TMPA0503SV-R47MN-D

Form No: T00XXX-7-0000-TBM03-170300375 Specification for Approval Date: 2017/03/16 Customer : 深圳臺慶 TMPA0503SV-Series(N)-D TAI-TECH P/N: CUSTOMER P/N: DESCRIPTION: QUANTITY: pcs REMARK: Customer Approval Feedback □ 西北臺慶科技股份有限公司 TAI-TECH Advanced Electronics Co., Ltd Headquarter: NO.1 YOU 4TH ROAD, YOUTH INDUSTRIAL DISTRICT, YANG-MEI, TAO-YUAN HSIEN, TAIWAN, R.O.C. TEL: +886-3-4641148 FAX: +886-3-4643565 http://www.tai-tech.com.tw E-mail: sales@tai-tech.com.tw □ 東莞臺慶精密電子有限公司 DONGGUAN TAI-TECH ADVANCED ELECTRONICS CO., LTD JITIGANG MANAGEMENT DISTRICT, HUANGJIANG, DONGGUAN, GUANGDONG, CHINA TEL: +86-769-3365488 FAX: +86-769-3366896 E-mail: sales@tai-tech.net Office: 金亨國際有限公司 KAMHENG INTERNATIONAL LIMITED TEL: +86-852-25772033 APPROVED CHECKED 管哲頎 Eric Kuan 曾詩涵 Angela Tseng FAX: +86-852-28817778 □ 臺慶精密電子(昆山)有限公司 TAI-TECH ADVANCED ELECTRONICS(KUNSHAN) CO., LTD SHINWHA ROAD, KUNJIA HI-TECH INDUSTRIAL PARK, KUN-SHAN, JIANG-SU, CHINA TEL: +86-512-57619396 FAX: +86-512-57619688 E-mail: sales@tai-tech.cn Office: 北欣國際有限公司 NORTH STAR INTERNATIONAL LIMITED TEL: +86-512-57619396 Sales Dep. FAX: +86-512-57619688 R&D Center APPROVED CHECKED DRAWN 楊祥忠 Mike Yang 詹偉特 Jack Chan 何秦芝 Sharon Ho ■ 慶邦電子元器件(泗洪)有限公司 TAIPAQ ELECTRONICS (SIHONG) CO., LTD JIN SHA JIANG ROAD , CONOMIC DEVELOPMENT ZONE SIHONG , JIANGSU , CHINA. TEL: +86-527-88601191 FAX: +86-527-88601190 E-mail: sales@taipaq.cn BTMC7628100M03 TA734003 TAI-TECH P1 SMD Power Inductor TMPA0503SV-Series(N)-D ECN HISTORY LIST REV DATE DESCRIPTION APPROVED CHECKED DRAWN 1.0 17/03/16 新 發 行 楊祥忠 詹偉特 何秦芝 備 注 TAI-TECH P2 SMD Power Inductor TMPA0503SV-Series(N)-D 1. Features 1. Shielded construction. 2. Capable of corresponding high frequency (5MHz). Halogen Pb Halogen-free Pb-free 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7.High reliability -Reliability test complied to AEC-Q200. 2. Applications 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. 3. Dimensions Recommend PC Board Pattern C A A` D L H E B 4R7 1546 T Series TMPA0503 A G A` B C D E 5.7±0.3 5.2±0.3 5.2±0.2 2.8±0.2 1.0±0.3 4. Part Numbering 0503 SV A B C A: Series B: Dimension C: Type D: Inductance E: Inductance Tolerance F: Code L(mm) G(mm) H(mm) 0~0.15 6.0 2.8 2.5 Note: The above PCB layout reference only. Recommend solder paste thickness at 0.12mm and above. Unit:mm TMPA 2.0±0.2 T - 4R7 MN D E - D F BxC Standard. V: Vehicle R10=0.1uh，4R7=4.7uh，100=10uh，101=100uh，102=1000uh. K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% Marking: Black.4R7 and 1546(15 YY, 46 WW,follow production date). TAI-TECH P3 5. Specification Part Number Inductance L0 A(uH) ±20% Heat Rating Current DC Typ ( A ) Irms. Saturation Current DC Typ (A)I sat Typ Max Typ Max DCR (mΩ)Typ DCR (mΩ)Max TMPA0503SV-R47MN-D 0.47 13.5 12 10 9.0 5.2 6.0 TMPA0503SV-R68MN-D 0.68 12.5 11 9.0 8.0 7.4 8.5 TMPA0503SV-R82MN-D 0.82 10 9.0 8.8 7.7 8.0 9.2 TMPA0503SV-1R0MN-D 1.00 9.0 8.0 8.5 7.5 10.5 12 TMPA0503SV-1R5MN-D 1.50 8.0 7.0 7.5 6.5 13.6 15.7 TMPA0503SV-2R2MN-D 2.20 7.0 6.5 6.5 5.8 21.6 25 TMPA0503SV-3R3MN-D 3.30 6.3 5.8 6.0 5.3 28 33 TMPA0503SV-4R7MN-D 4.70 5.5 4.8 5.3 4.6 38 44 TMPA0503SV-5R6MN-D 5.60 5.0 4.3 4.6 4.0 50 58 TMPA0503SV-6R8MN-D 6.80 4.3 3.7 3.5 3.1 57 66 TMPA0503SV-100MN-D 10.0 3.8 3.4 2.5 2.1 88 103 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 155℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement. TAI-TECH P4 6. Material List NO Items 1 Core Alloy Powder . Materials 2 Wire Polyester Wire or equivalent. 3 Clip 100% Pb free solder(Ni+Sn---Plating) 4 Ink Halogen-free ketone 7. Reliability and Test Condition Item Performance Operating temperature -55~+155℃(Including self - temperature rise) Storage temperature and Humidity range 1.-10~+40℃,50~60%RH (Product without taping) 2.-55~+155℃(on board) Test Condition Electrical Performance Test Inductance Refer to standard electrical characteristics list. DCR HP4284A,CH11025,CH3302,CH1320,CH1320S LCR Meter. CH16502,Agilent33420A Micro-Ohm Meter. Saturation Current (Isat) Approximately △L30% Saturation DC Current (Isat) will cause L0 to drop △L(%) Heat Rated Current (Irms) Approximately △T40℃ Heat Rated Current (Irms) will cause the coil temperature rise △ T(℃). 1.Applied the allowed DC current 2.Temperature measured by digital surface thermometer Reliability Test Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：155±2℃(Inductor) High Temperature Exposure(Storage) Duration ：1000hrs Min. Measured at room temperature after placing for 24±2 hrs Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 30min Min.(Inductor) Temperature Cycling Step2：155±2℃ transition time 1min MAX. Step3：155±2℃ 30min Min. Step4：Low temp. transition time 1min MAX. Number of cycles： 1000 Measured at room temperature after placing for 24±2 hrs Appearance：No damage. Moisture Resistance Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Biased Humidity (AEC-Q200) Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles 1. Baked at50℃ for 25hrs, measured at room temperature after placing for 4 hrs. 2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs. 3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and keep 3 hours, cool down to 25℃ in 2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs 4. Keep at 25℃ 80-100%RH for 15min and vibrate at the frequency of 10 to 55 Hz to 10 Hz, measure at room temperature after placing for 1~2 hrs. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Humidity ：85±3﹪ R.H, Temperature：85℃±2℃ Duration : 1000hrs Min with 100% rated current. Measured at room temperature after placing for24±2 hrs High Temperature Operational Life (AEC-Q200) Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Temperature：155±2℃(Inductor) Duration ：1000hrs Min. with 100% rated current. Measured at room temperature after placing for24±2 hrs Oscillation Frequency: 10～2K～10Hz for 20 minute Vibration Equipment： Vibration checker Total Amplitude:1.52mm±10% Testing Time : 12 hours(20 minutes, 12 cycles each of 3 orientations)。 TAI-TECH P5 Item Performance Mechanical Shock Test Condition Type Peak value (g’s) Normal duration (D) (ms) Wave form Velocity change (Vi)ft/sec SMD 100 6 Half-sine 12.3 Lead 100 6 Half-sine 12.3 shocks in each direction along 3 perpendicular axes. Number of heat cycles: 1 Appearance：No damage. Resistance to Soldering Heat Temperature(℃) Time(s) 260±5(solder temp) 10±1 Impedance：within±15% of initial value Inductance：within±10% of initial value Temperature ramp/immersion and emersion rate 25mm/s ±6 mm/s Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Thermal shock Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Condition for 1 cycle Step1：-55±2℃ 15±1min(Inductor) Step2：155±2℃ within 20Sec. Step3：155±2℃ 15±1min Number of cycles： 300 Measured at room temperature after placing fo24±2hrs Resistance to Solvents Add aqueous wash chemical - OKEM clean or equivalent. Appearance：No damage. ESD Solderability More than 95% of the terminal electrode should be covered with solder。 Steam Aging: 8 hours ± 15 min Preheat: 150℃,60sec.。 Solder: Sn96.5% Ag3% Cu0.5% Temperature: 245±5℃。 Flux for lead free: Rosin. 9.5%。 Dip time: 4±1sec. Depth: completely cover the termination Electrical Test not required V-0 or V-1 are acceptable epoxy V-0 or V-1 are acceptable Flammability TAI-TECH Item P6 Performance Test Condition Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020DClassification Reflow Profiles Place the 100mm X 40mm board into a fixture similar to the one shown in below Figure with the component facing down. The apparatus shall consist of mechanical means to apply a force which will bend the board (D) x = 2 mm minimum. The duration of the applied forces shall be 60 (+ 5) sec. The force is to be applied only once to the board. Board Flex Appearance：No damage. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles With the component mounted on a PCB with the device to be tested, apply a 17.7 N (1.8 Kg) force to the side of a device being tested. This force shall be applied for 60 +1 seconds. Also the force shall be applied gradually as not to apply a shock to thecomponent being tested. Terminal Strength ( SMD ) Note : When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition. TAI-TECH P7 8. Soldering and Mounting (1) Soldering Mildly activated rosin fluxes are preferred. The minimum amount of solder can lead to damage from the stresses caused by the difference in coefficients of expansion between solder, chip and substrate. TAI-TECH terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. (2) Solder re-flow: Recommended temperature profiles for re-flow soldering in Figure 1. (3) Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. In the event that a soldering iron must be employed the following precautions are recommended. ‧Preheat circuit and products to 150℃ ‧355℃ tip temperature (max) ‧Never contact the ceramic with the iron tip ‧1.0mm tip diameter (max) ‧Use a 20 watt soldering iron with tip diameter of 1.0mm ‧Limit soldering time to 4~5sec. Reflow Soldering Iron Soldering PRE-HEATING SOLDERING NATURAL COOLING PRE-HEATING 217 60~150s 200 150 60~180s TEMPERATURE(°C) TEMPERATURE(°C) tp(245° C / 20~40s.) SOLDERING within 4~5s TP(260 ℃ / 10s max.) 350 150 Gradual cooling Over 60s 480s max. NATURAL COOLING 25 TIME( sec.) Reflow times: 3 times max. Fig.1 TIME(sec.) Iron Soldering times: 1 times max. Fig.2 9. Friendly reminder (1) When there are questions concerning measurement result : measurement shall be made after 48 ± 2 hours of recovery under the standard condition (2) This power choke coil itself does not have any protective function in abnormal condition such as overload, short-circuit and open-circuit conditions, etc. Therefore, it shall be confirmed as the end product that there is no risk of smoking, fire, dielectric withstand voltage, insulation resistance, etc. in abnormal conditions to provide protective devices and/or protection circuit in the end product. (3) When this power choke coil was used in a similar or new product to the original one, sometimes it might not be able to satisfy the specifications due to different condition of use. (4) Dielectric withstanding test with higher voltage than specific value will damage insulating material and shorten its life. (5) This power choke coil must not be used in wet condition by water, coffee or any liquid because insulation strength becomes very low in this condition. (6) Please consult our company to confirm the reliability of the process required to wash or use or exposure to a chemical solvent used in this product. PCB washing tested to MIL-STD-202 Method. Use only alcohol to wash the PCB and dry it off immediately (Marking will be washed away if using alcohol). TAI-TECH P8 10. Packaging Information (1) Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 13”x12mm 12.4+2/-0 100±2 13+0.5/-0.2 330 C B D 2.0±0.5 A EMBOSSED CARRIER (2) Tape Dimension 4.0 Blank portions Chip cavity Blank portions T B0 W F D K0 P 200mm or more 400mm or more Direction of tape Series Size Bo(mm) Ao(mm) Ko(mm) P(mm) W(mm) F(mm) TMPA 0503 6.2±0.1 5.6±0.1 3.3±0.1 8.0±0.1 12.0±0.3 5.5±0.1 A0 t(mm) D(mm) 0.35±0.05 1.5±0.1 (3) Packaging Quantity TMPA 0503 Chip / Reel 2000 Inner box 4000 Carton 16000 (4) Tearing Off Force F Top cover tape The force for tearing off cover tape is 10 to 130 grams in the arrow direction under the following conditions(referenced ANSI/EIA-481-C-2003 of 4.11 standard). 165° to180° Base tape Room Temp. (℃) Room Humidity (%) Room atm (hPa) Tearing Speed mm/min 5~35 45~85 860~1060 300 Application Notice ‧Storage Conditions(component level) To maintain the solderability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months form the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. ‧Transportation 1. Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. TAI-TECH P9 11. Typical Performance Curves 0.48 30 0.32 20 0.16 10 0 5.6 8.4 11.2 1.2 48 0.6 30 0.9 36 0.4 20 0.6 24 0.2 10 0.3 12 0 14 0 0 2.6 DC CURRENT(A) TMPA0503SV-1R0 TMPA0503-1R0 TMPA0503SV-1R5 TMPA0503-1R5 1 20 1.6 20 0.5 10 0.8 10 0 12 0 0 1.8 DC CURRENT(A) 4 48 3 36 2 24 1 12 0 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 8 0 1.6 3.2 4.8 6.4 7.2 4.8 30 6 30 3.2 20 4 20 1.6 10 2 10 0 0 0 0 1.2 2.4 3.6 4.8 6 10.8 24 4.8 16 7.2 16 2.4 8 3.6 8 0 0 40 0 0 0.76 1.52 2.28 DC CURRENT(A) 1.1 2.2 3.3 DC CURRENT(A) TMPA0503SV-100 TMPA0503-100 3.04 3.8 50 0 0 24 4.5 TMPA0503SV-5R6 TMPA0503-5R6 40 7.2 3.6 8 8 32 2.7 6.4 40 14.4 1.8 4.8 6.4 32 0 3.2 10 9.6 DC CURRENT(A) 1.6 DC CURRENT(A) 18 0.9 0 0 40 0 0 9 DC CURRENT(A) TMPA0503SV-6R8 TMPA0503-6R8 50 50 8 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 5.4 TMPA0503SV-4R7 TMPA0503-4R7 DC CURRENT(A) 12 3.6 DC CURRENT(A) 60 0 TMPA0503SV-2R2 TMPA0503-2R2 30 10 TMPA0503SV-3R3 TMPA0503-3R3 12 2.4 0.36 0 9.6 30 20 9.6 7.2 1.5 0.72 0 4.8 DC CURRENT(A) 40 30 5 2.4 3.2 1.08 7.2 0 0 40 40 4.8 0 13 2 1.44 2.4 10.4 4 2.5 0 7.8 50 50 TEMP. RISE(oC) INDUCTANCE (uH) INDUCTANCE (uH) 1.8 5.2 DC CURRENT(A) TEMP. RISE(oC) INDUCTANCE (uH) 2.8 40 TEMP. RISE(oC) INDUCTANCE (uH) 0 0.8 TEMP. RISE(oC) INDUCTANCE (uH) 0 60 1.5 TEMP. RISE(oC) 40 TMPA0503SV-R82 TMPA0503-R82 50 TEMP. RISE(oC) 0.64 TMPA0503SV-R68 TMPA0503-R68 4.4 5.5 TEMP. RISE(oC) 1 TEMP. RISE(oC) INDUCTANCE (uH) 50 TEMP. RISE(oC) INDUCTANCE (uH) TMPA0503SV-R47 TMPA0503-R47 0.8