MR256D08BMA45R

MR256D08B Dual Supply 32K x 8 MRAM FEATURES • +3.3 Volt power supply • I/O Voltage range supports wide +1.65 to +3.6 Volt interfaces • Fast 45 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA package BENEFITS • One memory replaces FLASH, SRAM, EEPROM and BBSRAM in systems for simpler, more efficient designs • Improves reliability by replacing battery-backed SRAM RoHS INTRODUCTION The MR256D08B is a 262,144-bit magnetoresistive random access memory (MRAM) device organized as 32,768 words of 8 bits. It supports I/O voltages from +1.65 to +3.6 volts. The MR256D08B offers SRAM compatible 45ns read/write timing with unlimited endurance. Data is always non-volatile for greater than 20-years. Data is automatically protected on power loss by low-voltage inhibit circuitry to prevent writes with voltage out of specification. The MR256D08B is the ideal memory solution for applications that must permanently store and retrieve critical data and programs quickly. The MR256D08B is available in small footprint 8 mm x 8 mm, 48-pin ball grid array (BGA) package with 0.75 mm ball centers. The MR256D08B provides highly reliable data storage over a wide range of temperatures. The product is offered with commercial temperature (0 to +70 °C). CONTENTS 1. DEVICE PIN ASSIGNMENT......................................................................... 2 2. ELECTRICAL SPECIFICATIONS................................................................. 4 3. TIMING SPECIFICATIONS.......................................................................... 8 4. ORDERING INFORMATION....................................................................... 13 5. MECHANICAL DRAWING.......................................................................... 14 6. REVISION HISTORY...................................................................................... 15 How to Reach Us.......................................................................................... 15 Copyright © 2018 Everspin Technologies, Inc. 1 MR256D08B Rev. 3.3 3/2018 MR256D08B 1. DEVICE PIN ASSIGNMENT Figure 1.1 Block Diagram OUTPUT ENABLE BUFFER G A[14:0] 15 OUTPUT ENABLE 7 ADDRESS BUFFER 8 ROW DECODER COLUMN DECODER CHIP ENABLE BUFFER E 8 8 OUTPUT BUFFER 8 32K x 8 BIT MEMORY ARRAY WRITE ENABLE BUFFER W SENSE AMPS 8 FINAL WRITE DRIVERS 8 WRITE DRIVER 8 DQ[7:0] WRITE ENABLE Table 1.1 Pin Functions Signal Name Function A Address Input E Chip Enable W Write Enable G Output Enable DQ Data I/O VDD Power Supply VDDQ I/O Power Supply VSS Ground DC Do Not Connect NC No Connection, Ball D3, H1, H6, G2 Reserved for Future Expansion Copyright © 2018 Everspin Technologies, Inc. 2 MR256D08B Rev. 3.3 3/2018 MR256D08B DEVICE PIN ASSIGNMENT Figure 1.2 Pin Diagrams for Available Packages (Top View) 1 2 3 4 5 6 DC G A A A VDD A NC DC A A E DC B DQ VDD A A NC DQ C VSS DQ NC A DQ VDDQ D VDDQ DQ DC VSS DQ VSS E DQ3 NC VSS NC DQ F NC NC A A W NC G NC A A A A NC H 48 Pin FBGA Table 1.2 Operating Modes E1 G1 W1 Mode VDD Current DQ[7:0]2 H X X Not selected ISB1, ISB2 Hi-Z L H H Output disabled IDDR Hi-Z L L H Byte Read IDDR DOut L X L Byte Write IDDW Din 1 H = high, L = low, X = don’t care 2 Hi-Z = high impedance Copyright © 2018 Everspin Technologies, Inc. 3 MR256D08B Rev. 3.3 3/2018 MR256D08B 2. ELECTRICAL SPECIFICATIONS Absolute Maximum Ratings This device contains circuitry to protect the inputs against damage caused by high static voltages or electric fields; however, it is advised that normal precautions be taken to avoid application of any voltage greater than maximum rated voltages to these high-impedance (Hi-Z) circuits. The device also contains protection against external magnetic fields. Precautions should be taken to avoid application of any magnetic field more intense than the maximum field intensity specified in the maximum ratings. Table 2.1 Absolute Maximum Ratings1 Parameter Symbol Value Unit Core Supply voltage2 VDD -0.5 to 4.0 V I/O Power Supply voltage2 VDDQ -0.5 to 4.0 V -0.5 to +4.0 or Voltage on any pin2 VIN VDDQ + 0.5 V whichever is less Output current per pin IOUT ±20 mA Package power dissipation 3 PD 0.600 W Temperature under bias TBIAS -10 to 85 °C Storage Temperature Tstg -55 to 150 °C Lead temperature during solder (3 minute max) TLead 260 °C Maximum magnetic field during write Hmax_write 2000 A/m Maximum magnetic field during read or standby Hmax_read 8000 A/m 1 Permanent device damage may occur if absolute maximum ratings are exceeded. Functional operation should be restricted to recommended operating conditions. Exposure to excessive voltages or magnetic fields could affect device reliability. 2 All voltages are referenced to VSS. Power dissipation capability depends on package characteristics and use environment. 3 Copyright © 2018 Everspin Technologies, Inc. 4 MR256D08B Rev. 3.3 3/2018 MR256D08B Electrical Specifications Table 2.2 Operating Conditions Parameter Symbol Min Typical Max Unit Core Power supply voltage VDD 3.0 3.3 3.6 V I/O Power supply voltage VDDQ 1.65i - 3.6 V Write inhibit voltage VWIDD 2.5 2.7 3.0 i V Write inhibit voltage VWIDDQ 1.2 1.4 1.65i V Input high voltage (VDDQ=1.65-2.2V) VIH 1.4 - VDDQ + 0.2 ii V Input high voltage (VDDQ=2.2-2.7V) VIH 1.8 - VDDQ + 0.2 ii V Input high voltage (VDDQ=2.7-3.6V) VIH 2.2 - VDDQ + 0.2 ii V Input low voltage (VDDQ=1.65-2.2V) VIL -0.2 iii - 0.4 V Input low voltage (VDDQ=2.2-2.7V) VIL -0.2 iii - 0.6 V Input low voltage (VDDQ=2.7-3.6V) VIL -0.2 iii - 0.8 V Temperature under bias TA 0 70 °C i VDDQ≤VDD. Write inhibit occurs when either VDD or  VDDQ drops below its write inhibit voltage. There is a 2 ms startup time once VDD exceeds VDD(min). See Power Up and Power Down Sequencing. ii VIH(max) = VDDQ + 0.2 V DC ; VIH(max) = VDDQ + 0.5 V AC (pulse width ≤ 20 ns) for I ≤ 20.0 mA. iii VIL(min) = -0.2 V DC ; VIL(min) = -2.0 V AC (pulse width ≤ 20 ns) for I ≤ 20.0 mA. i Copyright © 2018 Everspin Technologies, Inc. 5 MR256D08B Rev. 3.3 3/2018 MR256D08B Electrical Specifications Power Up and Power Down Sequencing MRAM is protected from write operations whenever VDD is less than VWIDD or VDDQ is less than VWIDDQ. As soon as VDD exceeds VDD(min) and VDDQ exceeds VDDQ(min), there is a startup time of 2 ms before read or write operations can start. This time allows memory power supplies to stabilize. The E and W control signals should track VDD on power up to VDD- 0.2 V or VIH (whichever is lower) and remain high for the startup time. In most systems, this means that these signals should be pulled up with a resistor so that signal remains high if the driving signal is Hi-Z during power up. Any logic that drives E and W should hold the signals high with a power-on reset signal for longer than the startup time. During power loss or brownout where either VDD goes below VWIDD or VDDQ goes below VWIDDQ, writes are protected and a startup time must be observed when power returns above VDD(min) and / or VDDQ. Figure 2.1 Power Up and Power Down Diagram VWIDD VDD / VDDQ VWIDDQ STARTUP 2 ms READ/WRITE INHIBITED BROWNOUT or POWER LOSS NORMAL OPERATION READ/WRITE INHIBITED 2 ms RECOVER NORMAL OPERATION VIH VIH E W Copyright © 2018 Everspin Technologies, Inc. 6 MR256D08B Rev. 3.3 3/2018 MR256D08B Electrical Specifications Table 2.3 DC Characteristics Parameter Symbol Min Typical Max Unit Input leakage current Ilkg(I) - - ±1 μA Output leakage current Ilkg(O) - - ±1 μA Output low voltage (VDDQ=1.65-2.2V@ 0.1mA) VOL - - 0.2 V Output low voltage (VDDQ=2.2-2.7V@ 0.1mA) VOL - - 0.4 V Output low voltage (VDDQ=2.7-3.6V@ 2.1 mA) VOL - - 0.4 V Output high voltage (VDDQ=1.65-2.2V@ - 0.1 mA) VOH 1.4 - - V Output high voltage (VDDQ=2.2-2.7V@ -0.1 mA) VOH 2 - - V Output high voltage (VDDQ=2.7-3.6V@ -1.0 mA) VOH 2.4 - - V Table 2.4 Power Supply Characteristics Parameter AC active supply current - read modes1 (IOUT= 0 mA, VDD= max) AC active supply current - write modes1 (VDD= max) Symbol Typical Max Unit IDDR 25 30 mA IDDW 55 65 mA IDDQ 0.50 2 mA ISB1 6 8 mA ISB2 5 7 mA AC active operating current (VDDQ = VIH= 3.6V, VIL= 0V) input transitions