CBT16292DGG,112

Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia CBT16292 12-bit 1-of-2 multiplexer/demultiplexer Rev. 02 — 18 April 2008 Product data sheet 1. General description The CBT16292 is a 12-bit 1-of-2 high-speed TTL-compatible multiplexer/demultiplexer. The low ON resistance of the switch allows connections to be made with minimal propagation delay. When the select input (S) is LOW, port nA is connected to port nB1 and port nB2 is connected to GND via an internal pull-down resistor (500 Ω). When select input (S) is HIGH, port nA is connected to port nB2 and nB1 is connected to GND via an internal pull-down resistor (500 Ω). The CBT16292 is characterized for operation from –40 °C to +85 °C. 2. Features 6 Ω switch connection between two ports TTL compatible input levels Break-before-make feature Internal 500 Ω pull-down resistors to ground ESD protection: u HBM JESD22-A114E Class 2 exceeds 2000 V u MM JESD22-A115-A exceeds 200 V u CDM JESD22-C101C exceeds 1000 V n Latch-up performance exceeds 500 mA per JESD 78 n n n n n 3. Ordering information Table 1. Ordering information Type number CBT16292DGG Package Temperature range Name Description Version −40 °C to 85 °C plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 TSSOP56 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 4. Functional diagram 2 4 6 9 11 13 15 18 21 23 25 27 1 1A 2A 3A 4A 5A 6A 7A 8A 9A 10A 11A 12A 1B1 1B2 2B1 2B2 3B1 3B2 4B1 4B2 5B1 5B2 6B1 6B2 7B1 7B2 8B1 8B2 9B1 9B2 10B1 10B2 11B1 11B2 12B1 12B2 54 53 52 51 50 1A 48 1B1 46 500 Ω 45 44 53 43 1B2 42 41 40 39 37 36 12A 27 30 12B1 35 500 Ω 34 33 500 Ω 32 31 29 30 12B2 29 S Logic symbol S Fig 2. 1 001aah984 Logic diagram CBT16292_2 Product data sheet 54 500 Ω 47 001aah983 Fig 1. 2 © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 2 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 5. Pinning information 5.1 Pinning S 1 56 n.c. 1A 2 55 n.c. n.c. 3 54 1B1 2A 4 53 1B2 n.c. 5 52 2B1 3A 6 51 2B2 n.c. 7 50 3B1 GND 8 49 GND 4A 9 48 3B2 n.c. 10 47 4B1 5A 11 46 4B2 n.c. 12 45 5B1 6A 13 44 5B2 n.c. 14 43 6B1 CBT16292 7A 15 42 6B2 n.c. 16 41 7B1 VCC 17 40 7B2 8A 18 39 8B1 GND 19 38 GND n.c. 20 37 8B2 9A 21 36 9B1 n.c. 22 35 9B2 10A 23 34 10B1 n.c. 24 33 10B2 11A 25 32 11B1 n.c. 26 31 11B2 12A 27 30 12B1 n.c. 28 29 12B2 001aah985 Fig 3. Pin configuration SOT364-1 (TSSOP56) 5.2 Pin description Table 2. Pin description Symbol Pin Description S 1 select input nA 2, 4, 6, 9, 11, 13, 15, 18, 21, 23, 25, 27 common input or output (1A to 12A) n.c. 3, 5, 7, 10, 12, 14, 16, 20, 22, 24, 26, 28, 55, 56 not connected GND 8, 19, 38, 49 ground (0 V) VCC 17 supply voltage nB1 54, 52, 50, 47, 45, 43, 41, 39, 36, 34, 32, 30 independent input or output (1B1 to 12B1) nB2 53, 51, 48, 46, 44, 42, 40, 37, 35, 33, 31, 29 independent input or output (1B2 to 12B2) CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 3 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 6. Functional description Table 3. Function selection[1] S input Channel on L nA to nB1 or nB1 to nA (nB2 connected to GND via internal resistor (500 Ω) H nA to nB2 or nB2 to nA (nB1 connected to GND via internal resistor (500 Ω) [1] H = HIGH voltage level; L = LOW voltage level. 7. Limiting values Table 4. Limiting values [1][2] In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VCC supply voltage Conditions Min Max Unit −0.5 +7.0 V VI input voltage −0.5 +7.0 V IIK input clamping current VI < 0 V −50 - mA ISW switch current continuous current through channel −128 +128 mA Tstg storage temperature −65 +150 °C - 600 mW total power dissipation Ptot [3] Tamb = −40 °C to +125 °C [4] [1] Stresses beyond those listed may cause permanent damage to the device. These are stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. [2] The performance capability of a high-performance integrated circuit in conjunction with its thermal environment can create junction temperatures which are detrimental to reliability. The maximum junction temperature of this integrated circuit should not exceed 150 °C. [3] The input and output negative voltage ratings may be exceeded if the input and output clamp current ratings are observed. [4] Ptot derates linearly with 8 mW/K above 55 °C. 8. Recommended operating conditions Table 5. Operating conditions All unused control inputs of the device must be held at VCC or GND to ensure proper device operation. Symbol Parameter VCC Conditions Min Max Unit supply voltage 4.0 5.5 V VIH HIGH-level input voltage 2.0 - V VIL LOW-level input voltage - 0.8 V Tamb ambient temperature −40 +85 °C operating in free-air CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 4 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 9. Static characteristics Table 6. Static characteristics Tamb = −40 °C to +85 °C. Symbol Parameter Conditions VIK input clamping voltage VCC = 4.5 V; II = −18 mA Min Typ[1] Max Unit - - −1.2 V II input leakage current VCC = 5.5 V; VI = VCC or GND - - ±5 µA ICC supply current VCC = 5.5 V; IO = 0 mA; VI = VCC or GND - - 3 µA ∆ICC additional supply current per input; VCC = 5.5 V; one input at 3.4 V, other inputs at VCC or GND - - 2.5 mA CI input capacitance select input S; VCC = 5.0 V; VI = 3 V or 0 V - 4 - pF Cio(off) off-state input/output capacitance VO = 3 V or 0 V; VCC = 0 V - 6 - pF VI = 0 V; II = 64 mA - 8 12.5 Ω VI = 0 V; II = 30 mA - 8 11 Ω VI = 2.4 V; II = 15 mA - 13 16 Ω RON ON resistance [2] [3] VCC = 4.5 V [1] All typical values are measured at Tamb = 25 °C. [2] This is the increase in supply current for each input that is at the specified TTL voltage level rather than VCC or GND. [3] Measured by the voltage drop between the A and the B terminals at the indicated current through the switch. ON resistance is determined by the lowest voltage of the two (A or B) terminals. 10. Dynamic characteristics Table 7. Dynamic characteristics Tamb = −40 °C to +85 °C; VCC = 5.0 V ± 0.5 V; for test circuit see Figure 6. Symbol Parameter propagation delay tpd Conditions nA, nBn to nBn, nA; see Figure 4 [1][2] Min Typ Max Unit - - 0.4 ns ten enable time S to nA, nBn; see Figure 5 [2] 1.5 - 6.0 ns tdis disable time S to nA, nBn; see Figure 5 [2] 2.2 - 5.5 ns nA, nBn to nBn, nA [3] 0 - 2.0 ns break-before-make time tb-m [1] This parameter is warranted but not production tested. The propagation delay is based on the RC time constant of the typical ON resistance of the switch and a load capacitance, when driven by an ideal voltage source (zero output impedance). [2] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [3] Time interval between break and make measured at the same operating point (VCC and temperature). CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 5 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 11. Waveforms VI input GND VM VM tPLH tPHL VOH output VM VM VOL 001aah986 Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 4. Input (nA or nBn) to output (nBn or nA) propagation delays VI S input GND 3.5 V output OFF to LOW LOW to OFF V OL output OFF to HIGH HIGH to OFF VM VM tPZL tPLZ VM VOL + 0.3 V tPZH tPHZ VOH VOH − 0.3 V VM GND 001aah987 Measurement points are given in Table 8. VOL and VOH are typical output voltage levels that occur with the output load. Fig 5. Table 8. Enable and disable times Measurement points Supply voltage Input Output VCC VM VI VM 4.5 V to 5.5 V 1.5 V GND to 3.0 V 1.5 V CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 6 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer VEXT VCC VI RL VO G DUT RT CL RL mna616 Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to the output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 6. Test circuit Table 9. Test data Supply voltage Input Load VEXT VCC VI tr = tf CL RL tPLH, tPHL tPZH, tPHZ tPZL, tPLZ 4.5 V to 5.5 V GND to 3.0 V ≤ 2.5 ns 50 pF 500 Ω open open 7.0 V CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 7 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 12. Package outline TSSOP56: plastic thin shrink small outline package; 56 leads; body width 6.1 mm SOT364-1 E D A X c HE y v M A Z 56 29 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 28 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 14.1 13.9 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.5 0.1 8 o 0 o Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT364-1 Fig 7. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Package outline SOT364-1 (TSSOP56) CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 8 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 13. Abbreviations Table 10. Abbreviations Acronym Description CDM Charged Device Model DUT Device Under Test ESD ElectroStatic Discharge HBM Human Body Model MM Machine Model TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes CBT16292_2 20080418 Product data sheet - CBT16292_1 Modifications: CBT16292_1 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • • Legal texts have been adapted to the new company name where appropriate. Changed ten from 5.8 ns to 6.0 ns in Table 7 “Dynamic characteristics”. 19990913 Product specification CBT16292_2 Product data sheet - - © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 9 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 15.3 Disclaimers General — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com CBT16292_2 Product data sheet © NXP B.V. 2008. All rights reserved. Rev. 02 — 18 April 2008 10 of 11 CBT16292 NXP Semiconductors 12-bit 1-of-2 multiplexer/demultiplexer 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3 Functional description . . . . . . . . . . . . . . . . . . . 4 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 4 Recommended operating conditions. . . . . . . . 4 Static characteristics. . . . . . . . . . . . . . . . . . . . . 5 Dynamic characteristics . . . . . . . . . . . . . . . . . . 5 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 8 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . 9 Legal information. . . . . . . . . . . . . . . . . . . . . . . 10 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 10 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Contact information. . . . . . . . . . . . . . . . . . . . . 10 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2008. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 18 April 2008 Document identifier: CBT16292_2