PC96-230-230-4

PC96 Non Silicone Gap Filler Description PC96 is a yellowish white, highly filled tacky non silicone system suitable thermal dissipation of electronic devices. It has stable pot life and long shelf life even at room temperature of 25 °C. Applications Heat dissipation from electronic components. Guidelines for Use 1. 2. 3. 4. 5. Wear rubber gloves when handling the product. Pick up some of the product from the container using hand. Peel off the liner. Place the product in required electronic part and circuit by hand. Not require heating and curing. The product can be applied and removed easily (care must be taken during installation to avoid tearing). Properties Property Typical Value Unit Test Method Appearance Yellowish White - Pen 10 Tackiness Both Sides - - Viscosity, Brookfield Cap 2000+, 25°C Pad cP Pen 44 Operating temperature -40 to 125 °C Pen 92 Thermal Conductivity 2.5 W/mK ISO/DIS 22007 Density 1.5 g/cm³ Pen 14 Hardness 50 Shore 00 Pen 111 Packaging Standard sheets Customized shapes Storage Store this silicone thermal pad in air tight container, cool, dark place (temperature range from 20⁰C to 30⁰C) to prolong shelf life. Prevent moisture condition. NOTICE: The information contained herein is to the best of our knowledge true and accurate. However, since the varied conditions of potential use are beyond our control, all recommendations or suggestions are presented without guarantee or responsibility on our part and users should make their own test to determine the suitability of our products in any specific situation. This product is sold without warranty either expressed or implied, of fitness for a particular purpose or otherwise, except that this product shall be of standard quality, and except to the extent otherwise stated T-Global Technology Europe and North America’s invoice, quotation, or order acknowledgment. We disclaim any and liability incurred in connection with the use of information contained herein, or otherwise. All risks of such are assumed by the user. Furthermore, nothing contained herein shall be construed as a recommendation to use any process or to manufacture or to use any product in conflict with existing future patents covering any product or material or its use. Tel: +44 (0) 1455 553 510 Email: sales@tglobaltechnology.com Web: www.tglobaltechnology.com Skype: tglobal.technology