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74AVC16245DGG,518

74AVC16245DGG,518

  • 厂商:

    NEXPERIA(安世)

  • 封装:

    TSSOP48_12.5X6.1MM

  • 描述:

    IC TXRX NON-INVERT 3.6V 48TSSOP

  • 数据手册
  • 价格&库存
74AVC16245DGG,518 数据手册
Important notice Dear Customer, On 7 February 2017 the former NXP Standard Product business became a new company with the tradename Nexperia. Nexperia is an industry leading supplier of Discrete, Logic and PowerMOS semiconductors with its focus on the automotive, industrial, computing, consumer and wearable application markets In data sheets and application notes which still contain NXP or Philips Semiconductors references, use the references to Nexperia, as shown below. Instead of http://www.nxp.com, http://www.philips.com/ or http://www.semiconductors.philips.com/, use http://www.nexperia.com Instead of sales.addresses@www.nxp.com or sales.addresses@www.semiconductors.philips.com, use salesaddresses@nexperia.com (email) Replace the copyright notice at the bottom of each page or elsewhere in the document, depending on the version, as shown below: - © NXP N.V. (year). All rights reserved or © Koninklijke Philips Electronics N.V. (year). All rights reserved Should be replaced with: - © Nexperia B.V. (year). All rights reserved. If you have any questions related to the data sheet, please contact our nearest sales office via e-mail or telephone (details via salesaddresses@nexperia.com). Thank you for your cooperation and understanding, Kind regards, Team Nexperia 74AVC16245 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state Rev. 3 — 31 January 2013 Product data sheet 1. General description The 74AVC16245 is a 16-bit transceiver featuring non-inverting 3-state bus compatible outputs in both send and receive directions. The device features two output enable inputs (nOE) for easy cascading and two send/receive inputs (nDIR) for direction control. Inputs nOE control the outputs so that the buses are effectively isolated. This device can be used as two 8-bit transceivers or one 16-bit transceiver. The 74AVC16245 is designed to have an extremely fast propagation delay and a minimum amount of power consumption. To ensure the high-impedance output state during power-up or power-down, tie pins nOE to VCC through a pull-up resistor (Live Insertion). A Dynamic Controlled Output (DCO) circuitry is implemented to support termination line drive during transient (see Figure 4 and Figure 5) 2. Features and benefits  Wide supply voltage range from 1.2 V to 3.6 V  Complies with JEDEC standards:  JESD8-7 (1.2 V to 1.95 V)  JESD8-5 (1.8 V to 2.7 V)  JESD8-1A (2.7 V to 3.6 V)  CMOS low power consumption  Input/output tolerant up to 3.6 V  Dynamic Controlled Output (DCO) circuit dynamically changes output impedance, resulting in noise reduction without speed degradation  Low inductance multiple VCC and GND pins to minimize noise and ground bounce  Supports Live Insertion 3. Ordering information Table 1. Ordering information Type number 74AVC16245DGG Package Temperature range Name Description Version 40 C to +85 C TSSOP48 plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 4. Functional diagram 2DIR 1DIR 2OE 1OE 2A0 1A0 1B0 1A1 2B0 2A1 2B1 1B1 1A2 2A2 1B2 1A3 2B2 2A3 1B3 1A4 2B3 2A4 2B4 1B4 1A5 2A5 1B5 1A6 2B5 2A6 1B6 2B6 2A7 1A7 1B7 2B7 001aaa789 Fig 1. Logic symbol 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 2 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 1OE 1DIR 2OE 2DIR 1A0 G3 3EN1[BA] 3EN2[AB] G6 6EN1[BA] 6EN2[AB] 1B0 1 2 1A1 1B1 1A2 1B2 1A3 1B3 1A4 1B4 1A5 1B5 1A6 1B6 1A7 1B7 2A0 2B0 4 5 2A1 2B1 2A2 2B2 2A3 2B3 2A4 2B4 2A5 2B5 2A6 2B6 2B7 2A7 001aaa790 Fig 2. IEC logic symbol 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 3 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 5. Pinning information 5.1 Pinning $9& ',5   2( %   $ %   $ *1'   *1' %   $ %   $ 9&&   9&& %   $ %   $ *1'   *1' %   $ %   $ %   $ %   $ *1'   *1' %   $ %   $ 9&&   9&& %   $ %   $ *1'   *1' %   $ %   $ ',5   2( DDD Fig 3. Pin configuration 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 4 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 5.2 Pin description Table 2. Pin description Symbol Pin Description 1DIR, 2DIR 1, 24 direction control input 1B0 to 1B7 2, 3, 5, 6, 8, 9, 11, 12 data input/output 2B0 to 2B7 13, 14, 16, 17, 19, 20, 22, 23 data input/output GND 4, 10, 15, 21, 28, 34, 39, 45 ground (0 V) VCC 7, 18, 31, 42 supply voltage 1OE, 2OE 48, 25 output enable input (active LOW) 1A0 to 1A7 47, 46, 44, 43, 41, 40, 38, 37 data input/output 2A0 to 2A7 36, 35, 33, 32, 30, 29, 27, 26 data input/output 6. Functional description Table 3. Function table[1] Inputs Outputs nOE nDIR nAn nBn L L A=B inputs L H inputs B=A H X Z Z [1] H = HIGH voltage level; L = LOW voltage level; X = don’t care; Z = high-impedance OFF-state. 7. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter VCC supply voltage IIK input clamping current VI input voltage IOK output clamping current output voltage VO Conditions VI < 0 V [1] Min Max Unit 0.5 +4.6 V 50 - mA 0.5 +4.6 V 50 - mA output HIGH or LOW [1] 0.5 VCC + 0.5 V output 3-state [1] 0.5 +4.6 V - 50 mA VO < 0 V IO output current VO = 0 V to VCC ICC supply current - 100 mA IGND ground current 100 - mA Tstg storage temperature 65 +150 C Ptot total power dissipation - 500 mW Tamb = 40 C to +125 C [2] [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] Above 60 C, the value of Ptot derates linearly with 5.5 mW/K. 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 5 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 8. Recommended operating conditions Table 5. Recommended operating conditions Symbol Parameter VCC supply voltage Conditions Min Typ Max Unit according to JEDEC Low Voltage Standards 1.4 - 1.6 V 1.65 - 1.95 V 2.3 - 2.7 V 3.0 - 3.6 V 1.2 - 3.6 V 0 - 3.6 V for low-voltage applications VI input voltage VO output voltage output HIGH or LOW 0 - VCC V output 3-state 0 - 3.6 V Tamb ambient temperature in free air 40 - +85 C t/V input transition rise and fall rate VCC = 1.4 V to 1.6 V 0 - 40 ns/V VCC = 1.65 V to 1.95 V 0 - 30 ns/V VCC = 2.3 V to 3.0 V 0 - 20 ns/V VCC = 3.0 V to 3.6 V 0 - 10 ns/V 9. Static characteristics Table 6. Static characteristics At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Typ[1] Max VCC = 1.2 V VCC - - V VCC = 1.4 V to 1.6 V 0.65  VCC 0.9 - V VCC = 1.65 V to 1.95 V 0.65  VCC 0.9 - V VCC = 2.3 V to 2.7 V 1.7 1.2 - V VCC = 3.0 V to 3.6 V 2.0 1.5 - V VCC = 1.2 V - - GND V VCC = 1.4 V to 1.6 V - 0.9 0.35  VCC V VCC = 1.65 V to 1.95 V - 0.9 0.35  VCC V VCC = 2.3 V to 2.7 V - 1.2 0.7 V VCC = 3.0 V to 3.6 V - 1.5 0.8 V Unit Tamb = 40 C to +85 C VIH VIL VOH HIGH-level input voltage LOW-level input voltage HIGH-level output voltage 74AVC16245 Product data sheet VI = VIH or VIL IO = 100 A; VCC = 1.65 V to 3.6 V VCC  0.20 VCC - V IO = 3 mA; VCC = 1.4 V VCC  0.35 VCC  0.21 - V IO = 4 mA; VCC = 1.65 V VCC  0.45 VCC  0.25 - V IO = 8 mA; VCC = 2.3 V VCC  0.55 VCC  0.37 - V IO = 12 mA; VCC = 3.0 V VCC  0.70 VCC  0.47 - V All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 6 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state Table 6. Static characteristics …continued At recommended operating conditions. Voltages are referenced to GND (ground = 0 V). Min Typ[1] Max Unit IO = 100 A; VCC = 1.65 V to 3.6 V - GND 0.20 V IO = 3 mA; VCC = 1.4 V - 0.22 0.35 V IO = 4 mA; VCC = 1.65 V - 0.24 0.45 V IO = 8 mA; VCC = 2.3 V - 0.38 0.55 V IO = 12 mA; VCC = 3.0 V - 0.53 0.70 V Symbol Parameter Conditions VOL VI = VIH or VIL LOW-level output voltage II input leakage current VI = VCC or GND; VCC = 1.4 V to 3.6 V - 0.1 2.5 A IOFF power-off leakage current VI or VO = 3.6 V; VCC = 0.0 V - 0.1 10 A IOZ OFF-state output current VI = VIH or VIL; VO = VCC or GND VCC = 1.4 V to 2.7 V - 0.1 5 A VCC = 3.0 V to 3.6 V - 0.1 10 A VCC = 1.4 V to 2.7 V - 0.1 20 A VCC = 3.0 V to 3.6 V - 0.2 40 A - 5.0 - pF supply current ICC input capacitance CI [1] VI = VCC or GND; IO = 0 A All typical values are measured at Tamb = 25 C. 9.1 Graphs DDD  ,2+ P$ DDD  9 ,2/ P$ 9   9 9   9 9  Fig 4.     92+ 9 Output voltage as a function of the HIGH-level output current. 74AVC16245 Product data sheet   Fig 5.     92/ 9  Output voltage as a function of the LOW-level output current. All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 7 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 10. Dynamic characteristics Table 7. Dynamic characteristics Voltages are referenced to GND (ground = 0 V). For test circuit see Figure 8. Symbol Parameter propagation delay tpd enable time ten 40 C to +85 C Conditions Min Max VCC = 1.2 V - 2.8 - ns VCC = 1.4 V to 1.6 V - 1.8 - ns VCC = 1.65 V to 1.95 V 0.7 1.8 3.0 ns VCC = 2.3 V to 2.7 V 0.6 1.3 1.9 ns VCC = 3.0 V to 3.6 V 0.5 1.1 1.7 ns - 5.9 - ns nAn to nBn; nBn to nAn; see Figure 6 nOE to nAn, nBn; see Figure 7 [1] [1] VCC = 1.2 V VCC = 1.4 V to 1.6 V - 3.9 - ns VCC = 1.65 V to 1.95 V 1.4 3.3 6.5 ns VCC = 2.3 V to 2.7 V 1.0 2.4 4.5 ns 0.7 2.0 3.7 ns VCC = 1.2 V - 6.9 - ns VCC = 1.4 V to 1.6 V - 4.8 - ns VCC = 1.65 V to 1.95 V 2.2 3.7 6.0 ns VCC = 2.3 V to 2.7 V 1.1 2.0 4.2 ns VCC = 3.0 V to 3.6 V 1.2 2.2 3.7 ns outputs enabled - 42 - pF outputs disabled - 2 - pF VCC = 3.0 V to 3.6 V disable time tdis power dissipation capacitance CPD [1] Unit Typ[2] nOE to nAn, nBn; see Figure 7 per input; VI = GND to VCC [1] [3] tpd is the same as tPLH and tPHL. ten is the same as tPZL and tPZH. tdis is the same as tPLZ and tPHZ. [2] [3] Typical values are measured at Tamb = 25 C and VCC = 1.2 V, 1.5 V, 1.8 V, 2.5 V and 3.3 V respectively. CPD is used to determine the dynamic power dissipation (PD in W). PD = CPD  VCC2  fi  N + (CL  VCC2  fo) where: fi = input frequency in MHz; fo = output frequency in MHz CL = output load capacitance in pF VCC = supply voltage in Volts N = number of inputs switching (CL  VCC2  fo) = sum of the outputs. 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 8 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 11. Waveforms VI nAn, nBn input VM GND t PHL t PLH VOH nBn, nAn output VM VOL mna477 Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 6. The input (nAn, nBn) to output (nBn, nAn) propagation delays VI nOE input VM GND tPLZ tPZL VCC output LOW-to-OFF OFF-to-LOW VM VX VOL tPHZ VOH tPZH VY output HIGH-to-OFF OFF-to-HIGH GND VM outputs enabled outputs enabled outputs disabled mna362 Measurement points are given in Table 8. Logic levels: VOL and VOH are typical output voltage levels that occur with the output load. Fig 7. Table 8. 3-state enable and disable times Measurement points Supply voltage VM VCC Input VI tr = tf VX VY 1.2 V 0.5  VCC VCC  2 ns VOL + 0.15 V VOH  0.15 V 1.4 V to 1.6 V 0.5  VCC VCC  2 ns VOL + 0.15 V VOH  0.15 V 1.65 V to 1.95 V 0.5  VCC VCC  2 ns VOL + 0.15 V VOH  0.15 V 2.3 V to 2.7 V 0.5  VCC VCC  2 ns VOL + 0.15 V VOH  0.15 V 3.0 V to 3.6 V 0.5  VCC VCC  2 ns VOL + 0.3 V VOH  0.3 V 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 9 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state VI tW 90 % negative pulse VM 0V tf tr tr tf VI 90 % positive pulse 0V VM 10 % VM VM 10 % tW VEXT VCC VI RL VO G DUT RT RL CL 001aae331 Test data is given in Table 9. Definitions for test circuit: RL = Load resistance. CL = Load capacitance including jig and probe capacitance. RT = Termination resistance should be equal to output impedance Zo of the pulse generator. VEXT = External voltage for measuring switching times. Fig 8. Table 9. Test circuit for measuring switching times Test data Supply voltage Input VI tr, tf CL RL tPLH, tPHL tPLZ, tPZL tPHZ, tPZH 1.2 V VCC  2 ns 15 pF 2 k open 2  VCC GND 1.4 V to 1.6 V VCC  2 ns 15 pF 2 k open 2  VCC GND 1.65 V to 1.95 V VCC  2 ns 30 pF 1 k open 2  VCC GND 2.3 V to 2.7 V VCC  2 ns 30 pF 500  open 2  VCC GND 3.0 V to 3.6 V VCC  2 ns 30 pF 500  open 2  VCC GND 74AVC16245 Product data sheet Load VEXT All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 10 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 12. Package outline TSSOP48: plastic thin shrink small outline package; 48 leads; body width 6.1 mm SOT362-1 E D A X c HE y v M A Z 48 25 Q A2 (A 3) A1 pin 1 index A θ Lp L 1 detail X 24 w M bp e 2.5 0 5 mm scale DIMENSIONS (mm are the original dimensions). UNIT A max. A1 A2 A3 bp c D (1) E (2) e HE L Lp Q v w y Z θ mm 1.2 0.15 0.05 1.05 0.85 0.25 0.28 0.17 0.2 0.1 12.6 12.4 6.2 6.0 0.5 8.3 7.9 1 0.8 0.4 0.50 0.35 0.25 0.08 0.1 0.8 0.4 8o o 0 Notes 1. Plastic or metal protrusions of 0.15 mm maximum per side are not included. 2. Plastic interlead protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT362-1 Fig 9. REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE 99-12-27 03-02-19 MO-153 Package outline SOT362-1 (TSSOP48) 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 11 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 13. Abbreviations Table 10. Abbreviations Acronym Description CMOS Complementary Metal-Oxide Semiconductor DUT Device Under Test TTL Transistor-Transistor Logic 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Order number Supersedes 74AVC16245 v.3 20130131 - Modifications: Product data sheet - 74AVC16245 v.2 • The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. • Legal texts have been adapted to the new company name where appropriate. 74AVC16245 v.2 19991115 Product specification - - 74AVC16245 v.1 74AVC16245 v.1 19981211 Product specification - - - 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 12 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 15. Legal information 15.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 15.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 15.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. 74AVC16245 Product data sheet Suitability for use — NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer’s own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 13 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products — Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors’ warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors’ specifications such use shall be solely at customer’s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors’ standard warranty and NXP Semiconductors’ product specifications. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 15.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com 74AVC16245 Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 3 — 31 January 2013 © NXP B.V. 2013. All rights reserved. 14 of 15 74AVC16245 NXP Semiconductors 16-bit transceiver with direction pin; 3.6 V tolerant; 3-state 17. Contents 1 2 3 4 5 5.1 5.2 6 7 8 9 9.1 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Ordering information . . . . . . . . . . . . . . . . . . . . . 1 Functional diagram . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 5 Functional description . . . . . . . . . . . . . . . . . . . 5 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5 Recommended operating conditions. . . . . . . . 6 Static characteristics. . . . . . . . . . . . . . . . . . . . . 6 Graphs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Dynamic characteristics . . . . . . . . . . . . . . . . . . 8 Waveforms . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 11 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12 Legal information. . . . . . . . . . . . . . . . . . . . . . . 13 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 13 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 14 Contact information. . . . . . . . . . . . . . . . . . . . . 14 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP B.V. 2013. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 31 January 2013 Document identifier: 74AVC16245
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