FTC252010-2R2M

FTC252010-XXXM REVISION:V1 FTC252010 Series This specification applies to FTC Series of Mini Molded Chip Power Inductor. 1 SPECIFICATION 1.2 APPLICATIONS • Voltage Regulator Module (VRM) • Multi-phase regulators • Point-of-load modules • Smart phone POL modules • SSD modules • Notebook regulators • Battery power systems • Graphics cards • Data networking and storage systems • DC/DC converter • Cellular phones, LCD displays, HDDs 1.1 DESCRIPTION • Halogen Free • Thin type on- board power supply module for exchanger 1.3 ENVIRONMENTAL DATA •Storage temperature range: -55°C to +125 °C • 125 °C maximum total temperature • Operating temperature range: -55°C to +125°C operation ( ambient plus self- temperature rise) • 2.7 x2. 2 x1.0mm maximum • Solder reflow temperature: J-STD-0 20 D compliant surface mount package • Magnetically shielded, low EMI • High current carrying capacity, Low core losses • RoHS compliant 1.4 PRODUCT IDENTIFICATION FTC 252010-1R0 (1) (2) (3) M (4) (1)Product Series (2)Choke Size (3)Initial Inductance(L @ 0A):1R0=1μH (4)Inductance Tolerance:M=L+/-20% Page 2 / 9 FTC252010-XXXM REVISION:V1 1.5 ELECTRICAL PARAMETERS Part Number L0 (μH) ±20% IRMS IRMS ISAT (Amp) (Amp) (Amp) Max. Typ. Max. ISAT (Amp) Typ. DCR DCR (mΩ ) (mΩ ) Typ. Max. @25℃ @25℃ 12 17.5 FTC252010-R24M 0.24±20% 3.6 6.4 7.04 8.58 FTC252010-R33M 0.33±20% 2.2 6.2 6.82 7.92 13 19 FTC252010-R47M 0.47±20% 5.3 5.6 6.16 7.15 15 22 FTC252010-R68M 0.68±20% 5.6 5 5.5 6.05 22.9 27 FTC252010-1R0M 1±20% 5 4.1 4.51 5.28 25.7 30 FTC252010-1R5M 1.5±20% 4.1 3 3.3 4.29 42.8 55 FTC252010-2R2M 2.2±20% 2.3 2.1 2.31 3.3 62.6 70 FTC252010-3R3M 3.3±20% 2.1 2 2.2 2.75 86 100 FTC252010-4R7M 4.7±20% 1.5 1.6 1.76 2.2 145 160 Notes : 1. Initial Inductance (L0 ) Test Parameters:1MHz, 1V,Idc=0.0A,+25℃ 2. Operating temperature range - 55 °C to + 125 °C 3. IDC(A): DC current (A) that will cause an approximate ΔT of 40 °C 4 . 5. ISAT(A):DC current (A) that will cause L0 to drop approximately 30 % The part temperature (ambient + temp rise) should not exceed 125 °C under worst case operating conditions. Circuit design, component placement, PWB trace size and thickness, airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 6 . The rated current as listed is either the saturation current or the heating current depending on which value is lower. Page 3 / 9 FTC252010-XXXM REVISION:V1 1.6 DIMENSION-mm 1.7 RECOMMENDED PCB LAYOUT (unit:mm) Notes : 1. Tolerances are +/-0. 1millimeters unless stated otherwise 2 . Dimensions of recommended PCB layout are reference only . 3. Do not route traces nor place vias underneath the inductor. Proper layout is required. Page 4 / 9 FTC252010-XXXM REVISION:V1 2. Reliability Data No. Items Requirements Test Methods and Remarks 100 V DC between inductor coil and The 2.1 Insulation Resistance ≥ 100MΩ middle of the top surface of the body for 60 seconds. Dip pads in flux and dip in solder pot 2.2 2.3 Solderability Resistance to Soldering Heat 90% or more of electrode area shall (96.5Sn/3.0Ag/0.5Cu) at (245±5) ℃ for be coated by new solder. (5±1) seconds. No visible mechanical damage. Inductance change: Within ± 10% Dip pads in flux and dip in solder pot (96.5Sn/3.0Ag/0.5Cu) at (260±5) ℃ for ( 10± 1) seconds. Inductors shall be subjected to 2.4 Adhesion of terminal electrode 2.5 High temperature Strong bond between the pad and the core, without come offPC board. No visible mechanical damage. Inductance change: Within ± 10% (260±5)℃ for (20±5) s Soldering in the base whit 0.3mm solder. And then aplomb electrode way plus tax 10 N for ( 10± 1) seconds. Temperature is (+85±2)℃ and keep (96±2) hours. 2.6 Low temperature No visible mechanical damage. Inductance change: Within ± 10% Temperature is (-40±2)℃ and keep (96±2) hours. Page 5 / 9 FTC252010-XXXM REVISION:V1 ( Continue on the table) No. Items Requirements Test Methods and Remarks The test sample shall be placed at (-40±3)℃ 2.7 Thermal shock No visible mechanical damage. Inductance change: Within ± 10% and ( 125±2)℃ for (30±3) min, different temperature conversion time is 2~3 minutes. The temperature cycle shall be repeated 32 cycles. Placed at room temperature for 2 hours, within 48 hours of testing. a ：+20 ℃ (30~45) min → b: -40 ℃ 2.9 Temperatur characteristic Inductance change Pc-b,Pc-d: Within ±20% c: +20 ℃ Static Humidity min (30~45) → min → d: + 125 ℃ (30~45) min → e: +20 ℃ (30~45) Pc -b 2.10 (30~45) Lb Lc 100% ； Pc -d min Ld Lc Lc 100% Lc Inductors shall be subjected to (93±3)%RH . at No visible mechanical damage. (60±2)℃ for (96±2) h . Placed at room temperature Inductance change: Within ± 10% for 2 hours, within 48 hours of testing. Inductors shall be store at (85±2)℃ for ( 1000±24) hours with Irms applied. Placed at room temperature for 2 hours, within 48 2.11 Life No visible mechanical damage. Inductance change: Within ± 10% hours of testing. Note: If the surface temperature of the part over 125 ℃ when the current is loaded, the current need to reduce until the surface temperature of the part less than 125 ℃. Page 6 / 9 FTC252010-XXXM REVISION:V1 3. Package 3.1. Tape Dimension( Unit:mm) W A0 B0 D D1 E F K0 P0 P2 P T 8±0.3 1.85±0. 1 2.25±0.1 1.5±0. 1 1.0MIN 1.75±0.1 3.5±0. 1 1. 15±0. 1 4.0±0.3 2.0±0.3 4.0±0.3 0.25±0.05 3.2. Direction of feed( Unit:mm) b A B C D a 178 Typical 58 Typical 13 Typical 8.4 Typical Blank portions Chip cavity c Leader 3.3. Packing quantity BOX (PCS) REEL (PCS) 3,000 15,000 Carton PCS 150,000 3.4. Peeling required 3.5. F force：10~130g； 3.6. Peeling speed：300mm/min±10%； 3.7. Peeling angle：165°~180°。 Page 7 / 9 FTC252010-XXXM REVISION:V1 4. Environmental Protection Statement Response to RoHS directive ：Our products are RoHS compliance. 5. Recommended soldering profile 5.1.Applicable soldering process to the products is reflow soldering. 5.2. Soldering Materials ⑴ Solder：Sn-3.0Ag-0.5Cu ⑵Flux: Use rosin- based flux, but not strongly acidic flux ( with chlorine exceeding 0 . 2 wt% ) . Do not use water-soluble flux. 5.3. Soldering Profile 5.4. Soldering Iron Reworking with electric soldering iron must preheating at 150℃ for 1 minute is required, and do not directly touch the core with the tip of the soldering iron. The reworking soldering conditions are as follows: 5.4.1 Temperature of soldering iron tip ：350℃； 5.4.2. Soldering iron power output：≤30W； 5.4.3. Diameter of soldering iron end：≤ 1.0mm； 5.4.4. Soldering time ：