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Dear Customer,
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In data sheets and application notes which still contain NXP or Philips Semiconductors references, use
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- © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights
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- © Nexperia B.V. (year). All rights reserved.
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Team Nexperia
74CBTLV16211
24-bit bus switch
Rev. 7 — 9 November 2016
Product data sheet
1. General description
The 74CBTLV16211 provides a dual 12-bit high-speed bus switch with separate output
enable inputs (1OE, 2OE). The low on-state resistance of the switch allows connections to
be made with minimal propagation delay. The switch is disabled (high-impedance
OFF-state) when the output enable (nOE) input is HIGH.
To ensure the high-impedance OFF-state during power-up or power-down, 1OE and 2OE
should be tied to the VCC through a pull-up resistor. The minimum value of the resistor is
determined by the current-sinking capability of the driver.
Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall
times across the entire VCC range from 2.3 V to 3.6 V.
This device is fully specified for partial power-down applications using IOFF.
The IOFF circuitry disables the output, preventing the damaging backflow current through
the device when it is powered down.
2. Features and benefits
Supply voltage range from 2.3 V to 3.6 V
High noise immunity
Complies with JEDEC standard:
JESD8-5 (2.3 V to 2.7 V)
JESD8-B/JESD36 (2.7 V to 3.6 V)
ESD protection:
HBM JESD22-A114F exceeds 2000 V
MM JESD22-A115-A exceeds 200 V
CDM AEC-Q100-011 revision B exceeds 1000 V
5 switch connection between two ports
Rail to rail switching on data I/O ports
CMOS low power consumption
Latch-up performance exceeds 250 mA per JESD78B Class I level A
IOFF circuitry provides partial Power-down mode operation
TSSOP56 packages: SOT364-1 and SOT481-2
Specified from 40 C to +85 C and 40 C to +125 C
74CBTLV16211
NXP Semiconductors
24-bit bus switch
3. Ordering information
Table 1.
Ordering information
Type number
Package
Temperature
range
Name
Description
Version
74CBTLV16211DGG
40 C to +125 C
TSSOP56 plastic thin shrink small outline package; 56 leads;
body width 6.1 mm
SOT364-1
74CBTLV16211DGV
40 C to +125 C
TSSOP56 plastic thin shrink small outline package; 56 leads;
body width 4.4 mm
SOT481-2
4. Functional diagram
2(
2(
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%
%
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%
%
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%
%
%
%
%
%
%
%
%
%
%
%
DDL
Fig 1.
Logic symbol
Q$Q
Q%Q
Q2(
DDL
Fig 2.
Logic diagram (one switch)
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
5. Pinning information
5.1 Pinning
QF
2(
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2(
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%
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%
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%
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%
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%
$
%
$
%
$
%
$
%
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%
DDL
Fig 3.
Pin configuration (SOT364-1 and SOT481-2)
5.2 Pin description
Table 2.
Pin description
Symbol
Pin
Description
n.c.
1
not connected
1A0 to 1A11
2, 3, 4, 5, 6, 7, 9, 10, 11, 12, 13, 14
independent input or output
2A0 to 2A11
15, 16, 18, 20, 21, 22, 23, 24, 25, 26, 27, 28
independent input or output
GND
8, 19, 38, 49
ground (0 V)
VCC
17
supply voltage
2B0 to 2B11
41, 40, 39, 37, 36, 35, 34, 33, 32, 31, 30, 29
independent input or output
74CBTLV16211
Product data sheet
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Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
Table 2.
Pin description …continued
Symbol
Pin
Description
1B0 to 1B11
54, 53, 52, 51, 50, 48, 47, 46, 45, 44, 43, 42
independent input or output
2OE
55
output enable input (active-LOW)
1OE
56
output enable input (active-LOW)
6. Functional description
Table 3.
Function table[1]
Output enable input OE
Function switch
L
ON-state
H
OFF-state
[1]
H = HIGH voltage level; L = LOW voltage level.
7. Limiting values
Table 4.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V).
Symbol
Parameter
VCC
supply voltage
Conditions
Min
Max
Unit
0.5
+4.6
V
[1]
0.5
+4.6
V
[1]
0.5
VCC + 0.5
V
VI
input voltage
VSW
switch voltage
enable and disable mode
IIK
input clamping current
VI < 0.5 V
50
-
mA
ISK
switch clamping current
VI < 0.5 V
50
-
mA
VSW = 0 V to VCC
ISW
switch current
-
128
mA
ICC
supply current
-
+100
mA
IGND
ground current
100
-
mA
Tstg
storage temperature
65
+150
C
-
600
mW
total power dissipation
Ptot
Tamb = 40 C to +125 C
[2]
[1]
The minimum input and output voltage ratings may be exceeded if the input and output current ratings are observed.
[2]
For TSSOP56 packages: above 55 C the value of Ptot derates linearly with 8.0 mW/K.
8. Recommended operating conditions
Table 5.
Recommended operating conditions
Symbol
Parameter
VCC
supply voltage
VI
input voltage
VSW
switch voltage
Tamb
ambient temperature
t/V
[1]
Conditions
enable and disable mode
input transition rise and fall rate
VCC = 2.3 V to 3.6 V
[1]
Min
Max
Unit
2.3
3.6
V
0
3.6
V
0
VCC
V
40
+125
C
0
200
ns/V
Applies to control signal levels.
74CBTLV16211
Product data sheet
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Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
9. Static characteristics
Table 6.
Static characteristics
At recommended operating conditions voltages are referenced to GND (ground = 0 V).
Symbol Parameter
Tamb = 40 C to +85 C
Conditions
Tamb = 40 C to +125 C Unit
Min
Typ[1]
Max
Min
Max
VCC = 2.3 V to 2.7 V
1.7
-
-
1.7
-
V
VCC = 3.0 V to 3.6 V
2.0
-
-
2.0
-
V
LOW-level input VCC = 2.3 V to 2.7 V
voltage
VCC = 3.0 V to 3.6 V
-
-
0.7
-
0.7
V
-
-
0.9
-
0.9
V
II
input leakage
current
-
-
1.0
-
20
A
IS(OFF)
OFF-state
VCC = 3.6 V; see Figure 4
leakage current
-
-
1
-
20
A
IS(ON)
ON-state
VCC = 3.6 V; see Figure 5
leakage current
-
-
1
-
20
A
IOFF
power-off
VI or VO = 0 V to 3.6 V;
leakage current VCC = 0 V
-
-
10
-
50
A
ICC
supply current
VI = GND or VCC; IO = 0 A;
VSW = GND or VCC;
VCC = 3.6 V
-
-
10
-
50
A
ICC
additional
supply current
pin nOE; VI = VCC 0.6 V;
VSW = GND or VCC;
VCC = 3.6 V
-
-
300
-
2000
A
CI
input
capacitance
pin nOE; VCC = 3.3 V;
VI = 0 V to 3.3 V
-
0.9
-
-
-
pF
CS(OFF)
OFF-state
capacitance
VCC = 3.3 V; VI = 0 V to 3.3 V
-
5.2
-
-
-
pF
CS(ON)
ON-state
capacitance
VCC = 3.3 V; VI = 0 V to 3.3 V
-
14.3
-
-
-
pF
HIGH-level
input voltage
VIH
VIL
pin nOE; VI = GND to VCC;
VCC = 3.6 V
[1]
All typical values are measured at Tamb = 25 C.
[2]
One input at 3 V, other inputs at VCC or GND.
[2]
9.1 Test circuits
9&&
9&&
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Q$Q
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9,/
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9O
DDP
Product data sheet
*1'
92
VI = VCC or GND and VO = open circuit.
Test circuit for measuring OFF-state leakage
current (one channel)
74CBTLV16211
Q%Q
DDP
VI = VCC or GND and VO = GND or VCC.
Fig 4.
Q$Q
Fig 5.
Test circuit for measuring ON-state leakage
current (one channel)
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
9.2 ON resistance
Table 7.
Resistance RON
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); for test circuit see Figure 6.
Symbol Parameter
RON
Tamb = 40 C to +85 C
Conditions
Tamb = 40 C to +125 C
Unit
Min
Typ[1]
Max
Min
Max
ISW = 64 mA; VI = 0 V
-
4.2
8.0
-
15.0
ISW = 24 mA; VI = 0 V
-
4.2
8.0
-
15.0
ISW = 15 mA; VI = 1.7 V
-
8.4
40
-
60.0
ISW = 64 mA; VI = 0 V
-
4.0
7.0
-
11.0
ISW = 24 mA; VI = 0 V
-
4.0
7.0
-
11.0
ISW = 15 mA; VI = 2.4 V
-
6.2
15
-
25.5
ON resistance VCC = 2.3 V to 2.7 V;
see Figure 7 to Figure 9
[2]
VCC = 3.0 V to 3.6 V;
see Figure 10 to Figure 12
[1]
Typical values are measured at Tamb = 25 C and nominal VCC.
[2]
Measured by the voltage drop between the A and B terminals at the indicated current through the switch. ON-state resistance is
determined by the lower of the voltages of the two (A or B) terminals.
9.3 ON resistance test circuit and graphs
DDL
521
ȍ
96:
9
9&&
Q2(
9,/
Q$Q
9O
Q%Q
*1'
,6:
9,9
DDP
(1) Tamb = 125 C.
RON = VSW / ISW.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
Fig 6.
Test circuit for measuring ON resistance
(one channel)
74CBTLV16211
Product data sheet
Fig 7.
ON resistance as a function of input voltage;
VCC = 2.5 V; ISW = 15 mA
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Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
DDL
521
ȍ
DDL
521
ȍ
9,9
(1) Tamb = 125 C.
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 8.
ON resistance as a function of input voltage;
VCC = 2.5 V; ISW = 24 mA
DDL
9,9
521
ȍ
Fig 9.
ON resistance as a function of input voltage;
VCC = 2.5 V; ISW = 64 mA
DDL
521
ȍ
9,9
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
(4) Tamb = 40 C.
Fig 10. ON resistance as a function of input voltage;
VCC = 3.3 V; ISW = 15 mA
Product data sheet
9,9
(1) Tamb = 125 C.
74CBTLV16211
Fig 11. ON resistance as a function of input voltage;
VCC = 3.3 V; ISW = 24 mA
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
DDL
521
ȍ
9,9
(1) Tamb = 125 C.
(2) Tamb = 85 C.
(3) Tamb = 25 C.
(4) Tamb = 40 C.
Fig 12. ON resistance as a function of input voltage; VCC = 3.3 V; ISW = 64 mA
10. Dynamic characteristics
Table 8.
Dynamic characteristics
GND = 0 V; for test circuit see Figure 15
Symbol Parameter
Tamb = 40 C to +85 C Tamb = 40 C to +125 C Unit
Conditions
Min
Typ[1]
Max
Min
Max
-
-
0.13
-
0.2
ns
-
-
0.2
-
0.31
ns
1.0
2.0
7.0
1.0
7.8
ns
1.0
1.7
6.2
1.0
6.8
ns
VCC = 2.3 V to 2.7 V
1.0
2.6
7.2
1.0
8.1
ns
VCC = 3.0 V to 3.6 V
1.0
3.0
7.7
1.0
8.8
ns
propagation delay nAn to nBn or nBn to
nAn; see Figure 13
tpd
[2][3]
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
enable time
ten
nOE to nAn or nBn;
see Figure 14
[4]
VCC = 2.3 V to 2.7 V
VCC = 3.0 V to 3.6 V
disable time
tdis
nOE to nAn or nBn;
see Figure 14
[5]
[1]
All typical values are measured at Tamb = 25 C and at nominal VCC.
[2]
The propagation delay is the calculated RC time constant of the typical on-state resistance of the switch and the load capacitance, when
driven by an ideal voltage source (zero output impedance).
[3]
tpd is the same as tPLH and tPHL.
[4]
ten is the same as tPZH and tPZL.
[5]
tdis is the same as tPHZ and tPLZ.
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
11. Waveforms
9,
LQSXW
90
90
9
W3+/
W3/+
92+
90
RXWSXW
90
92/
DDL
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 13. The data input (nAn or nBn) to output (nBn or nAn) propagation delays
Table 9.
Measurement points
Supply voltage
Input
Output
VCC
VM
VI
tr = tf
VM
VX
VY
2.3 V to 2.7 V
0.5VCC
VCC
2.0 ns
0.5VCC
VOL + 0.15 V
VOH 0.15 V
3.0 V to 3.6 V
0.5VCC
VCC
2.0 ns
0.5VCC
VOL + 0.3 V
VOH 0.3 V
9,
Q2(LQSXW
90
*1'
W3/=
W3=/
9&&
RXWSXW
/2:WR2))
2))WR/2:
90
9;
92/
W3+=
92+
W3=+
9<
RXWSXW
+,*+WR2))
2))WR+,*+
90
*1'
VZLWFK
HQDEOHG
VZLWFK
GLVDEOHG
VZLWFK
HQDEOHG
DDN
Measurement points are given in Table 9.
Logic levels: VOL and VOH are typical output voltage levels that occur with the output load.
Fig 14. Enable and disable times
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
9,
W:
QHJDWLYH
SXOVH
90
9
WI
WU
WU
WI
9,
SRVLWLYH
SXOVH
9
90
90
90
W:
9(;7
9&&
9,
*
5/
92
'87
57
5/
&/
DDH
Test data is given in Table 10.
Definitions for test circuit:
RL = Load resistance.
CL = Load capacitance including jig and probe capacitance.
RT = Termination resistance should be equal to the output impedance Zo of the pulse generator.
VEXT = External voltage for measuring switching times.
Fig 15. Test circuit for measuring switching times
Table 10.
Test data
Supply voltage
Load
VCC
CL
RL
tPLH, tPHL
tPZH, tPHZ
tPZL, tPLZ
2.3 V to 2.7 V
30 pF
500
open
GND
2VCC
3.0 V to 3.6 V
50 pF
500
open
GND
2VCC
74CBTLV16211
Product data sheet
VEXT
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
11.1 Additional dynamic characteristics
Table 11. Additional dynamic characteristics
At recommended operating conditions; voltages are referenced to GND (ground = 0 V); VI = GND or VCC (unless otherwise
specified); tr = tf 2.5 ns.
Symbol Parameter
f(3dB)
[1]
Tamb = 25 C
Conditions
3 dB frequency response VCC = 3.3 V; RL = 50 ; see Figure 16
[1]
Unit
Min
Typ
Max
-
458
-
MHz
fi is biased at 0.5VCC.
11.2 Test circuits
9&&
9&&
Q2(
9,/
5/
Q%Q
IL
Q$Q
*1'
G%
DDD
nOE connected to GND; Adjust fi voltage to obtain 0 dBm level at output. Increase fi frequency until dB meter reads 3 dB.
Fig 16. Test circuit for measuring the frequency response when channel is in ON-state
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
12. Package outline
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
627
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02
Fig 17. Package outline SOT364-1 (TSSOP56)
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
12 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
76623SODVWLFWKLQVKULQNVPDOORXWOLQHSDFNDJHOHDGVERG\ZLGWKPP
627
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(8523($1
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Fig 18. Package outline SOT481-2 (TSSOP56)
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
13. Abbreviations
Table 12.
Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal-Oxide Semiconductor
DUT
Device Under Test
ESD
ElectroStatic Discharge
HBM
Human Body Model
MM
Machine Model
14. Revision history
Table 13.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
74CBTLV16211 v.7
20161109
Product data sheet
-
74CBTLV16211 v.6
-
74CBTLV16211 v.5
Modifications:
74CBTLV16211 v.6
Modifications:
•
Section 11.1 and Section 11.2 added.
20111215
•
Product data sheet
Legal pages updated.
74CBTLV16211 v.5
20101230
Product data sheet
-
74CBTLV16211 v.4
74CBTLV16211 v.4
20100816
Product data sheet
-
74CBTLV16211 v.3
74CBTLV16211 v.3
20100112
Product data sheet
-
74CBTLV16211 v.2
74CBTLV16211 v.2
20090826
Product data sheet
-
74CBTLV16211 v.1
74CBTLV16211 v.1
20080620
Product data sheet
-
-
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
15. Legal information
15.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
15.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
15.3 Disclaimers
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
74CBTLV16211
Product data sheet
Suitability for use — NXP Semiconductors products are not designed,
authorized or warranted to be suitable for use in life support, life-critical or
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer’s own
risk.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
15 of 17
74CBTLV16211
NXP Semiconductors
24-bit bus switch
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Non-automotive qualified products — Unless this data sheet expressly
states that this specific NXP Semiconductors product is automotive qualified,
the product is not suitable for automotive use. It is neither qualified nor tested
in accordance with automotive testing or application requirements. NXP
Semiconductors accepts no liability for inclusion and/or use of
non-automotive qualified products in automotive equipment or applications.
In the event that customer uses the product for design-in and use in
automotive applications to automotive specifications and standards, customer
(a) shall use the product without NXP Semiconductors’ warranty of the
product for such automotive applications, use and specifications, and (b)
whenever customer uses the product for automotive applications beyond
NXP Semiconductors’ specifications such use shall be solely at customer’s
own risk, and (c) customer fully indemnifies NXP Semiconductors for any
liability, damages or failed product claims resulting from customer design and
use of the product for automotive applications beyond NXP Semiconductors’
standard warranty and NXP Semiconductors’ product specifications.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
15.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
16. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
74CBTLV16211
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 7 — 9 November 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
16 of 17
NXP Semiconductors
74CBTLV16211
24-bit bus switch
17. Contents
1
2
3
4
5
5.1
5.2
6
7
8
9
9.1
9.2
9.3
10
11
11.1
11.2
12
13
14
15
15.1
15.2
15.3
15.4
16
17
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 3
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 4
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4
Recommended operating conditions. . . . . . . . 4
Static characteristics. . . . . . . . . . . . . . . . . . . . . 5
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
ON resistance . . . . . . . . . . . . . . . . . . . . . . . . . . 6
ON resistance test circuit and graphs. . . . . . . . 6
Dynamic characteristics . . . . . . . . . . . . . . . . . . 8
Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Additional dynamic characteristics . . . . . . . . 11
Test circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 12
Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 14
Legal information. . . . . . . . . . . . . . . . . . . . . . . 15
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 15
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 16
Contact information. . . . . . . . . . . . . . . . . . . . . 16
Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: salesaddresses@nxp.com
Date of release: 9 November 2016
Document identifier: 74CBTLV16211