FWP201610P-2R2ML

FWP201610P L Series Engineering Specification 1. Scope Feature z High saturation current realized by material properties and structure design z Low DC resistance to achieve high conversion efficiency and lower temperature rising z Low Profile: 2.0 mm × 1.6 mm × 1.0 mm. z Magnetically shielded structure to accomplish high resolution in EMC protection. z Halogen free, Lead Free, RoHS Compliance. Applications FWP201610P L series is generic applied in portable DC to DC converter line. z Smart phone, PAD z DC/DC converter z Thin-type power supply module, 2. Explanation of Part Number F W P 2 0 1 6 1 0 P 2 R 2 M L 1 2 3 4 5 6 7 ♦ ♦ ♦ ♦ ♦ ♦ ♦ 1 : Series Name: Wire-wound type power inductor 2 : Size Code: The first two digitals: length(mm), The last two digitals: width(mm) 3 : Thickness in mm 4：Material code: Iron powder 5：Initial inductance value: 2R2 = 2.2 μH 6：Model code, Tolerance of Inductance ±20%. 7：Electrode type. FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 1 of 9  3. Construction & Dimensions 3.1. End termination: Ni/Sn 3.2. Construction & Dimension : L [mm] W [mm] T [mm] E [mm] 2.0±0.2 1.6±0.2 1.0 max. 0.5±0.3 3.3. Recommend Land Pattern Dimensions : B A A [mm] B [mm] C [mm] 1.6 0.9 2.0 C 4. General specifications 4.1. Temperature Specifications Operating Temperature range Storage Temperature range : -40℃ to +125℃ : -50℃ to +125℃ * The detail operating temperature describing can refer to 5.1 (7). FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 2 of 9  5. Performance Characteristics 5.1. Specifications INPAQ Part Number FWP201610P-R24ML FWP201610P-R33ML FWP201610P-R47ML FWP201610P-R68ML FWP201610P-1R0ML FWP201610P-1R5ML FWP201610P-2R2ML Li [μH] Initial inductance @1mA RDC [mΩ] DC Resistance Irms [A] Isat [A] Saturation Current Heat Rating Current Typical Maximum Typical Maximum Typical Maximum 0.24 0.33 0.47 0.68 1.0 1.5 2.2 17 24 33 41 60 114 135 21 29 40 49 69 137 150 5.6 5 4.4 3.7 2.9 2.5 1.9 5.05 4.50 4.00 3.33 2.61 2.25 1.71 5.0 4.1 3.5 3.4 2.6 1.9 1.7 Note 1: Customized design is available, please contact us. Nore 2: All test referenced to 26℃ ambient Note 3: Inductance tolerance +/- 20% Note 4: Inductance is measured with Agilent® LCR meter 4285A. Test frequency at 1MHz. Note 5: DC resistance is measured with HIOKI® micro-ohm meter RM3542-01. Note 6: Isat means that DC current will cause a 30% inductance reduction form initial value. Note 7: Irms means that DC current will cause coil temp. rising to 40℃ whichever is smaller. FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 3 of 9  4.50 3.69 3.15 3.06 2.26 1.65 1.50 5.2. Current Characteristic FWP201610P-R24ML 0.25 70 0.23 Inductance [uH] 50 0.18 0.15 0.13 0.10 Inductance 40 Temp. Rising 30 0.08 20 0.05 Temp.Rising[℃] 60 0.20 10 0.03 0.00 0 0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 5.5 6 DC Bias [A] FWP201610P-R68ML FWP201610P-R47ML 0.50 0.35 Inductance 40 Temp. Rising 30 0.30 0.25 0.20 20 0.15 10 0.10 0.05 0.5 1 1.5 2 2.5 3 3.5 4 50 0.65 0.60 0.55 0.50 Inductance 40 Temp. Rising 30 0.45 20 0.40 10 0.35 0.30 0 0 60 0.70 Inductance [uH] 50 Temp.Rising[℃] 0.40 70 0.75 60 0.45 0 0 4.5 0.5 1 1.5 2.5 3 3.5 4 DC Bias [A] DC Bias [A] FWP201610P-1R0ML FWP201610P-1R5ML 1.00 70 70 1.60 0.95 60 50 0.80 40 Inductance 0.75 Temp. Rising 0.70 30 0.65 20 0.60 0.55 0.50 0 0.5 1 1.5 2 2.5 3 60 1.40 Inductance [uH] 0.85 Temp.Rising[℃ ] 0.90 Inductance [uH] 2 50 1.20 1.00 0.80 0.60 Inductance 40 Temp. Rising 30 20 0.40 10 0.20 0 0.00 3.5 10 0 0 0.2 0.4 0.6 0.8 1 DC Bias [A] 1.2 1.4 1.6 1.8 2 2.2 2.4 2.6 DC Bias [A] 70 60 50 Inductance 40 Temp. Rising 30 20 Temp.Rising[℃ ] Inductance [uH] FWP201610P-2R2ML 2.40 2.20 2.00 1.80 1.60 1.40 1.20 1.00 0.80 0.60 0.40 0.20 0.00 10 0 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2 2.2 DC Bias [A] FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 4 of 9  Temp.Rising[℃] Inductance [uH] 0.80 70 Temp.Rising[℃] 0.55 6. Reliability and Test Condition Test item Test condition Criteria 1. More than 95 % of terminal electrode should be covered 1. Solder temperature : 260 ± 5℃ with new solder 2. No mechanical damage Resistance to Solder Heat 2. Flux : Rosin 3. DIP time : 10 ± 1 sec 3. Inductance value should be within ± 20 % of the initial value 1. Reflow temperature : 245℃ It 1. No mechanical damage shall be Soldered on the 2. Soldering the products on substrate applying direction Adhesive Test PCB after the pulling test parallel to the substrate force > 5 N 2. Apply force(F) : 5 N 3. Test time : 10 sec 1. Temperature:-50 ~ 125℃ For 30 minutes each 1. No mechanical damage 2. Cycle: 500 cycles 2. Inductance should be Temperature Cycle 3. Measurement: At ambient within ±20% of the initial temperature 24 hours after test value completion 1. Temperature: 85 ± 2℃ 2. Testing time: 500 hrs 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be Dry Heat Test current within ± 20% of the initial 4. Measurement: At ambient value temperature 24 hours after test completion 1. Temperature: 60 ± 2℃ 2. Humidity: 90-95 % RH 1. No mechanical damage 3. Applied current: Full rated 2. Inductance should be current within ±20% of the initial Humidity Test 4. Testing time: 500 hrs value 5. Measurement: At ambient temperature 24 hours after test completion FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 5 of 9  7. Taping Package and Label Marking 7.1. Carrier tape dimensions mm A0 B0 K0 t 1.80±0.1 2.20±0.1 1.15±0.1 0.22±0.05 7.2. Taping reel dimensions PART SIZE (EIA SIZE) 2016 Qty.(pcs) 3,000 BOX 5 reels / inner box FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 6 of 9  7.3. Taping specifications There shall be the portion having no product in both the head and the end of taping, and there shall be the cover tape in the head of taping. 7.4. Label Marking The label specified as follows shall be put on the side of reel. (1) Part No. (2) Quantity (3) Lot No. * Part No. And Quantity shall be marked on outer packaging. 7.5. Quantity of products in the taping package (1) Standard quantity：3000pcs/Reel (2) Shipping quantity is a multiple of standard quantity. 8. Precautions for Handling 8.1. Precaution for handling of substrate Do not exceed to bend the board after soldering this product extremely. (reference examples) • Mounting place must be as far as possible from the position, which is close to the break line of board, or on the line of large holes of board. • Do not bend extremely the board, in mounting another components. If necessary, use back-up pin (support pin) to prevent from bending extremely. • Do not break the board by hand. break it. We recommend to use the machine or the jig to 8.2. Precaution for soldering Note that this product will be easily damaged by rapid heating, rapid cooling or local heating. Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and gradual cooling. FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 7 of 9  8.3. Recommendable reflow soldering Reference IPC-020c-5-1 Profile Feature Average Ramp Rate (Ts max to Tp) Preheat - Temperature Min (Tsmin) - Temperature Min (Tsmax) - Time(tsmin to tsmin) Time maintained above: - Temperature (TL) - Time (tL) Pb free Assembly 3 ℃/second max Peak Temperature (Tp) 260℃ +0/-5 ℃ Time within 5 ℃ of actual Peak Temperature (Tp) Ramp-Down Rate Time 25℃ to Peak Temperature 20-40 seconds FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  150℃ 200℃ 60-180 seconds 217℃ 60-150 seconds 6 ℃/second max. 8 minutes max Version: A4  Page 8 of 9  8.4. Soldering gun procedure Note the follows, in case of using solder gun for replacement. (1) The tip temperature must be less than 280°C for the period within 3 seconds by using soldering gun under 30 W. (2) The soldering gun tip shall not touch this product directly. 8.5. Soldering volume Note that excess of soldering volume will easily get crack the body of this product. 8.6. Taping Package Storage Condition Storage Temperature : 5 to 40 ℃ Relative Humidity: < 65%RH Storage Time : 12 months max FWP201610P L Series Engineer Specification  „ All Specifications are subject to change without notice.  Version: A4  Page 9 of 9