XEF216-512-FB236-C20

XEF216-512-FB236 Datasheet 2020/10/05 Document Number: X007546 XEF216-512-FB236 Datasheet Table of Contents 1 xCORE Multicore Microcontrollers . . . . 2 XEF216-512-FB236 Features . . . . . . . 3 Pin Configuration . . . . . . . . . . . . . 4 Signal Description . . . . . . . . . . . . . 5 Example Application Diagram . . . . . . 6 Product Overview . . . . . . . . . . . . . 7 PLL . . . . . . . . . . . . . . . . . . . . . 8 Boot Procedure . . . . . . . . . . . . . . 9 Memory . . . . . . . . . . . . . . . . . . 10 USB PHY . . . . . . . . . . . . . . . . . . 11 RGMII . . . . . . . . . . . . . . . . . . . . 12 JTAG . . . . . . . . . . . . . . . . . . . . 13 Board Integration . . . . . . . . . . . . . 14 Electrical Characteristics . . . . . . . . . 15 Package Information . . . . . . . . . . . 16 Ordering Information . . . . . . . . . . . Appendices . . . . . . . . . . . . . . . . . . . . A Configuration of the XEF216-512-FB236 B Processor Status Configuration . . . . . C Tile Configuration . . . . . . . . . . . . . D Node Configuration . . . . . . . . . . . . E USB Node Configuration . . . . . . . . . F USB PHY Configuration . . . . . . . . . . G JTAG, xSCOPE and Debugging . . . . . . H Schematics Design Check List . . . . . . I PCB Layout Design Check List . . . . . . J Associated Design Documentation . . . K Related Documentation . . . . . . . . . . L Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 4 5 6 11 12 15 16 17 18 19 21 22 27 32 33 34 34 37 48 55 63 65 72 74 76 77 77 78 TO OUR VALUED CUSTOMERS It is our intention to provide you with accurate and comprehensive documentation for the hardware and software components used in this product. To subscribe to receive updates, visit http://www.xmos.com/. XMOS Ltd.is the owner or licensee of the information in this document and is providing it to you “AS IS” with no warranty of any kind, express or implied and shall have no liability in relation to its use. XMOS Ltd. makes no representation that the information, or any particular implementation thereof, is or will be free from any claims of infringement and again, shall have no liability in relation to any such claims. XMOS and the XMOS logo are registered trademarks of XMOS Ltd in the United Kingdom and other countries, and may not be used without written permission. Company and product names mentioned in this document are the trademarks or registered trademarks of their respective owners. 1 XEF216-512-FB236 Datasheet 1 xCORE Multicore Microcontrollers The xCORE200 Series is a comprehensive range of 32-bit multicore microcontrollers that brings the low latency and timing determinism of the xCORE architecture to mainstream embedded applications. Unlike conventional microcontrollers, xCORE multicore microcontrollers execute multiple real-time tasks simultaneously and communicate between tasks using a high speed network. Because xCORE multicore microcontrollers are completely deterministic, you can write software to implement functions that traditionally require dedicated hardware. X0Dxx I/O pins xTIME scheduler Hardware response ports JTAG xTIME scheduler X1Dxx I/O pins Hardware response ports xCORE logical core xCORE logical core xCORE logical core xCORE logical core xCORE logical core xCORE logical core xCORE logical core USB SRAM OTP Link 8 xCORE logical core xCONNECT Switch xCORE logical core xCORE logical core Figure 1: XEF216-512FB236 block diagram PLL xCORE logical core xCORE logical core FLASH xCORE logical core xCORE logical core xCORE logical core xCORE logical core OTP SRAM RGMII Key features of the XEF216-512-FB236 include: · Tiles: Devices consist of one or more xCORE tiles. Each tile contains between five and eight 32-bit xCOREs with highly integrated I/O and on-chip memory. · Logical cores Each logical core can execute tasks such as computational code, DSP code, control software (including logic decisions and executing a state machine) or software that handles I/O. Section 6.1 · xTIME scheduler The xTIME scheduler performs functions similar to an RTOS, in hardware. It services and synchronizes events in a core, so there is no requirement for interrupt handler routines. The xTIME scheduler triggers cores on events generated by hardware resources such as the I/O pins, communication channels and timers. Once triggered, a core runs independently and concurrently to other cores, until it pauses to wait for more events. Section 6.2 · Channels and channel ends Tasks running on logical cores communicate using channels formed between two channel ends. Data can be passed synchronously or asynchronously between the channel ends assigned to the communicating tasks. Section 6.5 · xCONNECT Switch and Links Between tiles, channel communications are implemented over a high performance network of xCONNECT Links and routed through a hardware xCONNECT Switch. Section 6.6 2 XEF216-512-FB236 Datasheet · Ports The I/O pins are connected to the processing cores by Hardware Response ports. The port logic can drive its pins high and low, or it can sample the value on its pins optionally waiting for a particular condition. Section 6.3 · Clock blocks xCORE devices include a set of programmable clock blocks that can be used to govern the rate at which ports execute. Section 6.4 · Memory Each xCORE Tile integrates a bank of SRAM for instructions and data, and a block of one-time programmable (OTP) memory that can be configured for system wide security features. Section 9 · PLL The PLL is used to create a high-speed processor clock given a low speed external oscillator. Section 7 · USB The USB PHY provides High-Speed and Full-Speed, device, host, and on-the-go functionality. Data is communicated through ports on the digital node. A library is provided to implement USB device functionality. Section 10 · RGMII The device has a set of pins that can be dedicated to communicate with an RGMII, including Gbit Ethernet PHYs, according to the RGMII v1.3 specification. Section 11 · Flash The device has a built-in 2MBflash. Section 8 · JTAG The JTAG module can be used for loading programs, boundary scan testing, in-circuit source-level debugging and programming the OTP memory. Section 12 1.1 Software Devices are programmed using C, C++ or xC (C with multicore extensions). XMOS provides tested and proven software libraries, which allow you to quickly add interface and processor functionality such as USB, Ethernet, PWM, graphics driver, and audio EQ to your applications. 1.2 xTIMEcomposer Studio The xTIMEcomposer Studio development environment provides all the tools you need to write and debug your programs, profile your application, and write images into flash memory or OTP memory on the device. Because xCORE devices operate deterministically, they can be simulated like hardware within xTIMEcomposer: uniquely in the embedded world, xTIMEcomposer Studio therefore includes a static timing analyzer, cycle-accurate simulator, and high-speed in-circuit instrumentation. xTIMEcomposer can be driven from either a graphical development environment, or the command line. The tools are supported on Windows, Linux and MacOS X and available at no cost from xmos.ai/software-tools. 3 XEF216-512-FB236 Datasheet 2 XEF216-512-FB236 Features · Multicore Microcontroller with Advanced Multi-Core RISC Architecture • 16 real-time logical cores on 2 xCORE tiles • Cores share up to 1000 MIPS — Up to 2000 MIPS in dual issue mode • Each logical core has: — Guaranteed throughput of between 1/5 and 1/8 of tile MIPS — 16x32bit dedicated registers • 167 high-density 16/32-bit instructions — All have single clock-cycle execution (except for divide) — 32x32→64-bit MAC instructions for DSP, arithmetic and user-definable cryptographic functions · USB PHY, fully compliant with USB 2.0 specification · RGMII support, compliant with RGMII v1.3 specification · Programmable I/O • 128 general-purpose I/O pins, configurable as input or output — Up to 32 x 1bit port, 12 x 4bit port, 8 x 8bit port, 4 x 16bit port, 2 x 32bit port — 8 xCONNECT links • Port sampling rates of up to 60 MHz with respect to an external clock • 64 channel ends (32 per tile) for communication with other cores, on or off-chip · Memory • 512KB internal single-cycle SRAM (max 256KB per tile) for code and data storage • 16KB internal OTP (max 8KB per tile) for application boot code • 2MB internal flash for application code and overlays · Hardware resources • 12 clock blocks (6 per tile) • 20 timers (10 per tile) • 8 locks (4 per tile) · JTAG Module for On-Chip Debug · Security Features • Programming lock disables debug and prevents read-back of memory contents • AES bootloader ensures secrecy of IP held on external flash memory · Ambient Temperature Range • -40 °C to 85 °C · Speed Grade • 24: 1200 MIPS • 20: 1000 MIPS · Power Consumption • 570 mA (typical) · 236-pin FBGA package 0.5 mm pitch 4 XEF216-512-FB236 Datasheet 3 Pin Configuration 1 A B C GND 1N X0D37 J M R V CLK TDO 1O TMS TRST_ N TDI X0 Li30 5 10 11 4F 4F 8D X1D31 X1D29 X1D41 rx1 rx_ctl tx2 4E 4E 4F 4E 8D X1D32 X1D28 X1D26 X1D42 rx3 rx2 rx_clk tx_clk tx1 DEBUG_ RST_N X1D10 N 12 13 14 15 NC MODE[0] OTP_ VCC 1D 4F 4E 8D 8D X1D30 X1D27 X1D43 X1D40 rx0 tx_ctl tx0 tx3 16 NC NC MODE[1] X0D33 NC NC 17 18 19 4F OTP_ VCC X1D11 X0D29 VDDIOR 4E GND 4E X0D32 VDDIOR VDDIOR 4F 4F 4F 4E 4E X0D31 X0D30 X0D28 X0D26 X0D27 X0 Lo3 7 X0 Lo4 7 1P 8D 1K 1L X0D39 X0D40 X0D34 X0D35 X0 Li20 X0 Li10 X0 Lo1 7 X0 Lo2 7 8D 8D 1J 1I 1B X0D41 X0D25 X0D24 X1D01 X0 Lo0 0 X0 Li00 X0 Lo0 7 X0 Li07 X0 Li17 1K 1L 1M X1D34 X1D35 X1D36 X0 Lo2 0 X0 Lo3 0 X0 Lo4 0 NC VDD VDD VDDIOT VDD VDD PLL_ AVDD PLL_ AGND 4A 4A 1A X1D08 X1D09 X1D00 X0 Li47 X0 Li37 X0 Li27 32A 32A VDD X0D69 X0D70 32A 32A X1D49 X1D50 X0 Li41 X0 Li31 X0 Lo3 6 X0 Lo4 6 32A 32A 32A 32A 32A 32A X1D53 X1D52 X1D51 X0D68 X0D67 X0D66 X0 Li01 X0 Li11 X0 Li21 X0 Lo2 6 X0 Lo1 6 X0 Lo0 6 32A 32A 32A 32A 32A 32A X1D54 X1D55 X1D56 X0D63 X0D64 X0D65 X0 Lo0 1 X0 Lo1 1 X0 Lo2 1 X0 Li26 X0 Li16 X0 Li06 32A 32A 32A 32A X1D58 X1D57 X0D62 X0D61 X0 Lo4 1 X0 Lo3 1 X0 Li36 X0 Li46 32A 32A 32A 32A 32A 32A X1D63 X1D62 X1D61 X0D58 X0D57 X0D56 X0 Li22 X0 Li32 X0 Li42 X0 Lo4 5 X0 Lo3 5 X0 Lo2 5 32A 32A 32A 32A 32A 32A X1D64 X1D65 X1D66 X0D53 X0D54 X0D55 X0 Li12 X0 Li02 X0 Lo0 2 X0 Li05 X0 Lo0 5 X0 Lo1 5 32A 32A 32A 32A X1D67 X1D68 X0D51 X0D52 X0 Lo1 2 X0 Lo2 2 32A 32A 1N X1D70 X1D69 X1D37 X0 Lo4 2 X0 Lo3 2 X0 Li43 1O 1P X1D38 X0 Li33 VDD VDD GND GND VDD VDD GND GND GND GND VDD GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND GND VDD GND GND GND GND GND VDD VDD VDD GND GND VDD VDD X0 Li25 X0 Li15 4B 32A 32A X1D07 X0D50 X0D49 X0 Lo4 4 X0 Li35 X0 Li45 4D 4A 4B 4B X1D39 X1D17 X1D03 X1D05 X1D06 X0 Li23 X0 Li03 X0 Lo0 4 X0 Lo2 4 X0 Lo3 4 VDD VDD VDD USB_ VDD USB_ VDD VDD VDD VDD NC 4D 4D 4A 4B X1D16 X1D18 X1D02 X1D04 X0 Li13 X0 Lo0 3 X0 Li04 X0 Lo1 4 1C 1B 4D 1A 1D 4B 1E X0D10 X0D01 X1D19 X0D00 X0D11 X0D07 X1D12 X0 Lo3 3 X0 Lo2 3 X0 Lo1 3 1G 4B X1D22 VDDIOL VDDIOL X0D04 1H GND GND GND VDD VDD GND USB_ VDD33 4B 4A 4A 4A X0D06 X0D03 X0D08 X0D09 X0 Lo4 3 W 9 X1D33 1C X0D38 VDDIOL 8 X0D42 T U TCK 7 8D N P 6 X0 Lo1 0 K L VDDIOL VDDIOL 5 X0D43 G H 4 1M D F 3 X0D36 VDDIOL VDDIOL X0 Li40 E 2 VDDIOL X1D23 4B 4A X0D05 X0D02 1F 1I 1G 1F 1H 4D 4D 4D X1D24 X0D22 X0D13 X0D23 X0D19 X0D18 X0D17 X0 Li14 X0 Li24 X0 Li34 USB_ VBUS USB_ ID USB_ VSSAC USB_ DM USB_ DP 4C 4C 1J 4C 4C X1D21 X1D14 X1D25 X0D21 X0D14 USB_ X1D13 RTUNE NC 1E 4D X0D12 VDDIOR VDDIOR X0D16 X0 Li44 4C 4C 4C 4C X1D20 X1D15 X0D20 X0D15 VDDIOR VDDIOR GND XEF216-512-FB236 Datasheet 4 Signal Description This section lists the signals and I/O pins available on the XEF216-512-FB236. The device provides a combination of 1bit, 4bit, 8bit and 16bit ports, as well as wider ports that are fully or partially (gray) bonded out. All pins of a port provide either output or input, but signals in different directions cannot be mapped onto the same port. Pins may have one or more of the following properties: · PD/PU: The IO pin has a weak pull-down or pull-up resistor. The resistor is enabled during and after reset. Enabling a link or port that uses the pin disables the resistor. Thereafter, the resistor can be enabled or disabled under software control. The resistor is designed to ensure defined logic input state for unconnected pins. It should not be used to pull external circuitry. Note that the resistors are highly non-linear and only a maximum pull current is specified in Section 14.3. · ST: The IO pin has a Schmitt Trigger on its input. · IOL/IOT/IOR: The IO pin is powered from VDDIOL, VDDIOT, and VDDIOR respectively Power pins (11) Signal Function Type GND Digital ground GND OTP_VCC OTP power supply PWR PLL_AGND Analog ground for PLL PWR PLL_AVDD Analog power for PLL PWR USB_VDD Digital tile power PWR USB_VDD33 USB Analog power PWR USB_VSSAC USB analog ground GND VDD Digital tile power PWR VDDIOL Digital I/O power (left) PWR VDDIOR Digital I/O power (right) PWR VDDIOT Digital I/O power (top) PWR Properties JTAG pins (6) 6 Signal Function Type Properties RST_N Global reset input, active low Input IOL, PU, ST TCK Test clock Input IOL, PD, ST TDI Test data input Input IOL, PU TDO Test data output Output IOL, PD TMS Test mode select Input IOL, PU TRST_N Test reset input, active low Input IOL, PU, ST XEF216-512-FB236 Datasheet I/O pins (128) Signal Function X0D00 X0D01 X0 L32out Type Properties 1A0 I/O IOL, PD 1B0 I/O— IOL, PD X0D02 4A0 8A0 16A0 32A20 I/O IOL, PD X0D03 4A1 16A1 32A21 I/O IOL, PD X0D04 4B0 8A2 16A2 32A22 I/O— IOL, PD X0D05 4B1 8A3 16A3 32A23 I/O— IOL, PD X0D06 4B2 8A4 16A4 32A24 I/O— IOL, PD X0D07 4B3 8A5 16A5 32A25 I/O— IOL, PD X0D08 4A2 8A6 16A6 32A26 I/O IOL, PD X0D09 4A3 8A7 32A27 I/O IOL, PD 1C0 I/O— IOL, PD X0D11 1D0 I/O IOL, PD X0D12 1E0 I/O IOR, PD X0D13 1F0 I/O IOR, PD X0D10 X0 L33out 8A1 16A7 X0D14 4C0 8B0 16A8 32A28 I/O IOR, PD X0D15 4C1 32A29 I/O IOR, PD 8B1 16A9 X0D16 X0 L44in 4D0 8B2 16A10 I/O IOR, PD X0D17 X0 L43in 4D1 8B3 16A11 I/O IOR, PD X0D18 X0 L42in 4D2 8B4 16A12 I/O IOR, PD X0D19 X0 L41in 4D3 8B5 16A13 I/O IOR, PD X0D20 4C2 8B6 16A14 32A30 I/O IOR, PD X0D21 4C3 8B7 I/O IOR, PD 16A15 32A31 X0D22 1G0 I/O IOR, PD X0D23 1H0 I/O IOR, PD X0D24 X0 L70in 1I0 I/O IOR, PD X0D25 X0 L70out 1J0 I/O IOR, PD X0D26 X0 L73out 4E0 8C0 16B0 I/O IOR, PD X0D27 X0 L74out 4E1 8C1 16B1 I/O IOR, PD X0D28 4F0 8C2 16B2 I/O IOR, PD X0D29 4F1 8C3 16B3 I/O IOR, PD X0D30 4F2 8C4 16B4 I/O IOR, PD X0D31 4F3 8C5 16B5 I/O IOR, PD X0D32 4E2 8C6 16B6 I/O IOR, PD X0D33 4E3 8C7 I/O IOR, PD 16B7 X0D34 X0 L71out 1K0 I/O IOR, PD X0D35 X0 L72out 1L0 I/O IOR, PD X0D36 1M0 8D0 16B8 I/O IOL, PD I/O IOL, PD X0D37 X0 L04in 1N0 8D1 X0D38 X0 L03in 1O0 8D2 16B10 I/O IOL, PD X0D39 X0 L02in 1P0 8D3 16B11 I/O IOL, PD X0D40 X0 L01in 8D4 16B12 I/O IOL, PD 16B9 (continued) 7 XEF216-512-FB236 Datasheet Signal Function Type Properties X0D41 X0 L00in 8D5 16B13 I/O IOL, PD X0D42 X0 L00out 8D6 16B14 I/O IOL, PD X0D43 X0 L01out 8D7 16B15 I/O IOL, PD X0D49 X0 L54in 32A0 I/O IOR, PD X0D50 X0 L53in 32A1 I/O IOR, PD X0D51 X0 L52in 32A2 I/O IOR, PD X0D52 X0 L51in 32A3 I/O IOR, PD X0D53 X0 L50in 32A4 I/O IOR, PD X0D54 X0 L50out 32A5 I/O IOR, PD X0D55 X0 L51out 32A6 I/O IOR, PD X0D56 X0 L52out 32A7 I/O IOR, PD X0D57 X0 L53out 32A8 I/O IOR, PD X0D58 X0 L54out 32A9 I/O IOR, PD X0D61 X0 L64in 32A10 I/O IOR, PD X0D62 X0 L63in 32A11 I/O IOR, PD X0D63 X0 L62in 32A12 I/O IOR, PD X0D64 X0 L61in 32A13 I/O IOR, PD X0D65 X0 L60in 32A14 I/O IOR, PD X0D66 X0 L60out 32A15 I/O IOR, PD X0D67 X0 L61out 32A16 I/O IOR, PD X0D68 X0 L62out 32A17 I/O IOR, PD X0D69 X0 L63out 32A18 I/O IOR, PD X0D70 X0 L64out 32A19 I/O IOR, PD X1D00 X0 L72in 1A0 I/O IOR, PD X1D01 X0 L71in 1B0 I/O IOR, PD X1D02 X0 L40in 4A0 8A0 16A0 32A20 I/O IOR, PD X1D03 X0 L40out 4A1 16A1 32A21 I/O IOR, PD X1D04 X0 L41out 4B0 8A2 16A2 32A22 I/O IOR, PD X1D05 X0 L42out 4B1 8A3 16A3 32A23 I/O IOR, PD X1D06 X0 L43out 4B2 8A4 16A4 32A24 I/O IOR, PD X1D07 X0 L44out 4B3 8A5 16A5 32A25 I/O IOR, PD X1D08 X0 L74in 4A2 8A6 16A6 32A26 I/O IOR, PD X1D09 X0 L73in 4A3 8A7 32A27 I/O IOR, PD 8A1 16A7 X1D10 1C0 I/O IOT, PD X1D11 1D0 I/O IOT, PD X1D12 1E0 I/O IOL, PD X1D13 1F0 I/O IOL, PD X1D14 4C0 8B0 16A8 32A28 I/O IOR, PD X1D15 4C1 32A29 I/O IOR, PD 8B1 16A9 X1D16 X0 L31in 4D0 8B2 16A10 I/O IOL, PD X1D17 X0 L30in 4D1 8B3 16A11 I/O IOL, PD X1D18 X0 L30out 4D2 8B4 16A12 I/O IOL, PD X1D19 X0 L31out 4D3 8B5 16A13 I/O IOL, PD (continued) 8 XEF216-512-FB236 Datasheet Signal Type Properties X1D20 4C2 8B6 16A14 32A30 I/O IOR, PD X1D21 4C3 8B7 I/O IOR, PD 1G0 I/O IOL, PD X1D23 1H0 I/O IOL, PD X1D24 1I0 I/O IOR, PD X1D25 1J0 I/O IOR, PD X1D22 Function X0 L34out 16A15 32A31 X1D26 tx_clk (rgmii) 4E0 8C0 16B0 I/O IOT, PD X1D27 tx_ctl (rgmii) 4E1 8C1 16B1 I/O IOT, PD X1D28 rx_clk (rgmii) 4F0 8C2 16B2 I/O IOT, PD X1D29 rx_ctl (rgmii) 4F1 8C3 16B3 I/O IOT, PD X1D30 rx0 (rgmii) 4F2 8C4 16B4 I/O IOT, PD X1D31 rx1 (rgmii) 4F3 8C5 16B5 I/O IOT, PD X1D32 rx2 (rgmii) 4E2 8C6 16B6 I/O IOT, PD X1D33 rx3 (rgmii) 4E3 8C7 I/O IOT, PD X1D34 X0 L02out 1K0 I/O IOL, PD X1D35 X0 L03out 1L0 I/O IOL, PD X1D36 X0 L04out 1M0 8D0 16B8 I/O IOL, PD X1D37 X0 L34in 1N0 8D1 I/O IOL, PD X1D38 X0 L33in 1O0 8D2 16B10 I/O IOL, PD X1D39 X0 L32in 1P0 8D3 16B11 I/O IOL, PD X1D40 tx3 (rgmii) 8D4 16B12 I/O IOT, PD X1D41 tx2 (rgmii) 8D5 16B13 I/O IOT, PD X1D42 tx1 (rgmii) 8D6 16B14 I/O IOT, PD X1D43 tx0 (rgmii) 8D7 16B15 I/O IOT, PD X1D49 X0 L14in 32A0 I/O IOL, PD X1D50 X0 L13in 32A1 I/O IOL, PD X1D51 X0 L12in 32A2 I/O IOL, PD X1D52 X0 L11in 32A3 I/O IOL, PD X1D53 X0 L10in 32A4 I/O IOL, PD X1D54 X0 L10out 32A5 I/O IOL, PD X1D55 X0 L11out 32A6 I/O IOL, PD X1D56 X0 L12out 32A7 I/O IOL, PD X1D57 X0 L13out 32A8 I/O IOL, PD X1D58 X0 L14out 32A9 I/O IOL, PD X1D61 X0 L24in 32A10 I/O IOL, PD X1D62 X0 L23in 32A11 I/O IOL, PD X1D63 X0 L22in 32A12 I/O IOL, PD X1D64 X0 L21in 32A13 I/O IOL, PD X1D65 X0 L20in 32A14 I/O IOL, PD X1D66 X0 L20out 32A15 I/O IOL, PD X1D67 X0 L21out 32A16 I/O IOL, PD X1D68 X0 L22out 32A17 I/O IOL, PD X1D69 X0 L23out 32A18 I/O IOL, PD 16B7 16B9 (continued) 9 XEF216-512-FB236 Datasheet Signal Function X1D70 X0 L24out Type Properties I/O IOL, PD Signal Function Type Properties CLK PLL reference clock Input IOL, PD, ST DEBUG_N Multi-chip debug, active low I/O IOL, PU MODE[1:0] Boot mode select Input PU Signal Function Type Properties USB_DM USB Data- I/O USB_DP USB Data+ I/O USB_ID USB Identification I/O USB_RTUNE USB resistor I/O USB_VBUS USB Power Detect Pin I/O 32A19 System pins (3) usb pins (5) 10 XEF216-512-FB236 Datasheet 5 Example Application Diagram JACK / MAGNETIC IN 2V5 OUT IN 1V0 OUT RGMII PHY IN 3V3 VDDIOT X1D11 X1D10 X1D33 X1D32 X1D31 X1D30 X1D29 X1D28 X1D27 X1D26 X1D43 X1D42 X1D41 X1D40 PLL_AGND VDD PLL_AVDD RESET SUPERVISOR USB_VDD OUT RST_N TRST_N OSCILLATOR 25 24 MHz CLK X0D01 OTP_VCC XnDnn xCORE200 Figure 2: Simplified Reference Schematic USB · see Section 10 for details on the USB PHY · see Section 11 for details on RGMII integration · see Section 13 for details on the power supplies and PCB design 11 GND USB_VDD33 USB_RTUNE VDDIOR USB_VBUS USB_DP USB_DM USB_ID VDDIOL GPIO XEF216-512-FB236 Datasheet 6 Product Overview The XEF216-512-FB236 is a powerful device that consists of two xCORE Tiles, each comprising a flexible logical processing cores with tightly integrated I/O and on-chip memory. 6.1 Logical cores Each tile has 8 active logical cores, which issue instructions down a shared five-stage pipeline. Instructions from the active cores are issued round-robin. If up to five logical cores are active, each core is allocated a fifth of the processing cycles. If more than five logical cores are active, each core is allocated at least 1/n cycles (for n cores). Figure 3 shows the guaranteed core performance depending on the number of cores used. Figure 3: Logical core performance Speed grade MIPS 10 1000 MIPS Frequency 1 500 MHz 100 Minimum MIPS per core (for n cores) 2 3 4 5 6 7 100 100 100 100 83 71 8 63 There is no way that the performance of a logical core can be reduced below these predicted levels (unless priority threads are used: in this case the guaranteed minimum performance is computed based on the number of priority threads as defined in the architecture manual). Because cores may be delayed on I/O, however, their unused processing cycles can be taken by other cores. This means that for more than five logical cores, the performance of each core is often higher than the predicted minimum but cannot be guaranteed. The logical cores are triggered by events instead of interrupts and run to completion. A logical core can be paused to wait for an event. 6.2 xTIME scheduler The xTIME scheduler handles the events generated by xCORE Tile resources, such as channel ends, timers and I/O pins. It ensures that all events are serviced and synchronized, without the need for an RTOS. Events that occur at the I/O pins are handled by the Hardware-Response ports and fed directly to the appropriate xCORE Tile. An xCORE Tile can also choose to wait for a specified time to elapse, or for data to become available on a channel. Tasks do not need to be prioritised as each of them runs on their own logical xCORE. It is possible to share a set of low priority tasks on a single core using cooperative multitasking. 6.3 Hardware Response Ports Hardware Response ports connect an xCORE tile to one or more physical pins and as such define the interface between hardware attached to the XEF216-512-FB236, and the software running on it. A combination of 1bit, 4bit, 8bit, 16bit and 32bit ports are available. All pins of a port provide either output or input. Signals in different directions cannot be mapped onto the same port. 12 XEF216-512-FB236 Datasheet reference clock readyOut conditional value clock block clock port readyIn port port counter port logic stamp/time PORT FIFO PINS Figure 4: Port block diagram port value output (drive) SERDES transfer register CORE input (sample) The port logic can drive its pins high or low, or it can sample the value on its pins, optionally waiting for a particular condition. Ports are accessed using dedicated instructions that are executed in a single processor cycle. xCORE200 IO pins can be used as open collector outputs, where signals are driven low if a zero is output, but left high impedance if a one is output. This option is set on a per-port basis. Data is transferred between the pins and core using a FIFO that comprises a SERDES and transfer register, providing options for serialization and buffered data. Each port has a 16-bit counter that can be used to control the time at which data is transferred between the port value and transfer register. The counter values can be obtained at any time to find out when data was obtained, or used to delay I/O until some time in the future. The port counter value is automatically saved as a timestamp, that can be used to provide precise control of response times. The ports and xCONNECT links are multiplexed onto the physical pins. If an xConnect Link is enabled, the pins of the underlying ports are disabled. If a port is enabled, it overrules ports with higher widths that share the same pins. The pins on the wider port that are not shared remain available for use when the narrower port is enabled. Ports always operate at their specified width, even if they share pins with another port. 6.4 Clock blocks xCORE devices include a set of programmable clocks called clock blocks that can be used to govern the rate at which ports execute. Each xCORE tile has six clock blocks: the first clock block provides the tile reference clock and runs at a default frequency of 100MHz; the remaining clock blocks can be set to run at different frequencies. A clock block can use a 1-bit port as its clock source allowing external application clocks to be used to drive the input and output interfaces. xCORE200 clock blocks optionally divide the clock input from a 1-bit port. 13 XEF216-512-FB236 Datasheet 100MHz reference clock 1-bit port ... ... divider readyIn clock block Figure 5: Clock block diagram port counter In many cases I/O signals are accompanied by strobing signals. The xCORE ports can input and interpret strobe (known as readyIn and readyOut) signals generated by external sources, and ports can generate strobe signals to accompany output data. On reset, each port is connected to clock block 0, which runs from the xCORE Tile reference clock. 6.5 Channels and Channel Ends Logical cores communicate using point-to-point connections, formed between two channel ends. A channel-end is a resource on an xCORE tile, that is allocated by the program. Each channel-end has a unique system-wide identifier that comprises a unique number and their tile identifier. Data is transmitted to a channel-end by an output-instruction; and the other side executes an input-instruction. Data can be passed synchronously or asynchronously between the channel ends. 6.6 xCONNECT Switch and Links XMOS devices provide a scalable architecture, where multiple xCORE devices can be connected together to form one system. Each xCORE device has an xCONNECT interconnect that provides a communication infrastructure for all tasks that run on the various xCORE tiles on the system. The interconnect relies on a collection of switches and XMOS links. Each xCORE device has an on-chip switch that can set up circuits or route data. The switches are connected by xConnect Links. An XMOS link provides a physical connection between two switches. The switch has a routing algorithm that supports many different topologies, including lines, meshes, trees, and hypercubes. The links operate in either 2 wires per direction or 5 wires per direction mode, depending on the amount of bandwidth required. Circuit switched, streaming and packet switched data can both be supported efficiently. Streams provide the fastest possible data rates between xCORE Tiles (up to 250 MBit/s), but each stream requires a single link to be reserved between switches on two tiles. All packet communications can be multiplexed onto a single link. 14 XEF216-512-FB236 Datasheet xCONNECT Link to another device switch CORE CORE CORE CORE CORE CORE CORE CORE CORE xCONNECT switch CORE CORE CORE Figure 6: Switch, links and channel ends CORE CORE CORE CORE xCORE Tile xCORE Tile Information on the supported routing topologies that can be used to connect multiple devices together can be found in the XS1-UEF Link Performance and Design Guide, X2999. 7 PLL The PLL creates a high-speed clock that is used for the switch, tile, and reference clock. The PLL multiplication value is selected through the two MODE pins, and can be changed by software to speed up the tile or use less power. The MODE pins are set as shown in Figure 7: Figure 7: PLL multiplier values and MODE pins Oscillator Frequency 3.25-10 MHz 9-25 MHz 25-50 MHz 50-100 MHz MODE 1 0 0 0 1 1 1 0 0 1 Tile Boot Frequency 130-400 MHz 144-400 MHz 167-400 MHz 196-400 MHz PLL Ratio 40 16 8 4 PLL settings OD F R 1 159 0 1 63 0 1 31 0 1 15 0 Figure 7 also lists the values of OD, F and R, which are the registers that define the ratio of the tile frequency to the oscillator frequency: Fcore = Fosc × F +1 1 1 × × 2 R+1 OD + 1 OD, F and R must be chosen so that 0 ≤ R ≤ 63, 0 ≤ F ≤ 4095, 0 ≤ OD ≤ 7, and 1 260M Hz ≤ Fosc × F 2+1 × R+1 ≤ 1.3GHz. The OD, F , and R values can be modified by writing to the digital node PLL configuration register. The MODE pins must be held at a static value during and after deassertion of the system reset. If the USB PHY is used, then either a 24 MHz or 12 MHz oscillator must be used. 15 XEF216-512-FB236 Datasheet If a different tile frequency is required (eg, 500 MHz), then the PLL must be reprogrammed after boot to provide the required tile frequency. The XMOS tools perform this operation by default. Further details on configuring the clock can be found in the xCORE-200 Clock Frequency Control document. 8 Boot Procedure The device is kept in reset by driving RST_N low. When in reset, all GPIO pins have a pulldown enabled. The processor must be held in reset until VDDIOL is in spec for at least 1 ms. When the device is taken out of reset by releasing RST_N the processor starts its internal reset process. After 15-150 µs (depending on the input clock) the processor boots. The device boots from a QSPI flash (IS25LP016D) that is embedded in the device. The QSPI flash is connected to the ports on Tile 0 as shown in Figure 8. An external 1K resistor must connect X0D01 to VDDIOL. X0D10 should ideally not be connected. If X0D10 is connected, then a 150 ohm series resistor close to the device is recommended. X0D04..X0D07 should be not connected. VDDIOL X0D04..7 X0D01 X0D10 PORT_4B PORT_1B PORT_1C CS_N CLK D[0..3] 1K xCORE Figure 8: QSPI port connectivity QSPI Flash The xCORE Tile boot procedure is illustrated in Figure 9. If bit 5 of the security register (see §9.1) is set, the device boots from OTP. Otherwise, the device boots from the internal flash. Start Boot ROM Primary boot Security Register Bit [5] set No Yes OTP Figure 9: Boot procedure 16 Copy OTP contents to base of SRAM Copy flash contents to base of SRAM Execute program Execute program XEF216-512-FB236 Datasheet The boot image has the following format: · A 32-bit program size s in words. · Program consisting of s × 4 bytes. · A 32-bit CRC, or the value 0x0D15AB1E to indicate that no CRC check should be performed. The program size and CRC are stored least significant byte first. The program is loaded into the lowest memory address of RAM, and the program is started from that address. The CRC is calculated over the byte stream represented by the program size and the program itself. The polynomial used is 0xEDB88320 (IEEE 802.3); the CRC register is initialized with 0xFFFFFFFF and the residue is inverted to produce the CRC. 8.1 Security register The security register enables security features on the xCORE tile. The features shown in Figure 10 provide a strong level of protection and are sufficient for providing strong IP security. Feature Bit Description 0 The JTAG interface is disabled, making it impossible for the tile state or memory content to be accessed via the JTAG interface. Disable Link access 1 Other tiles are forbidden access to the processor state via the system switch. Disabling both JTAG and Link access transforms an xCORE Tile into a “secure island” with other tiles free for non-secure user application code. Secure Boot 5 The xCORE Tile is forced to boot from address 0 of the OTP, allowing the xCORE Tile boot ROM to be bypassed (see §8). Redundant rows 7 Enables redundant rows in OTP. Sector Lock 0 8 Disable programming of OTP sector 0. Sector Lock 1 9 Disable programming of OTP sector 1. Sector Lock 2 10 Disable programming of OTP sector 2. Sector Lock 3 11 Disable programming of OTP sector 3. OTP Master Lock 12 Disable OTP programming completely: disables updates to all sectors and security register. Disable JTAG-OTP 13 Disable all (read & write) access from the JTAG interface to this OTP. Disable Global Debug 14 Disables access to the DEBUG_N pin. 21..15 General purpose software accessable security register available to end-users. 31..22 General purpose user programmable JTAG UserID code extension. Disable JTAG Figure 10: Security register features 9 17 Memory XEF216-512-FB236 Datasheet 9.1 OTP Each xCORE Tile integrates 8 KB one-time programmable (OTP) memory along with a security register that configures system wide security features. The OTP holds data in four sectors each containing 512 rows of 32 bits which can be used to implement secure bootloaders and store encryption keys. Data for the security register is loaded from the OTP on power up. All additional data in OTP is copied from the OTP to SRAM and executed first on the processor. The OTP memory is programmed using three special I/O ports: the OTP address port is a 16-bit port with resource ID 0x100200, the OTP data is written via a 32-bit port with resource ID 0x200100, and the OTP control is on a 16-bit port with ID 0x100300. Programming is performed through libotp and xburn. 9.2 SRAM Each xCORE Tile integrates a single 256KB SRAM bank for both instructions and data. All internal memory is 32 bits wide, and instructions are either 16-bit or 32-bit. Byte (8-bit), half-word (16-bit) or word (32-bit) accesses are supported and are executed within one tile clock cycle. There is no dedicated external memory interface, although data memory can be expanded through appropriate use of the ports. 10 USB PHY The USB PHY provides High-Speed and Full-Speed, device, host, and on-the-go functionality. The PHY is configured through a set of peripheral registers (Appendix F), and data is communicated through ports on the digital node. A library, XUD, is provided to implement USB-device functionality. The USB PHY is connected to the ports on Tile 0 and Tile 1 as shown in Figure 11. When the USB PHY is enabled on Tile 0, the ports shown can on Tile 0 only be used with the USB PHY. When the USB PHY is enabled on Tile 1, then the ports shown can on Tile 1 only be used with the USB PHY. All other IO pins and ports are unaffected. The USB PHY should not be enabled on both tiles. Two clock blocks can be used to clock the USB ports. One clock block for the TXDATA path, and one clock block for the RXDATA path. Details on how to connect those ports are documented in an application note on USB for xCORE200. 3V3 1V0 Regulators USB_VDD USB_VDD33 USB connector VBUS DP DM ID GND Figure 11: Bus powered USB-device 18 3V3 1V0 1-10uF USB_VBUS USB_DP USB_DM USB_ID USB_RTUNE 43R2 Please note: ID connection is optional DM may be marked as DN USB PHY xCORE TXD[0..7] TXRDYOUT TXRDYIN PORT_8A PORT_1K PORT_1H CLK PORT_1J RXRDY RXD[0..7] FLAG0 FLAG1 FLAG2 PORT_1I PORT_8B PORT_1E PORT_1F PORT_1G TXDATA CLKBLK CLKBLK RXDATA FLAG0 FLAG1 FLAG2 XEF216-512-FB236 Datasheet An external resistor of 43.2 ohm (1% tolerance) should connect USB_RTUNE to ground, as close as possible to the device. 10.1 USB VBUS USB_VBUS need not be connected if the device is wholly powered by USB, and the device is used to implement a USB-device. If you use the USB PHY to design a self-powered USB-device, then the device must be able detect the presence of VBus on the USB connector (so the device can disconnect its pull-up resistors from D+/D- to ensure the device does not have any voltage on the D+/Dpins when VBus is not present, “USB Back Voltage Test”). This requires USB_VBUS to be connected to the VBUS pin of the USB connector as is shown in Figure 12. 3V3 1V0 External Supply Regulators USB connector Figure 12: Self powered USB-device 3V3 1V0 10K 1-10 uF 47K VBUS DP DM ID GND 0.1 uF USB_VDD USB_VDD33 USB PHY xCORE USB_VBUS USB_DP USB_DM USB_ID USB_RTUNE 43R2 When connecting a USB cable to the device it is possible an overvoltage transient will be present on VBus due to the inductance of the USB cable combined with the required input capacitor on VBus. The circuit in Figure 12 ensures that the transient does not damage the device. The 10k series resistor and 0.1uF capacitor ensure than any input transient is filtered and does not reach the device. The 47k resistor to ground is a bleeder resistor to discharge the input capacitor when VBus is not present. The 1-10uF input capacitor is required as part of the USB specification. A typical value would be 2.2uF to ensure the 1uF minimum requirement is met even under voltage bias conditions. In any case, extra components (such as a ferrite bead and diodes) may be required for EMC compliance and ESD protection. Different wiring is required for USB-host and USBOTG. 10.2 Logical Core Requirements The XMOS XUD software component runs in a single logical core with endpoint and application cores communicating with it via a combination of channel communication and shared memory variables. Each IN (host requests data from device) or OUT (data transferred from host to device) endpoint requires one logical core. 11 RGMII The device has a series of pins that are dedicated to communicate with an RGMII PHY, as per the RGMII v1.3 spec. This can be used to communicate with GBit Ethernet PHYs. The 19 XEF216-512-FB236 Datasheet pins and functions are listed in Figure 13. When RGMII mode is enabled (using processor status register 2) these pins can no longer be used as GPIO pins, and will instead be driven directly from an RGMII block that provides DDR to SDR conversion, which in turn is interfaced to a set of ports on Tile 1. Figure 13: RGMII block pin functions Pin X1D40 X1D41 X1D42 X1D43 X1D26 X1D27 X1D28 X1D29 X1D30 X1D31 X1D32 X1D33 RGMII Function TX3 Transmit bit 3 TX2 Transmit bit 2 TX1 Transmit bit 1 TX0 Transmit bit 0 TX_CLK Receive clock (125 MHz) TX_CTL Transmit data valid/error RX_CLK Receive clock (125 MHz) RX_CTL Receive data valid/error RX0 Receive bit 0 RX1 Receive bit 1 RX2 Receive bit 2 RX3 Receive bit 3 The RGMII block is connected to the ports on Tile 1 as shown in Figure 14. When the RGMII block is enabled, the ports shown can only be used with the RGMII block, and IO pins X1D26..X1D33/X1D40..X1D43 can only be used with the RGMII block. Ports and pins not used in Figure 14 can be used as normal. The RGMII block generates a clock (configured using processor status register 2), and has the facility to delay the outgoing clock edge, putting it out of phase with the data. The RGMII block translates the double data-rate 4-wire data signals and 1-wire control signal into single-data rate 8-wire TX and DX signals and two control signals. Figure 14 shows how four clock blocks can be used to clock the RGMII ports. One clock block for the TXDATA path, one clock block for the RXDATA path, one clock block to delay the TX_CLK, and one clock block clocked on a negative valid signal to enable mode switching between 10/100/1000 speeds. Details on how to connect those ports are documented in an application note on RGMII for xCORE200. The XMOS RGMII software component runs a MAC layer on Tile 1. The SMI interface should be connected to two one-bit ports that are configured as opendrain IOs, using external pull-ups to 2.5V. Ports 1C and 1D are notionally allocated for this, but any GPIO can be used for this purpose. The bundles of RX and TX pins should be wired using matched trace-lengths over an uninterrupted ground-plane. The RGMII pins are supplied through the VDDIOT supply pins, which should be provided with 2.5V. Decouplers should be placed with a short path to VDDIOT and ground. If the PHY supports a 3.3V IO voltage, then a 3.3V supply can be used for VDDIOT. The RGMII PHY should be configured so that RX_CLK is low during reset of the xCORE. This may be achieved by putting a pull-down resistor on the reset of the PHY, keeping the PHY in reset until the RGMII layer on the xCORE takes the PHY out of reset. 20 XEF216-512-FB236 Datasheet Figure 14: RGMII port functions on Tile 1 12 External RGMII PHY SMC SMIO TX3 TX2 TX1 TX0 TX_CLK TX_CTL RX_CLK RX_CTL RX0 RX1 RX2 RX3 X1D11 X1D10 X1D40 X1D41 X1D42 X1D43 X1D26 X1D27 X1D28 X1D29 X1D30 X1D31 X1D32 X1D33 xCore TIle 1 RGMII Block TXD0..7 TXDV CLK TXCLK TXERR RXERR RXCLK RXDV RXD0..7 PORT_1D PORT_1C SMC SMIO PORT_8B PORT_1F PORT_1P PORT_1G PORT_1E PORT_1A PORT_1O PORT_1B PORT_8A PORT_1K PORT_4E TXDATA CLKBLK CLKBLK TXERROR RXERROR CLKBLK RXDATA CLKBLK MODE JTAG The JTAG module can be used for loading programs, boundary scan testing, in-circuit source-level debugging and programming the OTP memory. TDI TDI BS TAP TDO TDO TCK TMS Figure 15: JTAG chain structure TRST_N DEBUG_N The JTAG chain structure is illustrated in Figure 15. It comprises a single 1149.1 compliant TAP that can be used for boundary scan of the I/O pins. It has a 4-bit IR and 32-bit DR. It also provides access to a chip TAP that in turn can access the xCORE Tile for loading code and debugging. The TRST_N pin must be asserted low during and after power up for 100 ns. If JTAG is not required, the TRST_N pin can be tied to ground to hold the JTAG module in reset. The DEBUG_N pin is used to synchronize the debugging of multiple xCORE Tiles. This pin can operate in both output and input mode. In output mode and when configured to do so, DEBUG_N is driven low by the device when the processor hits a debug break point. Prior to this point the pin will be tri-stated. In input mode and when configured to do so, driving this pin low will put the xCORE Tile into debug mode. Software can set the 21 XEF216-512-FB236 Datasheet behavior of the xCORE Tile based on this pin. This pin should have an external pull up of 4K7-47K Ω or left not connected in single core applications. The JTAG device identification register can be read by using the IDCODE instruction. Its contents are specified in Figure 16. Figure 16: IDCODE return value Bit31 Device Identification Register Version 0 0 0 Bit0 Part Number 0 0 0 0 0 0 0 0 0 0 0 0 Manufacturer Identity 0 0 0 0 0 1 0 0 1 0 1 5 1 0 0 0 6 1 1 1 0 3 0 1 1 3 The JTAG usercode register can be read by using the USERCODE instruction. Its contents are specified in Figure 17. The OTP User ID field is read from bits [22:31] of the security register on xCORE Tile 0, see §9.1 (all zero on unprogrammed devices). Figure 17: USERCODE return value 13 Bit31 Usercode Register OTP User ID 0 0 0 0 0 0 0 0 0 Bit0 Unused 0 0 0 0 0 0 0 Silicon Revision 0 1 2 0 1 0 0 8 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 0 Board Integration The device has the following power supply pins: · VDD pins for the xCORE Tile, including a USB_VDD pin that powers the USB PHY · VDDIO pins for the I/O lines. Separate I/O supplies are provided for the left, top, and right side of the package; different I/O voltages may be supplied on those. The signal description (Section 4) specifies which I/O is powered from which power-supply VDDIOT powers the RGMII IO pins, and must be provided with 2.5V. · PLL_AVDD pins for the PLL · OTP_VCC pins for the OTP · A USB_VDD33 pin for the analogue supply to the USB-PHY Several pins of each type are provided to minimize the effect of inductance within the package, all of which must be connected. The power supplies must be brought up monotonically and input voltages must not exceed specification at any time. VDDIO/OTP_VCC and VDD can ramp up independently. In order to reduce stresses on the device, it is preferable to make them ramp up in a short time frame of each other, no more than 50 ms apart. RST_N and TRST_N should be kept low until all power supplies are stable and within tolerances of their final voltage. If your design is powered by VBUS, then RST_N should go high within 10 ms of attaching to VBUS in order to ensure that USB timings are met. RST_N should be at least 1 ms after VDDIO good to enable the built-in flash to settle. Power sequencing is summarised in Figure 18 The PLL_AVDD supply should be separated from the other noisier supplies on the board. The PLL requires a very clean power supply, and a low pass filter (for example, a 4.7 Ω resistor and 100 nF multi-layer ceramic capacitor) is recommended on this pin. 22 XEF216-512-FB236 Datasheet Bring up in short succession System dependent timing 1.0 VDD 0 3.3 VDDIO, OTP_VCC V Figure 18: Sequencing of power supplies and RST_N 0 3.3 RST_N 0 Time The following ground pins are provided: · PLL_AGND for PLL_AVDD · GND for all other supplies All ground pins must be connected directly to the board ground. The VDD and VDDIO supplies should be decoupled close to the chip by several 100 nF low inductance multi-layer ceramic capacitors between the supplies and GND (for example, 100nF 0402 for every other supply pin). The ground side of the decoupling capacitors should have as short a path back to the GND pins as possible. A bulk decoupling capacitor of at least 10 uF should be placed on each of these supplies. RST_N is an active-low asynchronous-assertion global reset signal. Following a reset, the PLL re-establishes lock after which the device boots up according to the boot mode (see §8). RST_N and must be asserted low during and after power up for 100 ns. 13.1 USB connections USB_VBUS should be connected to the VBUS pin of the USB connector. A 2.2 uF capacitor to ground is required on the VBUS pin. A ferrite bead may be used to reduce HF noise. For self-powered systems, a bleeder resistor may be required to stop VBUS from floating when no USB cable is attached. USB_DP and USB_DN should be connected to the USB connector. USB_ID does not need to be connected. 13.2 USB signal routing and placement The USB_DP and USB_DN lines are the positive and negative data polarities of a high speed USB signal respectively. Their high-speed differential nature implies that they must be coupled and properly isolated. The board design must ensure that the board traces for USB_DP and USB_DN are tightly matched. In addition, according to the USB 2.0 specification, the USB_DP and USB_DN differential impedance must be 90 Ω. 23 XEF216-512-FB236 Datasheet Figure 19: USB trace separation showing a low speed signal, two differential pairs and a high-speed clock Low-speed non-periodic signal 20 mils (0.51mm) 13.2.1 USB_DP0 USB_DN0 3.9 mils (0.10mm) USB_DP1 20 mils (0.51mm) High-speed periodic signal USB_DN1 3.9 mils (0.10mm - calculated on the stack up) 50 mils (1.27mm) General routing and placement guidelines The following guidelines will help to avoid signal quality and EMI problems on high speed USB designs. They relate to a four-layer (Signal, GND, Power, Signal) PCB. 0.12 mm 0.10 mm USB_DP 0.12 mm USB_DN 0.1 mm GND FR4 Dielectric 1.0 mm Power Figure 20: Example USB board stack 0.1 mm For best results, most of the routing should be done on the top layer (assuming the USB connector and XEF216-512-FB236 are on the top layer) closest to GND. Reference planes should be below the transmission lines in order to maintain control of the trace impedance. We recommend that the high-speed clock and high-speed USB differential pairs are routed first before any other routing. When routing high speed USB signals, the following guidelines should be followed: · High speed differential pairs should be routed together. · High-speed USB signal pair traces should be trace-length matched. Maximum tracelength mismatch should be no greater than 4mm. · Ensure that high speed signals (clocks, USB differential pairs) are routed as far away from off-board connectors as possible. 24 XEF216-512-FB236 Datasheet · High-speed clock and periodic signal traces that run parallel should be at least 1.27mm away from USB_DP/USB_DN (see Figure 19). · Low-speed and non-periodic signal traces that run parallel should be at least 0.5mm away from USB_DP/USB_DN (see Figure 19). · Route high speed USB signals on the top of the PCB wherever possible. · Route high speed USB traces over continuous power planes, with no breaks. If a tradeoff must be made, changing signal layers is preferable to crossing plane splits. · Follow the 20 × h rule; keep traces 20 × h (the height above the power plane) away from the edge of the power plane. · Use a minimum of vias in high speed USB traces. · Avoid corners in the trace. Where necessary, rather than turning through a 90 degree angle, use two 45 degree turns or an arc. · DO NOT route USB traces near clock sources, clocked circuits or magnetic devices. · Avoid stubs on high speed USB signals. 13.3 Land patterns and solder stencils The package is a 236 ball Fine Ball Grid Array (FBGA) on a 0.5 mm pitch. We recommend you use HDI or better PCB technology. The missing balls in the outer rows can be used to route the first inner row out over the top layer. The missing balls in the center can be used for ground vias. The missing rows four and five can be used for VDD vias if required. The land patterns and solder stencils will depend on the PCB manufacturing process. We recommend you design them with using the IPC specifications “Generic Requirements for Surface Mount Design and Land Pattern Standards” IPC-7351B. This standard aims to achieve desired targets of heel, toe and side fillets for solder-joints. The mechanical drawings in Section 15 specify the dimensions and tolerances. 13.4 Ground and Thermal Vias Vias from the ground balls into the ground plane of the PCB are recommended for a low inductance ground connection and good thermal performance. Typical designs could use 16 vias in a 4 x 4 grid, equally spaced amongst the ground balls. 13.5 Moisture Sensitivity XMOS devices are, like all semiconductor devices, susceptible to moisture absorption. When removed from the sealed packaging, the devices slowly absorb moisture from the surrounding environment. If the level of moisture present in the device is too high during reflow, damage can occur due to the increased internal vapour pressure of moisture. Example damage can include bond wire damage, die lifting, internal or external package cracks and/or delamination. 25 XEF216-512-FB236 Datasheet All XMOS devices are Moisture Sensitivity Level (MSL) 3 - devices have a shelf life of 168 hours between removal from the packaging and reflow, provided they are stored below 30C and 60% RH. If devices have exceeded these values or an included moisture indicator card shows excessive levels of moisture, then the parts should be baked as appropriate before use. This is based on information from Joint IPC/JEDEC Standard For Moisture/Reflow Sensitivity Classification For Nonhermetic Solid State Surface-Mount Devices J-STD-020 Revision D. 26 XEF216-512-FB236 Datasheet 14 Electrical Characteristics 14.1 Absolute Maximum Ratings Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Figure 21: Absolute maximum ratings Symbol VDD PLL_AVDD VDDIO OTP_VCC Tj Tstg V(Vin) I(XxDxx) V(X0D03-8) I(VDDIOL) I(VDDIOR) I(VDDIOT) USB_VDD USB_VDD33 USB_VBUS USB_DP USB_DM USB_ID Parameter Tile DC supply voltage PLL analog supply I/O supply voltage OTP supply voltage Junction temperature Storage temperature Voltage applied to any IO pin GPIO current Voltage applied to flash pins Current for VDDIOL domain Current for VDDIOR domain Current for VDDIOT domain USB tile DC supply voltage USB tile analog supply voltage USB VBUS voltage USB DP voltage USB DM voltage USB ID voltage MIN -0.2 -0.2 -0.3 -0.3 -65 -0.3 -30 -0.3 -0.2 -0.3 -0.3 -0.3 -0.3 -0.3 MAX 1.1 1.1 3.75 3.75 125 150 3.75 30 VDDIO+0.5 588 686 98 1.1 3.75 5.75 5.5 5.5 2.75 A Exceeding these current limits will result in premature aging and reduced lifetime. B This current consumption must be evenly distributed over all VDDIO pins. C All main power (VDD, VDDIO) and ground (VSS) pins must always be connected. 27 UNITS V V V V °C °C V mA V mA mA mA V V V V V V Notes A, B, C A, B, C A, C XEF216-512-FB236 Datasheet 14.2 Operating Conditions Symbol VDD VDDIOL VDDIOR VDDIOT 3v3 VDDIOT 2v5 USB_VDD VDD33 PLL_AVDD Cl Figure 22: Operating conditions Ta Tj 14.3 Figure 23: DC characteristics Parameter Tile DC supply voltage I/O supply voltage I/O supply voltage I/O supply voltage I/O supply voltage USB tile DC supply voltage Peripheral supply PLL analog supply xCORE Tile I/O load capacitance Ambient operating temperature () Ambient operating temperature () Junction temperature MIN 0.95 3.135 3.135 3.135 2.375 0.95 3.135 0.95 TYP 1.00 3.30 3.30 3.30 2.50 1.00 3.30 1.00 MAX 1.05 3.465 3.465 3.465 2.625 1.05 3.465 1.05 25 UNITS V V V V V V V V pF 0 70 °C -40 85 125 °C °C Notes DC Characteristics, VDDIO=3V3 Symbol V(IH) V(IL) V(OH) V(OL) I(PU) I(PD) I(LC) Parameter Input high voltage Input low voltage Output high voltage Output low voltage Internal pull-up current (Vin=0V) Internal pull-down current (Vin=3.3V) Input leakage current MIN 2.00 -0.30 2.20 TYP MAX 3.60 0.70 0.40 -100 100 10 -10 UNITS V V V V µA µA µA Notes A A B, C B, C D D 28 3.0 3.0 2.0 2.0 1.0 1.0 0.0 0 20 40 60 80 I(PD) current, uA 100 -100 -80 -60 -40 -20 I(PU) current, uA 0 0.0 IO Pin Voltage, V Figure 24: Typical internal pull-down and pull-up currents IO Pin Voltage, V A All pins except power supply pins. Pins X1D40, X1D41, X1D42, X1D43, X1D26, and X1D27 are nominal 8 mA drivers, the remainder of the B general-purpose I/Os are 4 mA. C Measured with 4 mA drivers sourcing 4 mA, 8 mA drivers sourcing 8 mA. Used to guarantee logic state for an I/O when high impedance. The internal pull-ups/pull-downs should not be used to pull external circuitry. In order to pull the pin to the opposite state, a 4K7 resistor is recommended to D overome the internal pull current. XEF216-512-FB236 Datasheet 14.4 Figure 25: ESD stress voltage ESD Stress Voltage Symbol HBM CDM 14.5 MIN -2.00 -500 TYP MAX 2.00 500 UNITS KV V Notes MIN 5 TYP MAX UNITS µs µs Notes Reset Timing Symbol T(RST) T(INIT) Figure 26: Reset timing Parameter Human body model Charged Device Model Parameters Reset pulse width Initialization time 150 A A Shows the time taken to start booting after RST_N has gone high. 14.6 Figure 27: xCORE Tile currents Power Consumption Symbol Parameter UNITS Notes I(DDCQ) Quiescent VDD current MIN TYP MAX 45 mA A, B, C PD Tile power dissipation 325 µW/MIPS A, D, E, F IDD Active VDD current 570 700 mA A, G I(ADDPLL) PLL_AVDD current 5 mA H I(VDD33) VDD33 current 26.7 mA I I(USB_VDD) USB_VDD current 8.27 mA J 7 A B C D E F G H Use for budgetary purposes only. Assumes typical tile and I/O voltages with no switching activity. Includes PLL current. Assumes typical tile and I/O voltages with nominal switching activity. Assumes 1 MHz = 1 MIPS. PD(TYP) value is the usage power consumption under typical operating conditions. Measurement conditions: VDD = 1.0 V, VDDIO = 3.3 V, 25 °C, 500 MHz, average device resource usage. PLL_AVDD = 1.0 V HS mode transmitting while driving all 0’s data (constant JKJK on DP/DM). Loading of 10 pF. Transfers do not I include any interpacket delay. J HS receive mode; no traffic. The tile power consumption of the device is highly application dependent and should be used for budgetary purposes only. More detailed power analysis can be found in the xCORE-200 Power Consumption document, 29 XEF216-512-FB236 Datasheet 14.7 Figure 28: Clock Clock Symbol f SR TJ(LT) f(MAX) Parameter Frequency Slew rate Long term jitter (pk-pk) Processor clock frequency MIN 3.25 0.10 TYP 24 MAX 100 2 500 UNITS MHz V/ns % MHz Notes A B A Percentage of CLK period. B Assumes typical tile and I/O voltages with nominal activity. Further details can be found in the xCORE-200 Clock Frequency Control document, 14.8 Figure 29: I/O AC characteristics xCORE Tile I/O AC Characteristics Symbol T(XOVALID) T(XOINVALID) T(XIFMAX) Parameter Input data valid window Output data invalid window Rate at which data can be sampled with respect to an external clock MIN TYP MAX UNITS 8 ns 9 ns 60 Notes MHz The input valid window parameter relates to the capability of the device to capture data input to the chip with respect to an external clock source. It is calculated as the sum of the input setup time and input hold time with respect to the external clock as measured at the pins. The output invalid window specifies the time for which an output is invalid with respect to the external clock. Note that these parameters are specified as a window rather than absolute numbers since the device provides functionality to delay the incoming clock with respect to the incoming data. Information on interfacing to high-speed synchronous interfaces can be found in the Port I/O Timing document, X5821. 14.9 Figure 30: Link performance xConnect Link Performance Symbol B(2blinkP) B(5blinkP) B(2blinkS) B(5blinkS) Parameter 2b link bandwidth (packetized) 5b link bandwidth (packetized) 2b link bandwidth (streaming) 5b link bandwidth (streaming) MIN TYP MAX 87 217 100 250 UNITS MBit/s MBit/s MBit/s MBit/s Notes A, B A, B B B Assumes 32-byte packet in 3-byte header mode. Actual performance depends on size of the header and A payload. B 7.5 ns symbol time. The asynchronous nature of links means that the relative phasing of CLK clocks is not important in a multi-clock system, providing each meets the required stability criteria. 30 XEF216-512-FB236 Datasheet 14.10 Figure 31: JTAG timing JTAG Timing Symbol f(TCK_D) f(TCK_B) T(SETUP) T(HOLD) T(DELAY) Parameter TCK frequency (debug) TCK frequency (boundary scan) TDO to TCK setup time TDO to TCK hold time TCK to output delay MIN TYP MAX 18 10 5 5 15 UNITS MHz MHz ns ns ns Notes A A B A Timing applies to TMS and TDI inputs. B Timing applies to TDO output from negative edge of TCK. All JTAG operations are synchronous to TCK apart from the global asynchronous reset TRST_N. 31 XEF216-512-FB236 Datasheet 15 32 Package Information XEF216-512-FB236 Datasheet 15.1 Part Marking FXCCRNTMM MCYYWWXX Figure 32: Part marking scheme 16 MC - Manufacturer YYWW - Date XX - Reserved [variable length] Wafer lot code Ordering Information Figure 33: Orderable part numbers 33 LLLLLL.LL F - Product family X - Reserved CC - Number of logical cores R - RAM [in log2(kbytes)] N - Flash size [in log2(Mbytes)+1] T - Temperature grade MM - Speed grade Product Code XEF216-512-FB236-C20A XEF216-512-FB236-I20A Marking E01692C20 E01692I20 Qualification Commercial Industrial Speed Grade 1000 MIPS 1000 MIPS XEF216-512-FB236 Datasheet Appendices A Configuration of the XEF216-512-FB236 The device is configured through banks of registers, as shown in Figure 34. xTIME scheduler X0Dxx I/O pins Hardware response ports JTAG X1Dxx I/O pins Hardware response ports xCORE logical core xCORE logical core USB USB SRAM OTP config Processor status xCORE logical core Tile configuration xCORE logical core Link 8 xCORE logical core Node configuration xCONNECT Switch xCORE logical core Tile configuration xCORE logical core xCORE logical core Processor status xCORE logical core xCORE logical core Figure 34: Registers xTIME scheduler PLL xCORE logical core FLASH xCORE logical core xCORE logical core xCORE logical core xCORE logical core xCORE logical core OTP SRAM RGMII The following communication sequences specify how to access those registers. Any messages transmitted contain the most significant 24 bits of the channel-end to which a response is to be sent. This comprises the node-identifier and the channel number within the node. if no response is required on a write operation, supply 24-bits with the last 8-bits set, which suppresses the reply message. Any multi-byte data is sent most significant byte first. A.1 Accessing a processor status register The processor status registers are accessed directly from the processor instruction set. The instructions GETPS and SETPS read and write a word. The register number should be translated into a processor-status resource identifier by shifting the register number left 8 places, and ORing it with 0x0B. Alternatively, the functions getps(reg) and setps( ,→ reg,value) can be used from XC. A.2 Accessing an xCORE Tile configuration register xCORE Tile configuration registers can be accessed through the interconnect using the functions write_tile_config_reg(tileref, ...) and read_tile_config_reg(tile ref, ,→ ...), where tileref is the name of the xCORE Tile, e.g. tile[1]. These functions implement the protocols described below. Instead of using the functions above, a channel-end can be allocated to communicate with the xCORE tile configuration registers. The destination of the channel-end should be set to 0xnnnnC20C where nnnnnn is the tile-identifier. A write message comprises the following: 34 control-token 24-bit response 16-bit 32-bit control-token 192 channel-end identifier register number data 1 XEF216-512-FB236 Datasheet The response to a write message comprises either control tokens 3 and 1 (for success), or control tokens 4 and 1 (for failure). A read message comprises the following: control-token 24-bit response 16-bit control-token 193 channel-end identifier register number 1 The response to the read message comprises either control token 3, 32-bit of data, and control-token 1 (for success), or control tokens 4 and 1 (for failure). A.3 Accessing node configuration Node configuration registers can be accessed through the interconnect using the functions write_node_config_reg(device, ...) and read_node_config_reg(device, ...), where device is the name of the node. These functions implement the protocols described below. Instead of using the functions above, a channel-end can be allocated to communicate with the node configuration registers. The destination of the channel-end should be set to 0xnnnnC30C where nnnn is the node-identifier. A write message comprises the following: control-token 24-bit response 16-bit 32-bit control-token 192 channel-end identifier register number data 1 The response to a write message comprises either control tokens 3 and 1 (for success), or control tokens 4 and 1 (for failure). A read message comprises the following: control-token 24-bit response 16-bit control-token 193 channel-end identifier register number 1 The response to a read message comprises either control token 3, 32-bit of data, and control-token 1 (for success), or control tokens 4 and 1 (for failure). A.4 Accessing a register of an analogue peripheral Peripheral registers can be accessed through the interconnect using the functions write_periph_32 ,→ (device, peripheral, ...), read_periph_32(device, peripheral, ...), write_periph_8 ,→ (device, peripheral, ...), and read_periph_8(device, peripheral, ...); where device is the name of the analogue device, and peripheral is the number of the peripheral. These functions implement the protocols described below. A channel-end should be allocated to communicate with the configuration registers. The destination of the channel-end should be set to 0xnnnnpp02 where nnnn is the node-identifier and pp is the peripheral identifier. A write message comprises the following: 35 XEF216-512-FB236 Datasheet control-token 24-bit response 8-bit 8-bit 36 channel-end identifier register number size data control-token 1 The response to a write message comprises either control tokens 3 and 1 (for success), or control tokens 4 and 1 (for failure). A read message comprises the following: control-token 24-bit response 8-bit 8-bit control-token 37 channel-end identifier register number size 1 The response to the read message comprises either control token 3, data, and controltoken 1 (for success), or control tokens 4 and 1 (for failure). 36 XEF216-512-FB236 Datasheet B Processor Status Configuration The processor status control registers can be accessed directly by the processor using processor status reads and writes (use getps(reg) and setps(reg,value) for reads and writes). The identifiers for the registers needs a prefix “XS1_PS_” and a postfix “_NUM”, and are declared in “xs1.h” Number Figure 35: Summary 37 Perm Description Register identifier 0x00 RW RAM base address RAM_BASE 0x01 RW Vector base address VECTOR_BASE 0x02 RW xCORE Tile control XCORE_CTRL0 0x03 RO xCORE Tile boot status BOOT_CONFIG 0x05 RW Security configuration SECURITY_CONFIG 0x06 RW Ring Oscillator Control RING_OSC_CTRL 0x07 RO Ring Oscillator Value RING_OSC_DATA0 0x08 RO Ring Oscillator Value RING_OSC_DATA1 0x09 RO Ring Oscillator Value RING_OSC_DATA2 0x0A RO Ring Oscillator Value RING_OSC_DATA3 0x0C RO RAM size RAM_SIZE 0x10 DRW Debug SSR DBG_SSR 0x11 DRW Debug SPC DBG_SPC 0x12 DRW Debug SSP DBG_SSP 0x13 DRW DGETREG operand 1 DBG_T_NUM 0x14 DRW DGETREG operand 2 DBG_T_REG 0x15 DRW Debug interrupt type DBG_TYPE 0x16 DRW Debug interrupt data DBG_DATA 0x18 DRW Debug core control DBG_RUN_CTRL 0x20 .. 0x27 DRW Debug scratch DBG_SCRATCH 0x30 .. 0x33 DRW Instruction breakpoint address DBG_IBREAK_ADDR 0x40 .. 0x43 DRW Instruction breakpoint control DBG_IBREAK_CTRL 0x50 .. 0x53 DRW Data watchpoint address 1 DBG_DWATCH_ADDR1 0x60 .. 0x63 DRW Data watchpoint address 2 DBG_DWATCH_ADDR2 0x70 .. 0x73 DRW Data breakpoint control register DBG_DWATCH_CTRL XEF216-512-FB236 Datasheet Figure 36: Summary (continued) Number Perm Description Register identifier 0x80 .. 0x83 DRW Resources breakpoint mask DBG_RWATCH_ADDR1 0x90 .. 0x93 DRW Resources breakpoint value DBG_RWATCH_ADDR2 0x9C .. 0x9F DRW Resources breakpoint control register DBG_RWATCH_CTRL B.1 RAM base address RAM_BASE 0x00 This register contains the base address of the RAM. It is initialized to 0x00040000. 0x00: RAM base address Bits Perm 31:2 RW 1:0 RO B.2 Init Description Most significant 16 bits of all addresses. - Identifier WORD_ADDRESS_BITS Reserved Vector base address VECTOR_BASE 0x01 Base address of event vectors in each resource. On an interrupt or event, the 16 most significant bits of the destination address are provided by this register; the least significant 16 bits come from the event vector. 0x01: Vector base address Bits Perm 31:18 RW 17:0 RO B.3 Init Description The event and interrupt vectors. - VECTOR_BASE Reserved xCORE Tile control Register to control features in the xCORE tile 38 Identifier XCORE_CTRL0 0x02 XEF216-512-FB236 Datasheet Bits Perm Init 31:26 RO - 25:18 RW 0 Description Identifier Reserved RGMII TX data delay value (in PLL output cycle increments) XCORE_CTRL0_RGMII_DELAY 17:9 RW 0 RGMII TX clock divider value. TX clk rises when counter (clocked by PLL output) reaches this value and falls when counter reaches (value»1). Value programmed into this field should be actual divide value required minus 1 XCORE_CTRL0_RGMII_DIVIDE 8 RW 0 Enable RGMII interface periph ports 7:6 RO - Reserved 0x02: xCORE Tile control B.4 XCORE_CTRL0_RGMII_ENABLE 5 RW 0 Select the dynamic mode (1) for the clock divider when the clock divider is enabled. In dynamic mode the clock divider is only activated when all active threads are paused. In static mode the clock divider is always enabled. XCORE_CTRL0_CLK_DIVIDER_DYN 4 RW 0 Enable the clock divider. This divides the output of the PLL to facilitate one of the low power modes. XCORE_CTRL0_CLK_DIVIDER_EN 3 RO - Reserved 2 RW 1 RW 0 RO Select between UTMI (1) and ULPI (0) mode. XCORE_CTRL0_USB_MODE Enable the ULPI Hardware support module - XCORE_CTRL0_USB_ENABLE Reserved BOOT_CONFIG 0x03 xCORE Tile boot status This read-only register describes the boot status of the xCORE tile. 0x03: xCORE Tile boot status 39 Bits Perm 31:24 RO 23:16 RO 15:9 RO Init - Description Reserved Processor number. - Identifier BOOT_CONFIG_PROCESSOR Reserved 8 RO 7:6 RO Overwrite BOOT_MODE. 5 RO 4 RO 3 RO Boot ROM boots from RAM BOOT_CONFIG_BOOT_FROM_RAM 2 RO Boot ROM boots from JTAG BOOT_CONFIG_BOOT_FROM_JTAG 1:0 RO The boot PLL mode pin value. - BOOT_CONFIG_SECURE_BOOT Reserved Indicates if core1 has been powered off BOOT_CONFIG_CORE1_POWER_DOWN_N Cause the ROM to not poll the OTP for correct read levels BOOT_CONFIG_DISABLE_OTP_POLL BOOT_CONFIG_PLL_MODE_PINS XEF216-512-FB236 Datasheet B.5 Security configuration SECURITY_CONFIG 0x05 Copy of the security register as read from OTP. Bits Perm 31 RW 30:15 RO 14 RW 13 RO Init Description Disables write permission on this register - Reserved Disable access to XCore’s global debug - Identifier SECUR_CFG_DISABLE_ACCESS SECUR_CFG_DISABLE_GLOBAL_DEBUG Reserved 12 RW lock all OTP sectors SECUR_CFG_OTP_MASTER_LOCK 11:8 RW lock bit for each OTP sector SECUR_CFG_OTP_SECTOR_LOCK 7 RW Enable OTP reduanacy 0x05: Security configuration 6 RO 5 RW 4 RW 3:1 RO 0 RW B.6 - SECUR_CFG_OTP_REDUANACY_ENABLE Reserved Override boot mode and read boot image from OTP SECUR_CFG_SECURE_BOOT Disable JTAG access to the PLL/BOOT configuration registers SECUR_CFG_DISABLE_PLL_JTAG - Reserved Disable access to XCore’s JTAG debug TAP Ring Oscillator Control SECUR_CFG_DISABLE_XCORE_JTAG RING_OSC_CTRL 0x06 There are four free-running oscillators that clock four counters. The oscillators can be started and stopped using this register. The counters should only be read when the ring oscillator has been stopped for at least 10 core clock cycles (this can be achieved by inserting two nop instructions between the SETPS and GETPS). The counter values can be read using four subsequent registers. The ring oscillators are asynchronous to the xCORE tile clock and can be used as a source of random bits. 0x06: Ring Oscillator Control Bits Perm 31:2 RO - Reserved 1 RW 0 Core ring oscillator enable. 0 RW 0 Peripheral ring oscillator enable. B.7 Init Description Ring Oscillator Value Identifier RING_OSC_CORE_ENABLE RING_OSC_PERPH_ENABLE RING_OSC_DATA0 0x07 This register contains the current count of the xCORE Tile Cell ring oscillator. This value is not reset on a system reset. 40 XEF216-512-FB236 Datasheet 0x07: Ring Oscillator Value Bits Perm 31:16 RO - Reserved 15:0 RO 0 Ring oscillator Counter data. B.8 Init Description Ring Oscillator Value Identifier RING_OSC_DATA RING_OSC_DATA1 0x08 This register contains the current count of the xCORE Tile Wire ring oscillator. This value is not reset on a system reset. 0x08: Ring Oscillator Value Bits Perm 31:16 RO - Reserved 15:0 RO 0 Ring oscillator Counter data. B.9 Init Description Ring Oscillator Value Identifier RING_OSC_DATA RING_OSC_DATA2 0x09 This register contains the current count of the Peripheral Cell ring oscillator. This value is not reset on a system reset. 0x09: Ring Oscillator Value Bits Perm 31:16 RO - Reserved 15:0 RO 0 Ring oscillator Counter data. B.10 Init Description Ring Oscillator Value Identifier RING_OSC_DATA RING_OSC_DATA3 0x0A This register contains the current count of the Peripheral Wire ring oscillator. This value is not reset on a system reset. 0x0A: Ring Oscillator Value Bits Perm 31:16 RO - Reserved 15:0 RO 0 Ring oscillator Counter data. B.11 Init Description Identifier RING_OSC_DATA RAM_SIZE 0x0C RAM size The size of the RAM in bytes 0x0C: RAM size 41 Bits Perm 31:2 RO 1:0 RO Init Description Most significant 16 bits of all addresses. - Reserved Identifier WORD_ADDRESS_BITS XEF216-512-FB236 Datasheet B.12 DBG_SSR 0x10 Debug SSR This register contains the value of the SSR register when the debugger was called. Bits Perm 31:11 RO Init - Description Identifier Reserved 10 DRW Address space indentifier 9 DRW Determines the issue mode (DI bit) upon Kernel Entry after Exception or Interrupt. SR_KEDI 0x10: Debug SSR SR_QUEUE 8 RO 7 DRW When 1 the thread is in fast mode and will continually issue. 6 DRW When 1 the thread is paused waiting for events, a lock or another resource. SR_WAITING 5 RO 4 DRW 1 when in kernel mode. 3 DRW 1 when in an interrupt handler. SR_ININT 2 DRW 1 when in an event enabling sequence. SR_INENB 1 DRW When 1 interrupts are enabled for the thread. SR_IEBLE 0 DRW When 1 events are enabled for the thread. SR_EEBLE B.13 Determines the issue mode (DI bit). - SR_DI SR_FAST Reserved SR_INK DBG_SPC 0x11 Debug SPC This register contains the value of the SPC register when the debugger was called. 0x11: Debug SPC Bits Perm 31:0 DRW B.14 Init Description Value. Identifier ALL_BITS DBG_SSP 0x12 Debug SSP This register contains the value of the SSP register when the debugger was called. 0x12: Debug SSP Bits Perm 31:0 DRW B.15 Init Description Value. DGETREG operand 1 The resource ID of the logical core whose state is to be read. 42 Identifier ALL_BITS DBG_T_NUM 0x13 XEF216-512-FB236 Datasheet 0x13: DGETREG operand 1 Bits Perm 31:8 RO 7:0 DRW B.16 Init Description - Identifier Reserved Thread number to be read DGETREG operand 2 DBG_T_NUM_NUM DBG_T_REG 0x14 Register number to be read by DGETREG 0x14: DGETREG operand 2 Bits Perm 31:5 RO 4:0 DRW B.17 Init Description - Identifier Reserved Register number to be read Debug interrupt type DBG_T_REG_REG DBG_TYPE 0x15 Register that specifies what activated the debug interrupt. 0x15: Debug interrupt type Bits Perm 31:18 RO 17:16 DRW 15:8 DRW 7:3 RO 2:0 B.18 DRW Init - Description Identifier Reserved Number of the hardware breakpoint/watchpoint which caused the interrupt (always 0 for =HOST= and =DCALL=). If multiple breakpoints/watchpoints trigger at once, the lowest number is taken. DBG_TYPE_HW_NUM Number of thread which caused the debug interrupt (always 0 in the case of =HOST=). DBG_TYPE_T_NUM - Reserved 0 Indicates the cause of the debug interrupt 1: Host initiated a debug interrupt through JTAG 2: Program executed a DCALL instruction 3: Instruction breakpoint 4: Data watch point 5: Resource watch point Debug interrupt data DBG_TYPE_CAUSE DBG_DATA 0x16 On a data watchpoint, this register contains the effective address of the memory operation that triggered the debugger. On a resource watchpoint, it countains the resource identifier. 0x16: Debug interrupt data 43 Bits Perm 31:0 DRW Init Description Value. Identifier ALL_BITS XEF216-512-FB236 Datasheet B.19 Debug core control DBG_RUN_CTRL 0x18 This register enables the debugger to temporarily disable logical cores. When returning from the debug interrupts, the cores set in this register will not execute. This enables single stepping to be implemented. 0x18: Debug core control Bits Perm 31:8 RO 7:0 B.20 Init - Description Identifier Reserved 1-hot vector defining which threads are stopped when not in debug mode. Every bit which is set prevents the respective thread from running. DBG_RUN_CTRL_STOP DRW Debug scratch DBG_SCRATCH 0x20 .. 0x27 A set of registers used by the debug ROM to communicate with an external debugger, for example over JTAG. This is the same set of registers as the Debug Scratch registers in the xCORE tile configuration. 0x20 .. 0x27: Debug scratch Bits Perm 31:0 DRW B.21 Init Description Identifier Value. Instruction breakpoint address ALL_BITS DBG_IBREAK_ADDR 0x30 .. 0x33 This register contains the address of the instruction breakpoint. If the PC matches this address, then a debug interrupt will be taken. There are four instruction breakpoints that are controlled individually. 0x30 .. 0x33: Instruction breakpoint address Bits Perm 31:0 DRW B.22 Init Description Identifier Value. Instruction breakpoint control ALL_BITS DBG_IBREAK_CTRL 0x40 .. 0x43 This register controls which logical cores may take an instruction breakpoint, and under which condition. 44 XEF216-512-FB236 Datasheet 0x40 .. 0x43: Instruction breakpoint control Bits Perm 31:24 RO Init - Description Identifier Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. 23:16 DRW 0 15:2 RO - Reserved 1 DRW 0 When 0 break when PC == IBREAK_ADDR. When 1 = break when PC != IBREAK_ADDR. IBRK_CONDITION 0 DRW 0 When 1 the instruction breakpoint is enabled. B.23 BRK_THREADS Data watchpoint address 1 BRK_ENABLE DBG_DWATCH_ADDR1 0x50 .. 0x53 This set of registers contains the first address for the four data watchpoints. 0x50 .. 0x53: Data watchpoint address 1 Bits Perm 31:0 DRW B.24 Init Description Identifier Value. Data watchpoint address 2 ALL_BITS DBG_DWATCH_ADDR2 0x60 .. 0x63 This set of registers contains the second address for the four data watchpoints. 0x60 .. 0x63: Data watchpoint address 2 Bits Perm 31:0 DRW B.25 Init Description Identifier Value. Data breakpoint control register ALL_BITS DBG_DWATCH_CTRL 0x70 .. This set of registers controls each of the four data watchpoints. 45 0x73 XEF216-512-FB236 Datasheet Bits Perm 31:24 RO 23:16 0x70 .. 0x73: Data breakpoint control register 15:3 DRW Init - 0 Description Identifier Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. BRK_THREADS RO - Reserved 2 DRW 0 When 1 the breakpoints will be be triggered on loads. 1 DRW 0 Determines the break condition: 0 = A AND B, 1 = A OR B. 0 DRW 0 When 1 the instruction breakpoint is enabled. B.26 Resources breakpoint mask BRK_LOAD DBRK_CONDITION BRK_ENABLE DBG_RWATCH_ADDR1 0x80 .. 0x83 This set of registers contains the mask for the four resource watchpoints. 0x80 .. 0x83: Resources breakpoint mask Bits Perm 31:0 DRW B.27 Init Description Identifier Value. Resources breakpoint value ALL_BITS DBG_RWATCH_ADDR2 0x90 .. 0x93 This set of registers contains the value for the four resource watchpoints. 0x90 .. 0x93: Resources breakpoint value Bits Perm 31:0 DRW B.28 Init Description Identifier Value. Resources breakpoint control register 0x9F ALL_BITS DBG_RWATCH_CTRL 0x9C .. This set of registers controls each of the four resource watchpoints. 46 XEF216-512-FB236 Datasheet 0x9C .. 0x9F: Resources breakpoint control register 47 Bits Perm 31:24 RO Init - Description Identifier Reserved A bit for each thread in the machine allowing the breakpoint to be enabled individually for each thread. 23:16 DRW 0 15:2 RO - Reserved 1 DRW 0 When 0 break when condition A is met. When 1 = break when condition B is met. RBRK_CONDITION 0 DRW 0 When 1 the instruction breakpoint is enabled. BRK_THREADS BRK_ENABLE XEF216-512-FB236 Datasheet C Tile Configuration The xCORE Tile control registers can be accessed using configuration reads and writes (use write_tile_config_reg(tileref, ...) and read_tile_config_reg(tileref, ...) for reads and writes). The identifiers for the registers needs a prefix “XS1_PSWITCH_” and a postfix “_NUM”, and are declared in “xs1.h” Number Perm Description Register identifier 0x00 CRO Device identification DEVICE_ID0 0x01 CRO xCORE Tile description 1 DEVICE_ID1 0x02 CRO xCORE Tile description 2 DEVICE_ID2 0x04 CRW Control PSwitch permissions to debug registers DBG_CTRL 0x05 CRW Cause debug interrupts DBG_INT 0x06 CRW xCORE Tile clock divider PLL_CLK_DIVIDER 0x07 CRO Security configuration SECU_CONFIG 0x20 .. 0x27 CRW Debug scratch DBG_SCRATCH 0x40 CRO PC of logical core 0 T0_PC 0x41 CRO PC of logical core 1 T1_PC 0x42 CRO PC of logical core 2 T2_PC 0x43 CRO PC of logical core 3 T3_PC 0x44 CRO PC of logical core 4 T4_PC 0x45 CRO PC of logical core 5 T5_PC 0x46 CRO PC of logical core 6 T6_PC 0x47 CRO PC of logical core 7 T7_PC 0x60 CRO SR of logical core 0 T0_SR 0x61 CRO SR of logical core 1 T1_SR 0x62 CRO SR of logical core 2 T2_SR 0x63 CRO SR of logical core 3 T3_SR 0x64 CRO SR of logical core 4 T4_SR 0x65 CRO SR of logical core 5 T5_SR 0x66 CRO SR of logical core 6 T6_SR 0x67 CRO SR of logical core 7 T7_SR Figure 37: Summary C.1 Device identification This register identifies the xCORE Tile 48 DEVICE_ID0 0x00 XEF216-512-FB236 Datasheet 0x00: Device identification Bits Perm 31:24 CRO Processor ID of this XCore. 23:16 CRO Number of the node in which this XCore is located. 15:8 CRO XCore revision. DEVICE_ID0_REVISION 7:0 CRO XCore version. DEVICE_ID0_VERSION C.2 Init Description xCORE Tile description 1 Identifier DEVICE_ID0_PID DEVICE_ID0_NODE DEVICE_ID1 0x01 This register describes the number of logical cores, synchronisers, locks and channel ends available on this xCORE tile. 0x01: xCORE Tile description 1 Bits Perm 31:24 CRO Number of channel ends. 23:16 CRO Number of the locks. DEVICE_ID1_NUM_LOCKS 15:8 CRO Number of synchronisers. DEVICE_ID1_NUM_SYNCS 7:0 RO C.3 Init - Description Identifier DEVICE_ID1_NUM_CHANENDS Reserved xCORE Tile description 2 DEVICE_ID2 0x02 This register describes the number of timers and clock blocks available on this xCORE tile. 0x02: xCORE Tile description 2 Bits Perm 31:16 RO 15:8 CRO Number of clock blocks. 7:0 CRO Number of timers. C.4 Init - Description Identifier Reserved Control PSwitch permissions to debug registers DEVICE_ID2_NUM_CLKBLKS DEVICE_ID2_NUM_TIMERS DBG_CTRL 0x04 This register can be used to control whether the debug registers (marked with permission CRW) are accessible through the tile configuration registers. When this bit is set, write -access to those registers is disabled, preventing debugging of the xCORE tile over the interconnect. 49 XEF216-512-FB236 Datasheet 0x04: Control PSwitch permissions to debug registers Bits Perm Init 31 CRW 0 When 1 the PSwitch is restricted to RO access to all CRW registers from SSwitch, XCore(PS_DBG_Scratch) and JTAG DBG_CTRL_PSWITCH_RO RO - Reserved CRW 0 When 1 the PSwitch is restricted to RO access to all CRW registers from SSwitch DBG_CTRL_PSWITCH_RO_EXT 30:1 0 C.5 Description Identifier DBG_INT 0x05 Cause debug interrupts This register can be used to raise a debug interrupt in this xCORE tile. 0x05: Cause debug interrupts Bits Perm 31:2 RO - Reserved 1 CRW 0 1 when the processor is in debug mode. 0 CRW 0 Request a debug interrupt on the processor. C.6 Init Description xCORE Tile clock divider Identifier DBG_INT_IN_DBG DBG_INT_REQ_DBG PLL_CLK_DIVIDER 0x06 This register contains the value used to divide the PLL clock to create the xCORE tile clock. The divider is enabled under control of the tile control register 0x06: xCORE Tile clock divider Bits Perm Init Description 31 CRW 0 Clock disable. Writing ’1’ will remove the clock to the tile. 30:16 RO - Reserved 15:0 CRW 0 Clock divider. C.7 Security configuration Copy of the security register as read from OTP. 50 Identifier PLL_CLK_DISABLE PLL_CLK_DIVIDER SECU_CONFIG 0x07 XEF216-512-FB236 Datasheet Bits Perm 31 CRO 30:15 14 Init Description Identifier Disables write permission on this register RO - CRO Disable access to XCore’s global debug SECUR_CFG_DISABLE_GLOBAL_DEBUG 13 RO 12 CRO lock all OTP sectors SECUR_CFG_OTP_MASTER_LOCK 11:8 CRO lock bit for each OTP sector SECUR_CFG_OTP_SECTOR_LOCK 0x07: Security configuration 7 CRO 6 RO 5 CRO 4 CRO 3:1 0 C.8 - SECUR_CFG_DISABLE_ACCESS Reserved Reserved Enable OTP reduanacy - SECUR_CFG_OTP_REDUANACY_ENABLE Reserved Override boot mode and read boot image from OTP SECUR_CFG_SECURE_BOOT Disable JTAG access to the PLL/BOOT configuration registers SECUR_CFG_DISABLE_PLL_JTAG RO - CRO Reserved Disable access to XCore’s JTAG debug TAP SECUR_CFG_DISABLE_XCORE_JTAG DBG_SCRATCH 0x20 .. 0x27 Debug scratch A set of registers used by the debug ROM to communicate with an external debugger, for example over the switch. This is the same set of registers as the Debug Scratch registers in the processor status. 0x20 .. 0x27: Debug scratch Bits Perm 31:0 CRW C.9 Init Description Value. PC of logical core 0 Identifier ALL_BITS T0_PC 0x40 Value of the PC of logical core 0. 0x40: PC of logical core 0 Bits Perm 31:0 CRO C.10 Init Description Value. PC of logical core 1 Value of the PC of logical core 1. 51 Identifier ALL_BITS T1_PC 0x41 XEF216-512-FB236 Datasheet 0x41: PC of logical core 1 Bits Perm 31:0 CRO C.11 Init Description Value. PC of logical core 2 Identifier ALL_BITS T2_PC 0x42 Value of the PC of logical core 2. 0x42: PC of logical core 2 Bits Perm 31:0 CRO C.12 Init Description Value. PC of logical core 3 Identifier ALL_BITS T3_PC 0x43 Value of the PC of logical core 3. 0x43: PC of logical core 3 Bits Perm 31:0 CRO C.13 Init Description Value. PC of logical core 4 Identifier ALL_BITS T4_PC 0x44 Value of the PC of logical core 4. 0x44: PC of logical core 4 Bits Perm 31:0 CRO C.14 Init Description Value. PC of logical core 5 Identifier ALL_BITS T5_PC 0x45 Value of the PC of logical core 5. 0x45: PC of logical core 5 Bits Perm 31:0 CRO C.15 Init Description Value. PC of logical core 6 Value of the PC of logical core 6. 52 Identifier ALL_BITS T6_PC 0x46 XEF216-512-FB236 Datasheet 0x46: PC of logical core 6 Bits Perm 31:0 CRO C.16 Init Description Value. PC of logical core 7 Identifier ALL_BITS T7_PC 0x47 Value of the PC of logical core 7. 0x47: PC of logical core 7 Bits Perm 31:0 CRO C.17 Init Description Value. SR of logical core 0 Identifier ALL_BITS T0_SR 0x60 Value of the SR of logical core 0 0x60: SR of logical core 0 Bits Perm 31:0 CRO C.18 Init Description Value. SR of logical core 1 Identifier ALL_BITS T1_SR 0x61 Value of the SR of logical core 1 0x61: SR of logical core 1 Bits Perm 31:0 CRO C.19 Init Description Value. SR of logical core 2 Identifier ALL_BITS T2_SR 0x62 Value of the SR of logical core 2 0x62: SR of logical core 2 Bits Perm 31:0 CRO C.20 Init Description Value. SR of logical core 3 Value of the SR of logical core 3 53 Identifier ALL_BITS T3_SR 0x63 XEF216-512-FB236 Datasheet 0x63: SR of logical core 3 Bits Perm 31:0 CRO C.21 Init Description Value. SR of logical core 4 Identifier ALL_BITS T4_SR 0x64 Value of the SR of logical core 4 0x64: SR of logical core 4 Bits Perm 31:0 CRO C.22 Init Description Value. SR of logical core 5 Identifier ALL_BITS T5_SR 0x65 Value of the SR of logical core 5 0x65: SR of logical core 5 Bits Perm 31:0 CRO C.23 Init Description Value. SR of logical core 6 Identifier ALL_BITS T6_SR 0x66 Value of the SR of logical core 6 0x66: SR of logical core 6 Bits Perm 31:0 CRO C.24 Init Description Value. SR of logical core 7 Identifier ALL_BITS T7_SR 0x67 Value of the SR of logical core 7 0x67: SR of logical core 7 54 Bits Perm 31:0 CRO Init Description Value. Identifier ALL_BITS XEF216-512-FB236 Datasheet D Node Configuration The digital node control registers can be accessed using configuration reads and writes (use write_node_config_reg(device, ...) and read_node_config_reg(device, ...) for reads and writes). The identifiers for the registers needs a prefix “XS1_SSWITCH_” and a postfix “_NUM”, and are declared in “xs1.h” Number 0x00 Figure 38: Summary Perm Description Register identifier RO Device identification DEVICE_ID0 0x01 RO System switch description DEVICE_ID1 0x04 RW Switch configuration NODE_CONFIG 0x05 RW Switch node identifier NODE_ID 0x06 RW PLL settings PLL_CTL 0x07 RW System switch clock divider CLK_DIVIDER 0x08 RW Reference clock REF_CLK_DIVIDER 0x09 R System JTAG device ID register JTAG_DEVICE_ID 0x0A R System USERCODE register JTAG_USERCODE 0x0C RW Directions 0-7 DIMENSION_DIRECTION0 0x0D RW Directions 8-15 DIMENSION_DIRECTION1 0x10 RW DEBUG_N configuration, tile 0 XCORE0_GLOBAL_DEBUG_CONFIG 0x11 RW DEBUG_N configuration, tile 1 XCORE1_GLOBAL_DEBUG_CONFIG 0x1F RO Debug source GLOBAL_DEBUG_SOURCE 0x20 .. 0x28 RW Link status, direction, and network SLINK 0x40 .. 0x47 RO PLink status and network PLINK 0x80 .. 0x88 RW Link configuration and initialization XLINK 0xA0 .. 0xA7 RW Static link configuration XSTATIC D.1 Device identification DEVICE_ID0 0x00 This register contains version and revision identifiers and the mode-pins as sampled at boot-time. 0x00: Device identification 55 Bits Perm Init 31:24 RO 23:16 RO Sampled values of BootCtl pins on Power On Reset. SS_DEVICE_ID0_BOOT_CTRL 15:8 RO SSwitch revision. SS_DEVICE_ID0_REVISION 7:0 RO SSwitch version. SS_DEVICE_ID0_VERSION - Description Identifier Reserved XEF216-512-FB236 Datasheet D.2 DEVICE_ID1 0x01 System switch description This register specifies the number of processors and links that are connected to this switch. 0x01: System switch description Bits Perm 31:24 RO 23:16 RO Number of SLinks on the SSwitch. 15:8 RO Number of processors on the SSwitch. 7:0 RO Number of processors on the device. D.3 Init - Description Identifier Reserved Switch configuration SS_DEVICE_ID1_NUM_SLINKS SS_DEVICE_ID1_NUM_PROCESSORS SS_DEVICE_ID1_NUM_PLINKS_PER_PROC NODE_CONFIG 0x04 This register enables the setting of two security modes (that disable updates to the PLL or any other registers) and the header-mode. Bits 0x04: Switch configuration Perm Init Description Identifier 31 RW 0 0 = SSCTL registers have write access. 1 = SSCTL registers can not be written to. SS_NODE_CONFIG_DISABLE_SSCTL_UPDATE 30:9 RO - Reserved 0 = PLL_CTL_REG has write access. 1 = PLL_CTL_REG can not be written to. 8 RW 0 7:1 RO - Reserved 0 RW 0 0 = 2-byte headers, 1 = 1-byte headers (reset as 0). D.4 SS_NODE_CONFIG_DISABLE_PLL_CTL_REG Switch node identifier SS_NODE_CONFIG_HEADERS NODE_ID 0x05 This register contains the node identifier. 0x05: Switch node identifier Bits Perm Init Description 31:16 RO - Reserved 15:0 RW 0 The unique ID of this node. D.5 PLL settings Identifier SS_NODE_ID_ID PLL_CTL 0x06 An on-chip PLL multiplies the input clock up to a higher frequency clock, used to clock the I/O, processor, and switch, see Oscillator. Note: a write to this register will cause the tile to be reset. 56 XEF216-512-FB236 Datasheet Bits 31 Perm Init Description Identifier RW If set to 1, the chip will not be reset 30 RW If set to 1, the chip will not wait for the PLL to re-lock. Only use this if a gradual change is made to the PLL SS_PLL_CTL_NLOCK 29 DW If set to 1, set the PLL to be bypassed 28 DW If set to 1, set the boot mode to boot from JTAG 27:26 RO 25:23 RW 22:21 RO 20:8 RW 7 RO 6:0 RW 0x06: PLL settings D.6 - SS_PLL_CTL_NRESET SS_TEST_MODE_PLL_BYPASS SS_TEST_MODE_BOOT_JTAG Reserved Output divider value range from 0 (8’h0) to 7 (8’h7). OD value. SS_PLL_CTL_POST_DIVISOR - Reserved Feedback multiplication ratio, range from 0 (8’h0) to 4095 (8’h3FF). F value. SS_PLL_CTL_FEEDBACK_MUL - Reserved Oscilator input divider value range from 0 (8’h0) to 63 (8’h3F). R value. SS_PLL_CTL_INPUT_DIVISOR System switch clock divider CLK_DIVIDER 0x07 Sets the ratio of the PLL clock and the switch clock. 0x07: System switch clock divider Bits Perm 31:16 RO - Reserved 15:0 RW 0 SSwitch clock generation D.7 Init Description Reference clock Identifier SS_CLK_DIVIDER_CLK_DIV REF_CLK_DIVIDER 0x08 Sets the ratio of the PLL clock and the reference clock used by the node. 0x08: Reference clock 57 Bits Perm Init Description 31:16 RO - Reserved 15:0 RW 3 Software ref. clock divider Identifier SS_SSWITCH_REF_CLK_DIV XEF216-512-FB236 Datasheet D.8 0x09: System JTAG device ID register System JTAG device ID register Bits Perm 31:28 RO SS_JTAG_DEVICE_ID_VERSION 27:12 RO SS_JTAG_DEVICE_ID_PART_NUM 11:1 RO SS_JTAG_DEVICE_ID_MANU_ID 0 RO SS_JTAG_DEVICE_ID_CONST_VAL D.9 0x0A: System USERCODE register Init JTAG_DEVICE_ID 0x09 Description System USERCODE register JTAG_USERCODE 0x0A Bits Perm 31:18 RO JTAG USERCODE value programmed into OTP SR 17:0 RO metal fixable ID code D.10 Init Identifier Description Identifier SS_JTAG_USERCODE_OTP SS_JTAG_USERCODE_MASKID DIMENSION_DIRECTION0 0x0C Directions 0-7 This register contains eight directions, for packets with a mismatch in bits 7..0 of the node-identifier. The direction in which a packet will be routed is goverened by the most significant mismatching bit. 0x0C: Directions 0-7 Bits Perm 31:28 RW 0 The direction for packets whose dimension is 7. DIM7_DIR 27:24 RW 0 The direction for packets whose dimension is 6. DIM6_DIR 23:20 RW 0 The direction for packets whose dimension is 5. DIM5_DIR 19:16 RW 0 The direction for packets whose dimension is 4. DIM4_DIR 15:12 RW 0 The direction for packets whose dimension is 3. DIM3_DIR 11:8 RW 0 The direction for packets whose dimension is 2. DIM2_DIR 7:4 RW 0 The direction for packets whose dimension is 1. DIM1_DIR 3:0 RW 0 The direction for packets whose dimension is 0. DIM0_DIR D.11 Init Directions 8-15 Description Identifier DIMENSION_DIRECTION1 0x0D This register contains eight directions, for packets with a mismatch in bits 15..8 of the node-identifier. The direction in which a packet will be routed is goverened by the most significant mismatching bit. 58 XEF216-512-FB236 Datasheet 0x0D: Directions 8-15 Bits Perm Init Description Identifier 31:28 RW 0 The direction for packets whose dimension is F. DIMF_DIR 27:24 RW 0 The direction for packets whose dimension is E. DIME_DIR 23:20 RW 0 The direction for packets whose dimension is D. DIMD_DIR 19:16 RW 0 The direction for packets whose dimension is C. DIMC_DIR 15:12 RW 0 The direction for packets whose dimension is B. DIMB_DIR 11:8 RW 0 The direction for packets whose dimension is A. DIMA_DIR 7:4 RW 0 The direction for packets whose dimension is 9. DIM9_DIR 3:0 RW 0 The direction for packets whose dimension is 8. DIM8_DIR D.12 DEBUG_N configuration, tile 0 XCORE0_GLOBAL_DEBUG_CONFIG 0x10 Configures the behavior of the DEBUG_N pin. 0x10: DEBUG_N configuration, tile 0 Bits Perm 31:2 RO - 1 RW 0 0 RW 0 D.13 Init Description Identifier Reserved Set 1 to enable GlobalDebug to generate debug request to XCore. GLOBAL_DEBUG_ENABLE_GLOBAL_DEBUG_REQ Set 1 to enable inDebug bit to drive GlobalDebug. DEBUG_N configuration, tile 1 GLOBAL_DEBUG_ENABLE_INDEBUG XCORE1_GLOBAL_DEBUG_CONFIG 0x11 Configures the behavior of the DEBUG_N pin. 0x11: DEBUG_N configuration, tile 1 Bits Perm 31:2 RO - 1 RW 0 0 RW 0 D.14 Init Description Set 1 to enable GlobalDebug to generate debug request to XCore. GLOBAL_DEBUG_ENABLE_GLOBAL_DEBUG_REQ Set 1 to enable inDebug bit to drive GlobalDebug. Debug source Contains the source of the most recent debug event. 59 Identifier Reserved GLOBAL_DEBUG_ENABLE_INDEBUG GLOBAL_DEBUG_SOURCE 0x1F XEF216-512-FB236 Datasheet 0x1F: Debug source Bits Perm 31:5 RO 4 RW 3:2 RO 1 RW 0 RW D.15 Init Description - Identifier Reserved If set, external pin, is the source of last GlobalDebug event. GLOBAL_DEBUG_SOURCE_EXTERNAL_PAD_INDEBUG - Reserved If set, XCore1 is the source of last GlobalDebug event. GLOBAL_DEBUG_SOURCE_XCORE1_INDEBUG If set, XCore0 is the source of last GlobalDebug event. GLOBAL_DEBUG_SOURCE_XCORE0_INDEBUG Link status, direction, and network SLINK 0x20 .. 0x28 These registers contain status information for low level debugging (read-only), the network number that each link belongs to, and the direction that each link is part of. The registers control links 0..7. Bits Perm Init 31:26 RO 25:24 RO Identify the SRC_TARGET type 0 - SLink, 1 - PLink, 2 - SSCTL, 3 Undefine. SLINK_SRC_TARGET_TYPE 23:16 RO When the link is in use, this is the destination link number to which all packets are sent. SLINK_SRC_TARGET_ID - Description Identifier Reserved 15:12 RO - Reserved 11:8 RW 0 The direction that this link operates in. 7:6 RO - Reserved 5:4 RW 0 3 RO - 2 RO 1 RO 1 when the dest side of the link is in use. LINK_DST_INUSE 0 RO 1 when the source side of the link is in use. LINK_SRC_INUSE 0x20 .. 0x28: Link status, direction, and network D.16 LINK_DIRECTION Determines the network to which this link belongs, reset as 0. LINK_NETWORK Reserved 1 when the current packet is considered junk and will be thrown away. LINK_JUNK PLink status and network PLINK 0x40 .. 0x47 These registers contain status information and the network number that each processorlink belongs to. 60 XEF216-512-FB236 Datasheet Bits Perm 31:26 RO 25:24 RO Identify the SRC_TARGET type 0 - SLink, 1 - PLink, 2 - SSCTL, 3 Undefine. PLINK_SRC_TARGET_TYPE 23:16 RO When the link is in use, this is the destination link number to which all packets are sent. PLINK_SRC_TARGET_ID 15:6 RO - 5:4 RW 0 3 RO - 2 RO 1 RO 1 when the dest side of the link is in use. LINK_DST_INUSE 0 RO 1 when the source side of the link is in use. LINK_SRC_INUSE 0x40 .. 0x47: PLink status and network D.17 Init - Description Identifier Reserved Reserved Determines the network to which this link belongs, reset as 0. LINK_NETWORK Reserved 1 when the current packet is considered junk and will be thrown away. LINK_JUNK Link configuration and initialization XLINK 0x80 .. 0x88 These registers contain configuration and debugging information specific to external links. The link speed and width can be set, the link can be initialized, and the link status can be monitored. The registers control links 0..7. Bits 0x80 .. 0x88: Link configuration and initialization 61 Perm Init Description Identifier Write to this bit with ’1’ will enable the XLink, writing ’0’ will disable it. This bit controls the muxing of ports with overlapping xlinks. 31 RW 30 RW 0 0: operate in 2 wire mode; 1: operate in 5 wire mode 29:28 RO - Reserved 27 RO Rx buffer overflow or illegal token encoding received. 26 RO 0 This end of the xlink has issued credit to allow the remote end to transmit RX_CREDIT 25 RO 0 This end of the xlink has credit to allow it to transmit. 24 WO Clear this end of the xlink’s credit and issue a HELLO token. 23 WO Reset the receiver. The next symbol that is detected will be the first symbol in a token. XLINK_RX_RESET 22 RO - Reserved 21:11 RW 0 Specify min. number of idle system clocks between two continuous symbols witin a transmit token -1. XLINK_INTRA_TOKEN_DELAY 10:0 RW 0 Specify min. number of idle system clocks between two continuous transmit tokens -1. XLINK_INTER_TOKEN_DELAY XLINK_ENABLE XLINK_WIDE XLINK_RX_ERROR TX_CREDIT XLINK_HELLO XEF216-512-FB236 Datasheet D.18 Static link configuration XSTATIC 0xA0 .. 0xA7 These registers are used for static (ie, non-routed) links. When a link is made static, all traffic is forwarded to the designated channel end and no routing is attempted. The registers control links C, D, A, B, G, H, E, and F in that order. Bits 0xA0 .. 0xA7: Static link configuration 62 Perm Init Description Identifier 31 RW 0 Enable static forwarding. 30:9 RO - Reserved 8 RW 0 The destination processor on this node that packets received in static mode are forwarded to. XSTATIC_DEST_PROC 7:5 RO - Reserved 4:0 RW 0 The destination channel end on this node that packets received in static mode are forwarded to. XSTATIC_DEST_CHAN_END XSTATIC_ENABLE XEF216-512-FB236 Datasheet E USB Node Configuration The USB node control registers can be accessed using configuration reads and writes (use write_node_config_reg(device, ...) and read_node_config_reg(device, ...) for reads and writes). Number Figure 39: Summary Perm Description Register identifier 0x00 RO Device identification register DEV_ID 0x04 RW Node configuration register NODE_CFG 0x05 RW Node identifier NODE_ID_SCTH 0x51 RW System clock frequency SYS_CLK_FREQ 0x80 RW Link Control and Status LINK_CTRL E.1 Device identification register DEV_ID 0x00 This register contains version information, and information on power-on behavior. 0x00: Device identification register Bits Perm 31:24 RO 0x0F 23:16 RO - 15:8 RO 0x02 Revision number of the USB block 7:0 RO 0x00 Version number of the USB block E.2 Init Description Chip identifier Identifier GLX_CFG_CHIP_ID Reserved Node configuration register GLX_CFG_REVISION GLX_CFG_VERSION NODE_CFG 0x04 This register is used to set the communication model to use (1 or 3 byte headers), and to prevent any further updates. Bits 0x04: Node configuration register 63 Perm Init Description Identifier 31 RW 0 Set to 1 to disable further updates to the node configuration and link control and status registers. GLX_CFG_DISABLE_UPDATES 30:1 RO - Reserved 0 RW 0 Header mode. 0: 3-byte headers; 1: 1-byte headers. GLX_CFG_HDR_MODE XEF216-512-FB236 Datasheet E.3 0x05: Node identifier Bits Perm 31:16 RO - Reserved 15:0 RW 0 16-bit node identifier. This does not need to be set, and is present for compatibility with XS1-switches. GLX_CFG_NODE_ID_SCTH E.4 0x51: System clock frequency 64 Init Description System clock frequency Bits Perm 31:7 RO 6:0 E.5 0x80: Link Control and Status NODE_ID_SCTH 0x05 Node identifier RW Init Identifier SYS_CLK_FREQ 0x51 Description - Identifier Reserved Oscillator clock frequency in MHz rounded up to the nearest integer value. Only values between 5 and 100 MHz are valid - writes outside this range are ignored and will be NACKed. This field must be set on start up of the device and any time that the input oscillator clock frequency is changed. It must contain the system clock frequency in MHz rounded up to the nearest integer value. 25 GLX_CFG_SYS_CLK_FREQ Link Control and Status Init LINK_CTRL 0x80 Bits Perm 31:28 RO 27 RO 26 RO 0 This end of the xlink has issued credit to allow the remote end to transmit RX_CREDIT 25 RO 0 This end of the xlink has credit to allow it to transmit. 24 WO Clear this end of the xlink’s credit and issue a HELLO token. 23 WO Reset the receiver. The next symbol that is detected will be the first symbol in a token. XLINK_RX_RESET 22 RO - Reserved 21:11 RW 1 Specify min. number of idle system clocks between two continuous symbols witin a transmit token -1. XLINK_INTRA_TOKEN_DELAY 10:0 RW 1 Specify min. number of idle system clocks between two continuous transmit tokens -1. XLINK_INTER_TOKEN_DELAY - Description Identifier Reserved Rx buffer overflow or illegal token encoding received. XLINK_RX_ERROR TX_CREDIT XLINK_HELLO XEF216-512-FB236 Datasheet F USB PHY Configuration The USB PHY is connected to the ports shown in section 10. The USB PHY is peripheral 1. The control registers are accessed using 32-bit reads and writes (use write_periph_32(device, 1, ...) and read_periph_32(device, 1, ...) for reads and writes). Number Figure 40: Summary Perm Description Register identifier 0x00 WO UIFM reset GLX_PER_UIFM_RESET 0x04 RW UIFM IFM control GLX_PER_UIFM_CONTROL 0x08 RW UIFM Device Address GLX_PER_UIFM_DEVICE_ADDRESS 0x0C RW UIFM functional control GLX_PER_UIFM_FUNC_CONTROL 0x10 RW UIFM on-the-go control GLX_PER_UIFM_OTG_CONTROL 0x14 RO UIFM on-the-go flags GLX_PER_UIFM_OTG_FLAGS 0x18 RW UIFM Serial Control GLX_PER_UIFM_SERIAL_MODE 0x1C RW UIFM signal flags GLX_PER_UIFM_IFM_FLAGS 0x20 RW UIFM Sticky flags GLX_PER_UIFM_FLAGS_STICKY 0x24 RW UIFM port masks GLX_PER_UIFM_MASK 0x28 RW UIFM SOF value GLX_PER_UIFM_SOFCOUNT 0x2C RO UIFM PID GLX_PER_UIFM_PID 0x30 RO UIFM Endpoint GLX_PER_UIFM_ENDPOINT 0x34 RW UIFM Endpoint match GLX_PER_UIFM_ENDPOINT_MATCH 0x38 RW OTG Flags mask GLX_PER_UIFM_OTG_FLAGS_MASK 0x3C RW UIFM power signalling GLX_PER_UIFM_PWRSIG 0x40 RW UIFM PHY control GLX_PER_UIFM_PHY_CONTROL F.1 GLX_PER_UIFM_RESET 0x00 UIFM reset A write to this register with any data resets all UIFM state, but does not otherwise affect the phy. 0x00: UIFM reset Bits Perm 31:0 WO F.2 Init Description Value. UIFM IFM control General settings of the UIFM IFM state machine. 65 Identifier ALL_BITS GLX_PER_UIFM_CONTROL 0x04 XEF216-512-FB236 Datasheet Bits Perm Init Description Identifier 31:8 RO - Reserved 7 RW 0 Set to 1 to enable XEVACKMODE mode. UIFM_IFM_CONTROL_XEVACKMODE 6 RW 0 Set to 1 to enable SOFISTOKEN mode. UIFM_IFM_CONTROL_SOFISTOKEN 5 RW 0 Set to 1 to enable UIFM power signalling mode. 4 RW 0 Set to 1 to enable IF timing mode. 3 RO - Reserved 2 RW 0 Set to 1 to enable UIFM linestate decoder. 1 RW 0 Set to 1 to enable UIFM CHECKTOKENS mode. 0 RW 0 Set to 1 to enable UIFM DOTOKENS mode. 0x04: UIFM IFM control F.3 UIFM Device Address UIFM_IFM_CONTROL_PWRSIGMODE UIFM_IFM_CONTROL_IFTIMINGMODE UIFM_IFM_CONTROL_DECODELINESTATE UIFM_IFM_CONTROL_CHECKTOKENS UIFM_IFM_CONTROL_DOTOKENS GLX_PER_UIFM_DEVICE_ADDRESS 0x08 The device address whose packets should be received. 0 until enumeration, it should be set to the assigned value after enumeration. 0x08: UIFM Device Address Bits Perm 31:7 RO - Reserved 6:0 RW 0 The enumerated USB device address must be stored here. Only packets to this address are passed on. UIFM_DEVICE_ADDRESS_ADDRESS F.4 Init Description UIFM functional control GLX_PER_UIFM_FUNC_CONTROL 0x0C Bits Perm 31:5 RO - Reserved 4:2 RW 1 Set to 0 to disable UIFM to UTMI+ OPMODE mode. 0x0C: UIFM functional control 1 0 F.5 RW RW Init Identifier 1 1 Description Identifier UIFM_FUNC_CONTROL_TERMSELECT Set to 1 to switch UIFM to UTMI+ XCVRSELECT mode. UIFM on-the-go control UIFM_FUNC_CONTROL_XCVRSELECT GLX_PER_UIFM_OTG_CONTROL 0x10 This register is used to negotiate an on-the-go connection. 66 UIFM_FUNC_CONTROL_OPMODE Set to 1 to switch UIFM to UTMI+ TERMSELECT mode. XEF216-512-FB236 Datasheet Bits Perm Init Description Identifier 31:8 RO - Reserved 7 RW 0 Set to 1 to switch UIFM to EXTVBUSIND mode. UIFM_OTG_CONTROL_EXTVBUSIND 6 RW 0 Set to 1 to switch UIFM to DRVVBUSEXT mode. UIFM_OTG_CONTROL_DRVVBUSEXT 5 RO - Reserved 4 RW 0 3 2 0x10: UIFM on-the-go control RW RW 0 0 1 RW 0 0 RW 0 F.6 Set to 1 to switch UIFM to UTMI+ CHRGVBUS mode. UIFM_OTG_CONTROL_CHRGVBUS Set to 1 to switch UIFM to UTMI+ DISCHRGVBUS mode. UIFM_OTG_CONTROL_DISCHRGVBUS Set to 1 to switch UIFM to UTMI+ DMPULLDOWN mode. UIFM_OTG_CONTROL_DMPULLDOWN Set to 1 to switch UIFM to UTMI+ DPPULLDOWN mode. UIFM_OTG_CONTROL_DPPULLDOWN Set to 1 to switch UIFM to IDPULLUP mode. UIFM on-the-go flags UIFM_OTG_CONTROL_IDPULLUP GLX_PER_UIFM_OTG_FLAGS 0x14 Status flags used for on-the-go negotiation 0x14: UIFM on-the-go flags 67 Bits Perm Init Description Identifier 31:6 RO - Reserved 5 RO 0 Value of UTMI+ Bvalid flag. 4 RO 0 Value of UTMI+ IDGND flag. 3 RO 0 Value of UTMI+ HOSTDIS flag. UIFM_OTG_FLAGS_HOSTDIS 2 RO 0 Value of UTMI+ VBUSVLD flag. UIFM_OTG_FLAGS_VBUSVLD 1 RO 0 Value of UTMI+ SESSVLD flag. UIFM_OTG_FLAGS_SESSVLD 0 RO 0 Value of UTMI+ SESSEND flag. UIFM_OTG_FLAGS_SESSEND UIFM_OTG_FLAGS_SESSVLDB UIFM_OTG_FLAGS_NIDGND XEF216-512-FB236 Datasheet F.7 UIFM Serial Control Bits Perm 31:7 RO - Reserved 6 RO 0 1 if UIFM is in UTMI+ RXRCV mode. UIFM_SERIAL_MODE_RXRCV 5 RO 0 1 if UIFM is in UTMI+ RXDM mode. UIFM_SERIAL_MODE_RXDM 4 RO 0 1 if UIFM is in UTMI+ RXDP mode. UIFM_SERIAL_MODE_RXDP 3 RW 0 Set to 1 to switch UIFM to UTMI+ TXSE0 mode. UIFM_SERIAL_MODE_TXSE0 2 RW 0 Set to 1 to switch UIFM to UTMI+ TXDATA mode. UIFM_SERIAL_MODE_TXDAT 1 RW 1 Set to 0 to switch UIFM to UTMI+ TXENABLE mode. UIFM_SERIAL_MODE_TXENN 0 RW 0 0x18: UIFM Serial Control F.8 Init GLX_PER_UIFM_SERIAL_MODE 0x18 Description Identifier Set to 1 to switch UIFM to UTMI+ FSLSSERIAL mode. UIFM_SERIAL_MODE_FSLSMODE UIFM signal flags GLX_PER_UIFM_IFM_FLAGS 0x1C Set of flags that monitor line and error states. These flags normally clear on the next packet, but they may be made sticky by using PER_UIFM_FLAGS_STICKY, in which they must be cleared explicitly. Bits Perm 31:7 RO - Reserved 6 RW 0 Set to 1 when the UIFM decodes a token successfully (e.g. it passes CRC5, PID check and has matching device address). UIFM_IFM_FLAGS_NEWTOKEN 5 RW 0 Set to 1 when linestate indicates an SE0 symbol. 4 RW 0 Set to 1 when linestate indicates a K symbol. UIFM_IFM_FLAGS_K 3 RW 0 Set to 1 when linestate indicates a J symbol. UIFM_IFM_FLAGS_J 2 RW 0 1 RW 0 Set to the value of the UTMI_RXACTIVE input signal. UIFM_IFM_FLAGS_RXACTIVE 0 RW 0 Set to the value of the UTMI_RXERROR input signal UIFM_IFM_FLAGS_RXERROR 0x1C: UIFM signal flags F.9 Init Description Identifier UIFM_IFM_FLAGS_SE0 Set to 1 if an incoming datapacket fails the CRC16 check. UIFM_IFM_FLAGS_CRC16FAIL UIFM Sticky flags GLX_PER_UIFM_FLAGS_STICKY 0x20 These bits define the sticky-ness of the bits in the UIFM IFM FLAGS register. A 1 means that bit will be sticky (hold its value until a 1 is written to that bitfield), or normal, in which case signal updates to the UIFM IFM FLAGS bits may be over-written by subsequent changes in those signals. 68 XEF216-512-FB236 Datasheet 0x20: UIFM Sticky flags Bits Perm Init Description 31:7 RO - Reserved 6:0 RW 0 Stickyness for each flag. F.10 Identifier UIFM_FLAGS_STICKY_STICKY GLX_PER_UIFM_MASK 0x24 UIFM port masks Set of masks that identify how port 1N, port 1O and port 1P are affected by changes to the flags in FLAGS Bits 31:24 23:16 15:8 0x24: UIFM port masks 7:0 F.11 Perm Init RW RW RW RW Description Identifier 0 Bit mask that determines which flags in UIFM_IFM_FLAG[6:0] contribute to port 1?. If any flag listed in this bitmask is high, port 1? will be high. UIFM_FLAGS_MASK_MASK3 0 Bit mask that determines which flags in UIFM_IFM_FLAG[6:0] contribute to port 1P. If any flag listed in this bitmask is high, port 1P will be high. UIFM_FLAGS_MASK_MASK2 0 Bit mask that determines which flags in UIFM_IFM_FLAG[6:0] contribute to port 1O. If any flag listed in this bitmask is high, port 1O will be high. UIFM_FLAGS_MASK_MASK1 0 Bit mask that determines which flags in UIFM_IFM_FLAG[6:0] contribute to port 1N. If any flag listed in this bitmask is high, port 1N will be high. UIFM_FLAGS_MASK_MASK0 UIFM SOF value GLX_PER_UIFM_SOFCOUNT 0x28 USB Start-Of-Frame counter Bits 0x28: UIFM SOF value Perm Init Description Identifier 31:11 RO - Reserved 10:8 RW 0 Most significant 3 bits of SOF counter UIFM_SOFCOUNT_COUNT2 7:0 RW 0 Least significant 8 bits of SOF counter UIFM_SOFCOUNT_COUNT1 F.12 GLX_PER_UIFM_PID 0x2C UIFM PID The last USB packet identifier received 0x2C: UIFM PID 69 Bits Perm Init Description 31:4 RO - Reserved 3:0 RO 0 Value of the last received PID. Identifier UIFM_PID_PID XEF216-512-FB236 Datasheet F.13 GLX_PER_UIFM_ENDPOINT 0x30 UIFM Endpoint The last endpoint seen 0x30: UIFM Endpoint Bits Perm 31:5 RO - Reserved 4 RO 0 1 if endpoint contains a valid value. 3:0 RO 0 A copy of the last received endpoint. F.14 Init Description UIFM Endpoint match Identifier UIFM_ENDPOINT_MATCH UIFM_ENDPOINT_ENDPOINT GLX_PER_UIFM_ENDPOINT_MATCH 0x34 This register can be used to mark UIFM endpoints as special. 0x34: UIFM Endpoint match Bits Perm 31:16 RO 15:0 F.15 0x38: OTG Flags mask 70 - 0 Description Bits Perm RW Init 0 This register contains a bit for each endpoint. If its bit is set, the endpoint will be supplied on the RX port when ORed with 0x10. UIFM_ENDPOINT_MATCH_MATCH Description Data UIFM power signalling Init Identifier Reserved OTG Flags mask 31:0 F.16 0x3C: UIFM power signalling RW Init Description GLX_PER_UIFM_OTG_FLAGS_MASK 0x38 Identifier OTG_FLAGS_MASK_DEFINED GLX_PER_UIFM_PWRSIG 0x3C Bits Perm 31:9 RO - Reserved Identifier 8 RW 0 Valid UIFM_PWRSIG_VALID 7:0 RW 0 Data UIFM_PWRSIG_DATA XEF216-512-FB236 Datasheet F.17 UIFM PHY control Bits Perm 31:19 RO - 18 RW 0 17:14 RO - 13 12 11:8 0x40: UIFM PHY control 71 RW RW RW Init 0 0 0 GLX_PER_UIFM_PHY_CONTROL 0x40 Description Identifier Reserved Set to 1 to disable pulldowns on ports 8A and 8B. UIFM_PHY_CONTROL_PULLDOWN_DISABLE Reserved After an auto-resume, this bit is set to indicate that the resume signalling was for reset (se0). Set to 0 to clear. UIFM_PHY_CONTROL_RESUMESE0 After an auto-resume, this bit is set to indicate that the resume signalling was for resume (K). Set to 0 to clear. UIFM_PHY_CONTROL_RESUMEK Log-2 number of clocks before any linestate change is propagated. UIFM_PHY_CONTROL_SE0FILTVAL 7 RW 0 Set to 1 to use the suspend controller handle to resume from suspend. Otherwise, the program has to poll the linestate_filt field in phy_teststatus. UIFM_PHY_CONTROL_AUTORESUME 6:4 RW 0 Control the the conf1,2,3 input pins of the PHY. 3:0 RO - Reserved UIFM_PHY_CONTROL_PHYCONF XEF216-512-FB236 Datasheet G JTAG, xSCOPE and Debugging If you intend to design a board that can be used with the XMOS toolchain and xTAG debugger, you will need an xSYS header on your board. Figure 41 shows a decision diagram which explains what type of xSYS connectivity you need. The three subsections below explain the options in detail. YES YES Figure 41: Decision diagram for the xSYS header NO Is xSCOPE required YES Is fast printf required ? Use full xSYS header See section 3 G.1 Is debugging required? NO YES Does the SPI flash need to be programmed? NO NO Use JTAG xSYS header See section 2 No xSYS header required See section 1 No xSYS header The use of an xSYS header is optional, and may not be required for volume production designs. However, the XMOS toolchain expects the xSYS header; if you do not have an xSYS header then you must provide your own method for writing to flash/OTP and for debugging. G.2 JTAG-only xSYS header The xSYS header connects to an xTAG debugger, which has a 20-pin 0.1" female IDC header. The design will hence need a male IDC header. We advise to use a boxed header to guard against incorrect plug-ins. If you use a 90 degree angled header, make sure that pins 2, 4, 6, ..., 20 are along the edge of the PCB. Connect pins 4, 8, 12, 16, 20 of the xSYS header to ground, and then connect: · TDI to pin 5 of the xSYS header · TMS to pin 7 of the xSYS header · TCK to pin 9 of the xSYS header · DEBUG_N to pin 11 of the xSYS header · TDO to pin 13 of the xSYS header 72 XEF216-512-FB236 Datasheet The RST_N net should be open-drain, active-low, and have a pull-up to VDDIO. G.3 Full xSYS header For a full xSYS header you will need to connect the pins as discussed in Section G.2, and then connect a 2-wire xCONNECT Link to the xSYS header. The links can be found in the Signal description table (Section 4): they are labelled XL0, XL1, etc in the function column. The 2-wire link comprises two inputs and outputs, labelled 1out , 0out , 0in , and 1in . For example, if you choose to use XL0 for xSCOPE I/O, you need to connect up XL01out , XL00out , XL00in , XL01in as follows: · XL01out (X0D43) to pin 6 of the xSYS header with a 33R series resistor close to the device. · XL00out (X0D42) to pin 10 of the xSYS header with a 33R series resistor close to the device. · XL00in (X0D41) to pin 14 of the xSYS header. · XL01in (X0D40) to pin 18 of the xSYS header. 73 XEF216-512-FB236 Datasheet H Schematics Design Check List This section is a checklist for use by schematics designers using the XEF216-512-FB236. Each of the following sections contains items to check for each design. H.1 Power supplies The VDD (core) supply ramps monotonically (rises constantly) from 0V to its final value (0.95V - 1.05V) within 10ms (Section 13). The VDD (core) supply is capable of supplying 700 mA (Section 13 and Figure 23). PLL_AVDD is filtered with a low pass filter, for example an RC filter, see Sec- . tion 13 H.2 Power supply decoupling The design has multiple decoupling capacitors per supply, for example at least four0402 or 0603 size surface mount capacitors of 100nF in value, per supply (Section 13). A bulk decoupling capacitor of at least 10uF is placed on each supply (Section 13). H.3 Power on reset The RST_N and TRST_N pins are asserted (low) until all supplies are good. There is enough time between VDDIO power good and RST_N to allow any boot flash to settle. RST_N is fast enough to meet USB timings. H.4 Clock The CLK input pin is supplied with a clock with monotonic rising edges and low jitter. Pins MODE0 and MODE1 are set to the correct value for the chosen oscillator frequency. The MODE settings are shown in the Oscillator section, Section 7. If you have a choice between two values, choose the value with the highest multiplier ratio since that will boot faster. H.5 RGMII interface This section can be skipped if you do not have any device connected to the RGMII interface. 74 XEF216-512-FB236 Datasheet RX_CLK will be low when the xCORE comes out of reset (see Section 11). VDDIOT has a 2.5V or 3.3V supply as appropriate. RGMII signals are connected to the appropriate RGMII pins of the xCORE device. H.6 Boot X0D01 has a 1K pull-up to VDDIOL (Section 8). The device is kept in reset for at least 1 ms after VDDIOL has reached its minimum level (Section 8). H.7 JTAG, XScope, and debugging You have decided as to whether you need an XSYS header or not (Section G) If you have not included an XSYS header, you have devised a method to program the SPI-flash or OTP (Section G). H.8 GPIO You have not mapped both inputs and outputs to the same multi-bit port. Pins X0D04, X0D05, X0D06, and X0D07 are output only and are, during and after reset, pulled low or not connected (Section 8) H.9 Multi device designs Skip this section if your design only includes a single XMOS device. One device is connected to a QSPI or SPI flash for booting. Devices that boot from link have, for example, X0D06 pulled high and have link XL0 connected to a device to boot from (Section 8). 75 XEF216-512-FB236 Datasheet I PCB Layout Design Check List This section is a checklist for use by PCB designers using the XS2-UEF16B512-FB236. Each of the following sections contains items to check for each design. I.1 Ground Plane Each ground ball has a via to minimize impedance and conduct heat away from the device. (Section 13.4) Other than ground vias, there are no (or only a few) vias underneath or closely around the device. This create a good, solid, ground plane. I.2 RGMII interface This section can be skipped if you do not have any device connected to the RGMII interface. The RGMII traces are length and impedance matched. I.3 Power supply decoupling The decoupling capacitors are all placed close to a supply pin (Section 13). The decoupling capacitors are spaced around the device (Section 13). The ground side of each decoupling capacitor has a direct path back to the center ground of the device. I.4 PLL_AVDD The PLL_AVDD filter (especially the capacitor) is placed close to the PLL_AVDD pin (Section 13). 76 XEF216-512-FB236 Datasheet J Associated Design Documentation Document Title Information Document Estimating Power Consumption For XS1-UEF Devices Power consumption XMOS Programming Guide Timers, ports, clocks, cores and channels Link xTIMEcomposer User Guide Compilers, assembler and linker/mapper Link Timing analyzer, xScope, debugger Flash and OTP programming utilities K Related Documentation Document Title Information Document xCORE200: the XMOS XS2 Architecture ISA manual Link I/O timings for xCORE200 Port timings Link xCONNECT Architecture Link, switch and system information Link XS1-UEF Link Performance and Design Guidelines Link timings xCORE-200 Clock Frequency Control Advanced clock control 77 Link XEF216-512-FB236 Datasheet L Revision History Date Description 2015-03-20 Preliminary release 2015-04-14 Added RST to pins to be pulled hard, and removed reference to TCK from Errata Removed TRST_N references in packages that have no TRST_N New diagram for boot from embedded flash showing ports Pull up requirements for shared clock and external resistor for QSPI 2015-05-06 Removed references to DEBUG_N 2015-07-09 Updated electrical characteristics - Section 14 2015-08-19 Added I(USB_VDD) - Section 14 Added USB layout guidelines - Section 13 2015-08-27 Updated part marking - Section 16 2016-04-20 Typical internal pull-up and pull down current diagrams added - Section 14 2017-02-02 Updated USB VBUS wiring description with bus-powered usb-device instructions - Section 10 Clarified available RGMII ports/pins - Section 11 2017-09-19 Added Absolute Maximum Ratings - Section 14.1 Reference document links updated - Section J 2018-03-23 Incorrect IDCODE return value updated - Section 12 Incorrect VBUS signal name updated to GND in USB diagrams - Section 10 2020-10-05 Released documentation for A revision that uses different flash - Section 8 Copyright © 2020, All Rights Reserved. Xmos Ltd. is the owner or licensee of this design, code, or Information (collectively, the “Information”) and is providing it to you “AS IS” with no warranty of any kind, express or implied and shall have no liability in relation to its use. Xmos Ltd. makes no representation that the Information, or any particular implementation thereof, is or will be free from any claims of infringement and again, shall have no liability in relation to any such claims. XMOS, xCore, xcore.ai, and the XMOS logo are registered trademarks of XMOS Ltd in the United Kingdom and other countries and may not be used without written permission. Company and product names mentioned in this document are the trademarks or registered trademarks of their respective owners. 78