A15348-01

Tflex 300 Series Thermal Gap Filler Product Description Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. *Ready for 5G Tflex™ 300H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Tflex™ 300TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production. FEATURES AND BENEFITS • Extreme compliancy allows material to “totally blanket” components • Thermal conductivity of 1.2 W/mK • Low compression set enables the pad to be reused many times • Environmentally friendly solution that meets regulatory requirements including RoHS and REACH SPECIFICATIONS Americas: +1.866.928.8181 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 www.lairdtech.com TYPICAL PROPERTIES VALUE TEST METHOD Construction & Composition Color Thickness Range Thermal Conductivity (W/mK) Density (g/cc) Hardness (Shore 00) N/A Visual N/A ASTM D5470 Helium Pyncometer ASTM D2240 Outgassing TML (weight %) Outgassing CVCM (weight %) Temperature Range Rth@ 40 mils, 10 psi, 500C Ceramic filled silicone sheet Light Green 0.50mm (0.020”) - 5.08mm (0.20”) 1.2 1.78 51.4 (20-30 mil) 25.2 (40+ mil) 0.56 0.1 -40°C to 160°C 0.98°C–in2/W * Dielectric Constant @ 10GHz UL Flammability Rating Volume Resistivity 4.5 * V-0 10^13 ohm-cm ASTM E595 ASTM E595 N/A ASTM D5470 (modified) ASTM D150 UL 94 ASTM D257 Tflex 300 Series Thermal Gap Filler Tflex 300 Deflection vs Pressure 100% 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 10 psi 20 psi 30 psi 40 psi Tflex 340 50 psi Tflex 380 60 psi 70 psi Tflex 3120 80 psi 90 psi 100 psi Tfex 3200 Tflex 300 Thermal Resistance vs Pressure 4.50 C-in2/W 3.75 C-in2/W 3.00 C-in2/W 2.25 C-in2/W 1.50 C-in2/W 0.75 C-in2/W 0.00 C-in2/W 10psi Tflex 340 20psi Tflex 380 30psi 40psi 50psi Tflex 3120 60psi Tflex 3200 AVAILABILITY STANDARD THICKNESSES • 0.5mm (0.020”) to 5.0mm (0.200”) thick material available in 0.25mm (0.010”) increments • Available in standard sheet sizes of 18” x 18” and 9” x 9” or custom die cut parts OPTIONS • DC1 proprietary tack eliminated coating ™ • Tgard “TG” dielectric barrier available to aid in handling and PET dielectric “H” liner available for applications for easy slide assembly PART NUMBER SYSTEM Tflex™ indicates Laird elastomeric thermal gap filler product line. 3xxx indicates Tflex 300 product line with thickness in mils (0.001”) EXAMPLES: • Tflex™ 340 = 0.040 inch thick Tflex™ 300 material • Tflex™ 380DC1 = 0.080 inch thick Tflex™ 300 material with DC1 coating • Tflex™ 3120TG = 0.120 inch thick Tflex™ 300 material with Tgard™ liner • Tflex™ 3200H = 0.200 inch thick Tflex™ 300 material with hard PET liner A15293-00 Tflex 300 DS 071718 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user. Laird Technologies makes no warranties as to the fitness, merchantability, suitability or non- infringement of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2015 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trademarks or registered trademarks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.