A15326-02

TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE Tflex™ 300, at pressures of 50psi, will deflect to over 50% the original thickness. This high rate of compliancy allows the material to “totally blanket” the component, enhancing thermal transfer. The material has a very low compression set enabling the pad to be reused many times. Tflex™ 300, in achieving its stellar compliancy, does not sacrifice thermal performance. With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low pressures. Tflex™ 300-H is offered with a hard, metallized liner option for easy handling and improved rework. The metallized liner’s lower coefficient of friction also allows for easy assembly of parts that must slide together, such as a card into a chassis. Tflex™ 300-TG is offered with a cut-through resistant Tgard™ silicone liner. The TG liner offers a guaranteed dielectric barrier, and easier part handling for mass production. FEATURES AND BENEFITS • Extreme compliancy allows material to “totally blanket” component(s) • Thermal conductivity of 1.2 W/mK • Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm) • Low compression set enables the pad to be reused many times APPLICATIONS • Notebook and desktop computers • Telecommunication hardware • Flat panel displays • Memory modules • Power conversion equipment • Set top box • Lighting ballast • Automotive electronics • LED lighting • Handheld electronics • Optical disk drives • Vibration dampening global solutions: local support Americas: +1.888.246.9050 Europe: +49.(0).8031.2460.0 Asia: +86.755.2714.1166 CLV-customerservice@lairdtech.com www.lairdtech.com/thermal TM TflexTM 300 Series Thermal Gap Filler Innovative Technology for a Connected World TFLEXTM 300 TYPICAL PROPERTIES TEST METHOD Color Thermal Conductivity Hardness (Shore 00) Density Thickness Range Filled silicone elastomer NA Light green Visual 1.2 W/mK 27 (at 3 second delay) ASTM D5470 1.78 g/cc ASTM D2240 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0 340 360 380 3100 3150 3200 10 20 30 40 50 60 70 80 90 100 110 P re ssure psi 0.020" - .200" (0.5 - 5.0mm)* P res s ure v s Deflec tion (A S T M D575) 3100 330 340 360 380 Thickness Tolerance ±10% UL Flammability Rating 94 V0 UL Temperature Range -40ºC to 160ºC NA Volume Resistivity 10 ^13 ohm-cm ASTEM D257 Outgassing TML 0.56% ASTM E595 Outgassing CVCM 0.10% ASTM E595 600 ppm/C IPC-TM-650 2.4.24 Coefficient Thermal Expansion (CTE) 330 Helium Pyncometer P erc ent Deflec tion Construction T herm al R es s itanc e in 2 /W 320 P res s ure v s . thermal res is tanc e (AS T M D 5470) ⁰ C- TFLEXTM 300 320 3150 90% 80% 70% 60% 50% 40% 30% 20% 10% 0% 0 3200 10 20 30 40 50 60 P re ssure psi 70 80 90 100 110 STANDARD THICKNESSES 0.020 to 0.200-inch (0.5 to 5.0mm)* 0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments 0.250-inch (6.4 mm) also available with TG liner option only. *Inquire about availability of material and options above 0.200-inches OPTIONS Tgard™ “TG” dielectric barrier available to aid in handling and PET dielectric “H” liner available for applications where easy slide assembly is desirable MATERIAL NAME AND THICKNESS EXAMPLES Tflex™ indicates elastomeric gap filler product line 3xxx indicates high recovery ‘3 series’ 1.2 W/mK material -DC1 designates proprietary tack eliminated coating -TG indicates Tgard™ liner option -H indicates hard PET liner option Tflex™ 3120 = standard 0.120-inch thick Tflex™ 300 material Tflex™ 3120DC1 = 0.120-inch thick material with DC1 coating Tflex™ 3120TG = 0.120-inch thick material with Tgard™ liner Tflex™ 3120H = 0.120-inch thick material with hard PET liner THR-DS-TFLEX-300 1010 Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specifications are subject to change without notice. Responsibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses. Laird Technologies makes no warranties as to the fitness, merchantability or suitability of any Laird Technologies materials or products for any specific or general uses. Laird Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2010 Laird Technologies, Inc. All Rights Reserved. Laird, Laird Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an affiliate company thereof. Other product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights. Document A15293-00 Rev D, 10/2009.