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ISD8101SYI

ISD8101SYI

  • 厂商:

    NUVOTON(新唐)

  • 封装:

    SOIC8_EP

  • 描述:

    IC AMP AUDIO GP ANLG 8SOP

  • 数据手册
  • 价格&库存
ISD8101SYI 数据手册
ISD8101 Audio Amplifier ISD8101 Datasheet The information described in this document is the exclusive intellectual property of Nuvoton Technology Corporation and shall not be reproduced without permission from Nuvoton. Nuvoton is providing this document only for reference purposes of Audio Product Line based system design. Nuvoton assumes no responsibility for errors or omissions. All data and specifications are subject to change without notice. For additional information or questions, please contact: Nuvoton Technology Corporation. www.nuvoton.com Jun 28, 2021 Page 1 of 22 Rev 2.1 ISD8101 GENERAL DESCRIPTION The ISD8100 is a general purpose analog audio amplifier capable of driving an 8-ohm load with up to 1.5Wrms output power. This device includes current limiting and a chip enable pin with low standby current and excellent pop-and-click performance. 1 Also included is the ability for the inputs to be configured as either single-ended or differential. Internal resistors set the device gain at 20dB in the single ended output configuration. With external resistors, any gain less than 20dB can be achieved. The device is unity gain stable, including when used with external input resistors and external capacitors as may be optionally used for implementing simple filtering functions. 2 FEATURES • • • • • • • • Wide power supply range and excellent standby current o 2.4Vdc - 6.8Vdc operation o 40dB power supply noise rejection Very fast start-up time o Less than 1msec when using Chip Enable Current limiting for over-current conditions Package options: Pb-free SOP-8, SOP-8 (Ex-Pad), PDIP-8 Temperature Range: -40°C to +85°C Jun 28, 2021 Page 2 of 22 Applications: • Toys • Mobile Phones • Greeting Cards • Portable Speakers • Boom Box • White Goods Rev 2.1 ISD8101 3 BLOCK DIAGRAM 8 Vdd R3 5 55k R1 5k - - INV SPN 1 + INP + 4 R2 5k R5 R4 55k R6 - VREF 2 SPP 6 + Bias Generator CE 7 ISD8101 GND 3 Figure 3-1 ISD8101 Block Diagram Jun 28, 2021 Page 3 of 22 Rev 2.1 ISD8101 4 PINOUT CONFIGURATION: 4.1 SOP- 8 SPN 1 SPP 2 GND 3 ISD8101 SOP-8 8 Vdd 7 CE 6 Vref 5 INV S-suffix optional thermal Ex-Pad INP 4 Figure 4-1 ISD8101 8-Lead SOP Pin Configuration. 4.2 PDIP-8 8 Vdd 7 CE 3 6 Vref 4 5 INV SPN 1 SPP 2 GND INP ISD8101 PDIP-8 Figure 4-2 ISD8101 8-Lead PDIP Pin Configuration. Jun 28, 2021 Page 4 of 22 Rev 2.1 ISD8101 5 PIN DESCRIPTION Pin Numb er Pin Name I/O Function 1 SPN O Non-Inverting Speaker Output 2 SPP O Inverting Speaker Output 3 GND I Ground 4 INP I Non-Inverting Signal Input 5 INV I Inverting Signal Input 6 Vref O Internal Reference Voltage (1/2 Vdd) 7 CE I Chip Enable 8 Vdd I Supply Voltage 9 Ex-Pad I Thermal Tab (must be connected to Vss, SOP-8 package, only) Jun 28, 2021 Page 5 of 22 Rev 2.1 ISD8101 6 6.1 ELECTRICAL CHARACTERISTICS OPERATING CONDITIONS OPERATING CONDITIONS (DIE) CONDITIONS VALUES Operating temperature range 1 -40°C to +85°C Supply voltage (VDD) +2.4V to +6.8V Ground voltage (VSS) 0V Input voltage (VDD) Vss to VDD Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V) OPERATING CONDITIONS (INDUSTRIAL PACKAGED PARTS) CONDITIONS VALUES Operating temperature range (Case temperature) 1 -40°C to +85°C Supply voltage (VDD) +2.4V to +6.8V Ground voltage (VSS) 0V Input voltage (VDD) Vss to VDD Voltage applied to any pins (VSS –0.3V) to (VDD +0.3V) [1] Conditions Notes: VDD=3.3V, TA=25°C unless otherwise stated. Die temperature must at all times be kept less than 125°C by appropriate thermal design of the system. 6.2 DC PARAMETERS MIN TYP [1] PARAMETER SYMBOL Supply Voltage VDD Operating Current IDD 2.4 Standby Current ISB 0.1 2.4 MAX 6.8 1 UNITS CONDITIONS V mA VDD = 5V, no load µA VDD = 5V CE input resistance 20k Ω Internal pull-down CE input current 120 µA CE = 2.3V, VDD= 5V CE threshold enabled VENL 0.9 V All supply voltages CE threshold standby VENH 1.5 V All supply voltages VDD/2 V Vref Reference Voltage [1] Conditions V Notes: DD = 3.3V, TA = 25°C unless otherwise stated. Die temperature must at all times be kept less than 125°C by appropriate thermal design of the system. Jun 28, 2021 Page 6 of 22 Rev 2.1 ISD8101 6.3 AC PARAMETERS 6.3.1 Analog Characteristics; Cref=4.7uF PARAMETER SYMBOL MIN TYP MAX UNITS CONDITIONS 0.3 - 5.5 V Vdd = 6.8Vdc 0.3 - 2.3 V Vdd = 3.3Vdc 0.5 - 1.4 V Vdd = 2.4Vdc Inverting Input Impedance 5k Ω Gain=20dB Non-Inverting Input Impedance 60k Ω Gain=20dB Audio Input Voltage Range Power Supply Rejection Ratio PSRR 41 dB Vdd = 5Vdc Common Mode Rejection Ratio CMRR 40 dB Signal at INP = INV Voltage Gain 20 dB Rinput = zero-ohms Enable Time from Standby 0.5 msec Single-ended Enable Time from Standby 0.5 msec Differential Pop-and-Click from Standby 1 10 mV Single Ended Pop-and-Click from Standby 1 10 mV Differential Thermal Resistance 2 90 °C/W SOP-8 (with Ex-Pad) 2 150 °C/W SOP-8 Thermal Resistance 2 117 °C/W PDIP-8 Thermal Resistance Notes: [1] Impulse voltage that is potentially audible. After impulse, there is a slow ramp from standby Vref to operating Vref, which is typically inaudible with Cref = 4.7uF [2] Thermal resistance values are calculated from a generic simulation following JEDEC specification (JESD51) and can vary depending upon PCB design. Jun 28, 2021 Page 7 of 22 Rev 2.1 ISD8101 6.3.2 Speaker Outputs PARAMETER SYMBOL Signal-to-Noise Ratio MIN SNR Output Power (BTL mode) Load 8Ω Vdd=5Vdc 0dB gain Distortion = THD+N Load Impedance Output Offset Voltage RL(SPK) 7.5 TYP[1] MAX UNITS CONDITIONS 100 dB 0dB gain, 5Vdc 500 mW
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