CURRENT SENSOR-LOW TCR
PF0603-series
5%,1%,
size 0603
Product specification – Feb. 17, 2010 V0
RoHS Compliant & Halogen Free
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1
Chip Resistor Surface Mount
SCOPE
This specification describes PF0603 current
sensor – low TCR chip resistors with
lead-free terminations.
PF
SERIES
0603
ORDERING INFORMATION - GLOBAL PART
NUMBER
Part number is identified by the series name, size,
tolerance, packaging type, temperature coefficient of
resistance, taping reel, resistance value.
X X X XX XXXX
(1) (2) (3) (4)
(5)
APPLICATIONS
PF0603
●
●
●
●
(1) TOLERANCE
Power supplies
Consumer(Mobile、PNDs、…)
Laptop
HDDs
FEATURES
● Products with lead free terminations meet
6
Z
(6)
F = ±1%
J = ±5%
(2) PACKAGING TYPE
R = Paper/PE taping reel
RoHS requirements.
● High component and equipment reliability
with high power rating 0.33W (1/3W).
(3)TEMPERATURE COEFFICIENT OF RESISTANCE
E=±50ppm/°C, M=±75ppm/°C, F=±100ppm/°C
● Low resistance 10mΩ and narrow
tolerance ±1% can suitable for current
detection.
(4) TAPING REEL
07 = 7 inch dia. Reel & 0.1W(1/10W)
7W = 7 inch dia. Reel & Power Rating 0.2W(1/5W)
7T = 7 inch dia. Reel & Power Rating 0.33W(1/3W)
47 = 7 inch dia. Reel & Power Rating 0.4W
57 = 7 inch dia. Reel & Power Rating 0.5W
(5) RESISTANCE VALUE
0R01 (10mR) to 0R1 (100mR)
(6) Default Code
Letter Z is system default code for order only(NOTE)
ORDERING EXAMPLE
The ordering code for a PF0603 0.2W chip resistor,TC100
value 0.068Ω(68mR) with ±1% tolerance, supplied in 7-inch
tape reel with 5Kpcs quantify is:
PF0603FRF7W0R068Z.
NOTE
1. All our RSMD products meet RoHS compliant and Halogen
Free. "LFP" of the internal 2D reel label mentions "Lead Free
Process".
2. On customized label, "LFP" or specific symbol can be
printed.
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2
Chip Resistor Surface Mount
PF
SERIES
0603
6
MARKING
PF0603:
Fig.1
Value=10mΩ
CONSTRUCTION
OUTLINES
The resistors are constructed out of
For dimension see Table 1
a high-grade ceramic body. Internal
metal electrodes are added at each
end and connected by a resistive
paste. The composition of the paste
is adjusted to give the approximate
required resistance and laser cutting
of this resistive layer that achieves
tolerance trims the value. The
resistive layer is covered with a
protective coat and printed with the
resistance value. Finally, the two
external terminations (matte tin) are
added. See fig. 2.
Fig.2
Chip resistor outlines
DIMENSIONS
Table 1
TYPE
L (mm)
W (mm)
H (mm)
I1 (mm)
PF0603
1.60±0.20
0.80±0.20
0.60±0.15
0.30±0.15
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3
Chip Resistor Surface Mount
PF
SERIES
0603
6
ELECTRICAL CHARACTERISTICS
Table 2
CHARACTERISTICS
PF0603
0.1W;0.2W;0.33W;0.4W;0.5W
–55°C to +155°C
Operating Temperature Range
( P * R)
Maximum Working Voltage
10mΩ to 100mΩ
Resistance Range
± 50ppm/℃,± 75ppm/℃, ±100ppm/°C
Temperature Coefficient
PACKING STYLE AND PACKAGING QUANTITY
Table 3
PRODUCT TYPE
PACKING STYLE
REEL DIMENSION
PF0603
Paper taping reel
7" (178 mm)
QUANTITY PER REEL
5,000 Units
FUNCTIONAL DESCRIPTION
POWER RATING
PF0603 rated power at 70°C is 0.1W; 0.2W ;
0.33W; 0.4W and 0.5W
RATED VOLTAGE
The DC or AC (rms) continuous working voltage
corresponding to the rated power is determined by the
following formula:
U=
( P * R)
Where
U=Continuous rated DC
or AC (rms) working voltage (v)
P=Rated power
R=Resistance value (Ω)
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Chip Resistor Surface Mount
PF
SERIES
0603
6
TAPING REEL
Table 4
DIMENSION
Tape Width(mm)
0603
8
ØA (mm)
180.0+0/-3
ØN (mm)
ØC (mm)
60.0+1/-0
13.0±0.2
ØD (mm)
W1 (mm)
21.0±0.8
8.4 +1/-0
W2 (mm)
Max 18.4
Fig.4 Reel
PAPER/PE TAPE SPECIFICATION
Table 5
DIMENSION
0603
A0 (mm)
1.10±0.15
B0 (mm)
W (mm)
1.90±0.15
8.0±0.30
E (mm)
F (mm)
1.75±0.10
3.50±0.10
P0 (mm)
P1 (mm)
4.0±0.10
4.0±0.10
P2 (mm)
D0 (mm)
2.0±0.10
1.50±0.10
T (mm)
0.85±0.15
Fig.5 Paper/PE tape
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5
Chip Resistor Surface Mount
PF
SERIES
0603
6
FOOTPRINT DIMENSION
Size Footprint
PF0603
Dimensions
Code
unit :mm
A
B
C
D
2.10
0.60
0.75
0.92
Fig.6 RECOMMENDED FOOTPRINT DIMENSIONS
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6
Chip Resistor Surface Mount
PF
SERIES
0603
6
TESTS AND REQUIREMENTS
TEST
Life/
Endurance
TEST METHOD
IEC 60115-1 4.25.1
High
Temperature
Exposure/
Endurance
at
upper
category
temperature
Moisture
Resistance
IEC 60068-2-2
Thermal
Shock
MIL-STD-202 Method 107G
Short time
overload
IEC 60115-1 4.13
Board Flex/
Bending
IEC 60068-2-21
Solderability
- Wetting
IPC/JEDEC J-STD-002B
test B
- Leaching
IPC/JEDEC J-STD-002B
test D
- Resistance
to Soldering
Heat
IEC 60068-2-58
MIL-STD-202 Method 106G
PROCEDURE
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
1,000 hours at 155±5 °C,unpowered
REQUIREMENT
Each temperature / humidity cycle is defined at
8 hours (Method 106G), 3 cycles / 24 hours for
10d. with 25 °C / 65 °C 95% R.H, without steps
7a & 7b, un-powered Parts mounted on
test-boards, without condensation on parts
Measurement at 24±2 hours after test
conclusion.
-55/+125 °C
Note: Number of cycles required is 300.
Devices
unmounted
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
Applied 5 times of rating power 5 seconds at
room temperature
± ( 0.5% + 0.0005Ω)
Chips mounted on a 90mm glass epoxy resin
PCB(FR4)
2 mm bending
Bending time: 60±1 seconds
Electrical Test not required
Magnification 50X
SMD conditions:
1st step: Method B, aging 4 hours at 155 °C
dry heat
2nd step: leadfree solder bath at 245±3 °C
Dipping time: 3±0.5 seconds
Leadfree solder, 260 °C, 30 seconds
immersion time
± (1.0 % + 0.0005Ω)
Condition B, no pre-heat of samples
Leadfree solder, 260±5 °C, 10±1seconds
immersion time
Procedure 2 for SMD: devices fluxed and
cleaned with isopropanol
± ( 0.5% + 0.0005Ω)
± (1.0 % + 0.0005Ω)
± (1.0 % + 0.0005Ω)
± ( 1.0% + 0.0005Ω)
± (0.5% + 0.0005Ω)
No visible damage
Well tinned (>95%
covered)
No visible damage
No visible damage
No visible damage
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7
Chip Resistor Surface Mount
PF
SERIES
0603
6
REVISION HISTORY
REVISION
DATE
CHANGE NOTIFICATION
DESCRIPTION
Version 0
2010-02-17
- First issue of this specification
Version 1
2010-12-16
- Range Extension
Version 2
2011-6-15
- Dimension of Paper Tape Modify
Version 3
2011-12-2
- Dimension of Paper Tape Modify
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