AT25DF041B-MHNHR-T

AT25DF041B 4-Mbit, 1.7V-3.6V Minimum SPI Serial Flash Memory DATASHEET (ADDENDUM) High Temperature Operation (125°C) This data sheet addendum is to be used in conjunction with the existing AT25DF041B datasheet specifications. The Adesto AT25DF041B 4Mbit Serial Flash devices will operate @ 125°C with the following datasheet caveats. All other parameters will meet the existing datasheet specifications. The ordering code suffix (CAN# Code) 'HR' or ‘HT’ must be used to ensure correct operation at this extended temperature range. Adesto will not modify and republish the current datasheet to reflect the CAN# ordering code or the above caveats. The standard AT25DF041B datasheet is available at http://www.adestotech.com. 1. Electrical Specifications 1.1 DC and AC Operating Range AT25DF041B-xxxHR Operating Temperature -40C to +125C Endurance (Maximum) 20,000 Cycles 1.2 DC, AC, Program and Erase Characteristics 1.7V to 3.6V Symbol Parameter IUDPD 2.3V to 3.6V Typ Max Units 1 .3 1 µA 4.5 40 5 40 µA 25 65 25 65 µA 85 85 MHz Maximum Clock Frequency for 03h 25 25 MHz fRDDO Maximum Clock Frequency for 3Bh Opcode 40 40 MHz tCSH Minimum CS - High Time tPP Page Program Time (256 Bytes) 2 6 2 4 ms Block Erase Time (4K) 45 100 45 100 ms Block Erase Time (32K) 250 800 250 500 ms Block Erase Time (64K) 450 1700 450 1000 ms Chip Erase Time 3.6 12 3.6 6.8 s Typ Max Ultra Deep Power-Down Current .2 IDPD Deep Power-Down Current ISB Standby Current fSCK Maximum Clock Frequency for All Operation ( including 0Bh Opcode) fRDLF tBLKE tCHPE Min 40 Min 25 ns DS-25DF041B–040C–8/2017 Addendum 2. Ordering Code 2.1 Green Package Options (Pb/Halide-free/RoHS Compliant) Ordering Code (1) AT25DF041B-SSHNHR-T AT25DF041B-SSHNHR-B AT25DF041B-XMHNHR-T AT25DF041B-XMHNHR-B Package Operating Voltage Max. Freq. (MHz) 1.7V to 3.6V 85MHz Operation Range 8S1 8X AT25DF041B-MAHNHR-T 8MA3 AT25DF041B-DWFHT (2) DWF AT25DF041B-UUNHR-T (3) 8-WLCSP Extended (-40°C to +125°C) 1. The shipping carrier option code is not marked on the devices. 2. Contact Adesto for mechanical drawing or Die Sales information. 3. Contact Adesto for WLCSP availability and lead time. Handle product in accordance with UV and ESD precautions. Package Type 8S1 8-lead, 0.150" Wide, Plastic Gull Wing Small Outline Package (JEDEC SOIC) 8X 8-lead, Thin Shrink Small Outline Package 8MA3 8-pad, 2 x 3 x 0.6mm, Thermally Enhanced Plastic Ultra Thin Dual Flat No Lead Package (UDFN) DWF Die in Wafer Form 8-WLCSP 8-ball, 3 x 2 x3mm Ball Matrix, 0.35mm Z-Height 3. Revision History Revision Level – Release Date History A – January 2015 Initial release. B – November 2015 Added WLCSP package. Corrected units specification for IUDPD and tCSH. Removed preliminary package note. C – August 2017 Updated corporate address information. Corporate Office California | USA Adesto Headquarters 3600 Peterson Way Santa Clara, CA 95054 Phone: (+1) 408.400.0578 Email: contact@adestotech.com © 2017 Adesto Technologies. All rights reserved. / Rev.: DS-25DF041B–040C–8/2017 Disclaimer: Adesto Technologies Corporation makes no warranty for the use of its products, other than those expressly contained in the Company's standard warranty which is detailed in Adesto's Terms and Conditions located on the Company's web site. The Company assumes no responsibility for any errors which may appear in this document, reserves the right to change devices or specifications detailed herein at any time without notice, and does not make any commitment to update the information contained herein. No licenses to patents or other intellectual property of Adesto are granted by the Company in connection with the sale of Adesto products, expressly or by implication. Adesto's products are not authorized for use as critical components in life support devices or systems.