CPA2512E1200FS-T10

Page 1 of 3 CPA Series (2512) Construction:  High Purity Alumina ceramic  Nickel alloy thin-film resistive element  Epoxy-resin overcoat  Pre-tinned (Sn100, matte) terminations over Ni barrier is standard (RoHS and Pb Free)  Halogen Free Features:  TCR’s to ± 25ppm/ºC  Tolerances less than ± 1% available  Standard and custom sizes & terminations available (Sn60Pb40 option)  High volume production, suitable for commercial and special applications  Competitive pricing Description: These power resistors are designed to tolerate high current and establish a low thermal resistance interface with the circuit board. A lower thermal resistance more efficiently sinks heat to the board, enabling a larger effective area for heat dissipation. As a result, much lower surface temperatures are achievable in comparison to standard chip resistors for the same chip size and applied power. Dimensions: Size Standard Dimensions (mm) Inch Metric L W H T-top 2512 6332 6.3 ± 0.2 3.2 ± 0.2 0.7± 0.1 0.9 ± 0.2 Call for other sizes and/or termination styles CPA2512 Derating Curve Examples: 6 Electrical Specifications: Size: Inch (Metric) Rated Power 1, 2 Rated Voltage Resistance Tolerance Standard Resistance Values (E12) TCR (ppm/ºC) 3 Operating Temperature Range 4 Insulation Resistance (100V, 1min) 5 T-btm 2.0 ± 0.2 2512 (6332) Up to 16W 1, 2 √(PxR) ± 1% 3.3 to 120 Ω Call for other values 22 thru 120 Ω ± 25 (E) 3.3 thru 20 Ω ± 50 (Q) -55 to 155ºC > 1GΩ Notes: 1. Dependent on effective thermal conductivity/resistance of board construction/land design and size of board - greater power capability for board/land with lower thermal resistance. For relatively high thermal resistance mountings, the power resistors are capable of generating sufficient heat to reflow solder bonds without device damage. 2. Refer to Thermal Performance Plot below. 3. Per MIL-PRF-55342 (-55/25/125ºC). 4. Per MIL-PRF-55342. 5. Per IEC 60115-1. 6. Derating curves are derived from the thermal performance plots. Page 2 of 3 Thermal Performance: Peak Surface Temperature Rise of CPA2512 per Board Thermal Resistance and Applied Power (see notes below for details) 250 Peak Surface Temp. Rise (deg C) 200 16W 150 16W 10W 10W 6W 3W 6W 100 1W 3W 50 1W 0 0.1 1 10 100 Thermal Resistance of Board (C/W) Notes:  Plots produced by characterization of thermal coefficients determined from experimental measurements (by thermal imaging camera) at thermal equilibrium with parts mounted to various boards (with homogeneous thermal conductivity to minimize uncertainty) per recommended solder pad dimensions and with boards pressed against a Cu carrier/heat-sink (not ideal) with a thermal compound interface in a static environment (no air flow).  Heat flow primarily through thickness of board with virtually zero lateral heat transfer in board.  Thermal resistance of test boards were calculated based on material manufacturer specified thermal conductivity (20ºC) via the following: Thermal Resistance (ºC/W) = L / (k • A), where Thermal Conductivity, k (W/m•K) = (L / (A • ΔT)) • ΔQ/Δt, L = Thickness of board in meters and A = area of chip resistor in meters (2512 size = 6.3x3.2mm)  The relationships between peak surface temperature rise, power, and board thermal resistance are linear, but the x-axis is plotted in log-scale to offer greater resolution at lower board thermal resistances. Recommended Solder Pad Dimensions: Feature A B C Standard Dimensions (mm) 1.6 7.7 3.5 Page 3 of 3 Environmental Performance Specifications: Test High Temperature Exposure Short Time Overload Reference MIL-PRF-55342, MIL-STD-202 Method 108A MIL-PRF-55342, MIL-STD-202 Method 107G MIL-PRF-55342 MIL-PRF-55342 Moisture Load Life JEDEC 22-A101 Life 4 Thermal Shock Resistance to Soldering Heat 1 Solderability 2 Board Flex MIL-PRF-55342, MIL-STD-202 Method 210F MIL-PRF-55342, MIL-STD-202 Method 208H IEC 60115-1 / JIS C 5202 MIL-PRF-55342 Conditions of Test Requirement 70ºC, 2000h, rated power 3, 1.5h on, 0.5h off ± 0.5% + 0.01Ω Condition F-3, -65ºC/0.25h to 155ºC/0.25h, 100 cycles ± 0.1% + 0.01Ω 155ºC, 100h 2.5 x rated voltage 3, 5 sec. 85°C / 85%RH, 2,000 hours 24h/cycle, with and without bias, bias = 1.5h on, 0.5h off @ 1/10th rated power 3 260ºC for 15 sec., over 220ºC for 60 sec., 3 cycles Precondition E: 150ºC dry bake for 16h, Method 1 “Dip and Look Test”, 245ºC, 5 sec., Pbfree (SnAgCu) Solder Bend amount of 3mm, measurements during and after bend Force of 3kg for 30 sec. ± 0.1% + 0.01Ω ± 0.1% + 0.01Ω ± 0.5% + 0.01Ω ± 0.1% + 0.01Ω Min 95% coverage of critical area ± 0.1% + 0.01Ω, No mech. damage No mech. damage Terminal Strength Notes: 1. Test conditions modified to represent the high temperature Pb-free reflow conditions and an extra cycle is added. 2. JESD22-B102D adds test conditions for Pb-free and is aligned with J-STD-002B referenced in MIL-STD-202 Method 208H. JESD22-B102D procedure comes from EIA-638, “Surface Mount Solderability Test”. 3. Parts mounted to boards in accordance with NEMA grade FR-4 of IPC-4101 (62mils thick) with no Cu carrier/heat-sink at a rated power of 2W (Board Therm. Res. ~ 72C/W). 4. Due to the complexity of managing the heat load of hundreds of pieces during qualification, long-term reliability testing for the 16W power rating had been conducted in terms of the equivalent current density via much thinner/narrower resistor patterns to limit the heat load. Full power testing was conducted on a smaller scale. Marking: Marking shall include:  Material Designator (A = Alumina)  The 4-digit Resistance Value (MIL-STD-1285D) Ex. A27R0 = 27.0Ω Resistance with Alumina Material Part Numbering: (Ex. CPA2512E27R0FS-T10) CP Product Designator CP A Material Designator A= Alumina 2512 E Size, Inch TCR Refer to table above E= Q= ± 25 ppm/ºC ± 50 ppm/ºC 27R0 Resistance Value Ex. 27R0 = 27.0 Ω F Tolerance F= ± 1% S Custom Designator Standard = S Custom = TBD -T10 Packaging Tape & Reel -T10 = 1000 -T50 = 5000 Note: When requesting quotes or ordering parts, it is not necessary to add the T&R package quantity (-T##) to the end of the part number. This will be added by us based on the quantity ordered.