
175
Operating Temperature, °C
-40 to +120
INSTRUCTIONS FOR USE:
1. Surfaces must be clean and grease free. Use an oil free
solvent such as acetone to wipe surfaces. Adhesion can
be substantially increased by abrading the surfaces to be
bonded with emery cloth, sand paper, carbide grinding
tools, and sand blasting. A roughened, porous surface
will produce the best results. Any oxidized metal films
should be removed just prior to application of the
epoxy adhesive mixture.
2. Dispense material from BondaTherm Equalizer.
Apply mixed product to substrate to be bonded.
3. Join substrates within 3-5 minutes.
4. Cure according to one of the following schedules:
5. 25°C 2-4 hours
65°C < 10 minutes
STORAGE, HANDLING AND AVAILABILITY:
• Store in a cool, dry place in original containers.
• Please read and understand the Safety Data Sheet
(SDS) before using this product.
NOTES:
1. At room temperature, the BT-301-50M and
BT-301-200M will reach handle cure within
1-2 hours. The lap shear strength is 1,413 psi
after 4 hours.
2. This product is an adhesive and is not
designed for potting and encapsulating
applications. The BT-301-50M and BT301-200M are fast reacting epoxy systems
and they will create a high exothermic
temperature in large mass sizes (avoid
mass sizes greater than 25 grams).
Contact us: (603) 635-2800
149
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
GENERAL & THERMAL HIGH PERFORMANCE EPOXY
BT-103-50M
These high bond strength adhesives are clear 100% solids, two component, low viscosity adhesives with
a quick setting time of 5-46 minutes at room temperature. They are excellent for bonding plated metals,
pewter, glass, wood, ceramic, felt, cement, gem stones, most plastics, and rubbers. These adhesives were
tested in our laboratory for flame retardancy properties. According to our test results they meet the
requirements of UL94HB.
These unique adhesives are ideally suited for a wide range of electronic, electrical, industrial, structural, and
jewelry applications. These adhesives are also an excellent choice for field repairs. They are offered in the
popular TriggerBond® dual barrel cartridge dispensing system and bulk packaging.
FEATURES
•
•
•
•
•
•
BONDATHERM HARDWARE
BONDATHERM™ CARTRIDGES
High bond strength
Outstanding thermal shock resistance
Water and chemical resistance
Impact resistance
1:1 mix ratio
Fast room temperature cure – three speeds
to choose from
Typical Specifications (10-3005)
Color
Mix ratio by volume
Mixed viscosity, 25°C cps * Solids
Content, %
Clear (available in black)
1:01
12,000
100
Specific gravity, 25°C Shore D hardness
10-3005
10-3020
10-3046
1.15
86
72
65
Work Life, 25°C, minutes
10-3005
10-3020
10-3046
3-5
10-15
25-30
Handling time, 25°C, minutes
10-3005
10-3020
10-3046
15-20
30-35
55-60
Cure time, 25°C, hours
Coefficient of thermal expansion (in/in/°C)
Operating temperature range, °C Dielectric strength
V/mil
Izod Impact, ft-lb/in.
Dielectric constant, 1KHz at 25°C
24-48
60x10-6
50 to +130
420
2.7
4.00
Dissipation factor, 1KHZ at 25°C Volume resistivity,
ohm-cm at 25°C Shear strength, psi
Aluminum (etched) Cold rolled
Steel Copper
Brass
Stainless Steel
Galvanized Steel
ABS
PVC
Polycarbonate
.017
2.0 x 1014
1,500
1,000
960
725
750
900
500
335
Compression strength, psi
250
INSTRUCTIONS FOR USE:
1. Thoroughly mix equal parts of resin to catalyst by
weight or volume.
2. Apply evenly to both surface(s) to be bonded.
3. Application to the substrates should be made
within five minutes. Larger quantities and/or
higher temperatures will reduce the working time.
4. Avoid mixing large quantities and/or at high
temperature due to the possibility of creating a
high exothermic temperature.
5. Join the coated surfaces. Allow to cure at 60°F
(16°C) or higher until adhesive is set. Heat may be
added up to 200°F (93°C) to accelerate the cure.
6. Avoid moving parts during cure. Pressure to the
substrates is recommended. Maximum shear
strength is obtained with a 3-5 mil bond line.
Wakefield-Vette Part Number
Description
BT-01-50M
BT-01-200M
BT-02-50M
BT-02-200M
BondaTherm Equalizer Dispense Gun (50ml)
BondaTherm Equalizer Dispense Gun (200ml)
BondaTherm Equalizer Static Mixer (50ml)
BondaTherm Equalizer Static Mixer (200ml)
BONDATHERM EQUALIZER GUN
BT-01-50M
BONDATHERM™ CARTRIDGES
FOR USE W/ 200ML CARTRIDGES
BT-01-200M
BONDATHERM EQUALIZER STATIC MIXERS
BT-02-50M
FOR USE W/ 50ML CARTRIDGES
FOR USE W/ 200ML CARTRIDGES
BT-01-200M
Adhesive coverage: a .005-inch bond line will yield approximately 320 sq. ft./gallon
150
wakefield-vette.com
Contact us: (603) 635-2800
151
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
GENERAL & THERMAL HIGH PERFORMANCE EPOXY
BONDATHERM EQUALIZER KIT™
Wakefield-Vette Part Number
BT-101-50M-EQZ
BT-102-50M-EQZ
BT-301-50M-EQZ
BT-301-200M-EQZ
BONDATHERM HINGE PACKS
Description
Two Dual Cartridges (BT-101-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-102-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-301-50M), One Gun (BT-01-50M), Three Mixers (BT-02-50M)
Two Dual Cartridges (BT-301-200M), One Gun (BT-01-200M), Three Mixers (BT-02-200M)
(2) Dual Cartridges, (1) Dispense Gun, (3) Static Mixers
Packaging
Kit
Kit
Kit
Kit
BT-401-H
BT-401-H is a two component epoxy adhesive filled with silver. This electrically conductive epoxy
resin formulation offers continuity of conductivity with an electrical resistivity value of less than 1x10-4
ohm-cm. 40-3900 is also well known for its wide operating temperature range, -50 to + 170°C.
BT-401-H is specifically designed for adhesive bonding in microelectronic and optoelectronic
applications. Due to its excellent continuity, it has also been used extensively in applications such
as micro-wave EMI and RFI shielding, in the assembly or repair of printed circuit boards, wave guides,
electronic modules, flat cable, high frequency shields, connectors, circuitry, and as a cold solder.
BT-401-H is formulated with pure silver (no alloys) and is designed in a convenient 1:1 mix ratio.
Both the resin and hardener have silver powder dispersed.
STORAGE, HANDLING, AND AVAILABILITY:
• BT-401-H Resin and hardener should be stored
at 25°C in original tightly sealed containers.
Expected shelf life is twelve months in original
unopened containers.
• Filler settling is common with these products.
Gently stir resin and hardener before using to
make sure fillers are evenly dispersed.
FEATURES
•
•
•
•
•
Electrically conductive
Thermally conductive
Room temperature cure
Easy 1:1 mix ratio
Good bond strength
Typical Specifications
152
wakefield-vette.com
Mix Ratio, by Weight
Color
Mixed Viscosity
Pot Life, 100 gram mass @ 25°C
1:1
Silver
Creamy Paste
1 Hour
Specific Gravity, 25°C
Resin
Hardener
2.98
1.8
Hardness, Shore D
Thermal Conductivity, W/m- °K
Tensile Lapshear, psi (Al to Al)
Flexural Strength, psi
Volume Resistivity, ohm-cm
Operating Temp. Range, °C
70
7.93
700
10,200
0.0001
50 to +170
Cure Schedule
a) 24 hours @ 25°C
b) 1 hour @ 65°C
c) 15 minutes @ 90°C
Contact us: (603) 635-2800
153
THERMAL
INTERFACE PRODUCTS
THERMAL
INTERFACE PRODUCTS
GENERAL & THERMAL HIGH PERFORMANCE EPOXY
BT-402-H
This system has been formulated to meet the stringent non-burning requirements of UL94 V-0.
BT-402-H Black Epoxy is used with Catalyst 190 and are listed with Underwriter’s Laboratory for
passing UL94 V-0. This system offers excellent heat transfer, low shrinkage, and outstanding insulation
properties. BT-402-H Black with Catalyst 190 passes NASA’s outgassing requirements per ASTM
E595-07. Other Catalyst’s are available as well (30, 150.).
Typical applications for BT-402-H include encapsulating power supplies, transformers, coils,
insulators, and sensors. This system is an excellent choice for applications requiring high thermal
conductivity and flame retardancy.
Typical Specifications
154
BONDATHERM HINGE PACKS
BONDATHERM HINGE PACKS
Viscosity @ 25°C cps, Resin
Mixed with Cat. 190
Mixed with Cat. 30
Mixed with Cat. 150
60,000
28,000
17,000
1,500
Specific Gravity, 25°C
Hardness, Shore D Color
Tensile Strength, psi
Linear Shrinkage, in/in
Operating Temp. Range,°C
Dielectric Strength, V/mil Dielectric
Constant at 60 Hz
Volume Resistivity, ohm-cm, 25°C
Dissipation Factor, 60 Hz
Thermal Conductivity, W/m- °K
Compressive Strength, psi
Coefficient of Expansion, in/in °F
Heat Distortion, °C Outgassing
1.6
90
Black
9,850
0.002
60 to +200
485
5.6
1.5 x 1015
0.015
2.16
15,000
1.4 x 10-5
(with Cat. 190)
%TML
%CVCM
155
0.5
0.01
INSTRUCTIONS FOR USE:
A. With Catalyst 190 listed with UL 94 V-0 (room
temperature curing):
1. By weight, thoroughly mix 5 parts Catalyst
190 to 100 parts BT-402-H resin.
2. Degas and pour. Cure at room temperature
for 12-24 hours at 25°C ambient.
B. With Catalyst 30 listed with UL 94 V-0 and RTI
Rating of 130°C (Heat curing - Recommended for
higher operating temperature and physical
property applications):
1. By weight, thoroughly mix 10 parts Catalyst
30 to 100 parts BT-402-H resin.
2. Pour and cure according to one of the
following recommended cure schedules:
a) 85°C (185°F)
3-4 hours
b) 100°C (212°F)
2-3 hours
For optimum performance, an additional
2 hours @ 365°F (185°C) is recommended.
C. With Catalyst 150 (room temperature/heat curing):
1. By weight, thoroughly mix 17 parts Catalyst
150 to 100 parts BT-402-H resin.
2. Degas and pour. Cure at room temperature
for 24 hours or for 2-3 hours at 35-40°C.
wakefield-vette.com
BT-403-H
BT-403-H is a two component, aluminum filled epoxy system. This system is used for making heat
resistant tools, parts, or bonds that require the highest thermal conductivity and heat resistance. We
have developed this extremely conductive epoxy by formulating it with a unique combination of fillers,
particle sizes and dispersion techniques.
BT-403-H has good heat dissipation making this a popular choice for a variety of heat sink applications.
Its viscosity is particularly suited for Fin bonding. BT-403-H passes NASA’s outgassing requirements per
ASTM E-595-07.
FEATURES
• Excellent Thermal Conductivity
• Superior Adhesion
• Low Viscosity allows quick self leveling
STORAGE, HANDLING, AND AVAILABILITY:
• BT-401-H Resin and hardener should be stored
at 25°C in original tightly sealed containers.
Expected shelf life is twelve months in original
unopened containers.
• Filler settling is common with these products.
Gently stir resin and hardener before using to
make sure fillers are evenly dispersed.
Typical Specifications
Color
Grey
Viscosity, 25°C,
Resin
Mixed
130,000
8,000
Specific Gravity, 25°C
Working time, 100 grams, 25°C
1.81
5 Hours
Durometer, Shore D
25°C
100°C
90
65
Tensile Strength, psi, 25°C Aluminum 9,000
to Aluminum
1" overlap
2,500
Compressive Strength, PSI, 25°C Mix
Ratio, by weight
Operating temperature, °C
Coefficent of Thermal Expansion, °C
Thermal Conductivity, W/m- °K
18,500
100:10
-55 to 155
28 x 10-6
4.5
Outgassing
% TML
% CVCM
0.91
0.07
Contact us: (603) 635-2800
155
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